VISHAY 8ETH06 VIS Datasheet

Page 1
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2L TO-220AC
1
2
3
Anode
1
3
Cathode
Base
cathode
2
VS-8ETH06-M3
Vishay Semiconductors
Hyperfast Rectifier, 8 A FRED Pt
PRIMARY CHARACTERISTICS
I
F(AV)
V
R
V
at I
F
F
t
typ. 18 ns
rr
T
max. 175 °C
J
Package 2L TO-220AC
Circuit configuration Single
8 A
600 V
1.3 V
®
FEATURES
• Hyperfast recovery time
• Low forward voltage drop
• 175 °C operating junction temperature
• Low leakage current
• Designed and qualified according to JEDEC
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
DESCRIPTION / APPLICATIONS
State of the art hyperfast recovery rectifiers designed with optimized performance of forward voltage drop, hyperfast recovery time, and soft recovery.
The planar structure and the platinum doped life time control guarantee the best overall performance, ruggedness and reliability characteristics.
These devices are intended for use in PFC boost stage in the AC/DC section of SMPS, inverters or as freewheeling diodes.
Their extremely optimized stored charge and low recovery current minimize the switching losses and reduce over dissipation in the switching element and snubbers.
  
®
-JESD 47
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Repetitive peak reverse voltage V
Average rectified forward current I
Repetitive peak forward current I
Operating junction and storage temperatures T
F(AV)
FSM
, T
J
RRM
TC = 144 °C 8
TJ = 25 °C 90
FM
Stg
600 V
16
-65 to +175 °C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Breakdown voltage, blocking voltage
Forward voltage V
Reverse leakage current I
Junction capacitance C
Series inductance L
Revision: 23-Nov-17
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V
,
BR
V
IR = 100 μA 600 - -
R
IF = 8 A - 2.0 2.4
F
I
= 8 A, TJ = 150 °C - 1.3 1.8
F
VR = VR rated - 0.3 50
R
T
S
= 150 °C, VR = VR rated - 55 500
T
J
VR = 600 V - 17 - pF
Measured lead to lead 5 mm from package body - 8.0 - nH
1
Document Number: 96177
ANon-repetitive peak surge current I
V
μA
Page 2
VS-8ETH06-M3
1
10
TJ = 175 °C T
J
= 150 °C
T
J
= 25 °C
01
VF - Forward Voltage Drop (V)
I
F
- Instantaneous Forward Current (A)
100
23
4
0.1
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DYNAMIC RECOVERY CHARACTERISTICS (TC = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
IF = 1 A, dIF/dt = 100 A/μs, VR = 30 V - 18 22
I
= 8 A, dIF/dt = 100 A/μs, VR = 30 V - 20 25
Reverse recovery time t
Peak recovery current I
Reverse recovery charge Q
Reverse recovery time t
Peak recovery current I
Reverse recovery charge Q
rr
RRM
rr
rr
RRM
rr
F
T
= 25 °C
J
= 125 °C - 40 -
T
J
TJ = 25 °C - 2.4 -
= 125 °C - 4.8 -
T
J
TJ = 25 °C - 25 -
= 125 °C - 120 -
T
J
TJ = 125 °C
I
= 8 A
F
dI
/dt = 200 A/μs
F
V
= 390 V
R
= 8 A
I
F
dI
/dt = 600 A/μs
F
V
= 390 V
R
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Maximum junction and storage temperature range
Thermal resistance, junction-to-case R
Thermal resistance, junction-to-ambient per leg
Thermal resistance, case-to-heatsink R
Weight
Mounting torque
Marking device Case style 2L TO-220AC 8ETH06
T
, T
J
Stg
-1.42°C/W
thJC
R
thJA
thCS
Typical socket mount - - 70
Mounting surface, flat, smooth, and greased
Vishay Semiconductors
-25-
-33-ns
-12- A
- 220 - nC
-65 - 175 °C
-0.5-
-2.0- g
-0.07- oz.
6.0
(5.0)
-
12
(10)
ns
A
nC
kgf · cm
(lbf · in)
1000
100
10
1
0.1
- Reverse Current (µA)
R
0.01
I
0.001 0 200 400
100
TJ = 175 °C
TJ = 150 °C
TJ = 125 °C
TJ = 100 °C
TJ = 25 °C
300
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
Revision: 23-Nov-17
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2
Document Number: 96177
600500
Page 3
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100
1000
0 200 400 500 600
10
VR - Reverse Voltage (V)
C
T
- Junction Capacitance (pF)
300100
TJ = 25 °C
10
VS-8ETH06-M3
Vishay Semiconductors
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
1
0.1
- Thermal Impedance (°C/W)
thJC
Z
0.01
0.00001 0.0001 0.001 0.01 0.1 1
Single pulse
(thermal resistance)
Fig. 4 - Maximum Thermal Impedance Z
180
170
160
150
140
130
Allowable Case Temperature (°C)
See note (1)
120
02 6 1012
I
F(AV)
Square wave (D = 0.50)
applied
Rated V
R
48
- Average Forward Current (A)
DC
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
D = 0.50 D = 0.20 D = 0.10 D = 0.05 D = 0.02 D = 0.01
t1 - Rectangular Pulse Duration (s)
Characteristics
thJC
20
18
16
14
12
10
8
6
4
Average Power Loss (W)
2
0
02 6 1012
Fig. 6 - Forward Power Loss Characteristics
P
DM
t
1
t
2
Notes:
1. Duty factor D = t
2. Peak TJ = PDM x Z
DC
48
I
- Average Forward Current (A)
F(AV)
1/t2
thJC
.
