Verifone CM5P User Manual

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SC20 Hardware Design

Smart LTE Module Series

Rev: SC20_Hardware_Design_V1.4

Date: 2017-10-17

www.quectel.com

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Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

7thFloor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China

Tel: +86 21 5108 6236

Email: info@quectel.com

Or our local office. For more information, please visit:

http://quectel.com/support/sales.htm

For technical support, or to report documentation errors, please visit:

http://quectel.com/support/technical.htm

Or email to: support@quectel.com

GENERAL NOTES

QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

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About the Document

History

Revision

Date

Author

Description

1.0

2016-04-12

Tony GAO

Initial

1.1

2016-05-04

Mark ZHANG

1. Updated RF Receiving Sensitivity

2. Updated Operation Temperature

1.2

2016-07-22

Sea BAI

Added Chapters 2.4, 3.6~3.22, 4, 5 and 9

1.3

2016-08-19

Sea BAI

Updated Charging Parameters in Table 41

1.4

2017-10-17

Sea BAI/

Beny ZHU/

Jenson WU

1. Modified the name of SC20-CE to SC20-CE

R1.1

2. Added the frequency bands of SC20-E,

SC20-A, SC20-AU and SC20-J modules

(Tables 2, 3, 4 and 5)

3. Added descriptions of Wi-Fi 5GHz frequency

band (Tables 27, 28 and 35)

4. Updated SC20 module operating frequencies

(Table 33)

5. Updated reference circuit design for GNSS

passive antenna (Figure 37)

6. Updated antenna requirements (Table 38)

7. Added the current consumption of SC20-E,

SC20-A, SC20-AU and SC20-J (Tables 44,

45, 46 and 47)

8. Updated RF output power (Table 48)

9. Added the RF receiving sensitivity of

SC20-E, SC20-A, SC20-AU and SC20-J

(Tables 50, 51, 52 and 53)

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Contents

About the Document..................................................................................................................................................2

Contents........................................................................................................................................................................3

Table Index................................................................................................................................................................... 6

Figure Index................................................................................................................................................................. 8

1 Introduction....................................................................................................................................................... 10

1.1. Safety Information.................................................................................................................................10

2 Product Concept...............................................................................................................................................13

2.1. General Description..............................................................................................................................13

2.2. Key Features......................................................................................................................................... 16

2.3. Functional Diagram.............................................................................................................................. 19

2.4. Evaluation Board...................................................................................................................................20

3 Application Interfaces.....................................................................................................................................21

3.1. General Description..............................................................................................................................21

3.2. Pin Assignment..................................................................................................................................... 22

3.3. Pin Description......................................................................................................................................23

3.4. Power Supply........................................................................................................................................ 34

3.4.1. Power Supply Pins.....................................................................................................................34

3.4.2. Decrease Voltage Drop.............................................................................................................34

3.4.3. Reference Design for Power Supply.......................................................................................35

3.5. Turn on and off Scenarios................................................................................................................... 36

3.5.1. Turn on Module Using the PWRKEY......................................................................................36

3.5.2. Turn off Module...........................................................................................................................38

3.6. VRTC Interface......................................................................................................................................38

3.7. Power Output.........................................................................................................................................39

3.8. Battery Charge and Management......................................................................................................40

3.9. USB Interface........................................................................................................................................41

3.10. UART Interfaces....................................................................................................................................43

3.11. (U)SIM Interfaces..................................................................................................................................45

3.12. SD Card Interface.................................................................................................................................47

3.13. GPIO Interfaces.................................................................................................................................... 49

3.14. I2C Interfaces........................................................................................................................................51

3.15. ADC Interfaces......................................................................................................................................52

3.16. Motor Drive Interface............................................................................................................................52

3.17. LCM Interface........................................................................................................................................53

3.18. Touch Panel Interface..........................................................................................................................55

3.19. Camera Interfaces................................................................................................................................56

3.19.1. Rear Camera Interface..............................................................................................................56

3.19.2. Front Camera Interface.............................................................................................................58

3.19.3. Design Considerations.............................................................................................................. 60

3.20. Sensor Interfaces..................................................................................................................................61

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3.21. Audio Interfaces....................................................................................................................................62

3.21.1. Reference Circuit Design for Microphone..............................................................................63

3.21.2. Reference Circuit Design for Receiver Interface.................................................................. 63

3.21.3. Reference Circuit Design for Headphone Interface............................................................. 64

3.21.4. Reference Circuit Design for Loudspeaker Interface...........................................................64

3.21.5. Audio Interface Design Considerations..................................................................................65

3.22. Emergency Download Interface.........................................................................................................65

4 Wi-Fi and BT...................................................................................................................................................... 66

4.1. Wi-Fi Overview......................................................................................................................................66

4.1.1. Wi-Fi Performance..................................................................................................................... 66

4.2. BT Overview.......................................................................................................................................... 68

4.2.1. BT Performance......................................................................................................................... 69

5 GNSS....................................................................................................................................................................70

5.1. GNSS Performance..............................................................................................................................70

5.2. GNSS RF Design Guidance............................................................................................................... 70

6 Antenna Interface.............................................................................................................................................72

6.1. Main/Rx-diversity Antenna Interfaces................................................................................................72

6.1.1. Operating Frequency.................................................................................................................72

6.1.2. Reference Design of Main and Rx-diversity Antenna Interfaces....................................... 74

6.1.3. Reference Design of RF Layout.............................................................................................. 74

6.2. Wi-Fi/BT Antenna Interface.................................................................................................................76

6.3. GNSS Antenna Interface.....................................................................................................................77

6.3.1. Recommended Circuit for Passive Antenna..........................................................................78

6.3.2. Recommended Circuit for Active Antenna............................................................................. 78

6.4. Antenna Installation..............................................................................................................................79

6.4.1. Antenna Requirement................................................................................................................79

6.4.2. Recommended RF Connector for Antenna Installation.......................................................80

7 Electrical, Reliability and Radio Characteristics.....................................................................................82

7.1. Absolute Maximum Ratings................................................................................................................ 82

7.2. Power Supply Ratings..........................................................................................................................82

7.3. Charging Performance Specifications...............................................................................................83

7.4. Operating Temperature........................................................................................................................84

7.5. Current Consumption...........................................................................................................................84

7.6. RF Output Power..................................................................................................................................99

7.7. RF Receiving Sensitivity....................................................................................................................101

7.8. Electrostatic Discharge......................................................................................................................105

8 Mechanical Dimensions...............................................................................................................................106

8.1. Mechanical Dimensions of the Module...........................................................................................106

8.2. Recommended Footprint...................................................................................................................108

8.3. Top and Bottom Views of the Module............................................................................................. 109

9 Storage, Manufacturing and Packaging..................................................................................................110

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9.1. Storage.................................................................................................................................................110

9.2. Manufacturing and Soldering............................................................................................................111

9.3. Packaging.............................................................................................................................................113

10 Appendix A References............................................................................................................................... 115

11 Appendix B GPRS Coding Schemes........................................................................................................119

12 Appendix C GPRS Multi-slot Classes...................................................................................................... 120

13 Appendix D EDGE Modulation and Coding Schemes.........................................................................122

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Table Index

TABLE 1: SC20-CE R1.1 FREQUENCY BANDS

........................................................................................................

TABLE 2: SC20-E FREQUENCY BANDS

.....................................................................................................................

TABLE 3: SC20-A FREQUENCY BANDS

.....................................................................................................................

TABLE 4: SC20-AU FREQUENCY BANDS

..................................................................................................................

TABLE 5: SC20-J FREQUENCY BANDS

......................................................................................................................

TABLE 6: SC20 KEY FEATURES

...................................................................................................................................

TABLE 7: I/O PARAMETERS DEFINITION

...................................................................................................................

TABLE 8: PIN DESCRIPTION

.........................................................................................................................................

TABLE 9: POWER DESCRIPTION

.................................................................................................................................

TABLE 10: PIN DEFINITION OF USB INTERFACE

....................................................................................................

TABLE 11: USB TRACE LENGTH INSIDE THE MODULE

........................................................................................

TABLE 12: PIN DEFINITION OF UART INTERFACES

...............................................................................................

TABLE 13: PIN DEFINITION OF (U)SIM INTERFACES

.............................................................................................

TABLE 14: PIN DEFINITION OF SD CARD INTERFACE

..........................................................................................

TABLE 15: SD CARD TRACE LENGTH INSIDE THE MODULE

..............................................................................

TABLE 16: PIN DEFINITION OF GPIO INTERFACES

................................................................................................

TABLE 17: PIN DEFINITION OF I2C INTERFACES

...................................................................................................

TABLE 18: PIN DEFINITION OF ADC INTERFACES

.................................................................................................

TABLE 19: PIN DEFINITION OF MOTOR DRIVE INTERFACE

.................................................................................

TABLE 20: PIN DEFINITION OF LCM INTERFACE

....................................................................................................

TABLE 21: PIN DEFINITION OF TOUCH PANEL INTERFACE

.................................................................................

TABLE 22: PIN DEFINITION OF REAR CAMERA INTERFACE

...............................................................................

TABLE 23: PIN DEFINITION OF FRONT CAMERA INTERFACE

.............................................................................

TABLE 24: MIPI TRACE LENGTH INSIDE THE MODULE

........................................................................................

TABLE 25: PIN DEFINITION OF SENSOR INTERFACES

.........................................................................................

TABLE 26: PIN DEFINITION OF AUDIO INTERFACES

.............................................................................................

TABLE 27: Wi-Fi TRANSMITTING PERFORMANCE

.................................................................................................

TABLE 28: Wi-Fi RECEIVING PERFORMANCE

.........................................................................................................

TABLE 29: BT DATA RATE AND VERSION

..................................................................................................................

TABLE 30: BT TRANSMITTING AND RECEIVING PERFORMANCE

.....................................................................

TABLE 31: GNSS PERFORMANCE

..............................................................................................................................

TABLE 32: PIN DEFINITION OF MAIN/RX-DIVERSITY ANTENNA INTERFACES

................................................

TABLE 33: SC20 MODULE OPERATING FREQUENCIES

.......................................................................................

TABLE 34: PIN DEFINITION OF Wi-Fi/BT ANTENNA INTERFACE

..........................................................................

TABLE 35: Wi-Fi/BT FREQUENCY

................................................................................................................................

TABLE 36: PIN DEFINITION OF GNSS ANTENNA INTERFACE

..............................................................................

TABLE 37: GNSS FREQUENCY

....................................................................................................................................

TABLE 38: ANTENNA REQUIREMENTS

.......................................................................................................................

TABLE 39: ABSOLUTE MAXIMUM RATINGS

..............................................................................................................

TABLE 40: SC20 MODULE POWER SUPPLY RATINGS

..........................................................................................

TABLE 41: CHARGING PERFORMANCE SPECIFICATIONS

..................................................................................

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TABLE 42: OPERATING TEMPERATURE....................................................................................................................84

TABLE 43: SC20-CE R1.1 CURRENT CONSUMPTION............................................................................................84

TABLE 44: SC20-E CURRENT CONSUMPTION........................................................................................................ 87

TABLE 45: SC20-A CURRENT CONSUMPTION........................................................................................................ 91

TABLE 46: SC20-AU CURRENT CONSUMPTION..................................................................................................... 93

TABLE 47: SC20-J CURRENT CONSUMPTION......................................................................................................... 97

TABLE 48: RF OUTPUT POWER................................................................................................................................... 99

TABLE 49: SC20-CE R1.1 RF RECEIVING SENSITIVITY...................................................................................... 101

TABLE 50: SC20-E RF RECEIVING SENSITIVITY................................................................................................... 102

TABLE 51: SC20-A RF RECEIVING SENSITIVITY................................................................................................... 102

TABLE 52: SC20-AU RF RECEIVING SENSITIVITY................................................................................................ 103

TABLE 53: SC20-J RF RECEIVING SENSITIVITY....................................................................................................104

TABLE 54: ELECTROSTATIC DISCHARGE CHARACTERISTICS ( TEMPERATURE: 25ºC, HUMIDITY: 45%)

............................................................................................................................................................................................ 105

TABLE 55: REEL PACKAGING.....................................................................................................................................114

TABLE 56: RELATED DOCUMENTS........................................................................................................................... 115

TABLE 57: TERMS AND ABBREVIATIONS................................................................................................................ 115

TABLE 58: DESCRIPTION OF DIFFERENT CODING SCHEMES.........................................................................119

TABLE 59: GPRS MULTI-SLOT CLASSES................................................................................................................ 120

TABLE 60: EDGE MODULATION AND CODING SCHEMES................................................................................. 122

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM

............................................................................................................................

FIGURE 2: PIN ASSIGNMENT (TOP VIEW)

................................................................................................................

FIGURE 3: VOLTAGE DROP SAMPLE

.........................................................................................................................

FIGURE 4: STAR STRUCTURE OF THE POWER SUPPLY

.....................................................................................

FIGURE 5: REFERENCE CIRCUIT OF POWER SUPPLY

........................................................................................

FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT

...........................................................................

FIGURE 7: TURN ON THE MODULE USING KEYSTROKE

.....................................................................................

FIGURE 8: TIMING OF TURNING ON MODULE

........................................................................................................

FIGURE 9: TIMING OF TURNING OFF MODULE

......................................................................................................

FIGURE 10: RTC POWERED BY COIN CELL

............................................................................................................

FIGURE 11: RTC POWERED BY CAPACITOR

...........................................................................................................

FIGURE 12: REFERENCE DESIGN FOR BATTERY CHARGING CIRCUIT

.........................................................

FIGURE 13: USB INTERFACE REFERENCE DESIGN (OTG IS NOT SUPPORTED)

.........................................

FIGURE 14: USB INTERFACE REFERENCE DESIGN (OTG IS SUPPORTED)

..................................................

FIGURE 15: REFERENCE CIRCUIT WITH LEVEL TRANSLATOR CHIP (FOR UART1)

....................................

FIGURE 16: RS232 LEVEL MATCH CIRCUIT (FOR UART1)

...................................................................................

FIGURE 17: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR

..............................................................................................................................................................................................

FIGURE 18: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR46

FIGURE 19: REFERENCE CIRCUIT FOR SD CARD INTERFACE

.........................................................................

FIGURE 20: REFERENCE CIRCUIT FOR MOTOR CONNECTION

........................................................................

FIGURE 21: REFERENCE CIRCUIT DESIGN FOR LCM INTERFACE

..................................................................

FIGURE 22: REFERENCE DESIGN FOR BACKLIGHT DIRVING CIRCUIT

.........................................................

FIGURE 23: REFERENCE CIRCUIT DESIGN FOR TP INTERFACE

......................................................................

FIGURE 24: REFERENCE CIRCUIT DESIGN FOR REAR CAMERA INTERFACE

.............................................

FIGURE 25: REFERENCE CIRCUIT DESIGN FOR FRONT CAMERA INTERFACE

...........................................

