Power MOSFET
N-Channel MOSFET
G
D
S
HVMDIP
D
S
G
IRFD110, SiHFD110
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) 100
R
()V
DS(on)
Q
(Max.) (nC) 8.3
g
Q
(nC) 2.3
gs
Q
(nC) 3.8
gd
Configuration Single
= 10 V 0.54
GS
FEATURES
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• For Automatic Insertion
•End Stackable
• 175 °C Operating Temperature
• Fast Switching and Ease of Paralleling
• Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The 4 pin DIP package is a low cost machine-insertable
case style which can be stacked in multiple combinations on
standard 0.1" pin centers. The dual drain serves as a thermal
link to the mounting surface for power dissipation levels up
to 1 W.
ORDERING INFORMATION
Package HVMDIP
Lead (Pb)-free
SnPb
IRFD110PbF
SiHFD110-E3
IRFD110
SiHFD110
Available
RoHS*
COMPLIANT
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
Gate-Source Voltage V
= 25 °C
T
Continuous Drain Current V
Pulsed Drain Current
a
at 10 V
GS
A
= 100 °C 0.71
A
DS
± 20
GS
I
D
IDM 8.0
Linear Derating Factor 0.0083 W/°C
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation T
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range T
b
a
a
= 25 °C P
A
c
E
AS
I
AR
E
AR
D
dV/dt 5.5 V/ns
, T
J
stg
Soldering Recommendations (Peak Temperature) for 10 s 300
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
= 25 V, starting TJ = 25 °C, L = 52 mH, Rg = 25 , IAS = 2.0 A (see fig. 12).
DD
c. I
5.6 A, dI/dt 75 A/μs, VDD VDS, TJ 175 °C.
SD
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91127 www.vishay.com
S10-2466-Rev. C, 25-Oct-10 1
100
1.0
140 mJ
1.0 A
0.13 mJ
1.3 W
- 55 to + 175
d
V
AT
°C
IRFD110, SiHFD110
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
thJA
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
V
Temperature Coefficient VDS/TJ Reference to 25 °C, ID = 1 mA - 0.12 - V/°C
DS
Gate-Source Threshold Voltage V
Gate-Source Leakage I
Zero Gate Voltage Drain Current I
Drain-Source On-State Resistance R
Forward Transconductance g
Dynamic
Input Capacitance C
Reverse Transfer Capacitance C
Total Gate Charge Q
Gate-Drain Charge Q
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Internal Drain Inductance L
Internal Source Inductance L
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
Pulsed Diode Forward Current
a
Body Diode Voltage V
Body Diode Reverse Recovery Time t
Body Diode Reverse Recovery Charge Q
Forward Turn-On Time t
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width 300 μs; duty cycle 2 %.
DS
GS(th)
V
GSS
DSS
VGS = 10 V ID = 0.60 A
DS(on)
fs
iss
-81-
oss
-15-
rss
g
--2.3
gs
--3.8
gd
d(on)
r
-15-
d(off)
-9.4-
f
D
V
V
GS
R
Between lead,
6 mm (0.25") from
package and center of
S
S
die contact
MOSFET symbol
showing the
integral reverse
I
SM
SD
rr
rr
on
p - n junction diode
TJ = 25 °C, IF = 5.6 A, dI/dt = 100 A/μs
- 120 °C/W
VGS = 0 V, ID = 250 μA 100 - - V
VDS = VGS, ID = 250 μA 2.0 - 4.0 V
= ± 20 V - - ± 100 nA
GS
VDS = 100 V, VGS = 0 V - - 25
= 80 V, VGS = 0 V, TJ = 150 °C - - 250
DS
VDS = 50 V, ID = 0.60 A
VGS = 0 V,
V
= 25 V,
DS
f = 1.0 MHz, see fig. 5
