Information furnished in this manual is believed to be accurate and reliable. However , no responsibility
is assumed for its use, or for any infringement of patents or other rights of third parties that may result
from its use.
All product names listed are trademarks or trade names of their respective companies.
See the UEI website for complete terms and conditions of sale:
http://www.ueidaq.com/cms/terms-and-conditions/
Contacting United Electronic Industries
Mailing Address:
27 Renmar Avenue
Walpole, MA 02081
U.S.A.
For a list of our distributors and partners in the US and around the world, please contact a memb er of our
support team:
Support:
Telephone:(508) 921-4600
Fax:(508) 668-2350
Also see the FAQs and online “Live Help” feature on our web site.
DO NOT USE PRODUCTS SOLD BY UNITED ELECTRONIC INDUSTRIES, INC. AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
Products sold by United Electronic Industries, Inc. are not authorized for use as critical components in
life support devices or systems. A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness. Any attempt to purchase any United Electronic
Industries, Inc. product for that purpose is null and void and United Electronic Industries Inc. accepts
no liability whatsoever in contract, tort, or otherwise whether or not resulting from our or our
employees' negligence or failure to detect an improper purchase.
Specifications in this document are subject to change without notice. Check with UEI for
current status.
This document describes the features, performance specifications, and
operating functions of the DNR-12-1G Series RACKtangle
Series HalfRACK
RACKtangle and HalfRACK versions are identical except for the size of the
enclosure and the number of IO boards that can be installed. Both are designed
for use with a Gigabit Ethernet 1000 Base-T communication network.
This chapter provides the following information about the DNR-X-1G systems:
•Organization of This Manual (Section 1.1)
•Product Versions Described in This Manual (Section 1.2)
data acquisition systems.
DNR-X-1G Series RACKtangle and HalfRACK Systems
Chapter 11
Introduction
and the DNR-6-1 G
1.1Organization
of This
Manual
This DNR-X-1G User Manual is organized as follows:
•Chapter 1 – Introduction
This chapter describes the organi zation of the document and the
conventions used throughout the manual.
•Chapter 2 – DNR-12-1G Series RACKtangle
This chapter provides an overview of a DNR-12-1G system, features,
accessories, and a list of all items you need for initial operation.
•Chapter 3 – DNR-6-1G Series HalfRACK
This chapter provides an overview of a DNR-6-1G system, features, and
accessories. It is essentially the same as the DNR-12-1G system except
for enclosure size and number and arrangement of I/O boards.
•Chapter 4 – Installation and Configuration
This chapter summarizes the recommended procedures for installing,
configuring, starting up, and troubleshooting a DNR-X-1G system.
•Chapter 5 – PowerDNA Explorer
This chapter provides a general description of the menus and screens of
UEI’s GUI-based communication application, PowerDNA Explorer,
when used with a DNR-X-1G system.
•Chapter 6 – Programming CPU Board-specific Functions
This chapter describes tools and facilities used for programming boardspecific functions.
System
System
•Appendix A – Configuring Additional Ethernet Cards
This appendix describes procedures for installing and configuring
Ethernet cards for use with Windows operating systems.
•Appendix B – Field Replacement of Fuses
This appendix describes procedures for replacing fuses in the field.
•Index
This is an alphabetical listing of topics covered in the manual, identified
by page number.
To help you get the most out of this manual and our products, please note that
we use the following conventions:
Tips are designed to highlight quick ways to get the job done, or reveal
good ideas you might not discover on your own.
NOTE: Notes alert you to important information.
CAUTION! advises you of precautions to take to avoid injury, data loss, and
damage to your boards or a system crash.
T ext formatted in bold typeface g enerally represents text that shou ld be entered
verbatim. For instance, it can represent a filenames, as in the following example:
“You can instruct users how to run setup using setup.exe executable.”
Bold typeface will also represent button names, as in “Click Scan Network.”
Text formatted in fixed typeface generally represents commands,
source code, or other text that should be entered verbatim into the source code,
initialization, or other file or at a command prompt.
Before you begin:
Before plugging any I/O connector into the chassis or board(s), be sure to
remove power from all field wiring. Failure to do so may cause severe
damage to the equipment.