FIGURE 26: REFERENCE CIRCUIT DESIGN FOR MICROPHONE INTERFACE

...............................................

FIGURE 27: REFERENCE CIRCUIT DESIGN FOR RECEIVER INTERFACE

......................................................

FIGURE 28: REFERENCE CIRCUIT DESIGN FOR HEADPHONE INTERFACE

.................................................

FIGURE 29: REFERENCE CIRCUIT DESIGN FOR LOUDSPEAKER INTERFACE

.............................................

FIGURE 30: REFERENCE CIRCUIT DESIGN FOR EMERGENCY DOWNLOAD INTERFACE

........................

FIGURE 31: REFERENCE CIRCUIT DESIGN FOR MAIN AND RX-DIVERSITY ANTENNA INTERFACES

....

FIGURE 32: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB

..............................................................................

FIGURE 33: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB

........................................................

FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE

GROUND)

...........................................................................................................................................................................

FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE

GROUND)

...........................................................................................................................................................................

FIGURE 36: REFERENCE CIRCUIT DESIGN FOR Wi-Fi/BT ANTENNA

...............................................................

FIGURE 37: REFERENCE CIRCUIT DESIGN FOR GNSS PASSIVE ANTENNA

.................................................

FIGURE 38: REFERENCE CIRCUIT DESIGN FOR GNSS ACTIVE ANTENNA

....................................................

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FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM)...................................................... 80

FIGURE 40: MECHANICALS OF UF.L-LP CONNECTORS.......................................................................................81

FIGURE 41: SPACE FACTOR OF MATED CONNECTORS (UNIT: MM)................................................................ 81

FIGURE 42: MODULE TOP AND SIDE DIMENSIONS............................................................................................ 106

FIGURE 43: MODULE BOTTOM DIMENSIONS (TOP VIEW).................................................................................107

FIGURE 44: RECOMMENDED FOOTPRINT (TOP VIEW)......................................................................................108

FIGURE 45: TOP VIEW OF THE MODULE................................................................................................................ 109

FIGURE 46: BOTTOM VIEW OF THE MODULE....................................................................................................... 109

FIGURE 47: RECOMMENDED STENCIL DESIGN FOR LGA PADS.....................................................................111

FIGURE 48: REFLOW SOLDERING THERMAL PROFILE..................................................................................... 112

FIGURE 49: TAPE DIMENSIONS.................................................................................................................................113

FIGURE 50: REEL DIMENSIONS................................................................................................................................ 113

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1 Introduction

This document defines the SC20 module and describes its air interface and hardware interface which are

connected with customers’ application.

This document can help customers quickly understand module interface specifications, electrical and

mechanical details as well as other related information of SC20 module. Associated with application note

and user guide, customers can use SC20 module to design and set up mobile applications easily.

1.1. Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service

or repair of any cellular terminal or mobile incorporating SC20 module. Manufacturers of the cellular

terminal should send the following safety information to users and operating personnel, and incorporate

these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for

customers’ failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an

accident. Using a mobile while driving (even with a handsfree kit) causes

distraction and can lead to an accident. You must comply with laws and regulations

restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is

switched off. The operation of wireless appliances in an aircraft is forbidden, so as

to prevent interference with communication systems. Consult the airline staff about

the use of wireless devices on boarding the aircraft, if your device offers an

Airplane Mode which must be enabled prior to boarding an aircraft.

Switch off your wireless device when in hospitals,clinics or other health care

facilities. These requests are designed to prevent possible interference with

sensitive medical equipment.

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Cellular terminals or mobiles operating over radio frequency signal and cellular

network cannot be guaranteed to connect in all conditions, for example no mobile

fee or with an invalid (U)SIM card. While you are in this condition and need

emergent help, please remember using emergency call. In order to make or

receive a call, the cellular terminal or mobile must be switched on and in a service

area with adequate cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,

it receives and transmits radio frequency energy. RF interference can occur if it is

used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn

off wireless devices such as your phone or other cellular terminals. Areas with

potentially explosive atmospheres include fuelling areas, below decks on boats,

fuel or chemical transfer or storage facilities, areas where the air contains

chemicals or particles such as grain, dust or metal powders, etc.

Please do not discard. Maybe wireless devices have an impact on the environment

so please do not arbitrarily discarded.



Operation frequency range and related output power levels for

2G/WCDMA/LTE, BT , BLE , WiFi 2.4GHz , WiFi 5GHz, WiFi 5.8GHz and

GPS.

Bluetooth

Bluetooth LE

802.11a/b/g/n (HT20/40/80)

GSM 900

DCS1800

WCDMA B1

WCDMA B8

LTE B1

LTE B3

LTE B7

LTE B8

LTE B28

2402MHz - 2480 MHz @ 8.96dBm

2402MHz - 2480MHz @ 6.92dBm

2412MHz - 2472 MHz @ 16.82dBm

5150MHz - 5250 MHz @ 17.26dBm

5250MHz - 5350 MHz @ 17.07dBm

5470MHz - 5725 MHz @ 16.36dBm

5725MHz - 5850 MHz @ 13.4dBm

880MHz - 915MHz @ 35dBm

1710MHz - 1785MHz @ 32dBm

1920MHz - 1980MHz @ 25dBm

880MHz - 915MHz @ 25 dBm

1920MHz - 1980MHz @ 25dBm

1710MHz - 1785MHz @ 25dBm

2500MHz - 2570MHz @ 25dBm

880MHz - 915MHz @ 25dBm

703MHz –748 MHz @ 25dBm

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LTE B40

GPS Receiver

2300MHz - 2400MHz @25dBm

1575.42MHz



The device is restricted to indoor use only when operating in the 5150 to 5350

MHz frequency range.

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2 Product Concept

2.1. General Description

SC20 is a series of Smart LTE module based on Qualcomm platform and Android operating system, and

provides industrial grade performance. It supports worldwide LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+,

HSDPA, HSUPA, WCDMA, TD-SCDMA, CDMA, EDGE and GPRS coverage, and also supports

short-range wireless communication via Wi-Fi 802.11a/b/g/n and BT4.1 LE. Additionally, SC20 integrates

GPS/GLONASS/BeiDou satellite positioning systems. Due to multiple speech and audio and video

codecs as well as the built-in high performance AdrenoTM304 graphics processing unit, it enables smooth

play of 720P videos. The module also offers multiple audio and video input/output interfaces as well as

abundant GPIO interfaces.

SC20 module contains five variants: SC20-CE R1.1, SC20-E, SC20-A, SC20-AU and SC20-J. The

following tables show the supported frequency bands and network standards of SC20.

Table 1: SC20-CE R1.1 Frequency Bands

Type

Frequency

LTE-FDD

B1/B3/B5/B8

LTE-TDD

B38/B39/B40/B41

WCDMA

B1/B8

TD-SCDMA

B34/B39

CDMA

BC0

GSM

900/1800MHz

Wi-Fi 802.11a/b/g/n

2400MHz~2482MHz

5180MHz~5825MHz

BT4.1 LE

2402MHz~2480MHz

GNSS

GPS: 1575.42MHz±1.023MHz

GLONASS: 1597.5MHz~1605.8MHz

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BeiDou: 1561.098MHz±2.046MHz

Table 2: SC20-E Frequency Bands

Type

Frequency

LTE-FDD

B1/B3/B5/B7/B8/B20

LTE-TDD

B38/B40/B41

WCDMA

B1/B5/B8

GSM

850/900/1800/1900MHz

Wi-Fi 802.11a/b/g/n

2400MHz~2482MHz

5180MHz~5825MHz

BT4.1 LE

2402MHz~2480MHz

GNSS

GPS: 1575.42MHz±1.023MHz

GLONASS: 1597.5MHz~1605.8MHz

BeiDou: 1561.098MHz±2.046MHz

Table 3: SC20-A Frequency Bands

Type

Frequency

LTE-FDD

B2/B4/B5/B7/B12/B13/B25/B26

WCDMA

B1/B2/B4/B5/B8

GSM

850/1900MHz

Wi-Fi 802.11a/b/g/n

2400MHz~2482MHz

5180MHz~5825MHz

BT4.1 LE

2402MHz~2480MHz

GNSS

GPS: 1575.42MHz±1.023MHz

GLONASS: 1597.5MHz~1605.8MHz

BeiDou: 1561.098MHz±2.046MHz

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Table 4: SC20-AU Frequency Bands

Type

Frequency

LTE-FDD

B1/B3/B5/B7/B8/B28

LTE-TDD

B40

WCDMA

B1/B2/B5/B8

GSM

850/900/1800/1900MHz

Wi-Fi 802.11a/b/g/n

2400MHz~2482MHz

5180MHz~5825MHz

BT4.1 LE

2402MHz~2480MHz

GNSS

GPS: 1575.42MHz±1.023MHz

GLONASS: 1597.5MHz~1605.8MHz

BeiDou: 1561.098MHz±2.046MHz

Table 5: SC20-J Frequency Bands

Type

Frequency

LTE-FDD

B1/B3/B8/B18/B19/B26

LTE-TDD

B41

WCDMA

B1/B6/B8/B19

Wi-Fi 802.11a/b/g/n

2400MHz~2496MHz

5180MHz~5825MHz

BT4.1 LE

2402MHz~2480MHz

GNSS

GPS: 1575.42MHz±1.023MHz

GLONASS: 1597.5MHz~1605.8MHz

BeiDou: 1561.098MHz±2.046MHz

SC20 is an SMD type module, which can be embedded into applications through its 210-pin pads

including 146 LCC signal pads and 64 other pads. With a compact profile of 40.5mm × 40.5mm × 2.8mm,

SC20 can meet almost all requirements for M2M applications such as CPE, wireless POS, smart

metering, router, data card, automotive, smart phone, digital signage, alarm panel, security and industry

PDA, etc.

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2.2. Key Features

The following table describes the detailed features of SC20 module.

Table 6: SC20 Key Features

Feature

Details

Applications Processor

ARM Cortex-A7 microprocessor cores (quad-core) up to 1.1GHz

512KB L2 cache

Modem DSP

QDSP6 v5 core up to 691.2MHz

768KB L2 cache

Memory

8GB EMMC+8Gb LPDDR3

Operating System

Android 6.0

Power Supply

Supply voltage: 3.5V~4.2V

Typical supply voltage: 3.8V

Transmitting Power

Class 4 (33dBm±2dB) for GSM850 and EGSM900

Class 1 (30dBm±2dB) for DCS1800 and PCS1900

Class E2 (27dBm±3dB) for GSM850 and EGSM900 8-PSK

Class E2 (26dBm±3dB) for DCS1800 and PCS1900 8-PSK

Class 3 (24dBm+1/-3dB) for WCDMA bands

Class 3 (24dBm+3/-1dB) for CDMA BC0

Class 2 (24dBm+1/-3dB) for TD-SCDMA bands

Class 3 (23dBm±2dB) for LTE-FDD bands

Class 3 (23dBm±2dB) for LTE-TDD bands

LTE Features

Support 3GPP R8 Cat.4 FDD and TDD

Support 1.4 to 20 MHz RF bandwidth

Support DL 2 x 2 MIMO



FDD: Max 150Mbps (DL)/Max 50Mbps (UL)



TDD: Max 130Mbps (DL)/Max 35Mbps (UL)

UMTS Features

Support 3GPP R8 DC-HSDPA/HSPA+/HSDPA/HSUPA/WCDMA

Support 16-QAM, 64-QAM and QPSK modulation

 DC-HSDPA: Max 42Mbps (DL)

 HSUPA: Max 5.76Mbps (UL)

 WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)

TD-SCDMA Features

Support CCSA Release 3



Max 4.2Mbps (DL)/Max 2.2Mbps (UL)

CDMA2000 Features

Support 3GPP2 CDMA2000 1X Advanced, CDMA2000 1x EV-DO Rev.A



EVDO: Max 3.1Mbps (DL)/Max 1.8Mbps (UL)



1X Advanced: Max 307.2Kbps (DL)/Max 307.2Kbps (UL)

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GSM Features

R99:

CSD: 9.6kbps, 14.4kbps

GPRS:

Support GPRS multi-slot class 33 (33 by default)

Coding scheme: CS-1, CS-2, CS-3 and CS-4

Max 85.6Kbps (UL)/Max 107Kbps (DL)

EDGE:

Support EDGE multi-slot class 33 (33 by default)

Support GMSK and 8-PSK for different MCS (Modulation and Coding

Scheme)

Downlink coding schemes: CS 1-4 and MCS 1-9

Uplink coding schemes: CS 1-4 and MCS 1-9

Max 236.8Kbps (UL)/Max 296Kbps (DL)

WLAN Features

Support 2.4GHz and 5GHz frequency bands

Support 802.11a/b/g/n, maximally up to 150Mbps

Support AP mode

Bluetooth Feature

BT4.1 LE

GNSS Features

GPS/GLONASS/BeiDou

SMS

Text and PDU mode

Point-to-point MO and MT

SMS cell broadcast

SMS storage: ME by default

LCM Interface

4-lane MIPI_DSI, up to 1.5Gbps per lane

Support WVGA (2-lane MIPI_DSI), up to 720p (4-lane MIPI_DSI)

24bit color depth

Camera Interfaces

Use MIPI_CSI, up to 1.5Gbps per lane

Support two cameras:

2-lane MIPI_CSI for rear camera, max pixel up to 8MP

1-lane MIPI_CSI for front camera, max pixel up to 2MP

Video Codec

Video encoding:

H.264 BP/MP – 720p @30fps

MPEG-4 SP/H.263 P0 – WVGA @30fps

VP8 – WVGA @30fps

Video decoding:

H.264 BP/MP/HP – 1080P @30fps

MPEG-4 SP/ASP –1080P @30fps

DivX 4x/5x/6x –1080P @30fps

H.263 P0 – WVGA @30fps

VP8 –1080P @30 fps

(HEVC) H.265 MP 8 bit –1080P @30fps

Audio Interfaces

Audio input:

2 groups of analog microphone input, integrating internal bias voltage

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Audio output:

Class AB stereo headphone output

Class AB earpiece differential output

Class D speaker differential amplifier output

Audio Codec

HR, FR, EFR, AMR, AMR-WB

USB Interface

Compliant with USB 2.0 specification; the data transfer rate can reach up

to 480Mbps

Used for AT command communication, data transmission, software

debugging and firmware upgrade

Support USB OTG (Need additional 5V power supply chip)

USB Driver: Support Windows XP, Windows Vista, Windows 7/8/8.1

(U)SIM Interfaces

2 groups of (U)SIM interfaces

Support USIM/SIM card: 1.8V, 2.95V

Support Dual SIM Dual Standby (supported by default)

UART Interfaces

2 UART interfaces: UART1 and UART2

 UART1: 4-wire UART interface with RTS/CTS hardware flow control;

baud rate up to 4Mbps

 UART2: 2-wire UART interface used for debugging

Motor Drive Interface

Drive ERM motor

SD Card Interface

Support SD 3.0, 4-bit SDIO

Support hot-plug

I2C Interfaces

3 groups of I2C

Used for peripherals such as camera, sensor, touch panel, etc.

