Vishay SiC632, SiC632A Datasheet

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50 A VRPower® Integrated Power Stage
SiC632, SiC632A
Vishay Siliconix
DESCRIPTION
The SiC632 and SiC632A are integrated power stage solutions optimized for synchronous buck applications to offer high current, high efficiency, and high power density performance. Packaged in Vishay’s proprietary MLP package, SiC632 and SiC632A enables voltage regulator designs to deliver up to 50 A continuous current per phase.
The internal power MOSFETs utilizes Vishay’s
®
state-of-the-art Gen IV TrenchFET
technology that delivers industry benchmark performance to significantly reduce switching and conduction losses.
The SiC632 and SiC632A incorporate an advanced MOSFET gate driver IC that features high current driving capability, adaptive dead-time control, an integrated bootstrap Schottky diode, a thermal warning (THWn) that alerts the system of excessive junction temperature, and zero current detection to improve light load efficiency. The drivers are also compatible with a wide range of PWM controllers and supports tri-state PWM, 3.3 V (SiC632A), 5 V (SiC632) PWM logic.
5 mm x 5 mm
FEATURES
• Thermally enhanced PowerPAK® MLP55-31L package
• Vishay’s Gen IV MOSFET technology and a low side MOSFET with integrated Schottky diode
• Delivers up to 50 A continuous current
• High efficiency performance
• High frequency operation up to 1.5 MHz
• Power MOSFETs optimized for 19 V input stage
• 3.3 V (SiC632A), 5 V (SiC632) PWM logic with tri-state and hold-off
• Zero current detect control for light load efficiency improvement
• Low PWM propagation delay (< 20 ns)
• Faster disable
• Thermal monitor flag
• Under voltage lockout for V
CIN
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
APPLICATIONS
• Multi-phase VRDs for computing, graphics card and memory
• Intel IMVP-8 VRPower delivery
- V
- V
• Up to 24 V rail input DC/DC VR modules
CORE
, V
GRAPHICS
, V
platforms
for Apollo Lake platforms
CCGI
SYSTEM AGENT
Skylake, Kabylake
TYPICAL APPLICATION DIAGRAM
5V V
V
DRV
V
CIN
ZCD_EN#
PWM
controller
S20-0486-Rev. E, 29-Jun-2020
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DSBL#
PWM
THWn
Fig. 1 - SiC632 and SiC632A Typical Application Diagram
For technical questions, contact: powerictechsupport@vishay.com
Gate
driver
GL
C
GND
V
IN
BOOT
PHASE
V
SWH
P
GND
1
Document Number: 62992
IN
V
OUT
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P
GND
C
GND
BOOT
PHASE
V
IN
P
GNDPGNDPGNDPGND
VINVINV
IN
N.C.
GL
V
DRV
THWn
DSBL#
PWM
ZCD_EN#
V
CIN
PGND
VIN
CGND
GL
Top view Bottom view
P
GND
C
GND
BOOT
PHASE
V
IN
P
GNDPGNDPGNDPGND
VINV
INVIN
N.C.
GL
V
DRV
THWn
DSBL#
PWM
ZCD_EN#
V
CIN
35
P
GND
34
V
IN
32
C
GND
GL
2
1
4
3
6
5
8
7
2425262728293031
1514131211109
2
1
4
3
6
5
8
7
15 14 13 12 11 10 9
24 25 26 27 28 29 30 31
V
SWH
23
V
SWHVSWH
V
SWH
V
SWHVSWH
V
SWH
33 GL
V
SWH
22
V
SWH
21
V
SWH
20
V
SWH
19
V
SWH
18
V
SWH
17
V
SWH
16
23 V
SWH
22 V
SWH
21 V
SWH
20 V
SWH
19 V
SWH
16 V
SWH
18 V
SWH
17 V
SWH
PINOUT CONFIGURATION
SiC632, SiC632A
Vishay Siliconix
PIN CONFIGURATION
PIN NUMBER NAME FUNCTION
1 PWM PWM input logic
2 ZCD_EN# ZCD control. Active low
3V
4, 32 C
5 BOOT High side driver bootstrap voltage
6 N.C. Not connected internally, can be left floating or connected to ground
7 PHASE Return path of high side gate driver
8 to 11, 34 V
12 to 15, 28, 35 P
16 to 26 V
27, 33 GL Low side MOSFET gate signal
29 V
30 THWn Thermal warning open drain output
31 DSBL# Disable pin. Active low
ORDERING INFORMATION
PART NUMBER PACKAGE MARKING CODE OPTION
SiC632CD-T1-GE3 PowerPAK MLP55-31L SiC632 5 V PWM optimized
SiC632ACD-T1-GE3 PowerPAK MLP55-31L SiC632A 3.3 V PWM optimized
SiC632DB / SiC632ADB Reference board
