Vishay Si1405BDH Schematic

New Product

P-Channel 1.8-V (G-S) MOSFET

Si1405BDH

Vishay Siliconix

PRODUCT SUMMARY

VDS (V) r

0.112 at V

- 8

0.210 at V

(Ω)

DS(on)

= - 4.5 V - 1.6

GS

= - 2.5 V - 1.6

GS

= - 1.8 V - 1.6

GS

c

I

(A)

D

Qg (Typ)

3.67 nC0.160 at V

FEATURES

• TrenchFET® Power MOSFET

APPLICATIONS

• Load Switch for Portable Devices

RoHS

COMPLIANT

SOT-363

SC-70 (6-LEADS)

D

1

D

2

G

3

Top V i ew

Ordering Information: Si1405BDH-T1-E3 (Lead (Pb)-free)

D

6

5

D

S

4

Marking Code

BO XX

Par t # Code

YY

Lot Traceability and Date Code

ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted

Parameter Symbol Limit Unit

Drain-Source Voltage

Gate-Source Voltage

Continuous Drain Current (T

= 150 °C)

J

a, b

Pulsed Drain Current (10 µs Pulse Width)

Continuous Source-Drain Diode Current

Maximum Power Dissipation

a, b

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)

c, d

TC = 25 °C

T

= 70 °C

C

TA = 25 °C

TA = 70 °C

TC = 25 °C

TA = 25 °C

TC = 25 °C

T

= 70 °C

C

T

= 25 °C

A

TA = 70 °C

V

DS

V

GS

I

D

I

DM

I

S

P

D

, T

T

J

stg

- 8

± 8

c

-1.6

c

- 1.6

a, b, c

- 1.6

a, b, c

- 1.6

c

- 8

c

- 1.6

a, b

- 1.47

2.27

1.45

a, b

1.47

a, b

0.95

- 55 to 150

260

V

A

W

°C

THERMAL RESISTANCE RATINGS

Parameter Symbol Typical Maximum Unit

Maximum Junction-to-Ambient

a, d

t ≤ 5 s

Maximum Junction-to-Foot (Drain) Steady State

Notes: a. Surface Mounted on 1" x 1" FR4 board. b. t = 5 s. c. Package limited. d. Maximum under Steady State conditions is 125 °C/W.

Document Number: 74634 S-71945-Rev. A, 10-Sep-07

R

thJA

R

thJF

70 85

44 55

°C/W

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1

New Product

Si1405BDH

Vishay Siliconix

SPECIFICATIONS TJ = 25 °C, unless otherwise noted

Parameter Symbol Test Conditions Min Typ Max Unit

Static

Drain-Source Breakdown Voltage

V

Temperature Coefficient ΔVDS/T

DS

V

Temperature Coefficient ΔV

GS(th)

Gate-Source Threshold Voltage

Gate-Source Leakage

Zero Gate Voltage Drain Current

On-State Drain Current

Drain-Source On-State Resistance

Forward Transconductance

Dynamic

b

a

Input Capacitance

Reverse Transfer Capacitance

Total Gate Charge

V

DS

J

GS(th)/TJ

V

GS(th)

I

GSS

I

DSS

I

V

D(on)

r

DS(on)

g

fs

C

iss

C

oss

C

rss

Q

g

Qgs

Q

t

d(on)

t

d(off)

gd

R

g

t

r

t

f

Gate-Drain Charge

Gate Resistance

Tur n - On D e l a y T im e

Rise Time

Turn-Off Delay Time

Fall Time

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode Current

Pulse Diode Forward Current

Body Diode Voltage

Body Diode Reverse Recovery Time

Body Diode Reverse Recovery Charge

Reverse Recovery Fall Time

Reverse Recovery Rise Time

Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

I

S

I

SM

V

SD

t

rr

Q

rr

t

a

t

b

VGS = 0 V, ID = - 250 µA

ID = - 250 µA

V

= VGS, ID = - 250 µA

DS

VDS = 0 V, VGS = - 8 V

V

DS

= - 8 V, V

DS

= - 8 V, V

V

GS

≤ 5 V, V

DS

= - 4.5 V, ID = - 2.8 A

GS

= - 2.5 V, ID = - 2.3 A

GS

= - 1.8 V, ID = - 0.5 A

GS

= 0 V

GS

= 0 V, TJ = 55 °C

= - 4.5 V

GS

VDS = - 4 V, ID = - 2.8 A

VDS = - 4 V, V

= 0 V, f = 1 MHz

GS

= - 4.5 V, ID = - 2.8 A

GS

f = 1 MHz 6.3 Ω

V

= - 4 V, RL = 1.78 Ω

DD

≅ - 2.25 A, V

I

D

= - 4.5 V, Rg = 1 Ω

GEN

TC = 25 °C

IS = 1.4 A, V

GS

= 0 V

IF = - 1.4 A, di/dt = 100 A/µs, TJ = 25 °C

- 8 V

- 5.4

1.98

mV/°C

- 0.45 - 0.95 V

- 100 nA

- 1

- 10

- 8 A

0.091 0.112

0.132 0.160

0.171 0.205

4.8 S

305

108

66

3.67 5.5

0.61

0.98

10 15

26 39

16 24

7 10.5

- 1.6

- 8

- 0.8 - 1.2 V

23 35 ns

5.8 8.7 nC

6

17

µA

Ω

pFOutput Capacitance

nCGate-Source Charge

ns

A

ns

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Document Number: 74634

S-71945-Rev. A, 10-Sep-07

New Product

TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted

Si1405BDH

Vishay Siliconix

8

VGS = 5 V thru 2.5 V

6

VGS = 2 V

4

- Drain Current (A)I

D

2

0

01234

VDS - Drain-to-Source Voltage (V)

VGS = 1.5 V

Output Characteristics

0.5

0.4

VGS = 1.8 V

0.3

3.0

2.4

1.8

1.2

- Drain Current (A)I

D

0.6

0.0

0.0 0.4 0.8 1.2 1.6 2.0

VGS - Gate-to-Source Voltage (V)

TJ = 25 °C

TJ = 125 °C

Transfer Characteristics

500

400

C

iss

300

TJ = - 55 °C

- D to S On-Resistance (Ω)r

DS(on)

0.2

0.1

0.0 02468

VGS = 2.5 V

VGS = 4.5 V

ID - Drain Current (A)

On-Resistance vs. Drain Current and Gate Voltage

5

- Gate-to-Source Voltage (V)

GS

V

ID = 2.8 A

4

3

2

1

0

012345

VDS = 4 V

VDS = 6.4 V

Qg - Total Gate Charge (nC)

Gate Charge

200

C - Capacitance (pF)

100

0

02468

1.8

1.5

1.2

- On-Resistance r

(Normalized)

0.9

DS(on)

0.6

0.3

- 50 - 25 0 25 50 75 100 125 150

On-Resistance vs. Junction Temperature

C

oss

C

rss

VDS - Drain-to-Source Voltage (V)

Capacitance

VGS = 4.5 V, ID = 2.8 A

= 2.5 V, ID = 2.3 A

V

GS

VGS = 1.8 V, ID = 0.5 A

TJ- Junction Temperature (°C)

Document Number: 74634 S-71945-Rev. A, 10-Sep-07

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Vishay Si1405BDH Schematic [ru]