ADC Interfaces

Support 3 ADC interfaces

Used for input voltage sense, battery temperature detection and general

purpose ADC

Real Time Clock

Supported

Antenna Interfaces

Main antenna, DRX antenna, GNSS antenna and Wi-Fi/BT antenna

Physical Characteristics

Size: (40.5±0.15) × (40.5±0.15) × (2.8±0.2)mm

Package: LCC

Weight: approx. 9.8g

Temperature Range

Operating temperature range: -35°C~+65°C

Extended temperature range: -40°C~+75°C

Firmware Upgrade

Over USB interface

RoHS

All hardware components are fully compliant with EU RoHS directive

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Within operation temperature range, the module is 3GPP compliant.

Within extended temperature range, the module remains the ability to establish and maintain a

voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There

are also no effects on radio spectrum and no harm to radio network. Only one or more parameters

like P

out

might reduce in their value and exceed the specified tolerances. When the temperature

returns to the normal operating temperature levels, the module will meet 3GPP specifications again.

2.3. Functional Diagram

The following figure shows a block diagram of SC20 and illustrates the major functional parts.

 Power management

 Radio frequency

 Baseband

 LPDDR3+EMMC flash

 Peripheral interfaces

--USB interface

--UART interfaces

--(U)SIM interfaces

--SD card interface

--GPIO interfaces

--I2C interfaces

--ADC interfaces

--LCM (MIPI) interface

--TP interface

--CAM (MIPI) interface

--Audio interfaces

NOTES

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Figure 1: Functional Diagram

2.4. Evaluation Board

In order to help customers develop applications with SC20 conveniently, Quectel supplies the evaluation

board (SMART EVB), USB to RS232 converter cable, USB data cable, power adapter, battery, earphone,

antenna and other peripherals to control or test the module. For more details, please refer to

document [1].

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3 Application Interfaces

3.1. General Description

SC20 is equipped with 146-pin 1.0mm pitch SMT pads plus 64-pin ground/reserved pads that can be

embedded into cellular application platform. The following chapters provide the detailed description of

pins/interfaces listed below.

 Power supply

 VRTC interface

 USB interface

 UART interfaces

 SD card interface

 GPIO interfaces

 I2C interfaces

 ADC interfaces

 Motor drive interface

 LCM interface

 (U)SIM interfaces

 TP interface

 Camera interfaces

 Sensor interfaces

 Audio interfaces

 Emergency download interface

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3.2. Pin Assignment

The following figure shows the pin assignment of SC20 module.

Figure 2: Pin Assignment (Top View)

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3.3. Pin Description

The following tables show the SC20’s pin definition.

Table 7: I/O Parameters Definition

Type

Description

Bidirectional

Digital input

Digital output

Power input

Power output

Analog input

Analog output

Open drain

Table 8: Pin Description

Power Supply

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

VBAT_BB

1, 2

Power supply for

module’s

baseband part.

Vmax=4.2V

Vmin=3.5V

Vnorm=3.8V

It must be able to

provide sufficient

current up to 3.0A.

It is suggested to

use a zener diode

for voltage

stabilization.

VBAT_RF

145, 146

Power supply for

module’s RF part.

Vmax=4.2V

Vmin=3.5V

Vnorm=3.8V

VRTC

126

PI/PO

Power supply for

internal RTC

circuit.

VOmax=3.2V

VI=2.0V~3.25V

If unused, keep this

pin open.

LDO5_1V8

111

1.8V output power

supply

Vnorm=1.8V

IOmax=20mA

Power supply for

external GPIO’s pull

up circuits and level

conversion circuit.

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LDO6_1V8

125

1.8V output power

supply

Vnorm=1.8V

IOmax=100mA

Power supply for

peripherals.

2.2uF~4.7uF

capacitor is

recommended to be

applied to the

LDO6_1V8 pin.

If unused, keep this

pin open.

LDO17_2V85

129

2.85V output

power supply

Vnorm=2.85V

IOmax=300mA

Power supply for

peripherals.

2.2uF~4.7uF

capacitor is

recommended to be

applied to the

LDO17_2V85 pin.

If unused, keep this

pin open.

SD_LDO11

Power supply for

SD card.

Vnorm=2.95V

IOmax=600mA

SD_LDO12

1.8V/2.95V output

power supply

Vnorm=2.95V

IOmax=50mA

Power supply for

SD’s pull up circuits.

GND

3, 7, 12,

15, 27,

51, 62,

69, 76,

78, 85,

86, 88,

89, 120,

122, 130,

132, 135,

140, 143,

144,

147~150,

160~178,

180~182,

184~186,

188~189,

192~193,

198~200,

201~208,

GND

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209

Audio Interfaces

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

MIC1P

Microphone

positive input for

channel 1

MIC_GND

MIC reference

ground

MIC2P

Microphone

positive input for

channel 2

EARP

Earpiece positive

output

EARN

Earpiece negative

output

SPKP

Speaker positive

output

SPKN

Speaker negative

output

HPH_R

136

Headphone right

channel output

HPH_GND

137

Headphone virtual

ground

HPH_L

138

Headphone left

channel output

HS_DET

139

Headset insertion

detection

High level by

default.

USB Interface

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

USB_VBUS

141, 142

USB power supply

Vmax=6.3V

Vmin=4.35V

Vnorm=5.0V

Used for USB 5V

power input and

USB detection.

USB_DM

USB differential

data bus (minus)

Compliant with USB

2.0 standard

specification.

Require differential

impedance of 90Ω. USB_DP

USB differential

data bus (plus)

USB_ID

16AIUSB ID detection

High level by

default.

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(U)SIM Interfaces

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

USIM2_

DETECT

(U)SIM2 card

hot-plug detection

VILmax=0.63V

VIHmin=1.17V

Active Low. External

pull-up resistor is

required.

If unused, keep this

pin open.

USIM2_RST

(U)SIM2 card reset

signal

VOLmax=0.4V

VOHmin=

0.8×USIM2_VDD

USIM2_CLK

(U)SIM2 card

clock signal

VOLmax=0.4V

VOHmin=

0.8×USIM2_VDD

USIM2_DATA

(U)SIM2 card data

signal

VILmax=

0.2×USIM2_VDD

VIHmin=

0.7×USIM2_VDD

VOLmax=0.4V

VOHmin=

0.8×USIM2_VDD

USIM2_VDD

(U)SIM2 card

power supply

For 1.8V (U)SIM:

Vmax=1.85V

Vmin=1.75V

For 2.95V (U)SIM:

Vmax=3.1V

Vmin=2.8V

Either 1.8V or 2.95V

(U)SIM card is

supported by the

module

automatically.

USIM1_

DETECT

(U)SIM1 card

hot-plug detection

VILmax=0.63V

VIHmin=1.17V

Active low. External

pull-up resistor is

required.

If unused, keep this

pin open.

USIM1_RST

(U)SIM1 card reset

signal

VOLmax=0.4V

VOHmin=

0.8×USIM1_VDD

USIM1_CLK

(U)SIM1 card

clock signal

VOLmax=0.4V

VOHmin=

0.8×USIM1_VDD

USIM1_DATA

(U)SIM1 card data

signal

VILmax=

0.2×USIM1_VDD

VIHmin=

0.7×USIM1_VDD

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VOLmax=0.4V

VOHmin=

0.8×USIM1_VDD

USIM1_VDD

(U)SIM1 card

power supply

For 1.8V (U)SIM:

Vmax=1.85V

Vmin=1.75V

For 2.95V (U)SIM:

Vmax=3.1V

Vmin=2.8V

Either 1.8V or 2.95V

(U)SIM card is

supported by the

module

automatically

UART Interfaces

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

UART1_TX

UART1 transmit

data

VOLmax=0.45V

VOHmin=1.35V

1.8V power domain.

If unused, keep this

pin open.

UART1_RX

35DIUART1 receive data

VILmax=0.63V

VIHmin=1.17V

1.8V power domain.

If unused, keep this

pin open.

UART1_CTS

UART1 clear to

send

VILmax=0.63V

VIHmin=1.17V

1.8V power domain.

If unused, keep this

pin open.

UART1_RTS

UART1 request to

send

VOLmax=0.45V

VOHmin=1.35V

1.8V power domain.

If unused, keep this

pin open.

UART2_RX

UART2 receive

data.

Debug port by

default.

VILmax=0.63V

VIHmin=1.17V

1.8V power domain.

If unused, keep this

pin open.

UART2_TX

UART2 transmit

data.

Debug port by

default.

VOLmax=0.45V

VOHmin=1.35V

1.8V power domain.

If unused, keep this

pin open.

SD Card Interface

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

SD_CLK

High speed digital

clock signal of SD

card

1.8V SD card:

VOLmax=0.45V

VOHmin=1.4V

2.95V SD card:

VOLmax=0.37V

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VOHmin=2.2V

SD_CMD

Command signal of

SD card

1.8V SD card:

VILmax=0.58V

VIHmin=1.27V

VOLmax=0.45V

VOHmin=1.4V

2.95V SD card:

VILmax=0.73V

VIHmin=1.84V

VOLmax=0.37V

VOHmin=2.2V

SD_DATA0

High speed

bidirectional digital

signal lines of SD

card

1.8V SD card:

VILmax=0.58V

VIHmin=1.27V

VOLmax=0.45V

VOHmin=1.4V

2.95V SD card:

VILmax=0.73V

VIHmin=1.84V

VOLmax=0.37V

VOHmin=2.2V

SD_DATA1

IO SD_DATA2

IO SD_DATA3

SD_DET

SD card insertion

detection

VILmax=0.63V

VIHmin=1.17V

Active low

Touch Panel (TP) Interface

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

TP_INT

30DIInterrupt signal of TP

VILmax=0.63V

VIHmin=1.17V

1.8V power domain.

TP_RST

31DOReset signal of TP

VOLmax=0.45V

VOHmin=1.35V

1.8V power domain.

Active low.

TP_I2C_SCL

47ODI2C clock signal of TP

1.8V power domain.

TP_I2C_SDA

48ODI2C data signal of TP

1.8V power domain.

LCM Interface

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Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

PWM

Adjust the backlight

brightness.

PWM control signal.

VOLmax=0.45V

VOHmax=VBAT_BB

LCD_RST

49DOLCD reset signal

VOLmax=0.45V

VOHmin=1.35V

1.8V power domain.

Active low.

LCD_TE

LCD tearing effect

signal

VILmax=0.63V

VIHmin=1.17V

1.8V power domain.

MIPI_DSI_

CLKN

MIPI DSI clock signal

(negative)

MIPI_DSI_

CLKP

MIPI DSI clock signal

(positive)

MIPI_DSI_

LN0N

MIPI DSI data signal

(negative)

MIPI_DSI_

LN0P

MIPI DSI data signal

(positive)

MIPI_DSI_

LN1N

MIPI DSI data signal

(negative)

MIPI_DSI_

LN1P

MIPI DSI data signal

(positive)

MIPI_DSI_

LN2N

MIPI DSI data signal

(negative)

MIPI_DSI_

LN2P

MIPI DSI data signal

(positive)

MIPI_DSI_

LN3N

MIPI DSI data signal

(negative)

MIPI_DSI_

LN3P

MIPI DSI data signal

(positive)

Camera Interfaces

Pin Name

Pin No

I/O

Description

DC Characteristics

Comment

MIPI_CSI0_

CLKN

MIPI CSI clock signal

(negative)

MIPI_CSI0_

CLKP

MIPI CSI clock signal

(positive)

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MIPI_CSI0_

LN0N

MIPI CSI data signal

(negative)

MIPI_CSI0_

LN0P

MIPI CSI data signal

(positive)

MIPI_CSI0_

LN1N

MIPI CSI data signal

(negative)

MIPI_CSI0_

LN1P

MIPI CSI data signal

(positive)

MIPI_CSI1_

CLKN

MIPI CSI clock signal

(negative)

MIPI_CSI1_

CLKP

MIPI CSI clock signal

(positive)

MIPI_CSI1_

LN0N

MIPI CSI data signal

(negative)

MIPI_CSI1_

LN0P

MIPI CSI data signal

(positive)

CAM0_MCLK

Clock signal of rear

camera

VOLmax=0.45V

VOHmin=1.35V

CAM1_MCLK

Clock signal of front

camera

VOLmax=0.45V

VOHmin=1.35V

CAM0_RST

Reset signal of rear

camera

VOLmax=0.45V

VOHmin=1.35V

CAM0_PWD

Power down signal of

rear camera

VOLmax=0.45V

VOHmin=1.35V

CAM1_RST

Reset signal of front

camera

VOLmax=0.45V

VOHmin=1.35V

CAM1_PWD

Power down signal of

front camera

VOLmax=0.45V

VOHmin=1.35V

CAM_I2C_

SCL

I2C clock signal of

camera

1.8V power domain.

CAM_I2C_

SDA

I2C data signal of

camera

1.8V power domain.

Keypad Interfaces

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Pin Name

Pin No

I/O

Description

DC Characteristics

Comment

PWRKEY

114

Turn on/off the

module

VILmax=0.63V

VIHmin=1.17V

Pull-up to 1.8V

internally, active low.

KEY_VOL_

95DIVolume up

VILmax=0.63V

VIHmin=1.17V

If unused, keep this

pin open.

KEY_VOL_

DOWN

96DIVolume down

VILmax=0.63V

VIHmin=1.17V

If unused, keep this

pin open.

SENSOR_I2C Interface

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

SENSOR_I2C

_SCL

I2C clock signal for

external sensor

1.8V power domain.

SENSOR_I2C

_SDA

I2C data signal for

external sensor

1.8V power domain.

ADC Interfaces

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

ADC

128

General purpose

ADC

Maximum voltage

not exceeding 1.7V

VBAT_SNS

133AIInput voltage sense

Maximum input

voltage is 4.5V.

VBAT_

THERM

134

Battery temperature

detection

RF Interface

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

ANT_MAIN

87IOMain antenna

50Ω impedance

ANT_DRX

131AIDiversity antenna

ANT_GNSS

121AIGNSS antenna

ANT_WIFI/BT

77IOWi-Fi/BT antenna

GPIO Interfaces

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

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GPIO_23

33IOGPIO

GPIO_32

90IOGPIO

GPIO_31

97IOGPIO

GPIO_92

98IOGPIO

GPIO_88

99IOGPIO

GPIO_89

100IOGPIO

GPIO_69

101IOGPIO

GPIO_68

102IOGPIO

GPIO_97

103IOGPIO

GPIO_110

104IOGPIO

GPIO_0

105IOGPIO

GPIO_98

106IOGPIO

GPIO_94

107IOGPIO

GPIO_36

108IOGPIO

GPIO_65

109IOGPIO

GPIO_96

110IOGPIO

GPIO_58

112IOGPIO

GPIO_99

113IOGPIO

GPIO_95

115IOGPIO

GPIO_11

116IOGPIO

GPIO_10

117IOGPIO

GPIO_9

118IOGPIO

GPIO_8

119IOGPIO

GPIO_16

123IOGPIO

GPIO_17

124IOGPIO

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Other Interfaces

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

VIB_DRV

28POMotor drive

Connected to the

negative terminal of

the motor.

