Si4800BDY
Vishay Siliconix
N-Channel Reduced Qg, Fast Switching MOSFET
PRODUCT SUMMARY
VDS (V) R
30
0.0185 at V
0.030 at V
(Ω)I
DS(on)
GS
GS
= 10 V
= 4.5 V
D
(A)
9
7
FEATURES
• Halogen-free According to IEC 61249-2-21
Available
• TrenchFET
• High-Efficient PWM Optimized
• 100 % UIS and R
®
Power MOSFET
Tested
g
SO-8
S
1
S
2
S
3
G
4
Top View
Ordering Information: Si4800BDY-T1-E3 (Lead (Pb)-free)
Si4800BDY-T1-GE3 (Lead (Pb)-free and Halogen-free)
D
8
D
7
D
6
D
5
G
N-Channel MOSFET
D
S
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter Symbol 10 s Steady State Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
= 150 °C)
J
a, b
Pulsed Drain Current (10 µs Pulse Width)
Continuous Source Current (Diode Conduction)
a, b
Avalanche Current
Single-Pulse Avalanche Energy
Maximum Power Dissipation
a, b
Operating Junction and Storage Temperature Range
TA = 25 °C
T
= 70 °C
A
L = 0.1 mH
TA = 25 °C
T
= 70 °C
A
V
DS
V
GS
I
D
I
DM
I
S
I
AS
E
AS
P
D
T
, T
J
stg
7.0 5.0
2.3
2.5 1.3
1.6 0.8
30
± 25
96.5
40
15
11.25 mJ
- 55 to 150 °C
V
A
W
THERMAL RESISTANCE RATINGS
Limits
Parameter Symbol
Maximum Junction-to-Ambient
a
t ≤ 10 s
Steady State 70 95
Maximum Junction-to-Foot (Drain) Steady State
R
thJA
R
thJF
40 50
24 30
Notes:
a. Surface Mounted on FR4 board.
b. t ≤ 10 s.
Document Number: 72124
S-83039-Rev. H, 29-Dec-08
Unit Typ. Max.
°C/W
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Si4800BDY
Vishay Siliconix
MOSFET SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
V
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
Forward Transconductance
Diode Forward Voltage
Dynamic
b
a
a
Total Gate Charge
Gate-Drain Charge
Gate Resistance
Tur n -O n De l a y T i m e
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
V
GS(th)
I
GSS
I
DSS
I
V
D(on)
a
R
DS(on)
g
fs
V
SD
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
rr
V
V
I
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
= VGS, ID = 250 µA
DS
VDS = 0 V, VGS = ± 20 V
V
= 30 V, V
DS
= 30 V, V
DS
GS
≥ 5 V, V
DS
V
= 10 V, ID = 9 A
GS
V
= 4.5 V, ID = 7 A
GS
= 0 V
GS
= 0 V, TJ = 55 °C
= 10 V
GS
VDS = 15 V, ID = 9 A
IS = 2.3 A, V
= 15 V, V
DS
V
= 15 V, RL = 15 Ω
DD
≅ 1 A, V
D
GEN
= 0 V
GS
= 5.0 V, ID = 9 A
GS
= 10 V, Rg = 6 Ω
IF = 2.3 A, dI/dt = 100 A/µs
0.8 1.8 V
± 100 nA
1
5
30 A
0.0155 0.0185
0.023 0.030
16 S
0.75 1.2 V
8.7 13
1.5
nCGate-Source Charge
3.5
0.5 1.4 2.2 Ω
715
12 20
32 50
14 25
30 60
µA
Ω
ns
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Document Number: 72124
S-83039-Rev. H, 29-Dec-08
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Si4800BDY
Vishay Siliconix
- Drain Current (A)I
D
- On-Resistance (Ω)R
DS(on)
40
35
30
25
20
15
10
5
0
012345
0.040
0.032
0.024
0.016
0.008
0.000
0 5 10 15 20 25 30
VGS = 10 thru 5 V
4 V
3 V
- Drain-to-Source Voltage (V)
V
DS
Output Characteristics
VGS = 4.5 V
VGS = 10 V
ID - Drain Current (A)
On-Resistance vs. Drain Current
40
35
30
25
20
15
- Drain Current (A)I
D
10
5
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
1200
1000
800
600
C - Capacitance (pF)
400
200
0
048121620
TC = - 55 °C
- Gate-to-Source Voltage (V)
V
GS
Transfer Characteristics
C
iss
C
oss
C
rss
VDS - Drain-to-Source Voltage (V)
Capacitance
25 °C
125 °C
6
VDS = 15 V
= 9 A
I
5
4
3
2
- Gate-to-Source Voltage (V)
GS
V
1
0
0246810
D
Document Number: 72124
S-83039-Rev. H, 29-Dec-08
Qg - Total Gate Charge (nC)
Gate Charge
1.8
1.6
1.4
1.2
- On-Resistance
(Normalized)
1.0
DS(on)
R
0.8
0.6
- 50 - 25 0 25 50 75 100 125 150
VGS = 10 V
= 9 A
I
D
T
- Junction Temperature (°C)
J
On-Resistance vs. Junction Temperature
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