Ordering Information: Si7716ADN-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
1
D
3.30 mm
S
2
S
3
G
4
G
D
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
Gate-Source Voltage
T
Continuous Drain Current (T
= 150 °C)
J
T
TA = 25 °C
TA = 70 °C
Pulsed Drain Current
Avalanche Current
Avalanche Energy
Continuous Source-Drain Diode Current
L = 0.1 mH
T
T
T
Maximum Power Dissipation
T
T
TA = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d, e
= 25 °C
C
= 70 °C
C
= 25 °C
C
= 25 °C
A
= 25 °C
C
= 70 °C
C
= 25 °C
A
260
V
DS
V
GS
I
D
I
DM
I
AS
E
AS
I
S
30
± 20
a, g
16
16
b, c
12
b, c
9.5
32
15
11.25
a, g
16
b, c
2.9
V
g
A
g
mJ
A
27.7
P
D
T
, T
J
stg
17.7
b, c
3.5
b, c
2.2
- 55 to 150
W
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol TypicalMaximumUnit
Maximum Junction-to-Ambient
Maximum Junction-to-Case (Drain)
Notes:
a. Based on T
b. Surface Mounted on 1" x 1" FR4 board.
= 25 °C.
C
c. t = 10 s.
d. See Solder Profile (
http://www.vishay.com/ppg?73257). The PowerPAK 1212 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 81 °C/W.
g. Package limited.
Document Number: 68704
S-81450-Rev. A, 23-Jun-08
b, f
t ≤ 10 s
Steady State
R
thJA
R
thJC
2936
3.64.5
°C/W
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1
New Product
Si7716ADN
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ.Max.Unit
Static
V
Drain-Source Breakdown Voltage
V
Temperature Coefficient
DS
V
Temperature Coefficient
GS(th)
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
b
a
Input Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Tur n -O n De l a y T i m e
Rise Time
Turn-Off Delay Time
Fall Time
Tur n -O n De l a y T i m e
Rise Time
Turn-Off Delay Time
Fall Time
a
V
DS
ΔV
DS/TJ
ΔV
GS(th)/TJ
V
GS(th)
I
GSS
I
DSS
I
V
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
V
DS
V
V
DS
V
DS
I
D
I
D
IF = 10 A, dI/dt = 100 A/µs, TJ = 25 °C
= 0 V, ID = 250 µA
GS
VDS = V
V
= 0 V, V
DS
V
= 30 V, V
DS
= 30 V, V
≥ 5 V, V
DS
V
= 10 V, ID = 10 A
GS
V
= 4.5 V, ID = 7 A
GS
V
= 15 V, ID = 10 A
DS
= 15 V, V
DS
= 15 V, V
= 15 V, V
V
= 15 V, RL = 1.5 Ω
DD
≅ 10 A, V
V
= 15 V, RL = 1.5 Ω
DD
≅ 10 A, V
IS = 3 A, V
30V
ID = 250 µA
, ID = 250 µA
GS
= ± 20 V
GS
GS
= 0 V, TJ = 55 °C
GS
= 10 V
GS
1.22.5V
= 0 V
20A
33
- 5
mV/°C
± 100nA
1
5
0.01050.0135
0.01350.0165
24S
846
= 0 V, f = 1 MHz
GS
187
72
= 10 V, ID = 10 A
GS
15.423
7.311
= 4.5 V, ID = 10 A
GS
2.3
2.2
f = 1 MHz0.20.81.6Ω
1530
1224
= 4.5 V, Rg = 1 Ω
GEN
1326
1020
918
918
= 10 V, Rg = 1 Ω
GEN
1428
816
TC = 25 °C
16
32
GS
= 0 V
0.781.2V
1734ns
9.519nC
10
7
µA
Ω
pFOutput Capacitance
nC
ns
A
ns
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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2
Document Number: 68704
S-81450-Rev. A, 23-Jun-08
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Si7716ADN
Vishay Siliconix
50
40
30
20
- Drain Current (A)I
D
10
0
0.00.51.01.52.02.5
VGS=10thru 5 V
- Drain-to-Source Voltage (V)
V
DS
Output Characteristics
0.025
0.020
0.015
- On-Resistance (Ω)R
DS(on)
0.010
VGS=4.5V
VGS=10V
VGS=4V
VGS=3V
8
6
4
- Drain Current (A)I
D
2
0
012345
TC= 25 °C
TC= 125 °C
V
- Gate-to-Source Voltage (V)
GS
TC= - 55 °C
Transfer Characteristics
1100
C
880
660
440
C - Capacitance (pF)
220
iss
C
oss
0.005
0 1020304050
On-Resistance vs. Drain Current and Gate Voltage
10
ID=10A
8
6
4
- Gate-to-Source Voltage (V)
GS
2
V
0
0.03.26.49.612.816.0
Document Number: 68704
S-81450-Rev. A, 23-Jun-08
ID- Drain Current (A)
VDS=10V
VDS=20V
Qg- Total Gate Charge (nC)
Gate Charge
VDS=15V
C
rss
0
051015202530
VDS- Drain-to-Source Voltage (V)
Capacitance
1.8
ID=10A
1.6
1.4
1.2
- On-Resistance
(Normalized)
1.0
DS(on)
R
0.8
0.6
- 50- 250255075100125 150
-Junction Temperature (°C)
T
J
VGS=10V
On-Resistance vs. Junction Temperature
VGS=4.5V
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3
New Product
Si7716ADN
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
10
1
0.1
- Source Current (A)I
S
0.01
0.001
0.00.20.40.60.81.01.2
TJ= 150 °C
TJ= 25 °C
VSD-Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
0.4
0.2
0.0
- 0.2
Variance (V)V
GS(th)
- 0.4
- 0.6
ID= 250 µA
ID=5mA
0.06
ID=10A
0.05
0.04
0.03
- On-Resistance (Ω)R
0.02
DS(on)
0.01
0.00
012345678910
VGS- Gate-to-Source Voltage (V)
TJ= 125 °C
TJ=25 °C
On-Resistance vs. Gate-to-Source Voltage
120
96
72
Power (W)
48
24
- 0.8
- 50- 250255075100 125150
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4
TJ- Temperature (°C)
Threshold Voltage
- Drain Current (A)
D
I
100
10
0.1
0.01
1
0.01
Limited byR
TA= 25 °C
Single Pulse
0.1110
- Drain-to-Source Voltage (V)
V
DS
* V
> minimum VGSat which R
GS
DS(on)
*
Safe Operating Area, Junction-to-Ambient
0
0.1
Time (s)
Single Pulse Power (Junction-to-Ambient)
1ms
10 ms
100 ms
1s
10 s
BVDSS
Limited
DS(on)
DC
100
is specified
Document Number: 68704
S-81450-Rev. A, 23-Jun-08
011100.00.01
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