RESET_N

179DIReset the module

USB_BOOT

Force the module to

boot from USB port

Set USB_BOOT pin

to high level will

force the module to

enter into

emergency

download mode.

CHARGE_

SEL

127

Used for charger

selection

If it is open,

internal charger is

used;

If it is connected to

GND, external

charger is used.

Reserved Interface

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

RESERVED

151, 152,

153, 154,

155, 156,

157, 158,

159, 183,

187, 190,

191, 194,

195, 196,

197, 199,

202, 203,

204, 205,

206, 207,

210

Reserved pins

Not connected by

default.

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3.4. Power Supply

3.4.1. Power Supply Pins

SC20 provides four VBAT pins dedicated to connection with the external power supply. Two VBAT_RF

pins are used for module’s RF part; two VBAT_BB pins are used for module’s baseband part.

3.4.2. Decrease Voltage Drop

The power supply range of the module is 3.5V~4.2V, and the recommended value is 3.8V. The power

supply performance, such as load capacity, voltage ripple, etc. directly influences the module’s

performance and stability. Under ultimate conditions, the module may have a transient peak current up to

3A. If the supply voltage is not enough, there will be voltage drops, and if the voltage drops below 3.1V,

the module will be turned off automatically. Therefore, please make sure the input voltage will never drop

below 3.1V.

Figure 3: Voltage Drop Sample

To decrease voltage drop, a bypass capacitor of about 100µF with low ESR (ESR=0.7Ω) should be used,

and a multi-layer ceramic chip capacitor (MLCC) should also be reserved due to its ultra-low ESR. It is

recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and

place these capacitors close to VBAT_BB/RF pins. The main power supply from an external application

has to be a single voltage source and can be expanded to two sub paths with star structure. The width of

VBAT_BB trace should be no less than 1.5mm, and the width of VBAT_RF trace should be no less than

2mm. In principle, the longer the VBAT trace is, the wider it will be.

In addition, in order to get a stable power source, it is suggested to use a 0.5W zener diode and place it

as close to the VBAT_BB/RF pins as possible. The following figure shows the star structure of the power

supply.

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Figure 4: Star Structure of the Power Supply

3.4.3. Reference Design for Power Supply

The power design for the module is very important, as the performance of module largely depends on the

power source. The power supply of SC20 should be able to provide sufficient current up to 3A at least. If

the voltage drop between the input and output is not too high, it is suggested to use an LDO to supply

power for the module. If there is a big voltage difference between the input source and the desired output

(VBAT), a buck converter is preferred to be used as the power supply.

The following figure shows a reference design for +5V input power source which adopts an LDO

(MIC29302WU) from MICREL. The typical output voltage is 3.8V and the maximum load current is 3.0A.

Figure 5: Reference Circuit of Power Supply

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1. It is suggested that customers should switch off the power supply for module in abnormal state, and

then switch on the power to restart the module.

2. The module supports battery charging function by default. If the above power supply design is

adopted, please make sure the charging function is disabled by software, or connect VBAT to

Schottky diode in series to avoid the reverse current to the power supply chip.

3.5. Turn on and off Scenarios

3.5.1. Turn on Module Using the PWRKEY

The module can be turned on by driving PWRKEY pin to a low level for at least 1.6s. PWRKEY pin is

pulled to 1.8V internally. It is recommended to use an open drain/collector driver to control the PWRKEY.

A simple reference circuit is illustrated in the following figure.

Figure 6: Turn on the Module Using Driving Circuit

The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be

placed nearby the button for ESD protection. A reference circuit is shown in the following figure.

NOTES

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Figure 7: Turn on the Module Using Keystroke

The turning on scenario is illustrated in the following figure.

Figure 8: Timing of Turning on Module

Make sure that VBAT is stable before pulling down PWRKEY pin. The recommended time between them

is no less than 30ms. PWRKEY pin cannot be pulled down all the time.

NOTE

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3.5.2. Turn off Module

Set the PWRKEY pin low for at least 1s, and then choose to turn off the module when the prompt window

comes up.

The other way to turn off the module is to drive PWRKEY to a low level for at least 8s. The module will

execute forced shutdown. The forced power-down scenario is illustrated in the following figure.

Figure 9: Timing of Turning off Module

3.6. VRTC Interface

The RTC (Real Time Clock) can be powered by an external power source through VRTC when the

module is powered down and there is no power supply for the VBAT. The external power source can be

capacitor or rechargeable battery (such as coil cells) according to application demands. The following are

some reference circuit designs when an external battery or capacitor is utilized for powering RTC.

Figure 10: RTC Powered by Coin Cell

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Figure 11: RTC Powered by Capacitor

If RTC is ineffective, it can be synchronized through network after the module is powered on.

 2.0V~3.25V input voltage range and 3.0V typical value for VRTC. When VBAT is disconnected, the

average consumption is about 5uA.

 When powered by VBAT, the RTC error is 50ppm. When powered by VRTC, the RTC error is

200ppm.

 If the rechargeable battery is used, the ESR of the battery should be less than 2K, and it is

recommended to use the MS621FE FL11E of SEIKO.

 If large capacitance capacitor is selected, it is recommended to use a 100uF capacitor with low ESR.

The capacitor will be able to power the real-time clock for 45 seconds.

3.7. Power Output

SC20 supports output of regulated voltages for peripheral circuits. During application, it is recommended

to use parallel capacitors (33pF and 10pF) in the circuit to suppress high frequency noise.

Table 9: Power Description

Pin Name

Voltage Range (V)

Default Voltage (V)

Driving Current (mA)

IDLE

LDO5_1V8

1.820KEEP

LDO6_1V8

1.8

100

LDO17_2V85

2.85

300

SD_LDO12

1.750~3.337

2.95

SD_LDO11

1.750~3.337

2.95

600

USIM1_VDD

1.750~3.337

1.80/2.95

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USIM2_VDD

1.750~3.337

1.80/2.95

3.8. Battery Charge and Management

SC20 module can recharge batteries. The battery charger in SC20 module supports trickle charging,

constant current charging and constant voltage charging modes, which optimize the charging procedure

for Li-ion batteries.

 Trickle charging: There are two steps in this mode. When the battery voltage is below 2.8V, a 90mA

trickle charging current is applied to the battery. When the battery voltage is charged up and is

between 2.8V and 3.2V, the charging current can be set to 450mA maximally.

 Constant current mode (CC mode): When the battery is increased to between 3.2V and 4.2V, the

system will switch to CC mode. The maximum charging current is 1.44A when adapter is used for

battery charging; and the maximum charging current is 450mA while USB charging.

 Constant voltage mode (CV mode): When the battery voltage reaches the final value 4.2V, the

system will switch to CV mode and the charging current will decrease gradually. When the battery

level reaches 100%, the charging is completed.

SC20 module supports battery temperature detection in the condition that the battery integrates a

thermistor (47K 1% NTC thermistor with B-constant of 4050K by default; SDNT1608X473F4050FTF of

SUNLORD is recommended) and the thermistor is connected to VBAT_THERM pin. The default battery

temperature range is -3.0°C~48.5°C. If VBAT_THERM pin is not connected, there will be malfunctions

such as battery charging failure, battery level display error, etc.

A reference design for battery charging circuit is shown as below.

Figure 12: Reference Design for Battery Charging Circuit

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Mobile devices such as mobile phones and handheld POS systems are powered by batteries. When

different batteries are utilized, the charging and discharging curve has to be modified correspondingly so

as to achieve the best effect.

If thermistor is not available in the battery, or adapter is utilized for powering module, then there is only

need for VBAT and GND connection. In this case, the system may mistakenly judge that the battery

temperature is abnormal, which will cause battery charging failure. In order to avoid this, VBAT_THERM

should be connected to GND via a 47KΩ resistor. If VBAT_THERM is unconnected, the system will be

unable to detect the battery, making battery cannot be charged.

VBAT_SNS pin must be connected. Otherwise, the module will have abnormalities in voltage detection,

as well as associated power on/off and battery charging and discharging issues.

3.9. USB Interface

SC20 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0

specification and supports high speed (480Mbps) and full speed (12Mbps) modes. The USB interface is

used for AT command communication, data transmission, software debugging and firmware upgrade.

The following table shows the pin definition of USB interface.

Table 10: Pin Definition of USB Interface

Pin Name

Pin No.

I/O

Description

Comment

USB_VBUS

141, 142

USB power supply

4.35V~6.3V.

Typical 5.0V.

USB_DM

13IOUSB differential data bus (minus)

Require differential

impedance of 90Ω USB_DP

14IOUSB differential data bus (plus)

USB_ID

16AIUSB ID detection

High level by default

USB_VBUS can be powered by USB power or adapter. It can also be used for detecting USB connection,

as well as for battery charging via the internal PMU. The input voltage of power supply ranges from 4.35

to 6.3V, and the typical value is 5V. SC20 module supports charging management for a single Li-ion

battery, but varied charging parameters should be set for batteries with varied models or capacities. The

module is available a built-in linear-charging circuit which supports maximally 1.44A charging current.

The following are two USB interface reference designs for customers to choose from.

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Figure 13: USB Interface Reference Design (OTG is not Supported)

Figure 14: USB Interface Reference Design (OTG is Supported)

SC20 supports OTG protocol. If OTG function is needed, please refer to the above figure for the reference

design. AW3605DNR is a high efficiency DC-DC chip manufactured by AWINIC, and customers can

choose according to their own demands.

In order to ensure USB performance, please comply with the following principles while designing USB

interface.

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

It is important to route the USB signal traces as differential pairs with total grounding. The impedance

of USB differential trace is 90Ω.



Keep the ESD protection devices as close as possible to the USB connector. Pay attention to the

influence of junction capacitance of ESD protection devices on USB data lines. Typically, the

capacitance value should be less than 2pF.



Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is

important to route the USB differential traces in inner-layer with ground shielding on not only upper

and lower layer but also right and left sides.



Make sure the trace length difference between USB_DM and USB_DP is not exceeding 6.6mm.

Table 11: USB Trace Length Inside the Module

Signal

Length (mm)

Length Difference (DP-DM)

USB_DM

29.43

-0.07

USB_DP

29.36

3.10. UART Interfaces

The module provides two UART interfaces:



UART1: 4-wire UART interface which supports hardware flow control



UART2: 2-wire UART interfaces and is used for debugging

Table 12: Pin Definition of UART Interfaces

Pin Name

Pin No

I/O

Description

Comment

UART1_TX

34DOUART1 transmit data

1.8V power domain.

If it is unused, keep it open.

UART1_RX

35DIUART1 receive data

1.8V power domain.

If it is unused, keep it open.

UART1_CTS

36DIUART1 clear to send

1.8V power domain.

If it is unused, keep it open.

UART1_RTS

37DOUART1 request to send

1.8V power domain.

If it is unused, keep it open.

UART2_RX

UART2 receive data.

Debug port by default.

1.8V power domain.

If it is unused, keep it open.

UART2_TX

UART2 transmit data.

Debug port by default.

1.8V power domain.

If it is unused, keep it open.

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UART1 provides 1.8V logic level. A level translator should be used if customers’ application is equipped

with a 3.3V UART interface. A level translator TXS0104PWR provided by Texas Instruments is

recommended. The following figure shows the reference design.

Figure 15: Reference Circuit with Level Translator Chip (for UART1)

The following figure is an example of connection between SC20 and PC. A voltage level translator and a

RS-232 level translator chip are also recommended to be added between the module and PC, as these

two UART interfaces do not support the RS-232 level, while support the 1.8V CMOS level only.

Figure 16: RS232 Level Match Circuit (for UART1)

UART2 is similar to UART1. Please refer to UART1 reference circuit designs for UART2’s.

NOTE

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3.11. (U)SIM Interfaces

SC20 provides 2 (U)SIM interfaces which circuitry meet ETSI and IMT-2000 requirements. Dual SIM Card

Dual Standby is supported by default. Both 1.8V and 2.95V (U)SIM cards are supported, and the (U)SIM

card interfaces are powered by the internal power supply of SC20 module.

Table 13: Pin Definition of (U)SIM Interfaces

Pin Name

Pin No

I/O

Description

Comment

USIM2_DETECT

17DI(U)SIM2 card hot-plug detection

Active Low. External pull-up

resistor is required.

If unused, keep this pin open.

USIM2_RST

18DO(U)SIM2 card reset signal

USIM2_CLK

19DO(U)SIM2 card clock signal

USIM2_DATA

20IO(U)SIM2 card data signal

Pull-up to USIM2_VDD with a

10K resistor.

USIM2_VDD

21PO(U)SIM2 card power supply

Either 1.8V or 2.95V (U)SIM

card is supported by the

module automatically.

USIM1_DETECT

22DI(U)SIM1 card hot-plug detection

Active low. External pull-up

resistor is required.

If unused, keep this pin open.

USIM1_RST

23DO(U)SIM1 card reset signal

USIM1_CLK

24DO(U)SIM1 card clock signal

USIM1_DATA

25IO(U)SIM1 card data signal

Pull-up to USIM1_VDD with a

10K resistor.

USIM1_VDD

26PO(U)SIM1 card power supply

Either 1.8V or 2.95V (U)SIM

card is supported by the

module automatically.

SC20 supports (U)SIM card hot-plug via the USIM_DETECT pin. A reference circuit for (U)SIM interface

with an 8-pin (U)SIM card connector is shown below.

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Figure 17: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector

If there is no need to use USIM_DETECT, please keep it open. The following is a reference circuit for

(U)SIM interface with a 6-pin (U)SIM card connector.

Figure 18: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector

In order to ensure good performance and avoid damage of (U)SIM cards, please follow the criteria below

in (U)SIM circuit design:



Keep placement of (U)SIM card connector as close to the module as possible. Keep the trace length

of (U)SIM card signals as less than 200mm as possible.



Keep (U)SIM card signals away from RF and VBAT traces.



A 100nF filter capacitor shall be reserved for USIM_VDD, and its maximum capacitance should not

exceed 1uF. The capacitor should be placed near to (U)SIM card.



To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and

shield them with ground. USIM_RST also needs ground protection.

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

In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic

capacitance not exceeding 50pF. The 22Ω resistors should be added in series between the module

and (U)SIM card so as to suppress EMI spurious transmission and enhance ESD protection. Please

note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector.



The 33pF capacitors should be added in parallel on USIM_DATA, USIM_CLK and USIM_RST signal

lines so as to filter RF interference, and they should be placed as close to the (U)SIM card connector

as possible.

