Vishay IRF840L, SiHF840L Data Sheet

www.vishay.com

N-Channel MOSFET

G

D

S

I2PAK

(TO-262)

S

D

G

IRF840L, SiHF840L

Vishay Siliconix

Power MOSFET

PRODUCT SUMMARY

VDS (V) 500

R

()V

DS(on)

Q

max. (nC) 63

g

Q

(nC) 9.3

gs

Q

(nC) 32

gd

Configuration Single

= 10 V 0.85

GS

FEATURES

• Dynamic dV/dt rating

• Repetitive avalanche rated

• Fast switching

• Ease of paralleling

Available

Available

• Simple drive requirements

• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912

Note

*

Thi s datasheet pro vi des information about parts that are
RoHS-compliant and / or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details.





DESCRIPTION

Third generation power MOSFETs from Vishay provide the
designer with best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness. 

2

PAK (TO-262) is a power package capable of

The I
accommodating die sizes up to HEX-4. It provides the
highest power capability and lowest possible on-resistance.

2

PAK (TO-262) is suitable for high current applications

The I
because of its low internal connection resistance and can
dissipate up to 2.0 W.

ORDERING INFORMATION

Package I2PAK (TO-262)

Lead (Pb)-free and Halogen-free SiHF840L-GE3

Lead (Pb)-free

IRF840LPbF

SiHF840L-E3

ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)

PARAMETER SYMBOL LIMIT UNIT

Drain-Source Voltage V

Gate-Source Voltage V

T

= 25 °C

Continuous Drain Current V

Pulsed Drain Current

a

at 10 V

GS

C

= 100 °C 5.1

C

DS

± 20 V

GS

I

D

IDM 32

Linear Derating Factor 1.0 W/°C

Single Pulse Avalanche Energy

Repetitive Avalanche Current

Repetitive Avalanche Energy

Maximum Power Dissipation

Peak Diode Recovery dV/dt

Operating Junction and Storage Temperature Range T

Soldering Recommendations (Peak temperature)

b

a

a

T

= 25 °C

C

= 100 °C 50

T

c

d

C

for 10 s 300

E

AS

I

AR

E

AR

P

D

dV/dt 3.5 V/ns

, T

J

stg

Notes

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V

= 50 V, starting TJ = 25 °C, L = 14 mH, Rg = 25 , IAS = 8.0 A (see fig. 12).

DD

c. I

 8.0 A, dI/dt  100 A/μs, VDD  VDS, TJ  150 °C.

SD

d. 1.6 mm from case.

S16-0754-Rev. C, 02-May-16

1

For technical questions, contact: [e-mail]

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

500 V

8.0

510 mJ

8.0 A

13 mJ

125

-55 to +150

Document Number: 91069

AT

W

°C

IRF840L, SiHF840L

D

S

G

S

D

G

www.vishay.com

THERMAL RESISTANCE RATINGS

PARAMETER SYMBOL TYP. MAX. UNIT

Maximum Junction-to-Ambient R

Maximum Junction-to-Case (Drain) R

thJA

thJC

-62

-1.0

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT

Static

Drain-Source Breakdown Voltage V

V

Temperature Coefficient VDS/TJ Reference to 25 °C, ID = 1 mA - 0.78 - V/°C

DS

Gate-Source Threshold Voltage V

Gate-Source Leakage I

Zero Gate Voltage Drain Current I

Drain-Source On-State Resistance R

Forward Transconductance g

DS

GS(th)

V

GSS

DSS

V

DS(on)

fs

Dynamic

Input Capacitance C

Reverse Transfer Capacitance C

Total Gate Charge Q

Gate-Drain Charge Q

Turn-On Delay Time t

Rise Time t

Turn-Off Delay Time t

Fall Time t

Internal Drain Inductance L

iss

-310-

oss

-120-

rss

g

--9.3

gs

--32

gd

d(on)

r

-49-

d(off)

