Toshiba MK6017MAP User Manual

TOSHIBA

Storage Device Division

MK6017MAP

(HDD2155)

HARD DISK DRIVE

PRODUCT SPECIFICA TION

Rev 00

October 2000

DOCUMENT NUMBER

14603

360014937



No.5T03670‑2D 

ＴＯＳＨＩＢＡ



ＴＩＴＬＥ：

REV No.

00 

      

  

                        

2.5 inch Disk Drives MK6017MAP Product Specification



APP’D



保管日

STGE.PER.



日 付



DATE

2000‑10‑06

       



  

Initialissue

   

記事

CONTENTS



部 門



DEP.

D‑SETSU2

   



担 当

REVISED

A.Iwata



承 認

M.Hattori









No.



ＴＯＳＨＩＢＡ ＣＯＲＰＯＲＡＴＩＯＮ

- 502 -

３６００１４９３７

３６００１４９３７３６００１４９３７

CONT.ON503

PAGENo.502





360014937

ＳＡＦＥＴＹ

ＳＡＦＥＴＹＳＡＦＥＴＹ

The hard disk drive and product specificat ions contain essential infor mation for the protection of users and others from possible injury and property damage and t o ensure correct handling. Please check that you fully understand the def inition of the f ollowing messages (s igns and graphical symbols) before going on to read the text, and always follow the instructions. Please describe requirements in the instr uction manual of t he product in which the drive is mounted and ensure that users are made thoroug hly aware of them.

IMPORTANT MESSAGES

Read this manual and follow its instructions. Sig nal words such as CAUTION and NOTE, will be followed by important safet y information t hat must be caref ully reviewed.

NOTE

LIMITATION OF LIABILITY



・Toshiba Corporation shall not be liable for any damage due to the fault or negligence

of users, fire, ear thquake, or ot her accident beyond the control of T oshiba Corporation.

・Toshiba Corporation shall not be liable for any incidental or consequential damages

including but not limited to change or loss of stored data, loss of profit, or interruption of business, which are caused by use or non-usability of t he product.

・Toshiba Corporation shall not be liable for any damage result fr om failure to com ply

Indicates a potentially hazardous situation which if not avoided, may result in minor injury or property damage.

Gives you helpful information.

with the contents in the product specification.

・Toshiba Corporation shall not be liable for any damage based on use of the product

in combination with connection devices, software, or other devices provided by Toshiba Corporation with the product.



503 -

360014937

 

USAGE RESTRICTIONS



● Since the drive is not designed or manufactured t o be used for a system including equipment (*1) directly link ed with human life, etc., T oshiba Corporation shall not

be liable for this type of use.

*1: Equipment directly linked with human life, etc. corresponds to t he following.

−Medical equipment such as life support systems, equipm ent used in operations，etc.

● When the drive is to be used f or a system including equipment (*2) linked with

human safety or having a serious influence on the saf e maintenance of public function, etc., special considerat ion (*3) must be given with regard to oper ation,

maintenance, and management of the system. *2: A system including equipment linked with human safety or having a ser ious influence on the safe maint enance of public function, et c. corresponds to the following.

−A main equipment control system used in atomic power plants, a safety protection based system used in atomic facilities, other important

safety lines and systems.

−An operation control system for mass t ransport, an air-tr affic control system.

*3: Special consideration means that a saf ety system (fool proof design, f ail saf e design, redundancy design, etc. ) is established as a result of

adequate consultation with Toshiba engineers.

- 504 -

360014937

SAFETY





■ Do not disassemble, remodel or r epair .  Disassembly, remodeling or repair may cause injury, failure, or data loss.

■■■■ Do not drop.  Dropping may cause injury.



■ Do not touch sharp edges or pins of the drive.  Sharp protrusions etc. may cause injury.

 Hold the drive by both sides when carrying it.

505 -

360014937

AFETY



Observe the following to prevent failure, malfunction or dat a loss.

 

●

Follow the specifications for 6. PO WER SUPPLY (page516), 8. ENVIRONMENT (page 522,

523), etc. when using.

NOTE



Failure to do so may cause damage to the drive.

●

Observe cautions in 7.4 MOUNTING INSTRUCT ION (page517) and 9.6 LOAD / UNLOAD



(page525 ) when handling, setting up, or using the drive.

●

Take anti-static measur es in order to avoid damage to the drive when handling it.



The drive uses parts susceptible to damage due to ESD (electrostatic discharge).



