Vishay 20ETF..SPbF Soft Recovery Series Data Sheet

20ETF..SPbF Soft Recovery Series
Fast Soft Recovery
Rectifier Diode, 20 A
Vishay High Power Products
FEATURES/DESCRIPTION
D2PAK (SMD-220)
Base
common
cathode
+
1
--
Anode
2
3 Anode
The 20ETF..SPbF fast soft recovery rectifier series has been optimized for combined short reverse recovery time and low forward voltage drop.
The glass passivation ensures stable reliable operation in the most severe temperature and power cycling conditions.
This product series has been designed and qualified for industrial level.
Compliant to RoHS directive 2002/95/EC.
Halogen-free according to IEC 61249-2-21 definition.
PRODUCT SUMMARY
VF at 20 A < 1.31 V
V
I
FSM
RRM
355 A
800 V to 1200 V
APPLICATIONS
• Output rectification and freewheeling in inverters, choppers and converters
• Input rectifications where severe restrictions on conducted EMI should be met
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL CHARACTERISTICS VALUES UNITS
I
F(AV)
V
RRM
I
FSM
V
F
t
rr
T
J
Sinusoidal waveform 20 A
800 to 1200 V
355 A
20 A, TJ = 25 °C 1.31 V
1 A, 100 A/µs 95 ns
Range - 40 to 150 °C
VOLTAGE RATINGS
V
, MAXIMUM PEAK
V
RRM
PART NUMBER
20ETF08SPbF 800 900
20ETF12SPbF 1200 1300
REVERSE VOLTAGE
V
, MAXIMUM NON-REPETITIVE
RSM
PEAK REVERSE VOLTAGE
V
I
RRM
AT 150 °C
mA
620ETF10SPbF 1000 1100
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average forward current I
Maximum peak one cycle non-repetitive surge current
Maximum I
Maximum I
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 94099 For technical questions, contact: diodestech@vishay.com Revision: 17-Sep-09 1
t for fusing I2t
t for fusing I2√t t = 0.1 ms to 10 ms, no voltage reapplied 6350 A2√s
F(AV)
I
FSM
TC = 97 °C, 180° conduction half sine wave 20
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied 355
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied 635
applied 300
RRM
applied 450
RRM
A
A
s
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20ETF..SPbF Soft Recovery Series
Vishay High Power Products
Fast Soft Recovery
Rectifier Diode, 20 A
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum forward voltage drop V
FM
Forward slope resistance r
Threshold voltage V
Maximum reverse leakage current I
F(TO)
RM
RECOVERY CHARACTERISTICS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Reverse recovery time t
Reverse recovery current I
rr
rr
Reverse recovery charge Q
Snap factor S Typical 0.6
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction and storage temperature range
Maximum thermal resistance, junction to case
Maximum thermal resistance, junction to ambient (PCB mount)
Soldering temperature T
Approximate weight
Marking device Case style D
Note
(1)
When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 µm) copper 40 °C/W For recommended footprint and soldering techniques refer to application note #AN-994
T
, T
J
R
thJC
R
thJA
S
20 A, TJ = 25 °C 1.31 V
t
rr
Stg
TJ = 150 °C
TJ = 25 °C
T
= 150 °C 6
J
IF at 20 Apk
25 A/µs 25 °C
V
= Rated V
R
RRM
400 ns
6.1 A
1.7 µC
11.88 mΩ
0.93 V
- 40 to 150 °C
DC operation 0.9
(1)
240 °C
0.07 oz.
PAK (SMD-220)
0.1
I
FM
t
rr
t
atb
dir
dt
I
RM(REC)
62
2g
20ETF08S
20ETF10S
20ETF12S
mA
Q
°C/W
t
rr
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Document Number: 94099
2 Revision: 17-Sep-09
20ETF..SPbF Soft Recovery Series
150
140
130
120
Temperature (°C)
110
Maximum Allowable Case
100
150
140
130
20ETF.. Series
(DC) = 0.9 K/W
R
thJC
Conduction angle
30°
60°
90°
120°
5
0
10 25
15
Average Forward Current (A)
Fig. 1 - Current Rating Characteristics
20ETF.. Series
(DC) = 0.9 K/W
R
thJC
Conduction period
Fast Soft Recovery
Rectifier Diode, 20 A
Ø
18
20
Ø
45
40
35
30
25
20
15
Power Loss (W)
10
Maximum Average Forward
350
300
250
200
Vishay High Power Products
180° 120° 90° 60° 30°
RMS limit
Conduction period
15
20ETF.. Series T
20
5
0
0
10 255
Average Forward Current (A)
Fig. 4 - Forward Power Loss Characteristics
At any rated load condition and with rated V
applied following surge.