S20-0486-Rev. E, 29-Jun-2020
Fig. 2 - SiC632 and SiC632A Pin Configuration
CIN
GND
IN
GND
SWH
DRV
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Supply voltage for internal logic circuitry
Signal ground
Power stage input voltage. Drain of high side MOSFET
Power ground
Phase node of the power stage
Supply voltage for internal gate driver
2
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PART MARKING INFORMATION
P/N
SiC632, SiC632A
Vishay Siliconix
= Pin 1 Indicator
P/N = Part Number Code
= Siliconix Logo
LL
= ESD Symbol
F = Assembly Factory Code
F Y W W
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL PARAMETER CONDITIONS LIMIT UNIT
Input voltage V
Control logic supply voltage V
Drive supply voltage V
Switch node (DC voltage)
Switch node (AC voltage)
BOOT voltage (DC voltage)
BOOT voltage (AC voltage)
BOOT to PHASE (DC voltage)
BOOT to PHASE (AC voltage)
All lo gic i npu ts an d o utpu ts (PWM, DSBL#, and THWn)
Max. operating junction temperature T
Storage temperature T
Electrostatic discharge protection
Notes
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability
(1)
The specification values indicated “AC” is V
(2)
The specification value indicates “AC voltage” is V
(3)
The specification value indicates “AC voltage” is V
(1)
(2)
(3)
Human body model, JESD22-A114 3000
Charged device model, JESD22-C101 1000
to P
SWH
GND
BOOT
BOOT
V
V
BOOT
V
BOOT-PHASE
-8 V (< 20 ns, 10 μJ), min. and 33 V (< 50 ns), max.
to P
, 40 V (< 50 ns) max.
GND
to V
PHASE
Y = Year Code
WW = Week Code
LL = Lot Code
IN
CIN
DRV
SWH
J
A
stg
, 8 V (< 20 ns) max.
-0.3 to +28
-0.3 to +7
-0.3 to +7
-0.3 to +28
-7 to +33
-0.3 to +7
-0.3 to +8
-0.3 to V
-40 to +125
-65 to +150
35
40
150
CIN
V
+ 0.3
°CAmbient temperature T
V
RECOMMENDED OPERATING RANGE
ELECTRICAL PARAMETER MINIMUM TYPICAL MAXIMUM UNIT
Input voltage (V
Drive supply voltage (V
Control logic supply voltage (V
BOOT to PHASE (V
Thermal resistance from junction to ambient - 10.6 -
Thermal resistance from junction to case - 1.6 -
S20-0486-Rev. E, 29-Jun-2020
)4.5-24
IN
) 4.555.5
DRV
) 4.555.5
CIN
BOOT-PHASE
, DC voltage) 4 4.5 5.5
3
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Document Number: 62992
V
°C/W
SiC632, SiC632A
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ELECTRICAL SPECIFICATIONS
(DSBL# = ZCD_EN# = 5 V, V
PARAMETER SYMBOL TEST CONDITION
POWER SUPPLY
Control logic supply current I
Drive supply current I
BOOTSTRAP SUPPLY
Bootstrap diode forward voltage V
PWM CONTROL INPUT (SiC632)
Rising threshold V
Falling threshold V
Tri-state voltage V
Tri-state rising threshold V
Tri-state falling threshold V
Tri-state rising threshold hysteresis V
Tri-state falling threshold hysteresis V
PWM input current I
PWM CONTROL INPUT (SiC632A)
Rising threshold V
Falling threshold V
Tri-state Voltage V
Tri-state rising threshold V
Tri-state falling threshold V
Tri-state rising threshold hysteresis V
Tri-state falling threshold hysteresis V
PWM input current I
TIMING SPECIFICATIONS
Tri-state to GH/GL rising propagation delay
Tri-state hold-off time t
GH - turn off propagation delay t
GH - turn on propagation delay (dead time rising)
GL - turn off propagation delay t
GL - turn on propagation delay (dead time falling)
DSBL# Lo to GH/GL falling propagation delay
PWM minimum on-time t
= 12 V, V
IN
VDRV
TH_PWM_R
TH_PWM_F
TRI_TH_R
TRI_TH_F
HYS_TRI_R
HYS_TRI_F
PWM
TH_PWM_R
TH_PWM_F
TRI_TH_R
TRI_TH_F
HYS_TRI_R
HYS_TRI_F
PWM
t
PD_TRI_R
TSHO
PD_OFF_GH
t
PD_ON_GH
PD_OFF_GL
t
PD_ON_GL
t
PD_DSBL#_F
PWM_ON_MIN
VCIN
F
TRI
TRI
DRV
and V
V
DSBL#
DSBL#
= 5 V, TA = 25 °C)
CIN
= 0 V, no switching, V
= 5 V, no switching, V
V
= 5 V, fS = 300 kHz, D = 0.1 - 525 -
DSBL#
fS = 300 kHz, D = 0.1 - 10 15
f
S
V
DSBL#
V
DSBL#
No load, see Fig. 4
MIN. TYP. MAX.