Wear ESD proof wrist strap in accordance with the usage specified when handling a drive that is not in an

anti-static protection bag.

●

There is a certain probability of the drive causing failure including data error or data loss.



Take preventive steps such as backing up data etc. without exception in order to prevent loss etc. in cases

where data loss may result in loss or damage.



Please include this in the instruction manual etc. of the system in which this device is used and ensure that users

are made thoroughly aware of it.

●

Inserting or pulling out t he dr ive when the power is turned on may cause damag e t o the

drive.



Exchange the drive etc. after the power of HDD is turned off.

●

Extreme shock to the drive may cause damage to it, data corruption, etc..



Do not subject the drive to extreme shock such as dropping, upsetting or crashing against other objects.

●

Do not touch the top cover since application of force to it may cause damage to the drive.

●

Do not stack the drive on another drive or on other par t s et c. or stack them on top of it during

storage or transportation.



Shock or weight may cause parts distortion etc..

●

Labels and the like attached to the drive are also used as a seal for maintenance of its

performance.



Do not remove them from the drive.

●

Attachment of dielectric m aterials such as metal powder, liquid, etc. to live parts such as

printed circuit board patterns or pins et c. may cause damage to the drive.



Avoid attachment of these materials.

●

Do not place objects which generate magnetic fields such as magnets, speakers, etc. near

the drive.

Magnetism may cause damage to the drive or data loss.

- 506 -

360014937

TABLE OF CONTENTS

1. SCOPE ......................................................................................................................................................................... 511

2. GENERAL DESCRIPTION....................................................................................................................................... 511

3. KEY FEATURES........................................................................................................................................................ 513

4. BASIC SPECIFICATION.......................................................................................................................................... 514

5. PERFORMANCE ....................................................................................................................................................... 515

6. POWER REQUIREMENTS...................................................................................................................................... 516

6.1 S

UPPLY VOLTAGE

.................................................................................................................................................. 516

6.1.1 Supply for Logic............................................................................................................................................516

6.1.2 Supply for Motor ........................................................................................................................................... 516

6.2 P

6.3 E

6.4 P

OWER CONSUMPTION NERGY CONSUMPTION EFFICIENCY OWER SEQUENCE

........................................................................................................................................... 516

...................................................................................................................... 516

................................................................................................................................................. 516

7. MECHANICAL SPECIFICATIONS........................................................................................................................ 517

7.1 D

7.2 W

7.3 D

7.4 M

IMENSION

EIGHT

RIVE ORIENTATION

OUNTING INSTRUCTIONS

............................................................................................................................................................. 517

.................................................................................................................................................................. 517

.............................................................................................................................................. 517

..................................................................................................................................... 517

7.4.1 Screwing........................................................................................................................................................ 518

7.4.2 Installation .................................................................................................................................................... 518

8. ENVIRONMENTAL LIMITS ................................................................................................................................... 522

8.1 T

EMPERATURE AND HUMIDITY

.............................................................................................................................. 522

8.1.1 Temperature .................................................................................................................................................. 522

8.1.2 Humidity........................................................................................................................................................ 522

8.2 V

8.3 S

8.4 A

8.5 A

8.6 S

IBRATION

HOCK

LTITUDE COUSTICS

AFETY STANDARDS

8.7 EMC A

............................................................................................................................................................. 522

.................................................................................................................................................................... 522

............................................................................................................................................................... 523

（

OUND POWER

）

............................................................................................................................. 523

.............................................................................................................................................. 523

DAPTABILITY

.............................................................................................................................................. 523

9. RELIABILITY............................................................................................................................................................524

9.1 E

RROR RATE

.......................................................................................................................................................... 524

9.1.1 Non- Recoverable Error Rate........................................................................................................................ 524

9.1.2 Seek Error Rate............................................................................................................................................. 524

9.2 M

9.3 P

9.4 R

9.5 P

9.6 L

EAN TIME TO FAILURE

RODUCT LIFE

EPAIR REVENTIVE MAINTENANCE OAD/UNLOAD

........................................................................................................................................................ 524

................................................................................................................................................................... 524

....................................................................................................................................................... 525

(MTTF).......................................................................................................................... 524

(PM)......................................................................................................................... 524

10. HOST INTERFACE ............................................................................................................................................... 526

10.1 C

ABLING

............................................................................................................................................................ 526

10.1.1 Interface Connector................................................................................................................................... 526

