Toshiba satellite a50s, tecra a3x Service Manual

Toshiba Personal Computer

Satellite A50S/TECRA A3X Series

Maintenance Manual

TOSHIBA CORPORATION

File Number 960-534

[CONFIDENTIAL]

© 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein.

Toshiba Satellite A50S/TECRA A3X Series Maintenance Manual First edition September 2005

Disclaimer

The information presented in this manual has been reviewed and validated for accuracy. The included set of instructions and descriptions are accurate for the Satellite A50S/TECRA A3X series at the time of this manual's production. However, succeeding computers and manuals are subject to change without notice. Therefore, Toshiba assumes no liability for damages incurred directly or indirectly from errors, omissions, or discrepancies between any succeeding product and this manual.

Trademarks

Intel, Intel SpeedStep, Pentium and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries/regions. Windows and Microsoft are registered trademarks of Microsoft Corporation. Other trademarks and registered trademarks not listed above may be used in this manual.

ii [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)

Preface

This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Satellite A50S/TECRA A3X series.

NOTE: This Satellite A50S/TECRA A3X series is a BTO-support personal computer. Each model has a different configuration. For each model’s configuration, refer to the parts list dedicated to it.

The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.

SAFETY PRECAUTIONS

Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.

DANGER: “Danger” indicates the existence of a hazard that could result in death or serious bodily injury, if the safety instruction is not observed.

WARNING: “Warning” indicates the existence of a hazard that could result in bodily injury, if the safety instruction is not observed.

CAUTION: “Caution” indicates the existence of a hazard that could result in property damage, if the safety instruction is not observed.

NOTE: “Note” contains general information that relates to your safe maintenance service.

Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.

 Be sure to fasten screws securely with the right screwdriver. Be sure to use the PH

Point size “0” and “1” screwdrivers complying with the ISO/DIS 8764-1:1996. If a screw is not fully fastened, it could come loose, creating a danger of a short circuit, which could cause overheating, smoke or fire.

 If you replace the battery pack or RTC battery, be sure to use only the same model

battery or an equivalent battery recommended by Toshiba. Installation of the wrong battery can cause the battery to explode.

Satellite A50S /TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL] iii

The manual is divided into the following parts:

Chapter 1 Hardware Overview describes Satellite A50S/TECRA A3X series

system unit and each FRU.

Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve

FRU problems.

Chapter 3 Test and Diagnostics describes how to perform test and diagnostic

operations for maintenance service.

Chapter 4 Replacement Procedures describes the removal and replacement of the

FRUs.

Appendices The appendices describe the following:

 Handling the LCD module  Board layout  Pin assignment  Display codes  Key layout  Wiring diagrams  BIOS/KBC/EC Update  Reliability

iv [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)

Conventions

This manual uses the following formats to describe, identify, and highlight terms and operating procedures.

Acronyms

On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example:

Read Only Memory (ROM)

Keys

Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.

Key operation

Some operations require you to simultaneously use two or more keys. We identify such operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause (Break) means you must hold down Ctrl and at the same time press Pause (Break). If three keys are used, hold down the first two and at the same time press the third.

User input

Text that you are instructed to type in is shown in the boldface type below:

DISKCOPY A: B:

The display

Text generated by this computer that appears on its display is presented in the type face below:

Format complete System transferred

Satellite A50S /TECRA A3X Maintenance Manual (960-534) [CONFIDENTIAL] v

Chapter 1 Hardware Overview

1.1 Features......................................................................................................................1-1

1.2 System Block Diagram.............................................................................................. 1-6

1.3 3.5-inch USB Floppy Disk Drive.............................................................................1-10

1.4 2.5-inch Hard Disk Drive......................................................................................... 1-11

1.5 CD-ROM Drive .......................................................................................................1-13

1.6 DVD-ROM Drive ....................................................................................................1-15

1.7 DVD-ROM & CD-R/RW Drive.............................................................................. 1-18

1.8 DVD Super Multi Drive...........................................................................................1-21

1.9 Keyboard..................................................................................................................1-24

1.10 TFT Color Display...................................................................................................1-25

1.11 Power Supply...........................................................................................................1-28

1.12 Batteries ...................................................................................................................1-30

1.13 AC Adapter.............................................................................................................. 1-33

