VISHAY SFH610A, SFH6106 User Manual

Page 1
SFH610A / SFH6106
Vishay Semiconductors
Optocoupler, High Reliability, 5300 V
Features
• Good CTR Linearity Depending on Forward Current
• Isolation Test Voltage, 5300 V
• High Collector-Emitter Voltage, V
= 70 V
CEO
• Low Saturation Voltage
• Fast Switching Times
• Low CTR Degradation
• Temperature Stable
• Low Coupling Capacitance
• End-Stackable, 0.100 " (2.54 mm) Spacing
• High Common-Mode Interference Immunity
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
RMS
e3
i179056
RMS
C
C
SFH610A
1
2
SFH6106
1
2
4
3
C
4
3
C
Agency Approvals
• UL1577, File No. E52744 System Code H or J, Double Protection
• DIN EN 60747-5-2 (VDE0884) DIN EN 60747-5-5 pending Available with Option 1
• CSA 93751
• BSI IEC60950 IEC60065
Description
The SFH610A (DIP) and SFH6106 (SMD) feature a high current transfer ratio, low coupling capacitance and high isolation voltage. These couplers have a GaAs infrared diode emitter, which is optically cou­pled to a silicon planar phototransistor detector, and is incorporated in a plastic DIP-4 or SMD package.
The coupling devices are designed for signal trans­mission between two electrically separated circuits.
The couplers are end-stackable with 2.54 mm spac­ing.
Creepage and clearance distances of > 8.0 mm are achieved with option 6. This version complies with IEC 60950 (DIN VDE 0805) for reinforced insulation up to an operation voltage of 400 V ifications subject to change.
or DC. Spec-
RMS
Order Information
Part Remarks
SFH610A-1 CTR 40 - 80 %, DIP-4
SFH610A-2 CTR 63 - 125 %, DIP-4
SFH610A-3 CTR 100 - 200 %, DIP-4
SFH610A-4 CTR 160 - 320 %, DIP-4
SFH610A-5 CTR 250 - 500 %, DIP-4
SFH6106-1 CTR 40 - 80 %, SMD-4
SFH6106-2 CTR 63 - 125 %, SMD-4
SFH6106-3 CTR 100 - 200 %, SMD-4
SFH6106-4 CTR 160 - 320 %, SMD-4
SFH6106-5T CTR 250 - 500 %, SMD-4, tape and reel
SFH610A-1X006 CTR 40 - 80 %, DIP-4 400 mil (option 6)
SFH610A-2X006 CTR 63 - 125 %, DIP-4 400 mil (option 6)
SFH610A-3X006 CTR 100 - 200 %, DIP-4 400 mil (option 6)
SFH610A-3X007 CTR 100 - 200 %, SMD-4 (option 7)
SFH610A-4X006 CTR 160 - 320 %, DIP-4 400 mil (option 6)
For additional information on the available options refer to Option Information.
Document Number 83666
Rev. 1.7, 11-May-05
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1
Page 2
SFH610A / SFH6106
Vishay Semiconductors
Absolute Maximum Ratings
T
= 25 °C, unless otherwise specified
amb
Stresses in excess of the absolute Maximum Ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute Maximum Rating for extended periods of the time can adversely affect reliability.