No HOT SWAP
Always turn POWER OFF before performing maintenance on a UEI system.
Failure to observe this warning may result in damage to the equipment and
possible injury to personnel.
Usage of Terms
Throughout this manual, the term “Cube” refers to either a PowerDNA Cube
product or to a PowerDNA RACKtangle
applicable.
Additionally throughout this manual, the following conventions apply:
•“DNR-X-1G” refers to both DNR-12-1G and DNR-6-1G types of
systems. The DNR-12-1G can accept up to 12 I/O boards and the
DNR-6-1G can accept up to 6 I/O boards. The two models are identical
in all other respects.
rack mounted system, whichever is
•Unless otherwise noted, “DNR-X-1G” applies to all versions of the
RACKtangle and HalfRACK systems: DNR-X-1G (-00/-01),
DNR-X-1G-02, and DNR-X-1G-03. Differences between product
versions are noted on the following page.
Note that the -02 product version is a fully compatible upgrade of the
This user manual provides documentation for the DNR-X-1G series data
acquisition systems: DNR-X-1G, DNR-X-1G-02, and DNR-X-1G-03 product
versions.
Each product version is available in a DNR-12-1G RACKtangle chassis or a
DNR-6-1G HalfRACK chassis.
T able 1-1 below provides a summary of features for each prod uct version. Refer
to the following chapters in this manual for detailed descriptions.
NOTE: Unless otherwise noted, DNR-X-1G refers collectively to the
DNR-X-1G(-00/-01), DNR-X-1G-02, and DNR-X-1G-03 series of
products.
Table 1-1 Summary of DNR-X-1G/DNR-X -1G-XX Product Versions
ItemSummary of Features
DNR-X-1G
(DNR-X-1G-00 /
DNR-X-1G-01)
•10/100/1000Base-T Ethernet interface
•Freescale MPC8347 CPU
•1PPS synchronization support
•128 MB RAM
•32 MB flash memory
2
2
1
DNR-X-1G-02•10/100/1000Base-T Ethernet interface
•Freescale MPC8347 CPU
•1PPS/IEEE-1588 synchronization support
•Optional solid-state hard drives
3
1
•256 MB RAM2
•32 MB flash memory
2
DNR-X-1G-03•10/100/1000Base-T Ethernet interface
•Freescale MPC8347E CPU, (encryption-ready / IPSec support
pending)
•1PPS/IEEE-1588 synchronization support
•Optional solid-state hard drives
•256 MB RAM
•128 MB flash memory
2
2
3
1
1.1PPS and IEEE-1588 synchronization support is described in the PowerDNx 1PPS Sync Interface Manual.
2.RAM and flash memory are not user-accessible for PowerDNA applications (hosted deployment). Portions
of RAM and flash are available for UEIPAC-based systems (stand-alone deployment). See UEIPAC documentation for more information.
3.On UEIPAC-based systems (stand-alone deployment), solid state d rives are used for data and/or root file
system storage.See UEIPAC documentation for more information.
This chapter provides the following information about the DNR-12-1G Series
RACKtangle
•PowerDNR DNR-12-1G System Overview (Section 2.1)
•DNR-12-1G Specifications (Section 2.2)
•DNR-12-1G Key Features (Section 2.3)
•DNR-12-1G RACKtangle Enclosure (Section 2.4)
•DNR-12 Power, NIC/CPU, and I/O Boards LEDs & Controls
•DNR-POWER-DC Module (Section 2.6)
•DNR-CPU/NIC Module (Section 2.7)
•DNR-Buffer Module (Section 2.8)
•DNR I/O Boards (Section 2.9)
•DNR-12-1G DC Power Thresholds (Section 2.10)
NOTE: For a list of product versions available for the DNR-12-1G Series
system:
(Section 2.5)
RACKtangle systems, refer to Section 1.2 on page 3.
2.1PowerDNR
DNR-12-1G
System
Overview
UEI PowerDNR DNR-12-1G RACKtangle systems are rack-mounted versions
of the PowerDNA Cube Ethernet-based data acquisition systems.