Chapter 2 Troubleshooting Procedures

2.1 Troubleshooting......................................................................................................... 2-1

2.2 Troubleshooting Flowchart........................................................................................ 2-2

2.3 Power Supply Troubleshooting..................................................................................2-6

2.4 System Board Troubleshooting................................................................................2-15

2.5 3.5” FDD Troubleshooting ......................................................................................2-29

2.6 2.5” HDD Troubleshooting...................................................................................... 2-32

2.7 Keyboard Troubleshooting ......................................................................................2-37

2.8 Display Troubleshooting.......................................................................................... 2-38

2.9 Touch Pad Troubleshooting..................................................................................... 2-41

2.10 Optical Drive Troubleshooting ................................................................................2-42

2.11 Modem Troubleshooting.......................................................................................... 2-43

2.12 LAN Troubleshooting.............................................................................................. 2-44

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2.13 Sound Troubleshooting............................................................................................ 2-45

2.14 Wireless LAN Troubleshooting...............................................................................2-47

Chapter 3 Tests and Diagnostics

3.1 The Diagnostic Test................................................................................................... 3-1

3.2 Executing the Diagnostic Test...................................................................................3-4

3.3 Setting of the hardware configuration........................................................................3-8

3.4 Heatrun Test.............................................................................................................3-11

3.5 Subtest Names.......................................................................................................... 3-12

3.6 System Test.............................................................................................................. 3-14

3.7 Memory Test............................................................................................................ 3-16

3.8 Keyboard Test.......................................................................................................... 3-17

3.9 Display Test.............................................................................................................3-18

3.10 Floppy Disk Test......................................................................................................3-21

3.11 Printer Test...............................................................................................................3-23

3.12 Async Test ............................................................................................................... 3-25

3.13 Hard Disk Test......................................................................................................... 3-26

3.14 Real Timer Test........................................................................................................3-29

3.15 NDP Test.................................................................................................................. 3-31

3.16 Expansion Test.........................................................................................................3-32

3.17 CD-ROM/DVD-ROM Test ..................................................................................... 3-34

3.18 Error Code and Error Status Names.........................................................................3-35

3.19 Hard Disk Test Detail Status....................................................................................3-38

3.20 ONLY ONE TEST................................................................................................... 3-40

3.21 Head Cleaning.......................................................................................................... 3-46

3.22 Log Utilities............................................................................................................. 3-47

3.23 Running Test............................................................................................................ 3-49

3.24 Floppy Disk Drive Utilities......................................................................................3-50

3.25 System Configuration ..............................................................................................3-55

3.26 Wireless LAN Test Program (Intel-made b/g).........................................................3-57

3.27 Wireless LAN Test Program (Intel-made a/b/g)...................................................... 3-61

3.28 Wireless LAN Test Program (Askey-made)............................................................3-66

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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program .................................................. 3-70

3.30 Sound Test program................................................................................................. 3-84

3.31 SETUP .....................................................................................................................3-90

Chapter 4 Replacement Procedures

4.1 Overview....................................................................................................................4-1

4.2 Battery Pack/PC Card................................................................................................4-8

4.3 Memory Module ......................................................................................................4-11

4.4 MDC ........................................................................................................................4-14

4.5 HDD......................................................................................................................... 4-16

4.6 Wireless LAN Card..................................................................................................4-19

4.7 Cooling Fin/CPU .....................................................................................................4-21

4.8 Keyboard..................................................................................................................4-26

4.9 Switch Membrane Board .........................................................................................4-30

4.10 Optical Drive............................................................................................................ 4-32

4.11 Display Assembly.................................................................................................... 4-34

4.12 Sound Board.............................................................................................................4-38

4.13 Parallel port board/Serial port board/S-Video board............................................... 4-39

4.14 FAN..........................................................................................................................4-46

4.15 System Board/DC-IN Jack/RTC Battery................................................................. 4-47

4.16 PC card cover...........................................................................................................4-50

4.17 Battery Latch............................................................................................................ 4-51

4.18 Battery Lock.............................................................................................................4-53

4.19 Touch Pad ...............................................................................................................4-55

4.20 LCD Unit/FL Inverter.............................................................................................. 4-57

4.21 Latch Assembly .......................................................................................................4-61