Input
Parameter Test condition Symbol Val ue Unit
Reverse voltage V
DC Forward current I
Surge forward current t 10 µsI
Power dissipation P
R
F
FSM
diss
Output
Parameter Test condition Symbol Val ue Unit
Collector-emitter voltage V
Emitter-collector voltage V
Collector current I
t 1.0 ms I
Power dissipation P
CE
EC
C
C
diss
6.0 V
60 mA
2.5 A
100 mW
70 V
7.0 V
50 mA
100 mA
150 mW
Coupler
Parameter Test condition Symbol Val ue Unit
Isolation test voltage between emitter and detector, refer to
V
ISO
climate DIN 40046, part 2, Nov. 74
Creepage 7.0 mm
Clearance 7.0 mm
Insulation thickness between emitter and detector
Comparative Tracking index per DIN IEC 112/VDEO 303, part 1
Isolation resistance V
= 500 V, T
IO
V
= 500 V, T
IO
Storage temperature range T
Ambient temperature range T
Junction temperature T
Soldering temperature max. 10 s. dip soldering
= 25 °C R
amb
= 100 °C R
amb
T
IO
IO
stg
amb
j
sld
distance to seating plane 1.5 mm
5300 V
0.4 mm
175
12
10
11
10
- 55 to + 150 °C
- 55 to + 100 °C
100 °C
260 °C
RMS
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2
Document Number 83666
Rev. 1.7, 11-May-05
Page 3
SFH610A / SFH6106
Vishay Semiconductors
Electrical Characteristics
T
= 25 °C, unless otherwise specified
amb
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluation. Typical values are for information only and are not part of the testing requirements.
Input
(IR GaAs)
Parameter Test condition Symbol Min Ty p. Max Unit
Forward voltage I
Reverse current V
Capacitance V
Thermal resistance R
= 60 mA V
F
= 6.0 V I
R
= 0 V, f = 1.0 MHz C
R
F
R
O
thja
Output
(Si Phototransistor)
Parameter Test condition Part Symbol Min Ty p. Max Unit
Collector-emitter capacitance V
Thermal resistance R
Collector-emitter leakage current
= 5 V, f = 1.0 MHz C
CE
V
= 10 V SFH610A-1
CE
SFH6106-1
SFH610A-2
SFH6106-2
SFH610A-3
SFH6106-3
SFH610A-4
SFH6106-4
SFH610A-5
SFH6106-5T
I
CEO
I
CEO
I
CEO
I
CEO
I
CEO
CE
thja
1.25 1.65 V
0.01 10 µA
13 pF
750 K/W
5.2 pF
500 K/W
2.0 50 nA
2.0 50 nA
5.0 100 nA
5.0 100 nA
5.0 100 nA
Coupler
Parameter Test condition Symbol Min Ty p. Max Unit
Collector-emitter saturation voltage
Coupling capacitance C
Document Number 83666
Rev. 1.7, 11-May-05
= 10 mA, f = 1.0 MHz V
I
F
CEsat
C
0.4 0.25 V
0.4 pF
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Page 4
SFH610A / SFH6106
Vishay Semiconductors
Current Transfer Ratio
Parameter Test condition Part Symbol Min Ty p. Max Unit
I
C/IF
IF = 10 mA, VCE = 5.0 V SFH610A-1
= 1.0 mA, VCE = 5.0 V SFH610A-1
I
F
SFH6106-1
SFH610A-2 SFH6106-2
SFH610A-3 SFH6106-3
SFH610A-4 SFH6106-4
SFH610A-5
SFH6106-5T
SFH6106-1
SFH610A-2 SFH6106-2
SFH610A-3 SFH6106-3
SFH610A-4 SFH6106-4
CTR 40 80 %
CTR 63 125 %
CTR 100 200 %
CTR 160 320 %
CTR 250 500 %
CTR 13 30 %
CTR 22 45 %
CTR 34 70 %
CTR 56 90 %
Switching Non-saturated
Para meter Current Rise time Fall time Turn-on tim Turn-off time Cut-off frequency
Test condition VCC = 5.0 V, RL = 75 VCC = 5.0 V
Symbol I
Unit mA µs µs µs µs kHz
F
10 2.0 2.0 3.0 2.3 250
t
r
t
f
t
on
t
off
F
Switching Saturated
Parameter Current Rise time Fall time Turn-on time Turn-off time
Symbol I
Unit mA µs µs µs µs
SFH610A-1 SFH6106-1
SFH610A-2 SFH6106-2
SFH610A-3 SFH6106-3
SFH610A-4 SFH6106-4
F
20 2.0 11 3.0 18
10 3.0 14 4.2 23
10 3.0 14 4.2 23
5.0 4.6 15 6.0 25
t
r
t
f
t
on
t
off
CO
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Document Number 83666
Rev. 1.7, 11-May-05
Page 5
SFH610A / SFH6106
Vishay Semiconductors
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
I
F
RL=75
I
C
47
isfh610a_01
Figure 1. Linear Operation ( without Saturation)
I
F
1.0 k
47
V
=5V
CC
isfh610a_04
Figure 4. Output Characteristics (typ.) Collector Current vs.
