Vishay Si7686DP Schematic [ru]

N-Channel 30-V (D-S) MOSFET
C
T
Si7686DP
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) R
30
0.0095 at V
0.014 at V
DS(on)
(Ω)
GS
GS
= 10 V
= 4.5 V
PowerPAK SO-8
6.15 mm
D
8
D
7
D
6
5
Bottom View
Ordering Information: Si7686DP-T1-E3 (Lead (Pb)-free) Si7686DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
1
D
5.15 mm
S
2
S
3
4
a
I
(A)
D
35
35
G
Qg (Typ.)
9.2 nC
FEATURES
TrenchFET
• New Low Thermal Resistance PowerPAK Package with Low 1.07 mm Profile
• Optimized for High-Side Synchronous Rectifier Operation
• 100 % R
APPLICATIONS
• DC/DC Converters
®
Power MOSFET
Tested
g
D
G
S
N-Channel MOSFET
RoHS
®
OMPLIAN
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage Gate-Source Voltage
= 25 °C
T
C
T
= 70 °C
Continuous Drain Current (T
= 150 °C)
J
C
TA = 25 °C TA = 70 °C
Pulsed Drain Current
T
= 25 °C
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current Avalanche Energy
Maximum Power Dissipation
C
T
= 25 °C
A
L = 0.1 mH
T
= 25 °C
C
T
= 70 °C
C
T
= 25 °C
A
TA = 70 °C
Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)
d, e
V
DS
V
GS
I
D
I
DM
I
S
I
AS
E
AS
± 20
35 35
17.9
14.3
31.5
4.2
30
50
10
V
a
a
b, c
b, c
b, c
5
A
mJ
37.9
P
D
T
, T
J
stg
24.2
b, c
5
b, c
3.2
- 55 to 150 260
W
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient Maximum Junction-to-Case (Drain) Steady State
Notes: a. Package Limited. b. Surface Mounted on 1" x 1" FR4 board. c. t = 10 s. d. See Solder Profile (
http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection. e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under Steady State conditions is 70 °C/W.
Document Number: 73451 S-80440-Rev. C, 03-Mar-08
b, f
t 10 s
R
thJA
R
thJC
21 25
2.8 3.3
°C/W
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1
Si7686DP
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
Temperature Coefficient ΔVDS/T
DS
V
Temperature Coefficient ΔV
GS(th)
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
b
a
a
a
Input Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Tur n -O n De l ay T i m e
Rise Time
Turn-Off Delay Time
Fall Time
Tur n -O n De l ay T i m e
Rise Time
Turn-Off Delay Time
Fall Time
V
DS
J
GS(th)/TJ
V
GS(th)
I
GSS
I
DSS
I
V
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
a
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
Notes: a. Pulse test; pulse width 300 µs, duty cycle 2 %. b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the de vice. These are stress rating s only, and functiona l operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
VGS = 0 V, ID = 250 µA
ID = 250 µA
V
= VGS, ID = 250 µA
DS
VDS = 0 V, VGS = ± 20 V
V
V
DS
= 30 V, V
DS
= 30 V, V
V
GS
5 V, V
DS
V
= 10 V, ID = 13.8 A
GS
= 4.5 V, ID = 11.4 A
GS
= 0 V
GS
= 0 V, TJ = 55 °C
= 10 V
GS
VDS = 15 V, ID = 13.8 A
VDS = 15 V, V
VDS = 15 V, V
V
= 15 V, V
DS
= 0 V, f = 1 MHz
GS
= 10 V, ID = 13.8 A
GS
= 5 V, ID = 13.8 A
GS
f = 1 MHz 0.8 1.2 Ω
V
= 15 V, RL = 1.5 Ω
DD
10 A, V
I
D
V
10 A, V
I
D
DD
= 4.5 V, Rg = 1 Ω
GEN
= 15 V, RL = 1.5 Ω
= 10 V, Rg = 1 Ω
GEN
TC = 25 °C
IS = 2.6 A
IF = 2.6 A, di/dt = 100 A/µs, TJ = 25 °C
30 V
31.5
- 6
mV/°C
13V
± 100 nA
1
10
µA
50 A
0.0078 0.0095
0.011 0.014
Ω
56 S
1220
230
pFOutput Capacitance
98
17 26
9.2 14
4.1
nC
2.8
20 30
20 30
20 30
815
13 20
ns
16 25
23 35
815
31.5
50
A
0.8 1.2 V
25 50 ns
15 30 nC
12.5
12.5
ns
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Document Number: 73451
S-80440-Rev. C, 03-Mar-08
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Si7686DP
Vishay Siliconix
50
40
30
- Drain Current (A)I
20
D
10
0
0.0 0.4 0.8 1.2 1.6 2.0
V
- Drain-to-Source Voltage (V)
DS
VGS = 10 thru 4 V
Output Characteristics
0.0140
0.0120
0.0100
VGS = 4.5 V
3 V
10
8
6
- Drain Current (A)I
4
D
TC = 125 °C
2
25 °C
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
V
- Gate-to-Source Voltage (V)
GS
Transfer Characteristics
1500
C
1200
900
iss
- 55 °C
VGS = 10 V
0.0080
- On-Resistance (mΩ)
DS(on)
R
0.0060
0.0040 0 1020304050
I
- Drain Current (A)
D
On-Resistance vs. Drain Current and Gate Voltage
10
ID = 13.8 A
8
VDS = 15 V
- Gate-to-Source Voltage (V)
GS
V
6
4
2
0
0 4 8 12 16 20
Qg - Total Gate Charge (nC)
VDS = 21 V
Gate Charge
600
C - Capacitance (pF)
300
0
0 5 10 15 20 25 30
C
oss
C
rss
VDS - Drain-to-Source Voltage (V)
Capacitance
1.8
ID = 13.8 A
1.6
1.4
1.2
- On-Resistance (Normalized)
1.0
DS(on)
R
0.8
0.6
- 50 - 25 0 25 50 75 100 125 150
T
- Junction Temperature (°C)
J
VGS = 10 V
On-Resistance vs. Junction Temperature
VGS = 4.5 V
Document Number: 73451 S-80440-Rev. C, 03-Mar-08
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