Toshiba SD-9100 User Manual
SERVICE MANUAL
DIGITAL VIDEO
DVD VIDEO PLAYER
FILE NO. 813-9906
SUPPLEMENT
SD-9100
– SUMMARY –
This service manual covers only the different points from the service manual, file no. 810-9807,
for model SD-9000 since SD-9100 are basically the same designing as SD-9000.
Please refer to the file no. 810-9807 for other information.
Feb., 2000 s
LASER BEAM CAUTION LABEL
VISIBLE LASER RADIATION
CAUTION
WHEN OPEN AND INTERLOCK DEFEATED
DO NOT STARE INTO BEAM.
WAVE LENGTH:650nm, MAX.LASER POWER:0.45mW
98763036
When the power supply is being turned on, you may not remove this laser cautions label. If it removes, radiation of a laser
may be recceived.
PREPARATION OF SERVICING
Pickup Head consists of a laser diode that is very susceptible to external static electricity.
Although it operates properly after replacement, if it was subject to electrostatic discharge during replacement, its
life might be shortened. When replacing, use a conductive mat, soldering iron with ground wire, etc. to protect the
laser diode from damage by static electricity.
And also, the LSI and IC are same as above.
Ground conductive
wrist strap for body.
Soldering iron
with ground wire
or ceramic type
1MΩ
Conductive mat
The ground resistance
between the ground line
and the ground is less than 10Ω.
GENERAL DESCRIPTIONS
CONTENTS
SECTION 1
GENERAL DESCRIPTIONS
1. OPERATING INSTRUCTIONS................................................ 1 - 1
General descriptions such as location of mechanical parts and troubleshooting are the same as SD-9000.
Please refer to the service manual for SD-9000 (File No. 810-9807).
SECTION 2
PART REPLACEMENT AND ADJUSTMENT PROCEDURES
Part replacement and adjustment procedures are the same as SD-9000.
Please refer to the service manual for SD-9000 (File No. 810-9807).
SECTION1
SERVICING DIAGRAMS
1. CIRCUIT SYMBOLS AND
SUPPLEMENTARY EXPLANATION..................................... 3- 1
1-1. Precautions for Part Replacement ..................................... 3-1
1-2. Solid Resistor Indication..................................................... 3-1
1-3. Capacitance Indication ....................................................... 3-1
1-4. Inductor Indication ............................................................. 3-2
1-5. Waveform and Voltage Measurement .............................. 3 - 2
1-6. Others ................................................................................... 3-2
1-7. When Replaced ROM ICs or Upgraded Firmware ......... 3 -2
2. PRINTED WIRING BOARD AND
SCHEMATIC DIAGRAM.......................................................... 3-3
SAFETY PRECAUTION ................................................................. 4-1
NOTICE ............................................................................................. 4-1
ABBREVIATIONS ........................................................................... 4-1
1. Integrated Circuit (IC) ............................................................ 4-1
2. Capacitor (Cap) ....................................................................... 4-1
3. Resistor (Res) ........................................................................... 4-1
SECTION 3
3. BLOCK DIAGRAMS.................................................................. 3-5
3-1. Overall Block Diagram .......................................................3-5
3-2. Main Block Diagram ........................................................... 3-7
3-2-1. Logical System Block Diagram...................................... 3-7
3-3. Output Block Diagram........................................................ 3-9
4. CIRCUIT DIAGRAMS........................................................... 3-11
4-1. Output Circuit Diagram................................................3-11
4-2. Sub Video Circuit Diagram .......................................... 3-16
SECTION 4
PARTS LIST
4. EXPLODED VIEWS ................................................................. 4 -2
4-1. Packing Assembly ............................................................. 4-2
4-2. Remote Control Unit........................................................ 4-2
4-3. Chassis Assembly ............................................................... 4-3
4-4. Mechanism Assembly........................................................ 4-4
5 . PARTS LIST ............................................................................... 4 -5
SECTION 3
100k
Rated Wattage Type Tolerance
100µ
Temperature
response
Rated
voltage
Tolerance
SERVICING DIAGRAMS
1. CIRCUIT SYMBOLS AND SUPPLEMENTARY EXPLANATION
1-1. Precautions for Part Replacement
• In the schematic diagram, parts marked (ex.
F801) are critical part to meet the safety regulations,
so always use the parts bearing specified part codes
(SN) when replacing them.