4.22 Wireless LAN Antenna/Speaker/Hinge...................................................................4-62

4.23 Fluorescent Lamp.....................................................................................................4-71

Appendices

Appendix A Handling the LCD Module ........................................................................A-1

Appendix B Board Layout ............................................................................................. B-1

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534)

Appendix C Pin Assignment.......................................................................................... C-1

Appendix D Keyboard Scan/Character Codes............................................................... D-1

Appendix E Key Layout..................................................................................................E-1

Appendix F Wiring Diagrams.........................................................................................F-1

Appendix G BIOS/KBC/EC Update.............................................................................. G-1

Appendix H Reliability...................................................................................................H-1

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x [CONFIDENTIAL] Satellite A50S/TECRA A3X Maintenance Manual (960-534)

Chapter 1 Hardware Overview

[CONFIDENTIAL]

1 Hardware Overview

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1 Hardware Overview

Chapter 1 Contents

1.1 Features...................................................................................................................... 1-1

1.2 System Block Diagram.............................................................................................. 1-6

1.3 3.5-inch USB Floppy Disk Drive.............................................................................1-10

1.4 2.5-inch Hard Disk Drive......................................................................................... 1-11

1.5 CD-ROM Drive .......................................................................................................1-13

1.6 DVD-ROM Drive ....................................................................................................1-15

1.7 DVD-ROM & CD-R/RW Drive.............................................................................. 1-18

1.8 DVD Super Multi Drive...........................................................................................1-21

1.9 Keyboard.................................................................................................................. 1-24

1.10 TFT Color Display................................................................................................... 1-25

1.10.1 LCD Module .......................................................................................1-25

1.10.2 FL Inverter Board................................................................................ 1-27

1.11 Power Supply........................................................................................................... 1-28

1.12 Batteries ...................................................................................................................1-30

1.12.1 Main Battery........................................................................................1-30

1.12.2 Battery Charging Control.................................................................... 1-31

1.12.3 RTC Battery........................................................................................ 1-32

1.13 AC Adapter.............................................................................................................. 1-33

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1 Hardware Overview

Figures

Figure 1-1 Front of the computer.....................................................................................1-4

Figure 1-2 System units configuration ............................................................................ 1-5

Figure 1-3 System block diagram....................................................................................1-6

Figure 1-4 3.5-inch USB FDD....................................................................................... 1-10

Figure 1-5 2.5-inch HDD...............................................................................................1-11

Figure 1-6 CD-ROM Drive ........................................................................................... 1-13

Figure 1-7 DVD-ROM Drive ........................................................................................1-15

Figure 1-8 DVD-ROM & CD-R/RW Drive ..................................................................1-18

Figure 1-9 DVD Super Multi Drive............................................................................... 1-21

Figure 1-10 Keyboard...................................................................................................... 1-24

Figure 1-11 LCD module................................................................................................. 1-25

Tables

Table 1-1 3.5-inch USB FDD specifications................................................................1-10

Table 1-2 2.5-inch HDD dimensions ...........................................................................1-11

Table 1-3 2.5-inch HDD specifications........................................................................ 1-12

Table 1-4 CD-ROM Drive dimensions........................................................................ 1-13

Table 1-5 CD-ROM Drive specifications ....................................................................1-14

Table 1-6 DVD-ROM Drive dimensions..................................................................... 1-15

Table 1-7 DVD-ROM Drive specifications .................................................................1-16

Table 1-8 DVD-ROM & CD-R/RW Drive dimensions............................................... 1-18

Table 1-9 DVD-ROM & CD-R/RW Drive specifications........................................... 1-19

Table 1-10 DVD Super Multi Drive dimensions ...........................................................1-21

Table 1-11 DVD Super Multi Drive speciifcations........................................................ 1-22

Table 1-12 LCD module specifications..........................................................................1-26

Table 1-13 FL inverter board specifications ..................................................................1-27

Table 1-14 Power supply output rating ..........................................................................1-29

Table 1-15 Battery specifications................................................................................... 1-30

Table 1-16 Time required for charges of main battery ..................................................1-31

Table 1-17 Battery preservation time.............................................................................1-31

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1 Hardware Overview

Table 1-18 Time required for charges of RTC battery................................................... 1-32

Table 1-19 AC adapter specifications............................................................................1-33

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1 Hardware Overview

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1.1 Features 1 Hardware Overview

1 Features

1.1 Features

The Satellite A50S/TECRA A3X is a high performance all-in-one PC running a Pentium M or Celeron M processor.