-20-

f

D

Between lead,
6 mm (0.25") from
package and center of

Internal Source Inductance L

S

die contact

VGS = 0 V, ID = 250 μA 500 - - V

VDS = VGS, ID = 250 μA 2.0 - 4.0 V

= ± 20 V - - ± 100 nA

GS

VDS = 500 V, VGS = 0 V - - 25

= 400 V, VGS = 0 V, TJ = 125 °C - - 250

V

DS

= 10 V ID = 4.8 A

GS

VDS = 50 V, ID = 4.8 A

b

b

VGS = 0 V,

V

= 25 V,

DS

f = 1.0 MHz, see fig. 5

= 8 A, VDS = 400 V

I

V

= 10 V

GS

V

DD

R

= 9.1 , RD = 31, see fig. 10

g

D

see fig. 6 and 13

= 250 V, ID = 8.0 A

b

b

Vishay Siliconix

°C/W

μA

- - 0.85 

4.9 - - S

- 1300 -

pFOutput Capacitance C

--63

nC Gate-Source Charge Q

-14-

-23-

-4.5-

-7.5-

ns

nH

Gate Input Resistance R

g

f = 1 MHz, open drain 0.6 - 2.8 

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode Current I

Pulsed Diode Forward Current

a

Body Diode Voltage V

Body Diode Reverse Recovery Time t

Body Diode Reverse Recovery Charge Q

Forward Turn-On Time t

S

MOSFET symbol
showing the 
integral reverse

I

SM

SD

rr

rr

on

p - n junction diode

TJ = 25 °C, IS = 8 A, VGS = 0 V

b

TJ = 25 °C, IF = 8.0 A, dI/dt = 100 A/μs

Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

--8.0

--32

--2.0V

- 460 970 ns

b

-4.28.9μC

A

Notes

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width  300 μs; duty cycle  2 %.

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

For technical questions, contact: [e-mail]

S16-0754-Rev. C, 02-May-16

2

Document Number: 91069

www.vishay.com

91069_01

VDS, Drain-to-Source Voltage (V)

I

D

, Drain Current (A)

10

1

10

0

10

0

10

1

Bottom

To p

V

GS

15 V
10 V

8.0 V

7.0 V

6.0 V

5.5 V

5.0 V

4.5 V

20 µs Pulse Width
T

C

= 25 °C

4.5 V

91069_03

25 °C

150 °C

20 µs Pulse Width
V

DS

= 50 V

10

1

10

0

I

D

, Drain Current (A)

V

GS

,

Gate-to-Source Voltage (V)

5678910

4

91069_05

2500

2000

1500

1000

0

500

10

0

10

1

Capacitance (pF)

V

DS

,

Drain-to-Source Voltage (V)

C

iss

C

rss

C

oss

V

GS

= 0 V, f = 1 MHz

C

iss

= Cgs + Cgd, Cds Shorted

C

rss

= C

gd

C

oss

= Cds + C

gd

91069_06

QG, Total Gate Charge (nC)

V

GS

, Gate-to-Source Voltage (V)

20

16

12

8

0

4

0

15

75

6045

30

ID = 8.0 A

For test circuit
see figure 13

V

DS

= 250 V

V

DS

= 100 V

V

DS

= 400 V

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

IRF840L, SiHF840L

3.0

ID = 8.0 A

= 10 V

V

GS

2.5

2.0

1.5

(Normalized)

1.0

0.5

, Drain-to-Source On Resistance

DS(on)

0.0

R

- 60 - 40 - 20 0 20 40 60 80 100 120 140 160

T

Junction Temperature (°C)

91069_04

,

J

Vishay Siliconix

Fig. 1 - Typical Output Characteristics, TC = 25 °C

V

To p

1

10

Bottom

, Drain Current (A)

D

I

0

10

0

10

91069_02

Fig. 2 - Typical Output Characteristics, T

GS

15 V
10 V

8.0 V

7.0 V

6.0 V

5.5 V

5.0 V

4.5 V

20 µs Pulse Width
T

1

10

V

Drain-to-Source Voltage (V)

,

DS

= 150 °C

C

C

4.5 V

= 150 °C

Fig. 4 - Normalized On-Resistance vs. Temperature

Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage

S16-0754-Rev. C, 02-May-16

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 3 - Typical Transfer Characteristics

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

For technical questions, contact: [e-mail]

Fig. 6 - Typical Gate Charge vs. Drain-to-Source Voltage

3

Document Number: 91069