RRM
DC
Ø
= 150 °C
J
30
Initial TJ = 150 °C at 60 Hz 0.0083 s at 50 Hz 0.0100 s
35
120
Temperature (°C)
110
Maximum Allowable Case
100
35
30
25
20
15
Power Loss (W)
10
Maximum Average Forward
5
0
60°
90°
30°
530
025
10 20
120°
18
15
DC
35
Average Forward Current (A)
Fig. 2 - Current Rating Characteristics
180° 120° 90° 60° 30°
RMS limit
Ø
Conduction angle
20ETF.. Series T
= 150 °C
J
0
10 155
20
25
Average Forward Current (A)
Fig. 3 - Forward Power Loss Characteristics
150
Forward Current (A)
Peak Half Sine Wave
100
50
400
350
300
250
200
150
Forward Current (A)
Peak Half Sine Wave
100
50
20ETF.. Series
1 10 100
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
Maximum non-repetitive surge current versus pulse train duration.
Initial TJ = 150 °C No voltage reapplied Rated V
20ETF.. Series
0.01 0.1 1
RRM
reapplied
Pulse Train Duration (s)
Fig. 6 - Maximum Non-Repetitive Surge Current
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Revision: 17-Sep-09 3
20ETF..SPbF Soft Recovery Series
Vishay High Power Products
Instantaneous Forward Current (A)
- Maximum Reverse
rr
t
0.7
0.6
0.5
0.4
0.3
0.2
Recovery Time (µs)
0.1
0
0 50 100 150 200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 8 - Recovery Time Characteristics, T
20ETF.. Series
= 25 °C
T
J
Fast Soft Recovery
Rectifier Diode, 20 A
1000
100
TJ = 25 °C
= 150 °C
T
10
1
0.5 1.5 2.5 3.5
0 1.0 2.0
Instantaneous Forward Voltage (V)
Fig. 7 - Forward Voltage Drop Characteristics
I
= 30 A
FM
= 20 A
I
FM
IFM = 10 A
I
= 5 A
FM
= 1 A
I
FM
= 25 °C
J
J
20ETF.. Series
- Maximum Reverse
rr
Recovery Charge (µC)
Q
3.0 4.0
6
20ETF.. Series
= 25 °C
T
J
5
4
3
2
1
0
0 50 100 150 200
IFM = 30 A
IFM = 20 A
IFM = 10 A
IFM = 5 A
IFM = 1 A
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 10 - Recovery Charge Characteristics, T
= 25 °C
J
1.2
0.9
0.6
- Maximum Reverse
0.3
Recovery Time (µs)
rr
t
0
0 50 100 150 200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 9 - Recovery Time Characteristics, T
20ETF.. Series
= 150 °C
T
J
IFM = 30 A
= 20 A
I
FM
I
= 10 A
FM
= 5 A
I
FM
= 1 A
I
FM
= 150 °C
J
10
20ETF.. Series
= 150 °C
T
J
8
6
4
- Maximum Reverse
rr
Recovery Charge (µC)
Q
2
0
0 50 100 150 200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 11 - Recovery Charge Characteristics, T
IFM = 30 A
IFM = 20 A
IFM = 5 A
IFM = 10 A
IFM = 1 A
= 150 °C
J
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Document Number: 94099
4 Revision: 17-Sep-09
20ETF..SPbF Soft Recovery Series
Fast Soft Recovery
Vishay High Power Products
Rectifier Diode, 20 A
- Maximum Reverse Recovery Current (A)
rr
I
25
20ETF.. Series
= 25 °C
T
J
20
15
10
5
0
0 50 100 150 200
IFM = 30 A
IFM = 20 A
IFM = 10 A
IFM = 5 A
IFM = 1 A
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 12 - Recovery Current Characteristics, TJ = 25 °C Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
1
- Maximum Reverse Recovery Current (A)
rr
I
35
20ETF.. Series T
30
25
20
15
10
= 150 °C
J
5
0
0 50 100 150 200
IFM = 30 A
dI/dt - Rate of Fall of Forward Current (A/µs)
Steady state value
(DC operation)
IFM = 20 A
IFM = 10 A
IFM = 5 A
IFM = 1 A
0.1
Single pulse
0.01
- Transient Thermal Impedance (K/W)
thJC
Z
Fig. 14 - Thermal Impedance Z
D = 0.50 D = 0.33 D = 0.25 D = 0.17 D = 0.08
Square Wave Pulse Duration (s)
Characteristics
thJC
20ETF.. Series
10.0001 0.001 0.01 0.1
Document Number: 94099 For technical questions, contact: diodestech@vishay.com