10.1.2 Cable ......................................................................................................................................................... 526

10.2 E

LECTRICAL SPECIFICATION

............................................................................................................................... 527

10.2.1 Cable length and capacitance................................................................................................................... 527

10.2.2 DC input/output Characteristics................................................................................................................527

10.3 I

NTERFACE CONNECTOR

..................................................................................................................................... 528

10.3.1 ATA interface connector............................................................................................................................ 528

10.3.2 Pin Assignment.......................................................................................................................................... 529

10.3.3 Signal Treatment ....................................................................................................................................... 530

10.3.4 Series resistance........................................................................................................................................ 531

507 -

360014937

10.3.5 Signal Description .....................................................................................................................................531

10.4 H

OST INTERFACE TIMING

...................................................................................................................................533

10.4.1 Program I/O Write Timing.........................................................................................................................533

10.4.2 Program I/O Read Timing .........................................................................................................................534

10.4.3 Single Word DMA Write Timing................................................................................................................535

10.4.4 Single Word DMA Read Timing.................................................................................................................536

10.4.5 Multiword DMA Write Timing...................................................................................................................537

10.4.6 Multiword DMA Read Timing....................................................................................................................538

10.4.7 Ultra DMA Timing.....................................................................................................................................539

10.4.8 Reset Timing...............................................................................................................................................548

10.5 G

10.6 A

10.7 R

ROUNDING DDRESS DECODING

EGISTER DESCRIPTION

........................................................................................................................................................548

..........................................................................................................................................549

......................................................................................................................................550

10.7.1 Data Register.............................................................................................................................................550

10.7.2 Error Register............................................................................................................................................551

10.7.3 Features Register (Write Precompensation Register)................................................................................552

10.7.4 Sector Count Register................................................................................................................................552

10.7.5 Sector Number Register.............................................................................................................................553

10.7.6 Cylinder Low Registers.............................................................................................................................. 553

10.7.7 Cylinder High Registers.............................................................................................................................553

10.7.8 Device/Head Register................................................................................................................................554

10.7.9 Status Register...........................................................................................................................................555

10.7.10 Command Register.....................................................................................................................................556

10.7.11 Alternate Status Register............................................................................................................................558

10.7.12 Device Control Register.............................................................................................................................558

10.7.13 Device Address register.............................................................................................................................558

10.8 C

OMMAND DESCRIPTIONS

..................................................................................................................................559

10.8.1 Nop (00h)................................................................................................................................................560

10.8.2 Recalibrate (1xh)..................................................................................................................................... 560

10.8.3 Flush Cache (E7h) ..................................................................................................................................560

10.8.4 Read Sector (20h/21h)............................................................................................................................561

10.8.5 Read Long (22h/23h)..............................................................................................................................561

10.8.6 Write Sector (30h/31h)............................................................................................................................561

10.8.7 Write Long (32h/33h)..............................................................................................................................562

10.8.8 Read Verify (40h)....................................................................................................................................562

10.8.9 Write Verify (3Ch)...................................................................................................................................562

10.8.10 Format Track (50h)...............................................................................................................................563

10.8.11 Seek (7xh)................................................................................................................................................564

10.8.12 Toshiba Specific.........................................................................................................................................564

10.8.13 Execute Diagnostics (90h)......................................................................................................................564

10.8.14 Initialize Device Parameters (91h) .........................................................................................................565

10.8.15 Read Multiple (C4h)................................................................................................................................566

10.8.16 Write Multiple (C5h)...............................................................................................................................567

10.8.17 Set Multiple Mode (C6h).........................................................................................................................568

10.8.18 Read DMA (C8h/C9h).............................................................................................................................568

10.8.19 Write DMA (CAh/CBh) ...........................................................................................................................569

10.8.20 Power Control (Exh)...............................................................................................................................570

10.8.21 Read Buffer (E4h)...................................................................................................................................572

10.8.22 Write Buffer (E8h)...................................................................................................................................572

10.8.23 Identify Device (ECh)..............................................................................................................................573

10.8.24 Set Max Address (F9h)............................................................................................................................586

10.8.25 Read Native Max Address (F8h)...........................................................................................................586

10.8.26 Set Features (EFh)..................................................................................................................................587

10.8.27 SECURITY SET PASSWORD (F1h) .......................................................................................................588

10.8.28 SECURITY UNLOCK (F2h)....................................................................................................................589

