Datasheet BB639, BB659 Datasheet (Vishay) [ru]

Silicon Variable Capacitance Diodes
g
For tuning of extended frequency band
in VHF TV / VTR tuners
High capacitance ratio
Low series inductance
Low series resistance
"in-line" matching assembly procedure
Pb-free (RoHS compliant) package
BB639 BB659
BB639/BB659...
Type Package Configuration L
BB639 BB659
SOD323 SCD80
single single
(nH) Marking
S
1.8
0.6
yellow S DE
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage V
Peak reverse voltage
V
R
RM
30 V
35
( R 5k )
Forward current I
Operating temperature range T
Storage temperature T
F
op
st
20 mA
-55 ... 150
-55 ... 150
°C
1
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BB639/BB659...
c
c
c
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Reverse current
= 30 V
V
R
= 30 V, TA = 85 °C
V
R
AC Characteristics
Diode capacitance
V
= 1 V, f = 1 MHz
R
V
= 2 V, f = 1 MHz
R
V
= 25 V, f = 1 MHz
R
V
= 28 V, f = 1 MHz
R
Capacitance ratio
V
= 1 V, VR = 28 V, f = 1 MHz
R
Capacitance ratio
V
= 2 V, VR = 25 V, f = 1 MHz
R
Capacitance matching1)
V
= 1 V, VR = 28 V, f = 1 MHz, 7 diode sequen
R
BB639
I
R
C
T
C
T1/CT28
C
T2/CT25
C
T/CT
-
-
36
27.7
2.5
2.4
-
-
38.3
29.75
2.85
2.6
10
200
40
31.8
3.2
2.9
13.5 14.7 -
9.8 10.4 -
-
-
2.5
nA
pF
%
V
= 1 V, VR = 28 V, f = 1 MHz, 4 diode sequen
R
BB659
V
= 1 V, VR = 28 V, f = 1 MHz, 7 diode sequen
R
BB659
Series resistance
V
= 5 V, f = 470 MHz
R
1
For details please refer to Application Note 047.
-
-
r
S
- 0.65 0.7
0.3
0.4
1
2
2
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BB639/BB659...
Diode capacitance CT = ƒ (VR)
f = 1MHz
40
pF
30
T
25
C
20
15
10
5
0
0 5 10 15 20
Temperature coefficient of the diode
capacitance
-3
10
1/°C
C
TC
-4
10
-5
V
30
V
R
10
10
T
= ƒ (VR)
Cc
0
10
1
V
V
2
10
R
Reverse current IR = ƒ (TA)
V
= 28V
R
3
10
pA
2
10
R
I
1
10
0
10
-30 -10 10 30 50 70
°C
Reverse current IR = ƒ(VR)
T
= Parameter
A
3
10
pA
2
10
R
I
1
10
0
10
-1
10
100
T
A
10
0
10
85°C
25°C
1
V
V
2
10
R
3
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Package Outline
Foot Print
Cathode marking
Package SCD80
0.2MA
±0.1
0.8
2
MAX.
˚
±0.1
10
1.7
1
±0.05
0.3
0.7
0.13
±0.1
+0.05
-0.03
˚
±1.5
˚
7
BB639/BB659...
A
±0.1
1.3
±0.05
0.2
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel
1.45
0.35
0.35
2005, June
Date code
BAR63-02W
Type code
Cathode marking
Laser marking
Cathode marking
Standard Reel with 2 mm Pitch
4
1.45 8
2.5
0.4
0.9
Cathode marking
2
4
0.2
0.7
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BB639/BB659...
Date Code marking for discrete packages with one digit (SCD80, SC79, SC75
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP 02bqBQbqBQbqBQ 03crCRcrCRcrCR 04dsDSdsDSdsDS 05et ETet ETe t ET 06fuFUfuFUfuFU
07gvGVgvGVgvGV 08h xHXhxHXhxHX 09jyJYjyJYjyJY 10k zKZkzKZkzKZ
11l 2L4 l2L4l 2L4
12n3N5n3N5n3N5
1)
) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
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Package SOD323
BB639/BB659...
6
2011-06-15
BB639/BB659...
Edition 2009-11-16
Published by Infineon Technologies AG 81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
>).
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