The DNR-12-1G houses a PowerDNA data acquisition system in a rack
enclosure with cabling, installation hardware, LEDs, and a power switc h
accessible from the front of the rack chassis. Multiple DNR-12-1G systems may
be mounted in a single rack. All standard DNA- Cube I/O boards are also
available in DNR- RACK versions for use in DNR-12-1G systems.
A standard DNR-12-1G rack system consists of the following:
•One or more DNR-12 rack mounted enclosure(s)
•DNR-POWER-DC Power Module (one for each enclosure)
•DNR-CPU-1000 or DNR-CPU-1000-XX Module
(Freescale MPC8347 or MPC8347E CPU and 1-GB Ethernet
1000 Base-T Network Interface Module — one for each enclosure)
•DNR-BUFFER Board Module (one for each enclosure)
•Optional DNR-IO-FILLER panels (one for each unused I/O slot)
Note: These slot covers are optional and not included in the price of the
rack
•DNA-PSU-180 180-Watt, 120/230 VAC to +24 VDC External Power
Supply (one for each enclosure) with cable and Molex connector for
plug-in to the DNR-POWER-DC Module front panel
T o configure a complete data acquisition system, insert up to 12 DNR I/O boards
into each PowerDNR rack enclosure. I/O boards may be specified in any
combination of UEI’s I/O boards.
All standard PowerDNA accessories are also available for use in a PowerDNR
rack-mount system.
NOTE: For detailed descriptions of all I/O boards and accessories available for
DNR-X-1G systems, refer to www.ueidaq.com.
UEI stand-alone systems (UEIPAC, UEISIM, UEIModbus, and UEIOPCUA
deployments) are also available for use with DNR-12-1G RACK systems:
Mounting
Brackets (2)
(Reversible for
rack or surface
mounting)
Grounding
Fingers
Add rubber feet (4)
for tabletop mounting
Note: Top/Rear Cover Not Shown
The DNR-12-1G Series RACKtangle System
Chapter 28
2.4DNR-12-1G
RACKtangle
Enclosure
2.4.1DNR-12-1G
Enclosure
This section describes the DNR-12-1G chassis and provides an overview of
common components included in every DNR-12-1G system.
The DNR-12 enclosure is a rigid mechanical structure with complete EMI
shielding (see Figure 2-4 below). Unused slots can be filled with filler panels
(filler panel diagram shown in Figure 2-6).
The DC/DC power module provides output voltages of 24, 3.3, 2.5, 1.5, and 1.2
VDC for the logic/CPU and 8 VDC to power the four cooling fans .
NOTE: Note that the rightmost module (I/O board slot 12) is 2-slots wide (to
accommodate future designs and/or custom modules).
Also note that the DNR-12 enclosure has reversible mounting flanges
designed for rack or surface mounting. Rubber feet are supplied for
desktop or tabletop mounting.
Refer to Section 4.7 on page 56 for more information about mounting
options and field connections.
Each DNR-12-1G chassis contains a power board (DNR-POWER-DC) with
Enclosure
Common
Components
status indicators and an external ON/OFF switch. Each DNR-12-1G chassis
also contains a CPU board with a dedicated GigE CPU and two Network
Interface Control (NIC) ports, one for controlling up to 12 I/O boards mounted in
the enclosure and another for diagnostics functions. Front-loading slots allow
I/O boards to be quickly and easily installed and removed, as needed.
Up to 12 DNR I/O boards can be installed in the chassis; DNR I/O boards are
functionally identical to the corresponding DNA boards for the Power DNA Cube.
The only differences between RACK and Cube I/O boards are the mounting
hardware. The DNA version I/O boards are designed to stack in a Cube chassis.
The DNR version I/O boards are designed to plug into the backplane of a RACK
chassis.
DNR-POWER-DCOne isolated DC/DC Power Module/Power Monitor with status indicators, a local
on/off switch, and 4-pin Molex Power-In connector. (Refer to Section 2.6 for
detailed information)
DNR-CPU-1000,
DNR-CPU-1000-02,
DNR-CPU-1000-03
DNR-BUFFEROne for buf fering address/con trol/clock lines (not currently addr essable). (Refer to
PowerDNR I/O
Boards
DNR-BP-12One backplane with two temperature sensors (see Figure 2-4 for diagram)
DNR-IO-FILLERBlank filler panels for all unused slots (see Figure 2-6. Note that this item is
One dual-slot CPU/NIC module with status indicators, two Ethernet connectors
(Main and Diagnostic Ports), sync connector , reset pushbutton, SD card slot, USB
controller/slave ports (reserved), and a DB-9 connector for a serial port.