3.12. SD Card Interface

SC20 module supports SD cards with 4-bit data interfaces or SDIO devices. The pin definition of the SD

card interface is shown below.

Table 14: Pin Definition of SD Card Interface

Pin Name

Pin No

I/O Description

Comment

SD_LDO11

38POPower supply for SD card

Vnorm=2.95V

IOmax=600mA

SD_LDO12

32PO1.8V/2.95V output power supply

Support 1.8V or 2.95V

power supply.

The maximum drive

current is 50mA.

SD_CLK

39DOHigh speed digital clock signal of SD card

Control characteristic

impedance as 50Ω.

SD_CMD

I/O

Command signal of SD card

SD_DATA0

I/O

High speed bidirectional digital signal

lines of SD card

SD_DATA1

I/O

SD_DATA2

I/O

SD_DATA3

I/O

SD_DET

45DISD card insertion detection

Active low

A reference circuit for SD card interface is shown as below.

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Figure 19: Reference Circuit for SD Card Interface

SD_LDO11 is a peripheral driver power supply for SD card. The maximum drive current is approx. 600mA.

Because of the high drive current, it is recommended that the trace width is 0.6mm or more. In order to

ensure the stability of drive power, a 2.2uF capacitor should be added in parallel near the SD card

connector.

CMD, CLK, DATA0, DATA1, DATA2 and DATA3 are all high speed signal lines. In PCB design, please

control the characteristic impedance of them as 50Ω, and do not cross with other traces. It is

recommended to route the trace on the inner layer of PCB, and keep the same trace length for CLK, CMD,

DATA0, DATA1, DATA2 and DATA3. CLK additionally needs ground shielding.

Layout guidelines:

 Control impedance as 50Ω±10%, and ground shielding is required.

 The total trace length difference between CLK and other signal line traces should not exceed 1mm.

Table 15: SD Card Trace Length Inside the Module

Pin No.

Signal

Length (mm)

Comment

SD_CLK

14.60

SD_CMD

14.55

SD_DATA0

14.53

SD_DATA1

14.56

SD_DATA2

14.53

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SD_DATA3

14.57

3.13. GPIO Interfaces

SC20 has abundant GPIO interfaces with logic level of 1.8V. The pin definition is listed below.

Table 16: Pin Definition of GPIO Interfaces

Pin Name

GPIO

Default state

Comment

TP_INT

GPIO_13

B-PD: nppukp

Wakeup

TP_RST

GPIO_12

B-PD: nppukp

Wakeup

GPIO_23

B-PD: nppukp

UART1_TX

GPIO_20

BH-PD: nppukp

Wakeup

UART1_RX

GPIO_21

B-PD: nppukp

UART1_RX Wakeup

UART1_CTS

GPIO_111

B-PD: nppukp

Wakeup

UART1_RTS

GPIO_112

B-PD: nppukp

Wakeup

SD_DET

GPIO_38

B-PD: nppukp

Wakeup

TP_I2C_SCL

GPIO_19

B-PD: nppukp

TP_I2C_SDA

GPIO_18

B-PD: nppukp

LCD_RST

GPIO_25

B-PD: nppukp

Wakeup

LCD_TE

GPIO_24

B-PD: nppukp

CAM0_CLK

GPIO_26

B-PD: nppukp

CAM1_CLK

GPIO_27

B-PD: nppukp

CAM0_RST

GPIO_35

B-PD: nppukp

Wakeup

CAM0_PWD

GPIO_34

B-PD: nppukp

Wakeup

CAM1_RST

GPIO_28

B-PD: nppukp

Wakeup

CAM1_PWD

GPIO_33

B-PD: nppukp

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CAM_I2C_SCL

GPIO_30

B-PD: nppukp

CAM_I2C_SDA

GPIO_29

B-PD: nppukp

GPIO_32

B-PD: nppukp

SENSOR_I2C_SCL

GPIO_7

B-PD: nppukp

SENSOR_I2C_SDA

GPIO_6

B-PD: nppukp

UART2_RX

GPIO_5

B-PD: nppukp

Wakeup

UART2_TX

GPIO_4

B-PD: nppukp

KEY_VOL_UP

GPIO_90

B-PD: nppukp

Wakeup

KEY_VOL_DOWN

GPIO_91

B-PD: nppukp

Wakeup

GPIO_31

B-PD: nppukp

Wakeup

GPIO_92

B-PD: nppukp

Wakeup

GPIO_88

B-PD: nppukp

100

GPIO_89

B-PD: nppukp

101

GPIO_69

B-PD: nppukp

102

GPIO_68

B-PD: nppukp

103

GPIO_97

B-PD: nppukp

Wakeup

104

GPIO_110

B-PD: nppukp

Wakeup

105

GPIO_0

B-PD: nppukp

106

GPIO_98

B-PD: nppukp

Wakeup

107

GPIO_94

B-PD: nppukp

Wakeup

108

GPIO_36

B-PD: nppukp

Wakeup

109

GPIO_65

B-PD: nppukp

Wakeup

110

GPIO_96

B-PD: nppukp

Wakeup

112

GPIO_58

B-PD: nppukp

Wakeup

113

GPIO_99

B-PD: nppukp

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115

GPIO_95

B-PD: nppukp

Wakeup

116

GPIO_11

B-PD: nppukp

Wakeup

117

GPIO_10

B-PD: nppukp

118

GPIO_9

B-PD: nppukp

119

GPIO_8

B-PD: nppukp

123

GPIO_16

B-PD: nppukp

124

GPIO_17

B-PD: nppukp

 Wakeup: interrupt pins that can wake up the system

 B: Bidirectional digital with CMOS input

 H: High-voltage tolerant

 PD: nppukp = default pull-down with programmable options following the colon (:)

3.14. I2C Interfaces

SC20 provides 3 groups of I2C interfaces which only support the master mode. As an open drain output,

the I2C interfaces need a pull-up resistor on its external circuit, and the recommended logic level is 1.8V.

Table 17: Pin Definition of I2C Interfaces

Pin Name

Pin No

I/O Description

Comment

TP_I2C_SCL

47ODI2C clock signal of touch panel

Used for touch panel TP_I2C_SDA

48ODI2C data signal of touch panel

CAM_I2C_SCL

83ODI2C clock signal of camera

Used for camera CAM_I2C_SDA

84ODI2C data signal of camera

SENSOR_I2C_

SCL

91ODI2C clock signal for external sensor

Used for external sensor SENSOR_I2C_

SDA

92ODI2C data signal for external sensor

NOTE

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3.15. ADC Interfaces

SC20 module provides three analog-to-digital converter (ADC) interfaces, and the pin definition is shown

below.

Table 18: Pin Definition of ADC Interfaces

Pin Name

Pin No

I/O Description

Comment

ADC

128AIGeneral purpose ADC

Max input voltage is 1.7V

VBAT_SNS

133AIInput voltage sense

Max input voltage is 4.5V

VBAT_THERM

134AIBattery temperature detection

Internal pull-up; externally

connect to GND with a 47K NTC

thermistor

The resolution of the ADC is up to 16 bits.

When the input voltage exceeds the maximum input voltage of VBAT_SNS pin, resistor divider cannot be

used in the circuit design. Instead, general purpose ADC with resistor divider input can be used.

3.16. Motor Drive Interface

The pin of motor drive interface is listed below.

Table 19: Pin Definition of Motor Drive Interface

Pin Name

Pin No

I/O Description

Comment

VIB_DRV

28POMotor drive

Connected to the negative terminal of the motor

The motor is driven by an exclusive circuit, and a reference circuit design is shown below.

NOTE

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Figure 20: Reference Circuit for Motor Connection

When the motor stops, the redundant electricity can be discharged from the circuit loop formed by diodes,

thus avoiding component damages.

3.17. LCM Interface

SC20 module provides an LCM interface meeting MIPI DSI specification. The interface supports high

speed differential data transmission, with up to four lanes and a transmission rate up to 1.5Gbps per lane.

It supports maximally 720P resolution displays.

Table 20: Pin Definition of LCM Interface

Pin Name

Pin No

I/O

Description

Comment

LDO6_1V8

125

1.8V output power supply for

LCM logic circuit and DSI

1.8V normal voltage.

Vnorm=1.8V

IOmax=100mA

LDO17_2V85

129

2.85V output power supply for

LCM analog circuits

2.85V normal voltage.

Vnorm=2.85V

IOmax=300mA

PWM

Adjust the backlight brightness.

PWM control signal.

LCD_RST

49DOLCD reset signal

Active low

LCD_TE

50DILCD tearing effect signal

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MIPI_DSI_CLKN

MIPI DSI clock signal

(negative)

MIPI_DSI_CLKP

MIPI DSI clock signal

(positive)

MIPI_DSI_LN0N

MIPI DSI data signal

(negative)

MIPI_DSI_LN0P

MIPI DSI data signal

(positive)

MIPI_DSI_LN1N

MIPI DSI data signal

(negative)

MIPI_DSI_LN1P

MIPI DSI data signal

(positive)

MIPI_DSI_LN2N

MIPI DSI data signal

(negative)

MIPI_DSI_LN2P

MIPI DSI data signal

(positive)

MIPI_DSI_LN3N

MIPI DSI data signal

(negative)

MIPI_DSI_LN3P

MIPI DSI data signal

(positive)

Four-lane MIPI DSI is needed for connection with 720P displays. The following is a reference circuit

design, by taking the connection with LCM interface on LHR050H41-00 (IC: ILI9881C) from HUARUI

Lighting as an example.

Figure 21: Reference Circuit Design for LCM Interface

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MIPI are high speed signal lines. It is recommended that common-mode filters should be added in series

near the LCM connector, so as to improve protection against electromagnetic radiation interference.

ICMEF112P900MFR from ICT is recommended.

When compatible design with other displays is required, please connect the LCD_ID pin of LCM to the

module’s ADC pin, and please note that the output voltage of LCD_ID cannot exceed the voltage range of

ADC pin.

Backlight driving circuit needs to be designed for LCM, and a reference circuit design is shown in the

following figure. Backlight brightness adjustment can be realized by PWM pin of SC20 module through

adjusting the duty ratio.

Figure 22: Reference Design for Backlight Dirving Circuit

3.18. Touch Panel Interface

SC20 provides a set of I2C interface for connection with Touch Panel (TP), and also provides the

corresponding power supply and interrupt pins. The definition of TP interface pins is illustrated below.

Table 21: Pin Definition of Touch Panel Interface

Pin Name

Pin No

I/O

Description

Comment

LDO6_1V8

125

1.8V output power supply for

TP I/O power

Pull-up power supply of I2C.

1.8V normal voltage

LDO17_2V85

129

2.85V output power supply

for TP VDD power

TP power supply.

2.85V normal voltage

TP_INT

30DIInterrupt signal of TP

TP_RST

31DOReset signal of TP

Active low

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TP_I2C_SCL

47ODI2C clock signal of TP

TP_I2C_SDA

48ODI2C data signal of TP

The following illustrates a TP interface reference circuit, by taking the connection with TP interface on

LHR050H41-00 (IC: GT9147) from HUARUI Lighting as an example.

Figure 23: Reference Circuit Design for TP Interface

3.19. Camera Interfaces

Based on standard MIPI CSI video input interface, SC20 module supports two cameras, and the

maximum pixel of the rear camera can be up to 8MP. The video and photo quality is determined by

various factors such as the camera sensor, camera lens quality, etc. It is recommended to select a proper

camera model, according to the specification of cameras verified and recommended by Quectel.

The following models of camera sensors have been verified by Quectel:

 For rear camera: Hi843 of SK Hynix, T4KA3 of TOSHIBA

 For front camera: Hi259 of SK Hynix, SP2508 of SuperPix

3.19.1. Rear Camera Interface

The rear camera realizes transmission and control via its FPC and a connector which is connected to the

module. SC20 rear camera interface integrates a two-lane MIPI CSI for differential data transmission, and

it maximally supports 8MP cameras.

The pin definition of rear camera interface is shown below.

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Table 22: Pin Definition of Rear Camera Interface

Pin Name

Pin No

I/O

Description

Comment

LDO6_1V8

125

1.8V output power supply for

DOVDD of camera

1.8V normal voltage.

Vnorm=1.8V

IOmax=100mA

LDO17_2V85

129

2.85V output power supply for

AVDD of camera

2.85V normal voltage.

Vnorm=2.85V

IOmax=300mA

MIPI_CSI0_CLKN

MIPI CSI clock signal

(negative)

MIPI_CSI0_CLKP

MIPI CSI clock signal

(positive)

MIPI_CSI0_LN0N

MIPI CSI data signal

(negative)

MIPI_CSI0_LN0P

MIPI CSI data signal

(positive)

MIPI_CSI0_LN1N

MIPI CSI data signal

(negative)

MIPI_CSI0_LN1P

MIPI CSI data signal

(positive)

CAM0_MCLK

74DOClock signal of rear camera

CAM0_RST

79DOReset signal of rear camera

CAM0_PWD

80DOPower down signal of rear camera

CAM_I2C_SCL

83ODI2C clock signal of camera

CAM_I2C_SDA

84ODI2C data signal of camera

The following is a reference circuit design for rear camera interface, by taking the connection with T4KA3

camera as an example.

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Figure 24: Reference Circuit Design for Rear Camera Interface

DVDD_1V2 is used to power the rear camera core, and VDD_AF_2V8 is used to power the rear camera

AF circuit. Both of them are powered by an external LDO.

3.19.2. Front Camera Interface

The front camera interface integrates a differential data interface meeting one-lane MIPI CSI standard,

and is tested to support 2MP cameras.

The pin definition of front camera interface is shown below.

Table 23: Pin Definition of Front Camera Interface

Pin Name

Pin No

I/O

Description

Comment

LDO6_1V8

125

1.8V output power supply for

DOVDD of camera

1.8V normal voltage.

Vnorm=1.8V

IOmax=100mA

NOTE

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LDO17_2V85

129

2.85V output power supply for

AVDD of camera

2.85V normal voltage.

Vnorm=2.85V

IOmax=300mA

MIPI_CSI1_CLKN

MIPI CSI clock signal

(negative)

MIPI_CSI1_CLKP

MIPI CSI clock signal

(positive)

MIPI_CSI1_LN0N

MIPI CSI data signal

(negative)

MIPI_CSI1_LN0P

MIPI CSI data signal

(positive)

CAM1_MCLK

75DOClock signal of front camera

CAM1_RST

81DOReset signal of front camera

CAM1_PWD

Power down signal of front

camera

CAM_I2C_SCL

83ODI2C clock signal of camera

CAM_I2C_SDA

84ODI2C data signal of camera

The following is a reference circuit design for front camera interface, by taking the connection with

SP2508 camera as an example.

Figure 25: Reference Circuit Design for Front Camera Interface

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3.19.3. Design Considerations

 Special attention should be paid to the definition of video device interface in schematic design.

