VICOR Maxi, Mini, Micro Design Manual & Applications Manual

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1. High-Density DC-DC Converter Technology
Design Guide & Applications Manual
Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies
The Maxi, Mini, Micro Family of DC-DC converters are an integral part of the company’s overall component power solution strategy (Figure 1.1), which includes advanced factory and design automation. The modules are available in an unlimited variety of standard versions, to the extent that the line between custom and standard DC-DC converter bricks becomes almost indistinguishable.
The design of the control, magnetic, switching and packaging elements of the module resulted in a component with a power density of up to 120W/in3 (7,3W /cm3) in three package sizes:
Maxi 4.6 x 2.2 x 0.5in [117 x 55,9 x 12,7mm] Mini 2.28 x 2.2 x 0.5in [57,9 x 55,9 x 12,7mm] Micro 2.28 x 1.45 x 0.5in [57,9 x 36,8 x 12,7mm]
The modules have one-third the number of parts of their predecessors.
While the natural by-products of this reduction in parts count has improved reliability and lower cost. The extra space also means that the bulk of the converter can now be devoted almost exclusively to the power train (i.e., the magnetic and switching elements at the core of the design).
AC-DC Products
Resistors can be used to trim the output voltage up or down, if necessary. Six pin styles, three baseplate options and a variety of data collection and reporting options are available. The devices have an operating temperature range of –55 to 100°C and come in five product grades – E, C, T, H and M.
Other specifications include a typical no-load to full-load regulation of ±0.5%, a programmable output of 10 – 110%, conversion efficiencies of up to 92% depending on the voltage combination and power level chosen, and an input-to-output isolation test voltage of 3,000V
[4,242VDC]. All models are parallelable with
RMS
N+M fault tolerance and current sharing. Paralleling architectures feature DC- or AC-coupled interface.
DC-DC Products
Universal 85 – 264V
Autoranging 115 – 230V Input
Autoranging 90 – 132V 180 – 264V
Autoranging 90 – 132V 180 – 264V
DC-DC Products
Nominal Input 18 – 425V
28VDC, 48VDC, 270V
24VDC, 28VDC, 48V
FARM3
Harmonic Attenuator Module
High Boost
HAM
Unity Power Factor
Up to 675W per module
MINIHAM
Filter / Autoranging Rectifier Module
Up to 1,000W
Autoranging Rectifier Module
Up to 1,500W
Transient Protection, Inrush Current Limiting EMI Filter
Up to 25A
Active EMI Filter
QPI
Up to 576W @ 48V
Front-end System for EN Compliance
Up to 550W
DC-DC Converter
Up to 600W per module 1 – 54V
dc
DC-DC Converter
Up to 300W per module 1 – 48V
DC-DC Converter
Up to 150W per module 1 – 48V
Single wire paralleling for high power, fault tolerant arrays.
Output Ripple Attenuation Module combines active and passive filtering.
QPO provides active filtering to
QPO
achieve differential noise attenuation.
Figure 1.1 — Component power solutions with the Maxi, Mini, Micro Family
Maxi, Mini, Micro Design Guide Rev 5.0 Page 3 of 87 03/2018
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1. High-Density DC-DC Converter Technology
Design Guide & Applications Manual
Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies
Key to the design of Maxi, Mini, Micro converters is its high level of component-level integration. (Figure 1.2) With the aid of hybrid technology, the device packs all control functions and active circuitry into two (primary and secondary side) ICs occupying a total volume of less than 1/10in3 [1,6c m3] each.
With Maxi, Mini, Micro devices, the plated-cavity transformer cores use copper armor, plated onto the ferrite core, to more closely confine the magnetic flux to couple widely separated primary and secondary windings. The wider separation provides greater isolation and therefore lowers input-to-output parasitic capacitance and noise. The plated cavity also serves to conduct heat away from the transformer to the baseplate, thus increasing the power-handling capability of the powertrain and minimizing temperature rise.
The powertrain assembly is contained between the baseplate and a terminal-block assembly, with input and output pins recessed. This allows the converter body to be mounted into an aperture in the PCB to reduce the height above board. The modules may be wave soldered or plugged into through-hole or surface-mount sockets.
The Maxi, Mini, Micro devices use a proprietary, low-noise, integrated power device that has an order of magnitude lower parasitic effect.
The advances made in the overall design of the Maxi, Mini, Micro Family DC-DC converters have been complemented by equally significant advances in the technology used to manufacture them. Vicor invested in a custom, fully-automated assembly line specifically designed for the assembly of Maxi, Mini, Micro power components. To further augment its Maxi, Mini, Micro product offering, Vicor has created an online user-interface tool,
PowerBenchTM, that allows customers to specify DC-DC module
requirements anytime, anywhere via the internet.
Bottom View
• Standard MLP power devices
• Efficient pick-and-place assembly
Top View
• Surface-mount components for greater manufacturing efficiency
• Standard reflow process
Figure 1.2 — Maxi assembly shows high level of integration
Baseplate
• Simplified baseplate construction
Model Number
Serial No. & Date Code
Complete Assembly
• Insert molded terminal block for more accurate pin positioning
• One-piece cover with label
• Encapsulated for superior thermal performance
Maxi, Mini, Micro Design Guide Rev 5.0 Page 4 of 87 03/2018
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1. High-Density DC-DC Converter Technology
Design Guide & Applications Manual
Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies
The Maxi, Mini, Micro’s ZCS / ZVS power-processing architecture (Figure 1.3) enables efficient, low-noise, high-frequency operation. The main switch is common drain for improved thermal and noise management. The reset switch located within the primary control IC is common source for ease of control.
The control circuitry is integrated into two (primary- and secondary-side) ICs. The result is a significant reduction in parts with the ensuing savings in cost and increase in reliability. This integration also provides extra room for the power train.
+IN
PC
PR
–IN
Primary Control IC
Maxi, Mini, Micro transformers place the primary and secondary windings far apart, but contain the magnetic flux using a copper armor plated onto the ferrite core. The armor also conducts excess heat to the baseplate.
+OUT
+SENSE*
SC
–SENSE*
–OUT
Secondary Control IC
Figure 1.3 — Maxi, Mini, Micro: Basic powertrain and control (*Not included in Micro family)
Maxi, Mini, Micro Design Guide Rev 5.0 Page 5 of 87 03/2018
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