(Refer to Section 2.7 for detailed information)
Section 2.8 for detailed information)
Up to 12 front pull-out I/O boards (DNR boards are functionally identical to
PowerDNA Cube I/O boards but designed for installation in a DNR rack
enclosure). (Refer to Section 2.9 for detailed information)
optional / not included in price of rack)
FansFour 8-volt cooling fans mounted on the rear of the enclosure (see Figure 2-9 for
air flow diagram)
All UEI modules are available in both PowerDNA and Power DNR package
designs.
A feature of th e DNR-X-1G design is that the address of a module is determined
by the position of the module within the enclosure, numbered from left to right. A
typical module address is:
0xA00nxxxx
where A00 is the BASE addressn is the module position number starting from 0 at the left
xxxx is the address of the module
With this addressing method, the address of a given I/O board (module)
automatically changes if you move it from one position to another within the
enclosure.
The slots or module positions are numbered as follows (left to right):
As shown below in Figure 2-9, cooling air is drawn into the rear of the enclosur e
via four fans, routed forward over the electronic circuit boards, up to the top of
the enclosure, and then out the top rear of the enclosure. The system is
designed to maintain positive pressure cooling within the enclosure at all times.
Figure 2-9. DNR-12 Air Flow
Two sensors mounted on the backplane over the Power Module and over the
CPU board continuously monitor internal temperatures, turning fans on if the
internal temperature exceeds 45°C, off if it falls below 45°C, and shutting down
power if a high limit is exceeded.
The DNR-POWER-DC Module is a dedicated DC/DC source and control
module available only for use with a PowerDNR rack enclosure. It is always
mounted in the leftmost slot of the DNR chassis and is recognized on the
PowerDNR bus with an ID of 0x020 at address 0xA00C0000.
The non-isolated side (NIS) logic complies with full common logic interface (CLI)
implementation. The key features of the DNR-POWER Module are:
•Input power — 9-36 VDC 80W maximum, protected by resettable fuses
and EMI chokes
•Power supply on/off switch (with guard)
•Output power sources (all with greater than 90% efficiency)
24V, 1A (24W)
3.3V, 5A (16.5W, including the 2.5V derived voltage)
2.5V, 3A (derived from 3.3V source)
1.5V, 5A, (7.5W, including the 1.2V derived voltage)
8V, 0.5A (4W for fans)
•DC/DC for 24V , 3.3V , and 1.5V are synchron ized from the single spreadspectrum clock source in the CPU/NIC Module for lower EMI noise level
•Fan control (Forced ON) and status ON/OFF
•Monitoring and LED indicators (1% accuracy, 0.25Hz update rate)
for:
– All output voltages
– Input current for the 9-36VDC for the DNR Enclosure
– All voltages from the NIC Module (24V, 3.3V, 2.5V)
– Temperature of the DNR backplane (2 sensors)
•Onboard FPGA logic chip is CYCLONE EP1C3/C6T144
•TI MSP4300 microcontroller used for logic reprogramming
•Input-Output connector is a 128-pin component that provides 9-36VDC
,
TEMP1 (TCPOS), TEMP2 (TCNEG). Voltage sources use 1:23.1
dividers on the front end, except for the Vin, which uses a 1:45.3
divider.
Standard NIC-logic plus:
Access to ADC data readings
Fan 1-2 and 3-4 ON/OFF control
Fan ON/OFF status
12 LEDs ON/OFF control
LED block – 12 status LEDs
Input Current
Monitor
+2.5V NIC
DNR Bus Connector
+3.3V NIC
+24V NIC
TEMP1
TEMP2
FAN1-2 CONTROL
Input Voltage Source
9-36 VDC @ 80 W max.
1.2V
1.5V
24V
3.3V
2.5V
24V
8V
Vin
Chapter 219
The DNR-12-1G Series RACKtangle System
A functional block diagram of the DNR-POWER-DC Module is shown in
Figure 2-15 below.