= FLOAT - 10 -
PWM
= FLOAT - 300 -
PWM
= 1 MHz, D = 0.1 - 35 -
= 0 V, no switching - 15 -
= 5 V, no switching - 55 -
IF = 2 mA 0.4 V
3.4 3.8 4.2
0.72 0.9 1.1
V
= FLOAT - 2.3 -
PWM
0.9 1.15 1.38
33.33.6
- 225 -
- 325 -
V
= 5 V - - 350
PWM
= 0 V - - -350
V
PWM
2.3 2.45 2.7
0.72 0.9 1.1
V
= FLOAT - 1.8 -
PWM
0.9 1.15 1.38
1.95 2.2 2.45
- 250 -
- 300 -
V
= 3.3 V - - 225
PWM
= 0 V - - -225
V
PWM
-30-
- 130 -
-15-
-10-
-13-
-10-
Fig. 5 - 15 -
30 - -
Vishay Siliconix
LIMITS
UNIT
μAV
mA
μA
V
mV
μA
V
mV
μA
ns
S20-0486-Rev. E, 29-Jun-2020
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Document Number: 62992
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ELECTRICAL SPECIFICATIONS
(DSBL# = ZCD_EN# = 5 V, V
PARAMETER SYMBOL TEST CONDITION
DSBL# ZCD_EN# INPUT
DSBL# logic input voltage
ZCD_EN# logic input voltage
PROTECTION
Under voltage lockout V
Under voltage lockout hysteresis V THWn flag set
THWn flag hysteresis THWn output low V
Notes
(1)
Typical limits are established by characterization and are not production tested
(2)
Guaranteed by design
(2)
(2)
(2)
= 12 V, V
IN
V
IH_DSBL#
V
IL_DSBL#
V
IH_ZCD_EN#
V
IL_ZCD_EN#
UVLO_HYST
T
THWn_SET
T
THWn_CLEAR
T
THWn_HYST
OL_THWn
UVLO
DRV
and V
= 5 V, TA = 25 °C)
CIN
MIN. TYP. MAX.
Input logic high 2 - -
Input logic low - - 0.8
Input logic high 2 - -
Input logic low - - 0.8
V
rising, on threshold - 3.7 4.1
CIN
V
falling, off threshold 2.7 3.1 -
CIN
I
= 2 mA - 0.02 - V
THWn
SiC632, SiC632A
Vishay Siliconix
LIMITS
- 575 - mV
- 160 -
- 135 -
-25-
UNIT
V
V
°CTHWn flag clear
DETAILED OPERATIONAL DESCRIPTION
PWM Input with Tri-State Function
The PWM input receives the PWM control signal from the VR controller IC. The PWM input is designed to be compatible with standard controllers using two state logic (H and L) and advanced controllers that incorporate tri-state logic (H, L and tri-state) on the PWM output. For two state logic, the PWM input operates as follows. When PWM is driven above V
PWM_TH_R
turned on. When PWM input is driven below V high side is turned off and the low side is turned on. For tri-state logic, the PWM input operates as previously stated for driving the MOSFETs when PWM is logic high and logic low. However, there is a third state that is entered as the PWM output of tri-state compatible controller enters its high impedance state during shutdown. The high impedance state of the controller’s PWM output allows the SiC632 and SiC632A to pull the PWM input into the tri-state region (see definition of PWM logic and tri-state, Fig. 4). If the PWM input stays in this region for the tri-state hold-off period, tTSHO, both high side and low side MOSFETs are turned off. The function allows the VR phase to be disabled without negative output voltage swing caused by inductor ringing and saves a Schottky diode clamp. The PWM and tri-state regions are separated by hysteresis to prevent false triggering. The SiC632A incorporates PWM voltage thresholds that are compatible with 3.3 V logic and the SiC632 thresholds are compatible with 5 V logic.