1-2. Solid Resistor Indication
Unit None ...........Ω
K ...........kΩ
M ...........MΩ
Tolerance None ...........±5%
B ...........±0.1%
C ...........±0.25%
D ...........±0.5%
F ...........±1%
G ...........±2%
K ...........±10%
M ...........±20%
Rated Wattage (1) Chip Parts
None.........1/16W
(2) Other Parts
None.........1/6W
Other than above, described in the Circuit Diagram.
Type None ...........Carbon film
S ...........Solid
R ...........Oxide metal film
W ...........Metal film
W ...........Cement
FR ...........Fusible
• Using the parts other than those specified shall violate
the regulations, and may cause troubles such as
operation failures, fire etc.
Eg. 1
Fig. 3-1-1
1-3. Capacitance Indication
Symbol
Unit None ...........F
Rated voltage None ...........50V
Tolerance (1) Ceramic, plastic, and film capacitors of which
Temperature characteristic None ........... SL
(Ceramic capacitor) For others, temperature characteristics are
Static electricity capacity Sometimes described with abbreviated letters as
(Ceramic capacitor) shown in Eg. 3.
+
........... Electrolytic, Special electrolytic
NP
...........Non polarity electrolytic
...........Ceramic, plastic
M
...........Film
...........Trimmer
µ ...........µF
p ...........pF
For other than 50V and electrolytic capacitors,
described in the Circuit Diagram.
capacitance are more than 10 pF.
None ...........±5% or more
B ...........±0.1%
C ...........±0.25%
D ...........±0.5%
F ...........±1%
G ...........±2%
(2) Ceramic, plastic, and film capacitors of which
capacitance are 10 pF or less.
None ...........more than ±5% pF
B ...........±0.1 pF
C ...........±0.25 pF
(3) Electrolytic, T rimmer
Tolerance is not described.
described. (For capacitors of 0.01 µF and
no indications are described as F.)
Eg. 2
Fig. 3-1-2
Eg. 3
104
4
pF (0.1µF)
10x10
Temperature characteristic
(or Temperature characteristic+
Static electricity capacity tolerance)
Fig. 3-1-3
SERVICING DIAGRAMS
SECTION 3
3-1
1-4. Inductor Indication
Type name
10µ
Type Tolerance
Unit None ...........Η
µ ...........µH
m ...........mH
Tolerance None ...........±5%
B ...........±0.1%
C ...........±0.25%
D ...........±0.5%
F ...........±1%
G ...........±2%
K ...........±10%
M ...........±20%
1-5. Waveform and Voltag e Measurement
• The waveforms for CD/DVD and RF shown in the
circuit diagrams are obtained when a test disc is
played back.
• All voltage values except the waveforms are expressed
in DC and measured by a digital voltmeter.
1-6. Others
• The parts marked with “NC” or “KETU” in the circuit
diagrams are not used for this model.
1-7. When Replaced ROM ICs or Upgraded Firmware
Eg. 4
Fig. 3-1-4
Eg. 5
Fig. 3-1-5
1. When replaced the following ROM ICs, it is necessary
to write the data into the new ICs.
1) IC615 (firmware)
2) IC613 (Setup default data and other information)
2. When the firmware is upgraded, rewriting the new
firmware into IC615 may be requested for servicing.
DATA UPDATE KIT
(RS-232C Interface/cable)
RS-232C
cable
Computer
(MS-DOS/PC-DOS)
3. Connect a computer to the main PC board of the DVD
video player with using DATA UPDATE KIT (P/No.
79080074). (Fig. 3-2-6)
4. Writing operation
Refer to the instruction attached to the data floppy
disc.
MAIN PC Board
DVD video player
Note:
• The firmware and setup data floppy discs are not available as service parts.
For more information, consult TOSHIBA service office in your area.
Fig. 3-1-6
3-2
2. PRINTED WIRING BOARD AND SCHEMATIC DIAGRAM
3-3
Fig. 3-2-1
3-4
3. BLOCK DIAGRAMS
3-1. Overall Block Diagram
3-5
Fig.3-3-1
3-6
3-2. Main Block Diagram
3-2-1. Logical System Block Diagram
3-7
Fig. 3-3-2
3-8
3-3. Output Block Diagram
3-9
Fig. 3-3-3
3-10
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