b
b
- - 0.54
0.80 - - S
- 180 -
--8.3
= 5.6 A, VDS = 80 V,
I
= 10 V
D
see fig. 6 and 13
b
-6.9-
V
= 50 V, ID = 5.6 A,
DD
= 24 , RD = 8.4 , see fig. 10
g
G
G
TJ = 25 °C, IS = 1.0 A, VGS = 0 V
b
D
S
D
S
b
-16-
-4.0-
-6.0-
--1.0
--8.0
--2.5V
- 100 200 ns
b
- 0.44 0.88 μC
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
μA
pFOutput Capacitance C
nC Gate-Source Charge Q
ns
nH
A
www.vishay.com Document Number: 91127
2 S10-2466-Rev. C, 25-Oct-10
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
91127_02
10
1
10
0
10
0
10
1
10
-1
Bottom
To p
V
GS
15 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
4.5 V
20 µs Pulse Width
T
A
= 175 °C
4.5 V
VDS, Drain-to-Source Voltage (V)
I
D
, Drain Current (A)
91127_03
10
1
10
0
I
D
, Drain Current (A)
V
GS
,
Gate-to-Source Voltage (V)
5678910
4
10
-1
25 °C
175 °C
20 µs Pulse Width
V
DS
= 50 V
91127_04
I
D
= 5.6 A
V
GS
= 10 V
3.0
0.0
0.5
1.0
1.5
2.0
2.5
- 60 - 40 - 20 0 20 406080 100 120 140 160
T
J
,
Junction Temperature (°C)
R
DS(on)
, Drain-to-Source On Resistance
(Normalized)
180
V
15 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
4.5 V
GS
To p
1
10
Bottom
0
10
IRFD110, SiHFD110
Vishay Siliconix
, Drain Current (A)
D
I
4.5 V
20 µs Pulse Width
= 25 °C
T
A
91127_01
-1
10
0
10
VDS, Drain-to-Source Voltage (V)
1
10
Fig. 1 - Typical Output Characteristics, TA = 25 °C
Fig. 3 - Typical Transfer Characteristics
Document Number: 91127 www.vishay.com
S10-2466-Rev. C, 25-Oct-10 3
Fig. 2 - Typical Output Characteristics, T
= 175 °C
A
Fig. 4 - Normalized On-Resistance vs. Temperature
IRFD110, SiHFD110
91127_05
400
320
240
160
0
80
10
0
10
1
Capacitance (pF)
V
DS
,
Drain-to-Source Voltage (V)
V
GS
= 0 V, f = 1 MHz
C
iss
= Cgs + Cgd, Cds Shorted
C
rss
= C
gd
C
oss
= Cds + C
gd
C
iss
C
rss
C
oss
91127_07
25 °C
175 °C
V
GS
= 0 V
10
-1
10
0
VSD, Source-to-Drain Voltage (V)
I
SD
, Reverse Drain Current (A)
0.5 0.90.80.70.6 1.0 1.21.1
Vishay Siliconix
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
20
ID = 5.6 A
V
= 80 V
16
V
= 20 V
12
DS
V
DS
DS
= 50 V
8
4
, Gate-to-Source Voltage (V)
GS
V
91127_06
0
02 864
QG, Total Gate Charge (nC)
For test circuit
see figure 13
10
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 7 - Typical Source-Drain Diode Forward Voltage
2
10
5
2
10
5
2
1
, Drain Current (A)
D
I
5
Operation in this area limited
by R
DS(on)
10 µs
100 µs
1 ms
10 ms
TA = 25 °C
91127_08
2
0.1
25 25 2
0.1
VDS, Drain-to-Source Voltage (V)
1
= 175 °C
T
J
Single Pulse
10
5
2
10
25
Fig. 8 - Maximum Safe Operating Area
3
10
www.vishay.com Document Number: 91127
4 S10-2466-Rev. C, 25-Oct-10
IRFD110, SiHFD110
91127_09
I
D
, Drain Current (A)
TA, Ambient Temperature (°C)
0.0
0.2
0.4
0.8
0.6
25 150125100
75
50 175
1.0
V
DS
90 %
10 %
V
GS
t
d(on)
t
r
t
d(off)
t
f
91127_11
0 - 0.5
0.2
0.1
0.05
0.01
Single Pulse
(Thermal Response)
P
DM
t
1
t
2
Notes:
1. Duty Factor, D = t
1/t2
2. Peak Tj = PDM x Z
thJC
+ T
C
0.02
Thermal Response (Z
thJA
)
t1, Rectangular Pulse Duration (s)
10
-5
10
-4
10
-3
10
-2
0.1 1 10
10
2
10
3
1
0.1
10
-2
10
2
10
10
3
Vishay Siliconix
R
D.U.T.
