Vishay IRFD024, SiHFD024 Data Sheet

Power MOSFET
N-Channel MOSFET
G
D
S
HVMDIP
D
S
G
Available
RoHS*
COMPLIANT
IRFD024, SiHFD024
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) 60
R
()V
DS(on)
Q
(Max.) (nC) 25
g
Q
(nC) 5.8
gs
Q
(nC) 11
gd
Configuration Single
= 10 V 0.10
GS
FEATURES
• Dynamic dV/dt Rating
•End Stackable
• 175 °C Operating Temperature
•Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The 4 pin DIP package is a low cost machine-insertable case style which can be stacked in multiple combinations on standard 0.1" pin centers. The dual drain serves as a thermal link to the mounting surface for power dissipation levels up to 1 W.
ORDERING INFORMATION
Package HVMDIP
Lead (Pb)-free
SnPb
IRFD024PbF SiHFD024-E3 IRFD024 SiHFD024
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
Gate-Source Voltage V
= 25 °C
T
Continuous Drain Current V
Pulsed Drain Current
a
at 10 V
GS
A
= 100 °C 1.8
A
DS
± 20
GS
I
D
IDM 20
Linear Derating Factor 0.0083 W/°C
Single Pulse Avalanche Energy
Maximum Power Dissipation T
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range T
b
= 25 °C P
A
c
E
AS
D
dV/dt 4.5 V/ns
, T
J
stg
Soldering Recommendations (Peak Temperature) for 10 s 300
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. V
= 25 V, starting TJ = 25 °C, L = 16 mH, Rg = 25 , IAS = 2.5 A (see fig. 12).
DD
17 A, dI/dt 140 A/μs, VDD VDS, TJ 175 °C.
c. I
SD
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91126 www.vishay.com S10-2466-Rev. C, 25-Oct-10 1
60
2.5
91 mJ
1.3 W
- 55 to + 175
d
V
AT
°C
IRFD024, SiHFD024
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
thJA
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
V
Temperature Coefficient VDS/TJ Reference to 25 °C, ID = 1 mA - 0.061 - V/°C
DS
Gate-Source Threshold Voltage V
Gate-Source Leakage I
Zero Gate Voltage Drain Current I
Drain-Source On-State Resistance R
Forward Transconductance g
Dynamic
Input Capacitance C
Reverse Transfer Capacitance C
Total Gate Charge Q
Gate-Drain Charge Q
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Internal Drain Inductance L
Internal Source Inductance L
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
Pulsed Diode Forward Current
a
Body Diode Voltage V
Body Diode Reverse Recovery Time t
Body Diode Reverse Recovery Charge Q
Forward Turn-On Time t
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width  300 μs; duty cycle  2 %.
DS
GS(th)
V
GSS
DSS
VGS = 10 V ID = 1.5 A
DS(on)
fs
iss
- 360 -
oss
-79-
rss
g
--5.8
gs
--11
gd
d(on)
r
-25-
d(off)
-42-
f
D
V
V
GS
R
Between lead, 6 mm (0.25") from package and center of
S
S
die contact
MOSFET symbol showing the
integral reverse
I
SM
SD
rr
rr
on
p - n junction diode
TJ = 25 °C, IF = 17 A, dI/dt = 100 A/μs
- 120 °C/W
VGS = 0 V, ID = 250 μA 60 - - V
VDS = VGS, ID = 250 μA 2.0 - 4.0 V
= ± 20 V - - ± 100 nA
GS
VDS = 60 V, VGS = 0 V - - 25
= 48 V, VGS = 0 V, TJ = 150 °C - - 250
DS
VDS = 25 V, ID = 1.5 A
VGS = 0 V,
V
= 25 V,
DS
f = 1.0 MHz, see fig. 5
b
b
- - 0.10
0.90 - - S
- 640 -
--25
= 17 A, VDS = 48 V,
I
= 10 V
D
see fig. 6 and 13
b
-13-
V
= 30 V, ID = 17 A,
DD
= 18 , RD = 1.7, see fig. 10
g
G
G
TJ = 25 °C, IS = 2.5 A, VGS = 0 V
b
D
S
D
S
b
-58-
-4.0-
-6.0-
--2.5
--20
--1.5V
- 80 180 ns
b
- 0.29 0.64 μC
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
μA
pFOutput Capacitance C
nC Gate-Source Charge Q
ns
nH
A
www.vishay.com Document Number: 91126 2 S10-2466-Rev. C, 25-Oct-10
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
TA = 25 °C
TA = 175 °C
IRFD024, SiHFD024
Vishay Siliconix
Fig. 1 - Typical Output Characteristics, TA = 25 °C
Fig. 2 - Typical Output Characteristics, T
= 175 °C
A
Fig. 3 - Typical Transfer Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
Document Number: 91126 www.vishay.com S10-2466-Rev. C, 25-Oct-10 3
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