Features are listed below.

 Microprocessor [CPU Easy Replaceable]

Microprocessor used is different from each model. Mobile Intel® Pentium® -M model

A 730/740/750/760/770/780 Pentium M processor with 533MHz bus operation.

Mobile Intel® Celeron ® -M model

A 360/370/380/390 Celeron M processor with 400MHz bus operation.

 Memory

Two SO-DIMM slots for DDR2-533. Memory modules can be installed to provide a maximum of 2GB. Memory modules are available in 256MB, 512MB and 1,024MB sizes. (Celeron M processor model operates with DDR2-400)

Montara-GML model can support 1GB in total as its maximum memory. Montara-GM+ model can support 2GB in total as its maximum memory.

 HDD

Single 20GB, 30GB, 40GB, 60GB or 80GB internal drive. 2.5 inch x 9.5mm height.

 USB FDD

The two-mode 3.5-inch USB FDD supports 720KB, and 1.44MB formats.

 Display

LCD

Built-in 15.0-inch, XGA (1,024 x 768 dots), or 15-inch, SXGA+ (1,400 x 1,050 dots), 262,144 colors, amorphous silicon TFT color display.

Interface

Image output - an RGB connector

- an S-Video connector (It depends on the model.)

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1 Hardware Overview 1.1 Features

 VRAM

The computer has VGA imbedded in North Bridge and VRAM in 128MB(max).

 Keyboard

An easy-to-use 85(US)-/86(UK)-key keyboard. Windows key is supported. The keyboard also supports touchpad as a pointing device.

 Optical devices

A CD-ROM, DVD-ROM, DVD-ROM & CD-R/RW or DVD Super Multi (supporting Double Layer) Drive is supported.

 Battery

The RTC battery is mounted inside the computer. The main battery is a detachable lithium ion battery (4,400mAh: Li-Ion, 6cell / 8,800mAh: Li-Ion, 12cell).

 USB (Universal Serial Bus)

Two or three USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported.

 PC card slot

The PC card slot accepts one Type II (5mm thick) card. The slot is equipped with an ejector and supports ToPIC-100 (3.3V/CardBus).

 Parallel port (It depends on the model.)

A parallel port is provided for some models.

 Serial port (It depends on the model.)

A serial port is provided for some models.

 Sound system

The computer has an external monaural microphone connector, stereo headphone connector and internal stereo speakers.

 Wireless LAN (Mini PCI slot)

The wireless LAN card (802.11b/g or 802.11a/b/g) is equipped on the mini PCI slot.

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1.1 Features 1 Hardware Overview

 LAN/MODEM

Connectors for LAN and Modem are separately mounted.

 RGB

The port enables connection of an external monitor.

 Docking interface port

Advanced Port Replicator III can be connected through docking port on the bottom.

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1 Hardware Overview 1.1 Features

Figure 1-1 shows the front of the computer.

Figure 1-1 Front of the computer

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1.1 Features 1 Hardware Overview

Figure 1-2 shows the system units configuration.

Figure 1-2 System units configuration

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1 Hardware Overview 1.2 System Block Diagram

1.2 System Block Diagram

Figure 1-3 shows the system block diagram.

Figure 1-3 System Block Diagram

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1.2 System Block Diagram 1 Hardware Overview

The PC contains the following components.

 CPU

Intel® Mobile Pentium® -M model

Pentium-M 1.60GHz (Processor Number ; 730)

1.73GHz (Processor Number ; 740)

1.86GHz (Processor Number ; 750)

2.00GHz (Processor Number ; 760)

2.13GHz (Processor Number ; 770)

2.26GHz (Processor Number ; 780) L1 cache : 64KB (32KB + 32KB)

L2 cache : 2MB FSB : 533MHz Core voltage : 1.280~1.356V

Intel® Mobile Celeron® -M model

Celeron-M 1.40GHz (Processor Number ; 360)

1.50GHz (Processor Number ; 370)

1.60GHz (Processor Number ; 380)

1.70GHz (Processor Number ; 390) L1 cache : 64KB (32KB + 32KB)

L2 cache : 1MB FSB : 400MHz Core voltage : 1.004~1.292V

 Memory

Two memory slots capable of accepting 256MB, 512MB or 1024MB memory modules for a maximum of 2GB.

