VISHAY BYT53 User Manual

Ultra Fast Avalanche Sinterglass Diode

Features

• Glass passivated junction

• Hermetically sealed package

• Low reverse current

• Soft recovery characteristics

• Lead (Pb)-free component

• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC

e2

BYT53.

Vishay Semiconductors

949539

Applications

Very fast rectification and switches
Switched mode power supplies
High-frequency inverter circuits

Parts Table

Part Type differentiation Package

BYT53A V

BYT53B V

BYT53C V

BYT53D V

BYT53F V

BYT53G V

Absolute Maximum Ratings

T

= 25 °C, unless otherwise specified

amb

Parameter Test condition Part Symbol Val ue Unit

Reverse voltage = Repetitive
peak reverse voltage

Peak forward surge current t

see electrical characteristics BYT53A V

= 10 ms, half sinewave I

p

= 50 V; I

R

= 100 V; I

R

= 150 V; I

R

= 200 V; I

R

= 300 V; I

R

= 400 V; I

R

Mechanical Data

Case: SOD-57 Sintered glass case
Terminals: Plated axial leads, solderable per

MIL-STD-750, Method 2026

Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: approx. 369 mg

= 1.9 A SOD-57

FAV

= 1.9 A SOD-57

FAV

= 1.9 A SOD-57

FAV

= 1.9 A SOD-57

FAV

= 1.9 A SOD-57

FAV

= 1.9 A SOD-57

FAV

= V

R

BYT53B V

BYT53C V

BYT53D V

BYT53F V

BYT53G V

R

R

R

R

R

= V

= V

= V

= V

= V

FSM

RRM

RRM

RRM

RRM

RRM

RRM

50 V

100 V

150 V

200 V

300 V

400 V

50 A

Document Number 86030

Rev. 1.8, 14-Apr-05

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1

BYT53.

Vishay Semiconductors

Parameter Test condition Part Symbol Valu e Unit

Average forward current l = 10 mm, TL = 25 °C I

Junction and storage
temperature range

Non repetitive reverse
avalanche energy

Maximum Thermal Resistance

T

= 25 °C, unless otherwise specified

amb

Parameter Test condition Part Symbol Valu e Unit

Junction ambient l = 10 mm, T

Electrical Characteristics

T

= 25 °C, unless otherwise specified

amb

Parameter Test condition Par t Symbol Min Ty p . Max Unit

Forward voltage I

Reverse current V

Reverse recovery time I

= 1 A E

I

(BR)R

= constant R

L

on PC board with spacing
25 mm

= 1 A V

F

I

= 1 A, Tj = 175 °C V

F

= V

R

RRM

V

= V

R

= 0.5 A, IR = 1 A, iR = 0.25 A t

F

, Tj = 150 °C I

RRM

F

F

I

R

R

rr

FAV

T

= T

j

stg

R

thJA

R

thJA

1.9 A

- 55 to + 175 °C

20 mJ

45 K/W

100 K/W

1.1 V

0.9 V

5 µA

200 µA

50 ns

Typical Characteristics (Tamb = 25 °C unless otherwise specified)

120

10

100

Tj= 175 °C

80

thJA

R - Therm. Resist. Junction/Ambient (K/W)

94 9552

60

40

20

0

0

51015 25

l - Lead Length ( mm )

ll

TL= constant

20

30

Figure 1. Max. Thermal Resistance vs. Lead Length

1

Tj=25°C

0.1

0.01

F

I - Forward Current(A)

0.001
0 0.5 1 1.5 2 2.5 3

16333

VF- Forward Voltage(V)

Figure 2. Forward Current vs. Forward Voltage

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2

Document Number 86030

Rev. 1.8, 14-Apr-05