D
+
-
V
DS
V
GS
R
g
10 V
Pulse width ≤ 1 µs
Duty factor ≤ 0.1 %
Fig. 10a - Switching Time Test Circuit
V
DD
Fig. 9 - Maximum Drain Current vs. Ambient Temperature
Fig. 10b - Switching Time Waveforms
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Document Number: 91127 www.vishay.com
S10-2466-Rev. C, 25-Oct-10 5
IRFD110, SiHFD110
R
g
I
AS
0.01 W
t
p
D.U.T.
L
V
DS
+
-
V
DD
10 V
Var y t
p
to obtain
required I
AS
D.U.T.
3 mA
V
GS
V
DS
I
G
I
D
0.3 µF
0.2 µF
50 kΩ
12 V
Current regulator
Current sampling resistors
Same type as D.U.T.
+
-
Vishay Siliconix
Fig. 12a - Unclamped Inductive Test Circuit Fig. 12b - Unclamped Inductive Waveforms
V
DS
t
p
V
DS
I
AS
V
DD
10 V
350
300
250
200
150
100
To p
Bottom
I
D
0.82 A
1.4 A
2.0 A
, Single Pulse Energy (mJ)
AS
50
E
91127_12c
VDD = 25 V
0
25 150
50
Starting T
, Junction Temperature (°C)
J
125
10075
175
Fig. 12c - Maximum Avalanche Energy vs. Drain Current
Q
G
Q
GS
V
G
Q
GD
Charge
Fig. 13a - Basic Gate Charge Waveform Fig. 13b - Gate Charge Test Circuit
www.vishay.com Document Number: 91127
6 S10-2466-Rev. C, 25-Oct-10
P.W.
Period
dI/dt
Diode recovery
dV/dt
Ripple ≤ 5 %
Body diode forward drop
Re-applied
voltage
Reverse
recovery
current
Body diode forward
current
V
GS
= 10 Va
I
SD
Driver gate drive
D.U.T. l
SD
waveform
D.U.T. V
DS
waveform
Inductor current
D =
P.W.
Period
+
-
+
+
+
-
-
-
Peak Diode Recovery dV/dt Test Circuit
V
DD
• dV/dt controlled by R
g
• Driver same type as D.U.T.
•
I
SD
controlled by duty factor “D”
• D.U.T. - device under test
D.U.T.
Circuit layout considerations
• Low stray inductance
• Ground plane
• Low leakage inductance
current transformer
R
g
Note
a. V
GS
= 5 V for logic level devices
V
DD
IRFD110, SiHFD110
Vishay Siliconix
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?91127
Document Number: 91127 www.vishay.com
S10-2466-Rev. C, 25-Oct-10 7
.
Fig. 14 - For N-Channel
HVM DIP (High voltage)
Package Information
Vishay Siliconix
0.248 [6.29]
0.240 [6.10]
0.043 [1.09]
0.035 [0.89]
0.094 [2.38]
0.086 [2.18]
0.017 [0.43]
0.013 [0.33]
0° to 15°
2 x
E min.
E max.
0.133 [3.37]
0.125 [3.18]
0.045 [1.14]
2 x
0.035 [0.89]
A
0.100 [2.54] typ.
L
0.197 [5.00]
0.189 [4.80]
0.160 [4.06]
0.140 [3.56]
0.024 [0.60]
0.020 [0.51]
0.180 [4.57]
0.160 [4.06]
4 x
INCHES MILLIMETERS
DIM. MIN. MAX. MIN. MAX.
A 0.310 0.330 7.87 8.38
E 0.300 0.425 7.62 10.79
L 0.270 0.290 6.86 7.36
ECN: X10-0386-Rev. B, 06-Sep-10
DWG: 5974
Note
1. Package length does not include mold flash, protrusions or gate burrs. Package width does not include interlead flash or protrusions.
Document Number: 91361 www.vishay.com
Revision: 06-Sep-10 1
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Revision: 13-Jun-16
1
Document Number: 91000
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