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Revision: 17-Sep-09 5
20ETF..SPbF Soft Recovery Series
Vishay High Power Products
ORDERING INFORMATION TABLE
Device code
20 E T F 12 S TRL PbF
1 - Current rating (20 = 20 A)
2 - Circuit configuration:
E = Single diode
3 - Package:
T = D
4 - Type of silicon:
F = Fast soft recovery rectifier
5 - Voltage code x 100 = V
6 - S = Surface mountable
7 -
8 -
Fast Soft Recovery
Rectifier Diode, 20 A
51324678
2
PAK (TO-220AC)
RRM
None = Tape
TRR = Tape and reel (right oriented)
TRL = Tape and reel (left oriented)
None = Standard production
PbF = Lead (Pb)-free
08 = 800 V 10 = 1000 V 12 = 1200 V
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Document Number: 94099
DIMENSIONS in millimeters and inches
Outline Dimensions
Vishay High Power Products
D2PAK
Conforms to JEDEC outline D
(2)(3)
E
(3)
L1
D
L2
2 x
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
4
132
BB
e
2
2 x b2
2 x b
PAK (SMD-220)
A
Detail A
H
(2)
C
MM
0.010
A
Lead tip
B
A
c2
AA
A
c
M
± 0.004
B
Gauge
0° to 8°
plane
L3
B
L
L4
Detail “A”
Rotated 90 °CW
Scale: 8:1
(E)
E1
View A - A
A1
(3)
(D1)
17.90 (0.70)
15.00 (0.625)
2.32
(0.08)
Plating
Seating
plane
2.64 (0.103)
2.41 (0.096)
(3)
H
B
Pad layout
11.00 MIN.
(0.43)
MIN.
(4)
b1, b3
(c)
(b, b2)
Section B - B and C - C
Scale: None
9.65
(0.38)
3.81
(0.15)
c1
MIN.
MIN.
Base Metal
(4)
SYMBOL
MILLIMETERS INCHES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
NOTES SYMBOL
MILLIMETERS INCHES
NOTES
A 4.06 4.83 0.160 0.190 D1 6.86 8.00 0.270 0.315 3
A1 0.00 0.254 0.000 0.010 E 9.65 10.67 0.380 0.420 2, 3
b 0.51 0.99 0.020 0.039 E1 7.90 8.80 0.311 0.346 3
b1 0.51 0.89 0.020 0.035 4 e 2.54 BSC 0.100 BSC
b2 1.14 1.78 0.045 0.070 H 14.61 15.88 0.575 0.625
b3 1.14 1.73 0.045 0.068 4 L 1.78 2.79 0.070 0.110
c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.066 3
c1 0.38 0.58 0.015 0.023 4 L2 1.27 1.78 0.050 0.070
c2 1.14 1.65 0.045 0.065 L3 0.25 BSC 0.010 BSC
D 8.51 9.65 0.335 0.380 2 L4 4.78 5.28 0.188 0.208
Notes
(1)
Dimensioning and tolerancing per ASME Y14.5 M-1994
(2)
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outmost extremes of the plastic body
(3)
Thermal pad contour optional within dimension E, L1, D1 and E1
(4)
Dimension b1 and c1 apply to base metal only
(5)
Datum A and B to be determined at datum plane H
(6)
Controlling dimension: inch
(7)
Outline conforms to JEDEC outline TO-263AB
Document Number: 95046 For technical questions concerning discrete products, contact: diodes-tech@vishay.com
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Revision: 31-Mar-09 For technical questions concerning module products, contact: ind-modules@vishay.com
1
D2PAK
Part Marking Information
Vishay High Power Products
Assembly lot code
xxxxxxS
V PYWWXA
8024
Part number
Product version (optional): P = Lead (Pb)-free None = Standard Date code: Year 0 = 2000 Week 02 Line X Child lot A
Example: This is a xxxxxxS with assembly lot code 8024, assembled on WW 02, 2000
Document Number: 95054 For technical questions concerning discrete products, contact: diodes-tech@vishay.com Revision: 17-Oct-08 For technical questions concerning module products, contact: ind-modules@vishay.com
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Legal Disclaimer Notice
Vishay

Disclaimer

All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 www.vishay.com Revision: 18-Jul-08 1
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