The device is CMOS Dynamic RAM organized as 4,194,304 words x 4 bits. It is fabricated
with an advanced submicron CMOS technology and designed to operate from a single 5V only
or 3.3V only power supply. Low voltage operation is more suitable to be used on battery
backup, portable electronic application. A new refresh feature called “ self-refresh “ is supported
and very slow CBR cycles are being performed. It is packaged in JEDEC standard 26/24 - pin
plastic SOJ or TSOP (II).
Features
• Single 5V (%) or 3.3V (+10%,-5%) only power supply
RAS - ONLY REFRESHLHXXROWn/aHigh - Z
CBR REFRESHLHXXXHigh - Z
Notes : 1. EARLY WRITE only.
1st CycleLHLROWCOL Data - Out
2st
Cycle
1st CycleLLXROWCOL Data - In
2st
Cycle
1st CycleLROWCOL Data - Out, Data - In
2st
Cycle
READLHLROWCOL Data - Out
WRITELLXROWCOL Data - In1
LHLn/aCOL Data - Out
LLXn/aCOL Data - In
Ln/aCOL Data - Out, Data - In
Document : Rev.Page 4
VG26(V)(S)17400FJ
±
VIS
Absolute Maximum Rating
ParameterSymbolValueUnit
Voltage on any pin relative to Vss 5V
3.3V
Supply voltage relative to Vss 5V
3.3V
Short circuit output currentI
Power dissipationP
Operating temperatureT
Storage temperatureT
Recommended DC Operating Conditions
Parameter/ConditionSymbol5 Volt Version3.3 Volt VersionUnit
MinTypMaxMinTypMax
Supply VoltageV
Input High Voltage, all inputsV
Input Low Voltage, all inputsV
cc
IH
IL
4.55.05.53.153.33.6V
2.4-V
-1.0-0.8-0.3-0.8V
4,194,304 x 4 - Bit
CMOS Dynamic RAM
V
T
V
cc
OUT
D
OPT
STG
+ 1.02.0-V
CC
-1.0 to + 7.0
-0.5 to + 4.6
-1.0 to + 7.0
-0.5 to + 4.6
50mA
1.0W
0 to + 70°C
-55 to + 125°C
+ 0.3V
CC
V
V
Capacitance
Ta = 25°C, V
Input capacitance (Address)C
Input capacitance
(RAS, CAS, OE, WE)
Output capacitance
(Data - in, Data - out)
Note : 1. Capacitance measured with effective capacitance measuring method.
2. CAS = VIH to disable Dout.
= % or 3.3V(+10%,-5%), f = 1MHz
CC
ParameterSymbolTypMaxUnitNote
l1
C
l2
C
I/O
-5pF1
-7pF1
-7pF1,2
Document : Rev.Page 5
VG26(V)(S)17400FJ
±
CC
≥
CC
≥
t
RASS
100µS≥µA
0.2V
≤
0VVIL0.2V
≤≤
0.2VV
IHVIH
≤≤
t
RAS
300ns
≤
µA
VIS
DC Characteristics; 5 - Volt verion
(Ta= 0 to 70°C, VCC = + 5V10%, V
ParameterSymbolTest Conditions
Operating
currentI
CC1
= 0V)
ss
RAS cycling
CAS cycling
tRC = min.
4,194,304 x 4 - Bit
CMOS Dynamic RAM
VG26 (V) (S) 17400E
-5-6
MinMaxMinMax
-145-135 mA1, 2
Unit Notes
Low
power
S - version
Standby
Current
RAS - only
refresh current
Fast page mode
current
CAS - before - RAS
refresh current
Self - refresh currant
(S - Version)
CAS - before - RAS
long refresh
current (S - Version)
Standard
power
version
TTL interface
RAS, CAS = V
Dout = high - Z
CMOS interface
RASCAS,V
Dout = high - Z
I
CC2
TTL interface
RAS, CAS = V
Dout = high - Z
CMOS interface
RASCAS,V
Dout = high - Z
I
I
I
I
I
RAS cycling, CAS = V
CC3
t
CC4
t
CC5tRC
RAS, CAS cycling
CC8
CC9
Standby : VCC CAS before RAS refresh :
2048 cycles/128ms
RAS, RAS :
VCC - (Max)
Dout = high - Z,
RC
PC
= min.
= min.
= min.
-2-2
IH
-0.25-0.25
- 0.2V
-2-2
IH
-1-1
- 0.2V
IH
RAS
-145-135
-100-90
-145-135
-350-350
-500-500
mA
mA
mA
mA
1, 2
mA
1,3
mA
1, 2
mA
Document : Rev.Page 6
VG26(V)(S)17400FJ
±
0VVinV
≤≤
µA
0VVoutV
≤≤
µA
VIS
DC Characteristics ; 5 - Volt Version (cont.)
(Ta = 0 to 70°C, V
ParameterSymbolTest Conditions
lnput leakage
current
Output leakage
current
Output high
voltage
Output low
voltage
Notes :
1. lCC is specified as an average current. It depends on output loading condition and cycle rate when
the device is selected. lCC max is specified at the output open condition.
2. Address can be changed once or less while RAS = VIL.
3. For l
= + 5V10%, V
CC
I
I
V
V
, address can be changed once or less within one Fast page mode cycle time.
CC4
= 0V)
ss
LI
LO
Dout = Disable
OH lOH
OL lOL
4,194,304 x 4 - Bit
CMOS Dynamic RAM
VG26 (V) (S) 17400E
-5-6
MinMax Min Max
+ 0.5V
CC
+ 0.5V
CC
= -5mA2.4-2.4-V
= + 4.2mA-0.4-0.4V
-55-55
-55-55
Unit Notes
Document : Rev.Page 7
VG26(V)(S)17400FJ
CC
≥
CC
≥
t
100µS≥µA
0.2V
≤
0VV
0.2V
≤≤
0.2VV
IHVIH
≤≤
t
300ns
≤
µA
VIS
DC Characteristics ; 3.3 - Volt Verion
(Ta = 0 to 70°C, V
ParameterSymbolTest Conditions
Operating
currentI
= + 3.3V(+10%,-5%), V
CC
CC1
RAS cycling
CAS cycling
tRC = min.
ss
= 0V)
4,194,304 x 4 - Bit
CMOS Dynamic RAM
VG26 (V) (S) 17400E
-5-6
MinMaxMinMax
-145-135 mA1, 2
Unit Notes
Low
power
S - version
Standby
Current
RAS - only
refresh current
Fast page mode
current
CAS - before - RAS
refresh current
Self - refresh currant
(S - Version)
CAS - before - RAS
long refresh
current (S - Version)
Standard
power
version
LVTTL interface
RAS, CAS = V
Dout = high - Z
CMOS interface
RASCAS,V
Dout = high - Z
I
I
I
I
I
I
LVTTL interface
CC2
RAS, CAS = V
Dout = high - Z
CMOS interface
RASCAS,V
Dout = high - Z
CC3
CC4
CC5 tRC
CC8
CC9
RAS cycling, CAS = V
t
t
RAS, CAS cycling
Standby : VCC CAS before RAS refresh :
2048 cycles/128ms
RAS, RAS :
VCC - (Max)
Dout = high - Z,
= min.
RC
= min.
PC
= min.
RASS
IH
IH
- 0.2V
- 0.2V
IL
RAS
IH
RAS
-0.5-0.5
- 0.15- 0.15
-2-2
-0.5-0.5
-145-135
-100-90
-145-135
-250-250
-300-300
mA
mA
mA
mA
1, 2
mA
1,3
mA
1, 2
mA
Document : Rev.Page 8
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