Different video devices will have varied definitions for their corresponding connectors. Assure the

device and the connectors are correctly connected.

 MIPI are high speed signal lines, supporting maximum data rate up to 1.5Gbps. The differential

impedance should be controlled as 100Ω. Additionally, it is recommended to route the trace on the

inner layer of PCB, and do not cross it with other traces. For the same video device, all the MIPI

traces should keep the same length. In order to avoid crosstalk, a distance of 1.5 times of the trace

width is recommended to be maintained among MIPI signal lines. During impedance matching, do

not connect GND on different planes so as to ensure impedance consistency.

 It is recommended to select a low capacitance TVS for ESD protection and the recommended

parasitic capacitance is below 1pF.

 Route MIPI traces according to the following rules:

a) The total trace length should not exceed 305mm;

b) Control the differential impedance as 100Ω±10%;

c) Control intra-lane length difference within 0.67mm;

d) Control inter-lane length difference within 1.3mm.

Table 24: MIPI Trace Length Inside the Module

Pin Name

Length (mm)

Length Difference (P-N)

MIPI_DSI_CLKN

7.08

-0.63

MIPI_DSI_CLKP

6.45

MIPI_DSI_LN0N

6.15

-0.30

MIPI_DSI_LN0P

5.85

MIPI_DSI_LN1N

6.64

-0.04

MIPI_DSI_LN1P

6.60

MIPI_DSI_LN2N

8.20

0.74

MIPI_DSI_LN2P

8.94

MIPI_DSI_LN3N

9.28

0.96

MIPI_DSI_LN3P

10.24

MIPI_CSI0_CLKN

10.55

0.54

MIPI_CSI0_CLKP

11.09

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MIPI_CSI0_LN0N

12.13

0.40

MIPI_CSI0_LN0P

12.53

MIPI_CSI0_LN1N

13.73

0.76

MIPI_CSI0_LN1P

14.49

MIPI_CSI1_CLKN

17.32

0.13

MIPI_CSI1_CLKP

17.45

MIPI_CSI1_LN0N

18.89

0.35

MIPI_CSI1_LN0P

19.24

3.20. Sensor Interfaces

SC20 module supports communication with sensors via I2C interface, and it supports ALS/PS, Compass,

G-sensor, and Gyroscopic sensors.

Verified sensor models by Quectel include: BST-BMA223, STK3311-WV, MPU-6881 and MMC35240PJ.

Table 25: Pin Definition of Sensor Interfaces

Pin Name

Pin No

I/O

Description

Comment

SENSOR_I2C_SCL

91ODI2C clock signal for external sensor

SENSOR_I2C_SDA

92ODI2C data signal for external sensor

GPIO_88

99DIGyroscope sensor interrupt signal 2

Default configuration;

but not limited to

these GPIO pins

GPIO_89

100DIGyroscope sensor interrupt signal 1

GPIO_94

107DIProximity sensor interrupt signal

GPIO_36

108DICompass sensor interrupt signal

GPIO_65

109DIGravity sensor interrupt signal 2

GPIO_96

110DIGravity sensor interrupt signal 1

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3.21. Audio Interfaces

SC20 module provides two analog input channels and three analog output channels. The following table

shows the pin definition.

Table 26: Pin Definition of Audio Interfaces

Pin Name

Pin No

I/O

Description

Comment

MIC1P

4AIMicrophone positive input for channel 1

MIC_GND

MIC reference ground

MIC2P

6AIMicrophone positive input for channel 2

EARP

8AOEarpiece positive output

EARN

9AOEarpiece negative output

SPKP

10AOSpeaker positive output

SPKN

11AOSpeaker negative output

HPH_R

136AOHeadphone right channel output

HPH_GND

137AIHeadphone virtual ground

HPH_L

138AOHeadphone left channel output

HS_DET

139AIHeadset insertion detection

High level by default

 The module offers two audio input channels which are both single-ended channels.

 The earpiece interface uses differential output.

 The loudspeaker interface uses differential output as well. The output channel is available with a

Class-D amplifier whose output power is 879mW when VBAT is 4.2V and load is 8Ω.

 The headphone interface features stereo left and right channel output, and headphone insert

detection function is supported.

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3.21.1. Reference Circuit Design for Microphone

Figure 26: Reference Circuit Design for Microphone Interface

3.21.2. Reference Circuit Design for Receiver Interface

Figure 27: Reference Circuit Design for Receiver Interface

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3.21.3. Reference Circuit Design for Headphone Interface

Figure 28: Reference Circuit Design for Headphone Interface

3.21.4. Reference Circuit Design for Loudspeaker Interface

Figure 29: Reference Circuit Design for Loudspeaker Interface

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3.21.5. Audio Interface Design Considerations

It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10pF and 33pF) for

filtering out RF interference, thus reducing TDD noise. The 33pF capacitor is applied for filtering out RF

interference when the module is transmitting at EGSM900MHz. Without placing this capacitor, TDD noise

could be heard. Moreover, the 10pF capacitor here is used for filtering out 1800MHz RF interference.

Please note that the resonant frequency point of a capacitor largely depends on the material and

production technique. Therefore, customers would have to discuss with their capacitor vendors to choose

the most suitable capacitor for filtering out high-frequency noises.

The severity degree of the RF interference in the voice channel during GSM transmitting largely depends

on the application design. In some cases, GSM900 TDD noise is more severe; while in other cases,

DCS1800 TDD noise is more obvious. Therefore, a suitable capacitor can be selected based on the test

results. Sometimes, even no RF filtering capacitor is required.

The capacitor which is used for filtering out RF noise should be close to the audio device or audio

interface. The trace should be as short as possible, and it is recommended to route the trace for

capacitors first and then for other points.

In order to decrease radio or other signal interference, RF antennas should be placed away from audio

interfaces and audio traces. Power traces cannot be parallel with and also should be far away from the

audio traces.

The differential audio traces must be routed according to the differential signal layout rule.

3.22. Emergency Download Interface

USB_BOOT is an emergency download interface. Pull up to LDO5_1V8 during power-up will force the

module enter into emergency download mode. This is an emergency option when there are failures such

as abnormal startup or running. For convenient firmware upgrade and debugging in the future, please

reverse this pin. The reference circuit design is shown as below.

Figure 30: Reference Circuit Design for Emergency Download Interface

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4 Wi-Fi and BT

SC20 module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth (BT) functions.

The interface impedance is 50Ω. External antennas such as PCB antenna, sucker antenna and ceramic

antenna can be connected to the module via the interface, so as to achieve Wi-Fi and BT functions.

4.1. Wi-Fi Overview

SC20 series module supports 2.4GHz/5GHz double-band WLAN wireless communication based on IEEE

802.11a/b/g/n standard protocols. The maximum data rate is up to 150Mbps.

The features are as below:

 Support Wake-on-WLAN (WoWLAN)

 Support ad hoc mode

 Support WAPI SMS4 hardware encryption

 Support AP mode

 Support Wi-Fi Direct

 Support MCS 0-7 for HT20 and HT40

4.1.1. Wi-Fi Performance

The following table lists the Wi-Fi transmitting and receiving performance of SC20 module.

Table 27: Wi-Fi Transmitting Performance

Standard

Rate

Output Power

2.4GHz

802.11b

1Mbps

16dBm±2.5dB

802.11b

11Mbps

16dBm±2.5dB

802.11g

6Mbps

16dBm±2.5dB

802.11g

54Mbps

14dBm±2.5dB

802.11n HT20

MCS0

15dBm±2.5dB

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802.11n HT20

MCS7

13dBm±2.5dB

802.11n HT40

MCS0

14dBm±2.5dB

802.11n HT40

MCS7

13dBm±2.5dB

5GHz

802.11a

6Mbps

15dBm±2.5dB

802.11a

54Mbps

13dBm±2.5dB

802.11n HT20

MCS0

14dBm±2.5dB

802.11n HT20

MCS7

12dBm±2.5dB

802.11n HT40

MCS0

14dBm±2.5dB

802.11n HT40

MCS7

12dBm±2.5dB

Table 28: Wi-Fi Receiving Performance

Standard

Rate

Sensitivity

2.4GHz

802.11b

1Mbps

-96dBm

802.11b

11Mbps

-87dBm

802.11g

6Mbps

-91dBm

802.11g

54Mbps

-74dBm

802.11n HT20

MCS0

-90dBm

802.11n HT20

MCS7

-72dBm

802.11n HT40

MCS0

-87dBm

802.11n HT40

MCS7

-68dBm

5GHz

802.11a

6Mbps

-90dBm

802.11a

54Mbps

-71dBm

802.11n HT20

MCS0

-88dBm

802.11n HT20

MCS7

-69dBm

802.11n HT40

MCS0

-86dBm

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802.11n HT40

MCS7

-66dBm

Referenced specifications are listed below:



IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June

2007



IEEE Std 802.11b, IEEE Std 802.11d, IEEE Std 802.11e, IEEE Std 802.11g, IEEE Std 802.11i: IEEE

802.11-2007 WLAN MAC and PHY, June 2007

4.2. BT Overview

SC20 module supports BT4.1 (BR/EDR+BLE) specification, as well as GFSK, 8-DPSK, π/4-DQPSK

modulation modes.

 Maximally support up to 7 wireless connections.

 Maximally support up to 3.5 piconets at the same time.

 Support one SCO (Synchronous Connection Oriented) or eSCO connection.

The BR/EDR channel bandwidth is 1MHz, and can accommodate 79 channels. The BLE channel

bandwidth is 2MHz, and can accommodate 40 channels.

Table 29: BT Data Rate and Version

Version

Data rate

Maximum Application Throughput

Comment

1.2

1 Mbit/s

>80 Kbit/s

2.0 + EDR

3 Mbit/s

>80 Kbit/s

3.0 + HS

24 Mbit/s

Reference 3.0 + HS

4.0

24 Mbit/s

Reference 4.0 LE

Referenced specifications are listed below:

 Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0 + HS,

August 6, 2009

 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009

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4.2.1. BT Performance

The following table lists the BT transmitting and receiving performance of SC20 module.

Table 30: BT Transmitting and Receiving Performance

Transmitter Performance

Packet Types

DH5

2-DH5

3-DH5

Transmitting Power

10dBm±2.5dB

8dBm±2.5dB

Receiver Performance

Packet Types

DH5

2-DH5

3-DH5

Receiving Sensitivity

-93dBm

-92dBm

-86dBm

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5 GNSS

SC20 module integrates a Qualcomm IZat™ GNSS engine (GEN 8C) which supports multiple positioning

and navigation systems including GPS, GLONASS and BeiDou. With an embedded LNA, the module

provides greatly improved positioning accuracy.

5.1. GNSS Performance

The following table lists the GNSS performance of SC20 module in conduction mode.

Table 31: GNSS Performance

Parameter

Description

Typ.

Unit

Sensitivity (GNSS)

Cold start

-146

dBm

Reacquisition

-158

dBm

Tracking

-160

dBm

TTFF (GNSS)

Cold start

Warm start

Hot start

Static Drift (GNSS)

CEP-50

5.2. GNSS RF Design Guidance

Bad design of antenna and layout may cause reduced GPS receiving sensitivity, longer GPS positioning

time, or reduced positioning accuracy. In order to avoid this, please follow the reference design rules as

below:

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

Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing

and antenna layout) to avoid mutual interference.



In user systems, GNSS RF signal lines and RF components should be placed far away from high

speed circuits, switched-mode power supplies, power inductors, the clock circuit of single-chip

microcomputers, etc.



For applications with harsh electromagnetic environment or with high requirement on ESD protection,

it is recommended to add ESD protective diodes for the antenna interface. Only diodes with ultra-low

junction capacitance such as 0.05pF can be selected. Otherwise, there will be effects on the

impedance characteristic of RF circuit loop, or attenuation of bypass RF signal may be caused.



Control the impedance of either feeder line or PCB trace as 50Ω, and keep the trace length as short

as possible.



Refer to Chapter 6.3 for GNSS reference circuit design.

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6 Antenna Interface

SC20 antenna interface includes a main antenna, an Rx-diversity/MIMO antenna, a GNSS antenna and a

Wi-Fi/BT antenna. The antenna interface has an impedance of 50Ω.

6.1. Main/Rx-diversity Antenna Interfaces

The pin definition of main/Rx-diversity antenna interfaces is shown below.

Table 32: Pin Definition of Main/Rx-diversity Antenna Interfaces

Pin Name

Pin No.

I/O

Description

Comment

ANT_MAIN

87IOMain antenna

50Ω impedance

ANT_DRX

131AIDiversity antenna

50Ω impedance

6.1.1. Operating Frequency

Table 33: SC20 Module Operating Frequencies

3GPP Band

Receive

Transmit

Unit

GSM850

869~894

824~849

MHz

EGSM900

925~960

880~915

MHz

DCS1800

1805~1880

1710~1785

MHz

PCS1900

1930~1990

1850~1910

MHz

WCDMA Band1

2110~2170

1920~1980

MHz

WCDMA Band2

1930~1990

1850~1910

MHz

WCDMA Band4

2110~2155

1710~1755

MHz

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WCDMA Band5

869~894

824~849

MHz

WCDMA Band6

875~885

830~840

MHz

WCDMA Band8

925~960

880~915

MHz

WCDAM Band19

875~890

830~845

MHz

CDMA BC0

869~894

824~849

MHz

TD-SCDMA Band34

2010~2025

MHz

TD-SCDMA Band39

1880~1920

MHz

LTE-FDD Band1

2110~2170

1920~1980

MHz

LTE-FDD Band2

1930~1990

1850~1910

MHz

LTE-FDD Band3

1805~1880

1710~1785

MHz

LTE-FDD Band4

2110~2155

1710~1755

MHz

LTE-FDD Band5

869~894

824~849

MHz

LTE-FDD Band7

2620~2690

2500~2570

MHz

LTE-FDD Band8

925~960

880~915

MHz

LTE-FDD Band12

729~746

699~716

MHz

LTE-FDD Band13

746~756

777~787

MHz

LTE-FDD Band18

860~875

815~830

MHz

LTE-FDD Band19

875~890

830~845

MHz

LTE-FDD Band20

791~821

832~862

MHz

LTE-FDD Band25

1930~1995

1850~1915

MHz

LTE-FDD Band26

859~894

814~849

MHz

LTE-FDD Band28

758~803

703~748

MHz

LTE-TDD Band38

2570~2620

MHz

LTE-TDD Band39

1880~1920

MHz

LTE-TDD Band40

2300~2400

MHz

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LTE-TDD Band41

2555~2655

MHz

The bandwidth of LTE-TDD Band 41 for SC20-J is 2545MHz~2655MHz, and the corresponding channel

range is 40140~41240.