Collector-Emitter Voltage
VF=f(IF)
V
=5V
CC
isfh610a_02
Figure 2. Switching Operation (with Saturation)
IF= 10 mA, VCC= 5.0 V
isfh610a_03
Figure 3. Current Transfer Ratio (CTR) vs. Temperature
Document Number 83666
Rev. 1.7, 11-May-05
isfh610a_05
Figure 5. Diode Forward Voltage vs. Forward Current
f = 1.0 MHz
isfh610a_06
Figure 6. Transistor Capacitance (typ.) vs. Collector-Emitter
Voltage
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Page 6
SFH610A / SFH6106
Vishay Semiconductors
Pulse cycle D = parameter,
isfh610a_07
Figure 7. Permissible Pulse Handling Capability Forward Current
vs. Pulse Width
P
=f(TA)
tot
isfh610a_08
Figure 8. Permissible Power Dissipation vs. Temperature
isfh610a_09
Figure 9. Permissible Diode Forward Current vs. Ambient
Temperature
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Document Number 83666
Rev. 1.7, 11-May-05
Page 7
Package Dimensions in Inches (mm)
2
1
pin one ID
.255 (6.48) .268 (6.81)
3
4
.179 (4.55) .190 (4.83)
.031 (.79) typ. .050 (1.27) typ.
.130 (3.30) .150 (3.81)
.020 (.508 ) .035 (.89)
.050 (1.27)
.100 (2.54)
i178027
.030 (.76) .045 (1.14)
typ.
.018 (.46) .022 (.56)
ISO Method A
.300 (7.62) typ.
10°
3°–9°
.008 (.20) .012 (.30)
SFH610A / SFH6106
Vishay Semiconductors
.230 (5.84) .250 (6.35)
.110 (2.79) .130 (3.30)
Package Dimensions in Inches (mm)
SMD
pin one ID
.255 (6.48) .268 (6.81)
34
.179 (4.55) .190 (4.83)
ISO Method A
i178029
.030 (.76) .045 (1.14)
4° typ.
1.00 (2.54)typ.
.050 (1.27)
typ.
.031 (.79) typ.
.130 (3.30) .150 (3.81)
.0098 (.249) .035 (.102)
Lead
coplanarity
.004 max.
.100 (2.54)
R .010 (.25)
.315 (8.00) mi
.435 (11.05)
.375 (9.52)
.395 (10.03)
.296 (7.52) .312 (7.90)
°
10
.315 (8.00)
min.
.020 (.508) .040 (1.02)
.030 (.76)
.070 (1.78)
n
.060 (1.52)
.010 (.25)
typ.
3°–7°
Document Number 83666
Rev. 1.7, 11-May-05
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Page 8
SFH610A / SFH6106
Vishay Semiconductors
18487
Option 6
.407 (10.36)
.391 (9.96)
.307 (7.8) .291 (7.4)
.014 (0.35)
.010 (0.25) .400 (10.16) .430 (10.92)
.028 (0.7)
MIN.
Option 7
.300 (7.62)
TYP.
.315 (8.0)
MIN.
.331 (8.4)
MIN.
.406 (10.3)
MAX.
.180 (4.6) .160 (4.1)
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Document Number 83666
Rev. 1.7, 11-May-05
Page 9
SFH610A / SFH6106
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 83666
Rev. 1.7, 11-May-05
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Page 10
Legal Disclaimer Notice
Vishay
Document Number: 91000 www.vishay.com Revision: 08-Apr-05 1
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.
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