+ T
C
RMS limit
.
D = 0.01 D = 0.02 D = 0.05 D = 0.10 D = 0.20 D = 0.50
Note
(1)
Formula used: TC = TJ - (Pd + Pd Pd = forward power loss = I Pd
= inverse power loss = VR1 x IR (1 - D); IR at VR1 = rated V
REV
Revision: 23-Nov-17
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) x R
x VFM at (I
F(AV)
REV
;
thJC
/D) (see fig. 5);
F(AV)
R
3
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Page 4
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100 1000
Q
rr
(nC)
dIF/dt (A/µs)
400
0
IF = 16 A I
F
= 8 A
300
200
100
50
VR = 390 V T
J
= 125 °C
T
J
= 25 °C
350
250
150
Q
rr
0.5 I
RRM
di
(rec)M
/dt
0.75 I
RRM
I
RRM
t
rr
t
b
t
a
I
F
diF/dt
0
(1)
(2)
(3)
(4)
(5)
(1) di
F
/dt - rate of change of current
through zero crossing
(2) I
RRM
- peak reverse recovery current
(3) t
rr
- reverse recovery time measured from zero crossing point of negative going I
F
to point where a line passing
through 0.75 I
RRM
and 0.50 I
RRM
extrapolated to zero current.
(4) Q
rr
- area under curve dened by t
rr
and I
RRM
trr x I
RRM
2
Qrr =
(5) di
(rec)M
/dt - peak rate of change of
current during t
b
portion of t
rr
VS-8ETH06-M3
Vishay Semiconductors
60
VR = 390 V
= 125 °C
T
J
= 25 °C
50
T
J
40
(ns)
rr
t
30
20
IF = 16 A
= 8 A
I
F
10
100 1000
dIF/dt (A/µs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt Fig. 8 - Typical Stored Charge vs. dIF/dt
Revision: 23-Nov-17
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Fig. 9 - Reverse Recovery Waveform and Definitions
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ORDERING INFORMATION TABLE
VS-8ETH06-M3
Vishay Semiconductors
Device code
VS-8 E T H06-M3
51 32 4 6 7
1 -Vishay Semiconductors product
2 - Current rating (8 = 8 A)
3 - E = single
4
- T = TO-220, D2PAK (TO-263AB)
5 - H = hyperfast recovery
6 - Voltage rating (06 = 600 V)
7
- Environmental digit:
-M3 = halogen-free, RoHS-compliant, and termination lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N QUANTITY PER T/R MINIMUM ORDER QUANTITY PACKAGING DESCRIPTION
VS-8ETH06-M3 50 1000 Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?96156
Part marking information www.vishay.com/doc?95391
Revision: 23-Nov-17
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Document Number: 96177
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12
C
C
D
D
2 x b22 x b
(b, b2)
b1, b3
0.014 AB
M M
0.015 AB
M M
Conforms to JEDEC® outline TO-220AC
(6)
(6)
(6)
(7)
L1
(2)
Detail B
Section C - C and D - D
Base metal Plating
(4)
(4)
c1
c
(6)
(6)
Ø P
E
Q
D
L
c
D1
e
e1
2 x
A
B
A
A
A
C
A2
A1
Thermal pad
H1
(E)
(H1)
D2
Detail B
E1
View A - A
Lead tip
DIMENSIONS in millimeters and inches
Outline Dimensions
Vishay Semiconductors
2L TO-220AC
SYMBOL
Notes
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Revision: 06-Dec-17
MILLIMETERS INCHES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
NOTES SYMBOL
MILLIMETERS INCHES
NOTES
A 4.25 4.65 0.167 0.183 D2 11.68 12.88 0.460 0.507 6 A1 1.14 1.40 0.045 0.055 E 10.11 10.51 0.398 0.414 3, 6 A2 2.50 2.92 0.098 0.115 E1 6.86 8.89 0.270 0.350 6
b 0.69 1.01 0.027 0.040 e 2.41 2.67 0.095 0.105 b1 0.38 0.97 0.015 0.038 4 e1 4.88 5.28 0.192 0.208 b2 1.20 1.73 0.047 0.068 H1 6.09 6.48 0.240 0.255 6, 7 b3 1.14 1.73 0.045 0.068 4 L 13.52 14.02 0.532 0.552
c 0.36 0.61 0.014 0.024 L1 3.32 3.82 0.131 0.150 2
c1 0.36 0.56 0.014 0.022 4 Ø P 3.54 3.91 0.139 0.154
D 14.85 15.35 0.585 0.604 3 Q 2.60 3.00 0.102 0.118 D1 8.38 9.02 0.330 0.355
Dimensioning and tolerancing as per ASME Y14.5M-1994 Lead dimension and finish uncontrolled in L1 Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body Dimension b1, b3, and c1 apply to base metal only Controlling dimensions: inches Thermal pad contour optional within dimensions E, H1, D2, and E1 Outline conforms to JEDEC® TO-220, except D2 (minimum)
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Document Number: 96156
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Disclaimer
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Revision: 08-Feb-17
1
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