6.1.2. Reference Design of Main and Rx-diversity Antenna Interfaces

A reference circuit design for main and Rx-diversity antenna interfaces is shown as below. A π-type

matching circuit should be reserved for better RF performance. The π-type matching components

(R1/C1/C2, R2/C3/C4) should be placed as close to the antennas as possible and are mounted according

to the actual debugging. C1, C2, C3 and C4 are not mounted and a 0Ω resistor is mounted on R1 and R2

respectively by default.

Figure 31: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces

6.1.3. Reference Design of RF Layout

For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50Ω. The

impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,

the distance between signal layer and reference ground (H), and the clearance between RF trace and

ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic

impedance control. The following are reference designs of microstrip line or coplanar waveguide line with

different PCB structures.

NOTE

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Figure 32: Microstrip Line Design on a 2-layer PCB

Figure 33: Coplanar Waveguide Line Design on a 2-layer PCB

Figure 34: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground)

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Figure 35: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground)

In order to ensure RF performance and reliability, the following principles should be complied with in RF

layout design:

 Use impedance simulation tool to control the characteristic impedance of RF traces as 50Ω.

 The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully

connected to ground.

 The distance between the RF pins and the RF connector should be as short as possible, and all the

right angle traces should be changed to curved ones.

 There should be clearance area under the signal pin of the antenna connector or solder joint.

 The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around

RF traces and the reference ground could help to improve RF performance. The distance between

the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W).

For more details about RF layout, please refer to document [4].

6.2. Wi-Fi/BT Antenna Interface

The following tables show the pin definition and frequency specification of the Wi-Fi/BT antenna interface.

Table 34: Pin Definition of Wi-Fi/BT Antenna Interface

Pin Name

Pin No.

I/O

Description

Comment

ANT_WIFI/BT

Wi-Fi/BT antenna interface

50Ω impedance

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Table 35: Wi-Fi/BT Frequency

Type

Frequency

Unit

802.11a/b/g/n

2400~2482

5180~5825

MHz BT4.1 LE

2402~2480

MHz

The supported Wi-Fi frequencies of SC20-J are 2400MHz~2496MHz and 5180MHz~5825MHz.

A reference circuit design for Wi-Fi/BT antenna interface is shown as below. A π-type matching circuit

should be reserved for better RF performance. The π-type matching components (R1, C1, C2) should be

placed as close to the antenna as possible and are mounted according to the actual debugging. C1 and

C2 are not mounted and a 0Ω resistor is mounted on R1 by default.

Figure 36: Reference Circuit Design for Wi-Fi/BT Antenna

6.3. GNSS Antenna Interface

The following tables show pin definition and frequency specification of GNSS antenna interface.

Table 36: Pin Definition of GNSS Antenna Interface

Pin Name

Pin No.

I/O

Description

Comment

ANT_GNSS

121AIGNSS antenna interface

50Ω impedance

NOTE

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Table 37: GNSS Frequency

Type

Frequency

Unit

GPS

1575.42±1.023

MHz

GLONASS

1597.5~1605.8

MHz

BeiDou

1561.098±2.046

MHz

6.3.1. Recommended Circuit for Passive Antenna

GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. When

the passive antenna is placed far away from the module (that is, the antenna trace is long), it is

recommended to add an external LNA circuit for better GNSS receiving performance, and the LNA should

be placed close to the antenna. A reference circuit design is given below.

Figure 37: Reference Circuit Design for GNSS Passive Antenna

6.3.2. Recommended Circuit for Active Antenna

The active antenna is powered by VCC power supply through the R1 and L1 power paths shown in the

following figure. The common power supply voltage ranges from 3.3V to 5.0V. Although featuring low

power consumption, the active antenna still requires stable and clean power supplies. It is recommended

to use high performance LDO as the power supply. A reference design of GNSS active antenna is shown

below.

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Figure 38: Reference Circuit Design for GNSS Active Antenna

6.4. Antenna Installation

6.4.1. Antenna Requirement

The following table shows the requirement on main antenna, RX-diversity antenna, Wi-Fi/BT antenna and

GNSS antenna.

Table 38: Antenna Requirements

Type

Requirements

GSM/WCDMA/TD-SCDMA/

LTE

VSWR: ≤ 2

Gain (dBi): 1

Max Input Power (W): 50

Input Impedance (Ω): 50

Polarization Type: Vertical

Cable Insertion Loss: < 1dB

(GSM850, EGSM900, WCDMA B5/B6/B8/B19, CDMA BC0, LTE-FDD

B5/B8/B12/B13/B18/B19/B20/B26/B28)

Cable Insertion Loss: < 1.5dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, TD-SCDMA B34/B39,

LTE-FDD B1/B2/B3/B4/B25, LTE-TDD B39)

Cable Insertion Loss: < 2dB

(LTE-FDD B7, LTE-TDD B38/B40/B41)

Wi-Fi/BT

VSWR: ≤ 2

Gain (dBi): 1

Max Input Power (W): 50

Input Impedance (Ω): 50

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Polarization Type: Vertical

Cable Insertion Loss: < 1dB

GNSS

Frequency range: 1565MHz~1607MHz

Polarization: RHCP or linear

VSWR: < 2 (Typ.)

Passive Antenna Gain: > 0dBi

Active Antenna Noise Figure: < 1.5dB

Active Antenna Total Gain: > 18dBi (Typ.)

6.4.2. Recommended RF Connector for Antenna Installation

If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector

provided by HIROSE.

Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm)

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U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.

Figure 40: Mechanicals of U.FL-LP Connectors

The following figure describes the space factor of mated connector.

Figure 41: Space Factor of Mated Connectors (Unit: mm)

For more details, please visit http://www.hirose.com.

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7 Electrical, Reliability and Radio

Characteristics

7.1. Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are

listed in the following table.

Table 39: Absolute Maximum Ratings

Parameter

Min.

Max.

Unit

VBAT

-0.56V

USB_VBUS

-0.516V

Peak Current of VBAT

03A

Voltage on Digital Pins

-0.3

2.3

7.2. Power Supply Ratings

Table 40: SC20 Module Power Supply Ratings

Parameter

Description

Conditions

Min.

Typ.

Max.

Unit

VBAT

The actual input voltages must

stay between the minimum and

maximum values.

3.5

3.8

4.2

Voltage drop

during transmitting

burst

Maximum power control level at

EGSM900.

400

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VBAT

Peak supply

current (during

transmission slot)

Maximum power control level at

EGSM900.

1.8

3.0

A USB_VBUS

USB detection

4.35

5.0

6.3

VRTC

Power supply

voltage of backup

battery.

2.0

3.0

3.25

7.3. Charging Performance Specifications

Table 41: Charging Performance Specifications

Parameter

Min.

Typ.

Max.

Unit

Trickle charging-A current

819099

Trickle charging-A threshold voltage range (15.62mV steps)

2.5

2.796

2.984

Trickle charging-B threshold voltage range (18.75mV steps)

3.0

3.2

3.581

Charge voltage range (25mV steps)

4.2

4.775

Charge voltage accuracy

+/-2

Charge current range (90mA steps)

1440

Charge current accuracy

+/-10

Charge termination current:

when charge current is from 90mA to 450mA

Charge termination current:

when charge current is from 450mA to 1440mA

7.4

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7.4. Operating Temperature

The operating temperature is listed in the following table.

Table 42: Operating Temperature

Parameter

Min.

Typ.

Max.

Unit

Operating temperature range

-35

+25

+65

ºC

Extended temperature range

-40

+75

ºC

Within operation temperature range, the module is 3GPP compliant.

Within extended temperature range, the module remains the ability to establish and maintain a

voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There

are also no effects on radio spectrum and no harm to radio network. Only one or more parameters

like P

out

might reduce in their value and exceed the specified tolerances. When the temperature

returns to the normal operating temperature levels, the module will meet 3GPP specifications again.

7.5. Current Consumption

The values of current consumption are shown below.

Table 43: SC20-CE R1.1 Current Consumption

Parameter

Description

Conditions

Typ.

Unit

VBAT

OFF state

Power down

GSM/GPRS supply current

Sleep (USB disconnected)

@DRX=2

3.85

Sleep (USB disconnected)

@DRX=5

3.01

Sleep (USB disconnected)

@DRX=9

2.91

WCDMA supply current

Sleep (USB disconnected)

@DRX=6

3.30

NOTES

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Sleep (USB disconnected)

@DRX=7

2.79

Sleep (USB disconnected)

@DRX=8

2.49

Sleep (USB disconnected)

@DRX=9

2.33

LTE-FDD supply current

Sleep (USB disconnected)

@DRX=5

5.60

Sleep (USB disconnected)

@DRX=6

3.83

Sleep (USB disconnected)

@DRX=7

3.02

Sleep (USB disconnected)

@DRX=8

2.65

LTE-TDD supply current

Sleep (USB disconnected)

@DRX=5

5.49

Sleep (USB disconnected)

@DRX=6

3.87

Sleep (USB disconnected)

@DRX=7

3.05

Sleep (USB disconnected)

@DRX=8

2.67

GSM voice call

GSM900

PCL=5 @31.84dBm

TBD

GSM900

PCL=12 @18.49dBm

TBD

GSM900

PCL=19 @4.95dBm

TBD

DCS1800

PCL=0 @28.91dBm

TBD

DCS1800

PCL=7 @15.35dBm

TBD

DCS1800

PCL=15 @-0.21dBm

TBD

CDMA voice call BC0 (max power)

@23.91dBm

TBD

BC0 (min power)

@-60.28dBm

TBD

WCDMA voice call

Band1 (max power)

@22.61dBm

TBD

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Band8 (max power)

@22.74dBm

TBD

EDGE data transfer

EDGE900 (1UL/4DL)

@26.29dBm

TBD

EDGE900 (2UL/3DL)

@26.15dBm

TBD

EDGE900 (3UL/2DL)

@26.06dBm

TBD

EDGE900 (4UL/1DL)

@25.92dBm

TBD

DCS1800 (1UL/4DL)

@24.89dBm

TBD

DCS1800 (2UL/3DL)

@24.74dBm

TBD

DCS1800 (3UL/2DL)

@24.54dBm

TBD

DCS1800 (4UL/1DL)

@24.44dBm

TBD

CDMA data transfer

BC0 (max power)

@23.68dBm

TBD

WCDMA data transfer

Band 1 (HSDPA)

@21.64dBm

TBD

Band 8 (HSDPA)

@21.61dBm

TBD

Band 1 (HSUPA)

@21.36dBm

TBD

Band 8 (HSUPA)

@21.56dBm

TBD

LTE data transfer

LTE-FDD Band1

@22.96dBm

TBD

LTE-FDD Band3

@22.95dBm

TBD

LTE-FDD Band5

@22.90dBm

TBD

LTE-FDD Band8

@23.17dBm

TBD

LTE-TDD Band38

@22.02dBm

TBD

LTE-TDD Band39

@22.13dBm

TBD

LTE-TDD Band40

TBD

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@22.01dBm

LTE-TDD Band41

@22.31dBm

TBD

Table 44: SC20-E Current Consumption

Parameter

Description

Conditions

Typ.

Unit

VBAT

OFF state

Power down

GSM/GPRS supply current

Sleep (USB disconnected)

@DRX=2

3.58

Sleep (USB disconnected)

@DRX=5

2.46

Sleep (USB disconnected)

@DRX=9

2.13

WCDMA supply current

Sleep (USB disconnected)

@DRX=6

2.99

Sleep (USB disconnected)

@DRX=7

2.35

Sleep (USB disconnected)

@DRX=8

2.01

Sleep (USB disconnected)

@DRX=9

1.85

LTE-FDD supply current

Sleep (USB disconnected)

@DRX=5

5.51

Sleep (USB disconnected)

@DRX=6

3.56

Sleep (USB disconnected)

@DRX=7

2.62

Sleep (USB disconnected)

@DRX=8

2.14

LTE-TDD supply current

Sleep (USB disconnected)

@DRX=5

5.93

Sleep (USB disconnected)

@DRX=6

3.74

Sleep (USB disconnected)

@DRX=7

2.70

Sleep (USB disconnected)

@DRX=8

2.17

GSM voice call

GSM850

PCL=5 @33.13dBm

263.8

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GSM850

PCL=12 @19.15dBm

134.7

GSM850

PCL=19 @5.31dBm

109.2

EGSM900

PCL=5 @33.07dBm

271.2

EGSM900

PCL=12 @19.53dBm

137.3

EGSM900

PCL=19 @5.59dBm

110.6

DCS1800

PCL=0 @30.00dBm

203.0

DCS1800

PCL=7 @16.45dBm

150.7

DCS1800

PCL=15 @0.67dBm

130.8

PCS1900

PCL=0 @29.72dBm

195.9

PCS1900

PCL=7 @16.72dBm

151.3

PCS1900

PCL=15 @0.98dBm

130.0

WCDMA voice call

Band 1 (max power)

@23.18dBm

544.1

Band 5 (max power)

@23.22dBm

513.5

Band 8 (max power)

@23.29dBm

522.7

GPRS data transfer

GPRS850 (1UL/4DL)

@33.12dBm

265.9

GPRS850 (2UL/3DL)

@33.02dBm

435.1

GPRS850 (3UL/2DL)

@30.50dBm

478.8

GPRS850 (4UL/1DL)

@29.49dBM

564.0

GPRS900 (1UL/4DL)

@33.10dBm

272.7

GPRS900 (2UL/3DL)

@33.00dBm

445.0

GPRS900 (3UL/2DL)

@30.96dBm

512.0

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GPRS900 (4UL/1DL)

@29.93dBm

599.2

DCS1800 (1UL/4DL)

@29.96dBm

205.8

DCS1800 (2UL/3DL)

@29.86dBm

314.3

DCS1800 (3UL/2DL)

@29.73dBm

420.8

DCS1800 (4UL/1DL)

@29.63dBm

531.7

PCS1900 (1UL/4DL)

@29.77dBm

199.3

PCS1900 (2UL/3DL)

@29.64dBm

307.2

PCS1900 (3UL/2DL)

@29.54dBm

411.5

PCS1900 (4UL/1DL)

@29.34dBm

518.7

EDGE data transfer

EDGE850 (1UL/4DL)

@26.75dBm

172.2

EDGE850 (2UL/3DL)

@27.13dBm

266.6

EDGE850 (3UL/2DL)

@26.63dBm

353.1

EDGE850 (4UL/1DL)

@26.54dBm

446.9

EDGE900 (1UL/4DL)

@27.05dBm

182

EDGE900 (2UL/3DL)

@27.13dBm

177.4

EDGE900 (3UL/2DL)

@27.28dBm

278.3

EDGE900 (4UL/1DL)

@27.19dBm

371.0

DCS1800 (1UL/4DL)

@26.04dBm

170.6

DCS1800 (2UL/3DL)

@25.98dBm

260.5

DCS1800 (3UL/2DL)

@25.71dBm

349.8

DCS1800 (4UL/1DL)

@25.46dBm

440.2

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PCS1900 (1UL/4DL)

@26.14dBm

171.0

PCS1900 (2UL/3DL)

@26.11dBm

260.5

PCS1900 (3UL/2DL)

@26.11dBm

349.6

PCS1900 (4UL/1DL)

@25.70dBm

442.3

WCDMA data transfer

Band 1 (HSDPA)

@22.43dBm

503.8

Band 5 (HSDPA)

@22.23dBm

471.6

Band 8 (HSDPA)

@22.24dBm

481.6

Band 1 (HSUPA)

@22.30dBm

504.6

Band 5 (HSUPA)

@21.93dBm

460.5

Band 8 (HSUPA)

@21.90dBm

464.8

LTE data transfer

LTE-FDD Band1

@23.29dBm

737

LTE-FDD Band3

@23.29dBm

756

LTE-FDD Band5

@23.44dBm

636

LTE-FDD Band7

@23.28dBm

842

LTE-FDD Band8

@23.44dBm

639

LTE-FDD Band20

@23.36dBm

684

LTE-TDD Band38

@23.19dBm

427

LTE-TDD Band40

@23.17dBm

427

LTE-TDD Band41

@23.19dBm

455

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Table 45: SC20-A Current Consumption

Parameter

Description

Conditions

Typ.

