IRFZ40, SiHFZ40
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
VDS (V) |
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60 |
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RDS(on) ( ) |
VGS = 10 V |
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0.028 |
Qg (Max.) (nC) |
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67 |
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Qgs (nC) |
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18 |
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Qgd (nC) |
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25 |
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Configuration |
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Single |
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D
TO-220AB
G
S
D S
G
N-Channel MOSFET
FEATURES
• Dynamic dV/dt Rating
• 175 °C Operating Temperature
• Fast Switching
•Ease of Paralleling
•Simple Drive Requirements
•Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The TO-220AB package is universially preferred for commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO-220AB contribute to its wide acceptance throughout the industry.
ORDERING INFORMATION |
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Package |
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TO-220AB |
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Lead (Pb)-free |
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IRFZ40PbF |
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SiHFZ40-E3 |
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SnPb |
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IRFZ40 |
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SiHFZ40 |
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ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) |
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PARAMETER |
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SYMBOL |
LIMIT |
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UNIT |
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Drain-Source Voltage |
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VDS |
60 |
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V |
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Gate-Source Voltage |
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VGS |
± 20 |
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Continuous Drain Currente |
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VGS at 10 V |
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TC = 25 °C |
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ID |
50 |
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Continuous Drain Current |
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TC = 100 °C |
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36 |
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A |
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Pulsed Drain Currenta |
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IDM |
200 |
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Linear Derating Factor |
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1.0 |
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W/°C |
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Single Pulse Avalanche Energyb |
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EAS |
100 |
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mJ |
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Maximum Power Dissipation |
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TC = 25 °C |
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PD |
150 |
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W |
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Peak Diode Recovery dV/dtc |
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dV/dt |
4.5 |
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V/ns |
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Operating Junction and Storage Temperature Range |
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TJ, Tstg |
- 55 to + 175 |
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°C |
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Soldering Recommendations (Peak Temperature)d |
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for 10 s |
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300 |
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Mounting Torque |
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6-32 or M3 screw |
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10 |
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lbf · in |
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1.1 |
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N · m |
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Notes |
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a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). |
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b. VDD = 25 V, starting TJ = 25 °C, L = 44 μH, Rg = 25 , IAS = 51 A (see fig. 12). |
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c. ISD 51 A, dI/dt 250 A/μs, VDD VDS, TJ 175 °C. |
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d. 1.6 mm from case. |
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e. Current limited by the package, (die current = 51 A). |
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* Pb containing terminations are not RoHS compliant, exemptions may apply |
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Document Number: 91385 |
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www.vishay.com |
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S11-0520-Rev. B, 21-Mar-11 |
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1 |
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IRFZ40, SiHFZ40
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER |
SYMBOL |
TYP. |
MAX. |
UNIT |
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Maximum Junction-to-Ambient |
RthJA |
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62 |
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Case-to-Sink, Flat, Greased Surface |
RthCS |
0.50 |
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°C/W |
Maximum Junction-to-Case (Drain) |
RthJC |
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1.0 |
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SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER |
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SYMBOL |
TEST CONDITIONS |
MIN. |
TYP. |
MAX. |
UNIT |
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Static |
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Drain-Source Breakdown Voltage |
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VDS |
VGS = 0 V, ID = 250 μA |
60 |
- |
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V |
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VDS Temperature Coefficient |
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VDS/TJ |
Reference to 25 °C, ID = 1 mA |
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0.060 |
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V/°C |
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Gate-Source Threshold Voltage |
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VGS(th) |
VDS = VGS, ID = 250 μA |
2.0 |
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4.0 |
V |
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Gate-Source Leakage |
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IGSS |
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VGS = ± 20 V |
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± 100 |
nA |
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Zero Gate Voltage Drain Current |
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IDSS |
VDS = 60 V, VGS = 0 V |
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25 |
μA |
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VDS = 48 V, VGS = 0 V, TJ = 125 °C |
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250 |
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Drain-Source On-State Resistance |
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RDS(on) |
VGS = 10 V |
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ID = 31 Ab |
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0.028 |
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Forward Transconductance |
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gfs |
VDS = 25 V, ID = 31 A |
15 |
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S |
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Dynamic |
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Input Capacitance |
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Ciss |
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VGS = 0 V, |
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1900 |
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Output Capacitance |
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Coss |
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pF |
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VDS = 25 V, |
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920 |
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f = 1.0 MHz, see fig. 5 |
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Reverse Transfer Capacitance |
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Crss |
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170 |
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Total Gate Charge |
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Qg |
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67 |
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VGS = 10 V |
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ID = 51 A, VDS = 48 V, |
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nC |
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Gate-Source Charge |
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Qgs |
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18 |
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see fig. 6 and 13b |
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Gate-Drain Charge |
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Qgd |
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- |
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25 |
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Turn-On Delay Time |
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td(on) |
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14 |
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Rise Time |
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tr |
VDD = 30 V, ID = 51 A, |
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110 |
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ns |
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Turn-Off Delay Time |
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td(off) |
Rg = 9.1 , RD = 0.55 , see fig. 10b |
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45 |
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Fall Time |
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tf |
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92 |
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Internal Drain Inductance |
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LD |
Between lead, |
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D |
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4.5 |
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6 mm (0.25") from |
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nH |
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Internal Source Inductance |
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LS |
package and center of |
G |
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7.5 |
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die contact |
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S |
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Drain-Source Body Diode Characteristics |
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Continuous Source-Drain Diode Current |
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IS |
MOSFET symbol |
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D |
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50 |
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showing the |
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A |
Pulsed Diode Forward Currenta |
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ISM |
integral reverse |
G |
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- |
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200 |
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p - n junction diode |
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S |
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Body Diode Voltage |
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VSD |
TJ = 25 °C, IS = 51 A, VGS = 0 Vb |
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2.5 |
V |
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Body Diode Reverse Recovery Time |
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trr |
TJ = 25 °C, IF = 51 A, dI/dt = 100 A/ s |
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120 |
180 |
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Body Diode Reverse Recovery Charge |
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Qrr |
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0.53 |
0.80 |
nC |
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Forward Turn-On Time |
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ton |
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD) |
Notes
a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b.Pulse width 300 μs; duty cycle 2 %.
www.vishay.com |
Document Number: 91385 |
2 |
S11-0520-Rev. B, 21-Mar-11 |
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IRFZ40, SiHFZ40
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Fig. 1 - Typical Output Characteristics, TC = 25 °C |
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Fig. 1 - Typical Transfer Characteristics |
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Fig. 2 - Typical Output Characteristics, TC = 175 °C |
Fig. 2 - Normalized On-Resistance vs. Temperature |
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Document Number: 91385 |
www.vishay.com |
S11-0520-Rev. B, 21-Mar-11 |
3 |
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000