Disable (DSBL#)
In the low state, the DSBL# pin shuts down the driver IC and disables both high side and low side MOSFETs. In this state, standby current is minimized. If DSBL# is left unconnected, an internal pull-down resistor will pull the pin to C shut down the IC.
the low side is turned off and the high side is
GND
the
and
PWM_TH_F
Diode Emulation Mode (ZCD_EN#)
When ZCD_EN# pin is driven below V
IL_ZCD_EN#
. diode emulation mode is enabled. If the PWM signal switches below V
TH_PWM_F
then the LS MOSFET is under control of the ZCD (zero crossing detect) comparator. If, after the internal blanking delay, the inductor current becomes less than or = 0 the low side is turned off. Light load efficiency is improved by avoiding discharge of output capacitors. If both high side and low side MOSFETs are required to be turned off, regardless of inductor current, the PWM input should be tri-stated.
Thermal Shutdown Warning (THWn)
The THWn pin is an open drain signal that flags the presence of excessive junction temperature. Connect with a maximum of 20 k, to V
. An internal temperature sensor
CIN
detects the junction temperature. The temperature threshold is 160 °C. When this junction temperature is exceeded the THWn flag is set. When the junction temperature drops below 135 °C the device will clear the THWn signal. The SiC632 and SiC632A do not stop operation when the flag is set. The decision to shutdown must be made by an external thermal control function.
Voltage Input (V
)
IN
This is the power input to the drain of the high side power MOSFET. This pin is connected to the high power intermediate BUS rail.
S20-0486-Rev. E, 29-Jun-2020
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Document Number: 62992
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DISB#
20K
V
SWH
V
SWH
GL
+
-
GL
+
-
ZCD_EN#
Thermal monitor
& warning
UVLO
V
CIN
PWM logic
control &
state
machine
Anti-cross
conduction
control
logic
BOOT
THWn
V
IN
PWM
C
GND
V
CIN
V
ref
= 1 V
V
ref
= 1 V
P
GND
PHASE
V
DRV
V
DRV
P
GND
SiC632, SiC632A
Vishay Siliconix
Switch Node (V
The switch node, V
and PHASE)
SWH
, is the circuit power stage output.
SWH
This is the output applied to the power inductor and output filter to deliver the output for the buck converter. The PHASE pin is internally connected to the switch node V
SWH
. This pin is to be used exclusively as the return pin for the BOOT capacitor. A 20 k resistor is connected between GH (the high side gate) and PHASE to provide a discharge path for the HS MOSFET in the event that V
goes to zero while
CIN
VIN is still applied.
Ground Connections (C
P
(power ground) should be externally connected
GND
to C
(signal ground). The layout of the printed circuit
GND
board should be such that the inductance separating C and P
is minimized. Transient differences due to
GND
GND
and P
GND
)
GND
inductance effects between these two pins should not exceed 0.5 V
, V
Control and Drive Supply Voltage Input (V
V
is the bias supply for the gate drive control IC. V
CIN
DRV
CIN
)
DRV
is the bias supply for the gate drivers. It is recommended to separate these pins through a resistor. This creates a low pass filtering effect to avoid coupling of high frequency gate drive noise into the IC.
FUNCTIONAL BLOCK DIAGRAM
Bootstrap Circuit (BOOT)
The internal bootstrap diode and an external bootstrap capacitor form a charge pump that supplies voltage to the BOOT pin. An integrated bootstrap diode is incorporated so that only an external capacitor is necessary to complete the bootstrap circuit. Connect a boot strap capacitor with one leg tied to BOOT pin and the other tied to PHASE pin.
Shoot-Through Protection and Adaptive Dead Time
The SiC632 and SiC632A have an internal adaptive logic to avoid shoot through and optimize dead time. The shoot through protection ensures that both high side and low side MOSFETs are not turned on at the same time. The adaptive dead time control operates as follows. The high side and low side gate voltages are monitored to prevent the MOSFET turning on from tuning on until the other MOSFET's gate voltage is sufficiently low (< 1 V). Built in delays also ensure that one power MOSFET is completely off, before the other can be turned ON. This feature helps to adjust dead time as gate transitions change with respect to output current and temperature.
Under Voltage Lockout (UVLO)
During the start up cycle, the UVLO disables the gate drive holding high side and low side MOSFET gates low until the supply voltage rail has reached a point at which the logic circuitry can be safely activated. The SiC632, SiC632A also incorporates logic to clamp the gate drive signals to zero when the UVLO falling edge triggers the shutdown of the device. As an added precaution, a 20 k resistor is connected between GH (the high side gate) and PHASE to provide a discharge path for the HS MOSFET.
Fig. 3 - SiC632 and SiC632A Functional Block Diagram
S20-0486-Rev. E, 29-Jun-2020
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