• 200-pin DDR-SDRAM (PC4300)

• Pipeline configuration

• 2.5V operation

 Firmware Hub

• 8Mbit (Flash memory)

• Vcc : 3.3V±0.3V

• Vpp : 3.3V/12V

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1 Hardware Overview 1.2 System Block Diagram

 Chipset

This gate array has the following elements and functions. ¾ North Bridge (Intel 915GM <Express Chipset>)

- Support Pentium-M(915GM)/Celeron-M(915GM/910GML) Processor System Bus

- System Memory Interface

- Memory Controller : DDR333/DDR2-400/DDR2-533, 2GB(max)

- Graphics I/F : x16 PCI Express Based Graphics I/F

- DMI (Direct Media Interface)

- Integrated Display interface

- 1,257-ball 40.0mmx37.5mmx2.6mm FC-BGA Package

¾ South Bridge (Intel 82801DBM (ICH6-M))

- DMI (Direct Media Interface)

- PCI Express I/F (4 ports)

- PCI Bus I/F Rev 2.3 (PCI REQ/GNT Pairs)

- Integrated Serial ATA Host Controller (2 ports, 150MB/S)

- Integrated IDE Controller (Ultra ATA 100/66/33)

- AC’97 2.3 codes

- USB 1.1/2.0 Controller 8 ports (EHCI: Enhanced Host Controller Interface)

- Built-in LAN Controller (Wfm 2.0& IEEE802.3 compliance)

- Power Management (ACPI 2.0 compliance)

- SMBus2.0 controller

- FWH interface (BIOS)

- LPC interface (EC/KBC, Super I/O)

- IRQ controller

- Serial Interrupt Function

- Suspend/Resume control

- Built-in RTC

- GPIO

- 609-ball 31mmx31mm micro BGA Package

 PC card controller (Texas Instruments PCI7411)

- PCI Interface (PCI Rev. 2.3)

- PC Card Controller

- IEEE1394 Controller

- Flash Media Controller

- SD Host Controller

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1.2 System Block Diagram 1 Hardware Overview

 VGA controller

Imbedded in North Bridge

 Other main system chips

• EC/KBC (M306KAFCLRP x 1)

• PSC (Toshiba-made TMP86PM49UG x 1)

• Thermal sensor (AnalogDevice-made ADM1032 x 1)

• Audio AMP (Mitsumi-made MM1517X x1)

• AC97-CODEC (SigmaTel-made STAC9750TG x1)

• Clock generator (ICS954204 x1)

 Mini PCI (Intel/Askey made 802.11b/g or 802.11a/b/g)

2.4 GHz DSSS wireless LAN card is equipped in the mini PCI card slot. Conformity with IEEE 802.11b (WiFi). Supports 128bit WEP.

 LAN (Intel-made Kinnereth (ED82562 x 1)

Controls LAN. Supports 100Base-TX and 10Base-T.

 MODEM (Askey-made 1456VQL4A (INT) x 1)

Supported by MDC. Uses secondary AC97 line. Data and FAX transmission is available. Supports ITU-TV.90 and V.92. The transfer speed of data receiving is 56kbps, of data sending is 33.6kbps and of FAX is 14.4Kbps. Actual speed depends on the quality of the line used. Connected to telephone line through RJ11 modem jack.

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1 Hardware Overview 1.3 3.5-inch USB Floppy Disk Drive

1.3 3.5-inch USB Floppy Disk Drive

This compact, lightweight and high-reliability FDD can be used with 720KB and 1.44MB floppy disks.

Figure 1-4 shows the 3.5-inch FDD. Table 1-1 lists the specifications.

Figure 1-4 3.5-inch USB FDD

Table 1-1 3.5-inch USB FDD specifications

Item Specifications

Disk used 2DD 2HD Unformatted capacity 1.0MB 2.0MB Formatted capacity 720KB 1.44MB Data transfer speed

（Kb/s） Rotation speed（rpm）

250 500

300 300

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1.4 2.5-inch Hard Disk Drive 1 Hardware Overview

1.4 2.5-inch Hard Disk Drive

The computer has a compact, high-capacity HDD with a height of 9.5 mm. The HDD contains a 2.5-inch magnetic disk and magnetic heads.