Figure 2-15. Functional Block Diagram of DNR-POWER-DC Module
As shown in Figure 2-15, the DNR-POWER-DC Module operates as follows:
A 9-36 VDC voltage input (Vin) from an external source is connected to the
board through a replaceable slow-blow fuse. The board monitors the input
current and passes Vin to the DNR bus as Vout.
Vout also is connected to DC/DC converters that produce 24 VDC, 3.3 VDC and
1.5 VDC output voltages, which are also placed on the DNR bus. Both 3.3 and
1.5 VDC voltages are connected to low dropout regulator s that, in turn, generate
the 2.5 VDC and 1.2 VDC output voltages on the bus. The 24 VDC source is fed
to a low dropout regulator that produces 8 VDC to drive the cooling fans (through
fan controller chips).
The input current and all output voltages, including the +2.5, +3.3, and +24 VDC
from the NIC module, plus signals from the two temperature sensors mounted
within the enclosure, are input to a 24-bit delta-sigma A/D converter. Except for
Vin, the voltage sources use 1:23.1 divide rs on the front end. Vin uses a 1:45.3
divider.
Figure 2-16 shows the interaction of modules within a DNR-12 enclosure when
the DNR-BUFFER module is used.
Figure 2-16. Functional Block Diagram of DNR-12 Enclosure
As shown above, the I/O slots are divided into two groups: 0 to 5 and 6 to 0xB.
0xC for the DC Power Module is included with the 0 to 5 group. The DNRBUFFER board is located at the center of the enclosure, which is also at the
center point of the ADDR/CTRL bus. The DNR-CPU-1000 module is also
located at the center of the enclosure and the center of the data b us to minimize
bus delays. The CPU addresses I/O Boards and transmits clock ticks through
the Buffer Board, which controls the Addr/Ctrl and clock lines to the modules.
Temperature sensors monitor temperatures within the enclosure above the
DNR-POWER-DC module and the DNR-CPU module.
The DNR-CPU/NIC Core Module (DNR-CPU-1000, DNR-CPU-1000-02, or
DNR-CPU-1000-03) occupies two slots of a DNR-X-1G RACKtangle
enclosure.
The DNR-CPU/NIC Core module consists of a Freescale (formerly Motorola)
MPC8347 or MPC8347E 32-bit 400 MHz CPU and per ipheral devices (USB 2.0,
RS-232, NIC, SD, etc) for use with a Gigabit Ethernet communication network
and an internal 66 MHz 32-bit common logic interface bus. The NICs are cop per
(1000BaseT) interfaces. The module has an RS-232 port used for co nfiguration
and also two USB 2.0 ports (controller and slave) for general purpose use (not
implemented yet). LEDs on the front panel of each module indicate the current
operating status of the device.
Figure 2-17. DNR-X-1G Series Core Module (CPU/NIC)
The core of the system is a Freescale PowerPC MPC834 7 or MPC8347E 32-bit
400 MHz processor, which controls the following components:
Table 2-2 Components in PowerDNR Core Module (DNR-CPU-1000 Series)
ItemDescription
NIC1:
Primary Network
Interface MII Port
NIC2:
Diagnostic Network
Interface MII Port
RS-232 PortThe RS-232 port provides a serial communication link between the DNR-X-1G
USB 2.0 Dual Port
(Controller and Slave)
32 MB or 128 MB
Flash Memory
1
The NIC1 port provides communication between the DNR system and the
primary LAN network.
The NIC2 port provides access to the DNR system for monitoring system health
during operation, using a separate diagnostic port. This port may also be
assigned as the primary Ethernet port if NIC1 is not available for use.
system and a standard RS-232 terminal.
The USB A and B ports are not supported on DNR-X-1G (hosted) systems
(only supported on UEIPAC, UEISIM, UEIModbus, and UEIOPC-UA
deployments).
DNR-X-1G (-00/-01) systems provide 32 MB of flash memory (DNR-CPU-
1000).
DNR-X-1G-02 systems provide 32 MB of flash memory (DNR-CPU-1000-02).
DNR-X-1G-03 systems provide 128 MB of flash memory (DNR-CPU-1000-03).
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