Unit

VBAT

OFF state

Power down

GSM/GPRS supply current

Sleep USB disconnected)

@DRX=2

4.08

Sleep (USB disconnected)

DRX=5

3.10

Sleep (USB disconnected)

DRX=9

2.77

WCDMA supply current

Sleep (USB disconnected)

DRX=6

3.86

Sleep (USB disconnected)

DRX=7

2.90

Sleep (USB disconnected)

DRX=8

2.55

Sleep (USB disconnected)

DRX=9

2.43

FDD-LTE supply current

Sleep (USB disconnected)

DRX=5

6.60

Sleep (USB disconnected)

DRX=6

4.24

Sleep (USB disconnected)

DRX=7

3.11

Sleep (USB disconnected)

DRX=8

2.77

GSM voice call

GSM850

PCL=5 @32.23dBm

254.60

GSM850

PCL=12 @18.34dBm

136.30

GSM850

PCL=19 @4.87dBm

111.30

PCS1900

PC=L0 @29.14dBm

196.60

PCS1900

PCL=7 @16.23dBm

158.40

PCS1900

PCL=15 @0.62dBm

135.50

WCDMA voice call Band 1 (max power)

@23.24dBm

548.13

Band 2 (max power)

575.70

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@23.40dBm

Band 4 (max power)

@23.20dBm

561.35

Band 5 (max power)

@23.47dBm

558.00

Band 8 (max power)

@23.5dBm

557.10

GPRS data transfer

GPRS850 (1UL/4DL)

@32.18dBm

254.50

GPRS850 (2UL/3DL)

@32.00dBm

410.70

GPRS850 (3UL/2DL)

@30.43dBm

496.10

GPRS850 (4UL/1DL)

@29.37dBm

573.90

PCS1900 (1UL/4DL)

@29.13dBm

198.70

PCS1900 (2UL/3DL)

@29.19dBm

306.50

PCS1900 (3UL/2DL)

@29.05dBm

408.90

PCS1900 (4UL/1DL)

@28.84dBm

514.60

EDGE data transfer

EDGE850 (1UL/4DL)

@26.39dBm

186.00

EDGE850 (2UL/3DL)

@26.30dBm

280.00

EDGE850 (3UL/2DL)

@26.30dBm

368.00

EDGE850 (4UL/1DL)

@26.07dBm

456.00

PCS1900 (1UL/4DL)

@25.70dBm

184.40

PCS1900 (2UL/3DL)

@25.55dBm

276.60

PCS1900 (3UL/2DL)

@25.39dBm

365.20

PCS1900 (4UL/1DL)

@25.17dBm

456.50

WCDMA data transfer

Band 1 (HSDPA)

@22.24dBm

506.35

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Band 2 (HSDPA)

@22.44dBm

535.10

Band 4 (HSDPA)

@22.23dBm

523.07

Band 5 (HSDPA)

@22.38dBm

513.13

Band 8 (HSDPA)

@22.47dBm

512.30

Band 1 (HSUPA)

@22.2dBm

516.00

Band2 (HSUPA)

@22.4dBm

545.60

Band 4 (HSUPA)

@21.93dBm

527.93

Band 5 (HSUPA)

@22.26dBm

528.94

Band 8 (HSUPA)

@22 dBm

507.70

LTE data transfer

LTE-FDD Band2

@23.05dBm

710.01

LTE-FDD Band4

@23.3dBm

736.50

LTE-FDD Band5

@23.13dBm

626.18

LTE-FDD Band7

@22.75dBm

733.40

LTE-FDD Band12

@22.74dBm

606.02

LTE-FDD Band13

@23.3dBm

674.84

LTE-FDD Band25

@23.2dBm

665.62

LTE-FDD Band26

@23.57dBm

718.75

Table 46: SC20-AU Current Consumption

Parameter

Description

Conditions

Typ.

Unit

VBAT

OFF state

Power down

GSM/GPRS supply

Sleep (USB disconnected)

TBD

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current

DRX=2

Sleep (USB disconnected)

DRX=5

TBD

Sleep (USB disconnected)

DRX=9

TBD

WCDMA supply current

Sleep (USB disconnected)

DRX=6

TBD

Sleep (USB disconnected)

DRX=7

TBD

Sleep (USB disconnected)

DRX=8

TBD

Sleep (USB disconnected)

DRX=9

TBD

LTE-FDD supply

current

Sleep (USB disconnected)

DRX=5

TBD

Sleep (USB disconnected)

DRX=6

TBD

Sleep (USB disconnected)

DRX=7

TBD

Sleep (USB disconnected)

DRX=8

TBD

LTE-TDD supply

current

Sleep (USB disconnected)

DRX=5

TBD

Sleep (USB disconnected)

DRX=6

TBD

Sleep (USB disconnected)

DRX=7

TBD

Sleep (USB disconnected)

DRX=8

TBD

GSM voice call

GSM850

PCL=5 @32.96dBm

268

GSM850

PCL=12 @18.83dBm

133

GSM850

PCL=19 @5.31dBm

109

GSM900

PCL=5 @32.96dBm

267

GSM900

PCL=12 @19.21dBm

137

GSM900

PCL=19 @5.60dBm

108

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PCS1800

PC=L0 @29.93dBm

202

PCS1800

PCL=7 @16.29dBm

152

PCS1800

PCL=15 @0.62dBm

131

PCS1900

PC=L0 @29.67dBm

194

PCS1900

PCL=7 @16.74dBm

149

PCS1900

PCL=15 @1.09dBm

130

WCDMA voice call

Band 1 (max power)

@23.33dBm

561

Band 2 (max power)

@23.51dBm

521

Band 5 (max power)

@23.37dBm

551

Band 8 (max power)

@23.38dBm

478

GPRS

data transfer

GPRS850 (1UL/4DL)

@32.91dBm

267

GPRS850 (2UL/3DL)

@32.73dBm

TBD

GPRS850 (3UL/2DL)

@30.72dBm

503

GPRS850 (4UL/1DL)

@29.38dBm

574

GSM900 (1UL/4DL)

@32.92dBm

266

GSM900 (2UL/3DL)

@32.74dBm

TBD

GSM900 (3UL/2DL)

@30.85dBm

509

GSM900 (4UL/1DL)

@29.58dBm

583

DCS1800 (1UL/4DL)

@39.81dBm

205

DCS1800 (2UL/3DL)

@39.70dBm

316

DCS1800 (3UL/2DL)

@29.50dBm

TBD

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DCS1800 (4UL/1DL)

@29.34dBm

530

PCS1900 (1UL/4DL)

@29.58dBm

TBD

PCS1900 (2UL/3DL)

@29.48dBm

TBD

PCS1900 (3UL/2DL)

@29.31dBm

TBD

PCS1900 (4UL/1DL)

@29.40dBm

TBD

EDGE

data transfer

EDGE850 (1UL/4DL)

@26.70dBm

TBD

EDGE850 (2UL/3DL)

@27.02dBm

300

EDGE850 (3UL/2DL)

@26.60dBm

389

EDGE850 (4UL/1DL)

@26.33dBm

457

GSM900 (1UL/4DL)

@26.87dBm

178

GSM900 (2UL/3DL)

@27.27dBm

276

GSM900 (3UL/2DL)

@26.85dBm

394

GSM900 (4UL/1DL)

@26.53dBm

490

DCS1800 (1UL/4DL)

@25.39dBm

197

DCS1800 (2UL/3DL)

@25.40dBm

287

DCS1800 (3UL/2DL)

@25.35dBm

373

DCS1800 (4UL/1DL)

@25.05dBm

461

PCS1900 (1UL/4DL)

@26.03dBm

168

PCS1900 (2UL/3DL)

@26.07dBm

257

PCS1900 (3UL/2DL)

@25.81dBm

345

PCS1900 (4UL/1DL)

@25.70dBm

436

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WCDMA data transfer

Band 1 (HSDPA)

@23.02dBm

517

Band 2 (HSDPA)

@23.11dBm

550

Band 5 (HSDPA)

@22.68dBm

486

Band 8 (HSDPA)

@22.72dBm

466

Band 1 (HSUPA)

@22.39dBm

521

Band2 (HSUPA)

@23.19dBm

509

Band 5 (HSUPA)

@22.44dBm

503

Band 8 (HSUPA)

@22.25dBm

474

LTE data transfer

LTE-FDD Band1

@23.37dBm

698

LTE-FDD Band3

@23.06dBm

709

LTE-FDD Band5

@23.25dBm

643

LTE-FDD Band7

@22.82dBm

802

LTE-FDD Band8

@23.47dBm

620

LTE-FDD Band28

@23.13dBm

756

LTE-TDD Band40

@23.24dBm

388

Table 47: SC20-J Current Consumption

Parameter

Description

Conditions

Typ.

Unit

VBAT

OFF state

Power down

WCDMA supply

current Sleep (USB disconnected)

DRX=6

TBD

Sleep (USB disconnected)

DRX=7

TBD

Sleep (USB disconnected)

TBD

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DRX=8

Sleep (USB disconnected)

DRX=9

TBD

LTE-FDD supply

current

Sleep (USB disconnected)

DRX=5

TBD

Sleep (USB disconnected)

DRX=6

TBD

Sleep (USB disconnected)

DRX=7

TBD

Sleep (USB disconnected)

DRX=8

TBD

LTE-TDD supply

current

Sleep (USB disconnected)

DRX=5

TBD

Sleep (USB disconnected)

DRX=6

TBD

Sleep (USB disconnected)

DRX=7

TBD

Sleep (USB disconnected)

DRX=8

TBD

WCDMA voice call

Band 1 (max power)

@22.97dBm

TBD

Band 6 (max power)

@22.99dBm

TBD

Band 8 (max power)

@23.20dBm

TBD

Band 19 (max power)

@22.99dBm

TBD

WCDMA data transfer

Band 1 (HSDPA)

@22.13dBm

482

Band 6 (HSDPA)

@22.28dBm

TBD

Band 8 (HSDPA)

@22.17dBm

471

Band 19 (HSDPA)

@22.31dBm

500

Band 1 (HSUPA)

@21.4dBm

494

Band 6 (HSUPA)

@22.11dBm

TBD

Band 8 (HSUPA)

@21.57dBm

472

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Band 19 (HSUPA)

@22.10dBm

TBD

LTE data transfer

LTE-FDD Band1

@23.64dBm

TBD

LTE-FDD Band3

@23.52dBm

TBD

LTE-FDD Band8

@23.40dBm

637

LTE-FDD Band18

@23.45dBm

TBD

LTE-FDD Band19

@23.42dBm

TBD

LTE-FDD Band26

@23.36dBm

TBD

LTE-TDD Band41

@23.23dBm

451

7.6. RF Output Power

The following table shows the RF output power of SC20 module.

Table 48: RF Output Power

Frequency

Max.

Min.

GSM850

33dBm±2dB

5dBm±5dB

EGSM900

33dBm±2dB

5dBm±5dB

DCS1800

30dBm±2dB

0dBm±5dB

PCS1900

30dBm±2dB

0dBm±5dB

WCDMA Band1

24dBm+1/-3dB

<-49dBm

WCDMA Band2

24dBm+1/-3dB

<-49dBm

WCDMA Band4

24dBm+1/-3dB

<-49dBm

WCDMA Band5

24dBm+1/-3dB

<-49dBm

WCDMA Band6

24dBm+1/-3dB

<-49dBm

Verifone CM5P User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Table Index

Figure Index

1 Introduction

1.1. Safety Information

2 Product Concept

2.1. General Description

2.2. Key Features

2.3. Functional Diagram

2.4. Evaluation Board

3 Application Interfaces

3.1. General Description

3.2. Pin Assignment

3.3. Pin Description

3.4. Power Supply

3.4.1. Power Supply Pins

3.4.2. Decrease Voltage Drop

3.4.3. Reference Design for Power Supply

3.5. Turn on and off Scenarios

3.5.1. Turn on Module Using the PWRKEY

3.5.2. Turn off Module

3.6. VRTC Interface

3.7. Power Output

3.8. Battery Charge and Management

3.9. USB Interface

3.10. UART Interfaces

3.11. (U)SIM Interfaces

3.12. SD Card Interface

3.13. GPIO Interfaces

3.14. I2C Interfaces

3.15. ADC Interfaces

3.16. Motor Drive Interface

3.17. LCM Interface

3.18. Touch Panel Interface

3.19. Camera Interfaces

3.19.1. Rear Camera Interface

3.19.2. Front Camera Interface

3.19.3. Design Considerations

3.20. Sensor Interfaces

3.21. Audio Interfaces

3.21.1. Reference Circuit Design for Microphone

3.21.2. Reference Circuit Design for Receiver Interface

3.21.3. Reference Circuit Design for Headphone Interface

3.21.4. Reference Circuit Design for Loudspeaker Interface

3.21.5. Audio Interface Design Considerations

3.22. Emergency Download Interface

4 Wi-Fi and BT

4.1. Wi-Fi Overview

4.1.1. Wi-Fi Performance

4.2. BT Overview

4.2.1. BT Performance

5 GNSS

5.1. GNSS Performance

5.2. GNSS RF Design Guidance

6 Antenna Interface

6.1. Main/Rx-diversity Antenna Interfaces

6.1.1. Operating Frequency

6.1.3. Reference Design of RF Layout

6.2. Wi-Fi/BT Antenna Interface

6.3. GNSS Antenna Interface

6.3.1. Recommended Circuit for Passive Antenna

6.3.2. Recommended Circuit for Active Antenna

6.4. Antenna Installation

6.4.1. Antenna Requirement

6.4.2. Recommended RF Connector for Antenna Installation

7.1. Absolute Maximum Ratings

7.2. Power Supply Ratings

7.3. Charging Performance Specifications

7.4. Operating Temperature

7.5. Current Consumption

7.6. RF Output Power