Figure 1-5 shows a view of the 2.5-inch HDD and Tables 1-2 and 1-3 list the dimensions and specifications.

Figure 1-5 2.5-inch HDD

Table 1-2 2.5-inch HDD dimensions (1/2)

Item

HDD2193VZK01 HDD2194VZK01 HDD2191VZK01

Width (mm) 69.85

Height (mm) 9.5

Depth (mm) 100.0

Weight (g) (MAX) 95

Standard

TOSHIBA

Table 1-2 2.5-inch HDD dimensions (2/2)

Standard

Item

G8BC0001N410 G8BC0001N610 G8BC0001N810 G8BC0001NA10

Width (mm) 69.85±0.25

Height (mm) 9.5±0.2

Depth (mm) 100.2±0.25

Weight (g) (MAX) 95 102

HITACHI-GST

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1 Hardware Overview 1.4 2.5-inch Hard Disk Drive

Table 1-3 2.5-inch HDD specifications (1/2)

Item

Specifications

TOSHIBA

HDD2193VZK01 HDD2194VZK01 HDD2191VZK01

Storage size (formatted) 40GB 60GB 80GB Rotation speed (RPM) 5,400 Data transfer rate (MB/s) 154.3-298.0 258.0-394.0 233.0-446.0 Interface transfer rate

(MB/s) Storage density (Kbpi) 728 735 728 Track density (Ktpi) 88.8 Average random seek time

(read) (ms) Average random seek time

(write) (ms) Motor startup time (ms) 4

100

Table 1-3 2.5-inch HDD specifications (2/2)

Specifications

Item

G8BC0001N410 G8BC0001N610 G8BC0001N810 G8BC0001NA10

Storage size (formatted) 40GB 60GB 80GB 100GB Rotation speed (RPM) 5,400 Data transfer rate (MB/s) 493 Interface transfer rate

(MB/s) Storage density (Kbpi) 717 764 Track density (Ktpi) 96.6 113.2 Average random seek time

(read) (ms) Average random seek time

(write) (ms) Motor startup time (ms) 3.5

HITACHI-GST

100

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1.5 CD-ROM Drive 1 Hardware Overview

1.5 CD-ROM Drive

The CD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD. It is a high-performance drive that reads at maximum 24-speed.

The CD-ROM drive is shown in Figure 1-6. The specifications of the CD-ROM drive are described in Table 1-4 and 1-5.

Figure 1-6 CD-ROM drive

Table 1-4 CD-ROM drive dimensions

Item

Dimensions

Weight (g) 165 (max)

Maker Width (mm)

Height (mm) Depth (mm)

Standard

TEAC

(G8CC0002R220)

128

12.7

129.4

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1 Hardware Overview 1.5 CD-ROM Drive

Table 1-5 CD-ROM drive specifications

Specifications

Items

TEAC

(G8CC0002R220)

Transfer

Speed

Access Time

(ms)

Buffer memory 256KB

Supported formats

Data transfer rate (MB/s)

Burst data transfer rate (MB/s)

CD-ROM

33.3Mbytes/sec (max) 1,545 – 3,600KB/sec

PIO mode 16.7 MB/s (PIO MODE4)

DMA mode 16.7 MB/s (Multiword MODE2)

Ultra DMA mode 33.3 MB/s (Ultra DMA MODE2)

110 (Random)

240 (Full stroke)

CD-DA, CD-ROM Mode1, Mode2

CD-ROM XA Mode2 (Form1, Form2),

Photo CD (single/multi-session), Enhanced CD

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+ 378 hidden pages

Toshiba satellite a50s, tecra a3x Service Manual

SAFETY PRECAUTIONS

Table of Contents

Chapter 1 Hardware Overview

Chapter 2 Troubleshooting Procedures

Chapter 3 Tests and Diagnostics

Chapter 4 Replacement Procedures

Appendices

1.1 Features

1.2 System Block Diagram

1.3 3.5-inch USB Floppy Disk Drive

1.4 2.5-inch Hard Disk Drive 1 Hardware Overview

1.5 CD-ROM Drive