10.8.29 SECURITY ERASE PREPARE (F3h)......................................................................................................589

10.8.30 SECURITY ERASE UNIT (F4h)..............................................................................................................590

10.8.31 SECURITY FREEZE LOCK (F5h)..........................................................................................................590

10.8.32 SECURITY DISABLE PASSWORD (F6h) ..............................................................................................591

10.8.33 SMART Function Set..................................................................................................................................592

10.9 S

ECURITY MODE FEATURE SET

..............................................................................................................................609

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360014937

10.9.1 Security mode default setting..................................................................................................................... 609

10.9.2 Initial setting of the user password............................................................................................................ 609

10.9.3 Security mode operation from power-on................................................................................................... 610

10.9.4 Password lost............................................................................................................................................. 611

10.9.5 Command Table ........................................................................................................................................ 612

10.10 S

ELF-MONITORING

, A

NALYSIS AND REPORTING TECHNOLOGY

......................................................................... 613

10.10.1 Attributes...................................................................................................................................................613

10.10.2 Attributes values........................................................................................................................................ 613

10.10.3 SMART function default setting................................................................................................................. 613

10.11 A

DAPTIVE POWER MODE CONTROL

................................................................................................................... 614

10.11.1 Performance Idle....................................................................................................................................... 614

10.11.2 Active Idle.................................................................................................................................................. 614

10.11.3 Low Power Idle.......................................................................................................................................... 614

10.11.4 Transition time........................................................................................................................................... 614

10.12 R

10.13 M

10.14 C

................................................................................................................................................................. 615

ESET

ASTER/SLAVE CONFIGURATION

ACHE MEMORY

................................................................................................................................................ 617

....................................................................................................................... 616

10.14.1 Cache Operations...................................................................................................................................... 617

10.14.2 Notes for write cache................................................................................................................................. 617

10.15 A

UTOMATIC WRITE REALLOCATION

.................................................................................................................. 617

11. PROTOCOL............................................................................................................................................................ 618

11.1 PIO

11.2 PIO

11.3 N

11.4 DMA

11.5 U

11.6 O

DATA IN COMMANDS DATA OUT COMMANDS

ON-DATA COMMANDS

DATA TRANSFER COMMANDS

DMA...................................................................................................................................................... 623

LTRA THER TIMINGS

................................................................................................................................... 619

................................................................................................................................ 620

...................................................................................................................................... 621

................................................................................................................... 622

.................................................................................................................................................. 626

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360014937

Table of Figures

IGURE

ABLE

1 MK6017MAP D

OUNTING RECOMMENDATION

2 M 3 ATA 4 P 5 U 6 O

7.4-1 D

10.3-1 S

10.3-2 S

10.6-1 R

10.6-2 D

10.7-1 D

10.7-2 C

10.8-1 I

10.8-2 I

10.8-3 I

10.8-4 I

10.9-1 S

10.12-1 I

11.6-1 O

INTERFACE CONNECTOR

ASSWORD SET SECURITY MODE POWER-ON FLOW SER PASSWORD LOST

PTIONAL JUMPER FOR MASTER/SLAVE

IMENSIONS

IGNAL PIN ASSIGNMENT IGNAL TREATMENT

EGISTER MAP ECODE LOGIC

IAGNOSTIC MODE ERROR REGISTER

OMMAND CODE DENTIFY INFORMATION DENTIFY INFORMATION (CONTINUED DENTIFY INFORMATION (CONTINUED DENTIFY INFORMATION (CONTINUED

ECURITY MODE COMMAND ACTIONS

NITIALIZATION OF TASK FILE REGISTERS

THER TIMINGS

IMENSIONS

.............................................................................................................................519

......................................................................................................................521

..............................................................................................................................528

.....................................................................................................................................611

......................................................................................................................................................520

...............................................................................................................................529

......................................................................................................................................530

..............................................................................................................................................549

.............................................................................................................................................549

..........................................................................................................................................557

...................................................................................................................................574

. ..............................................................................................................................................626

.......................................................................................610

..............................................................................................................616

...............................................................................................................552

)............................................................................................................575

)............................................................................................................576

)............................................................................................................577

.............................................................................................................612

.......................................................................................................615

- 510 -

1. SCOPE

This document describes the specifications of the following model, MK6017MAP of 2.5- inch type Winchester disk drives.

360014937

Factory Number

Sales Number

HDD2155 MK6017MAP

2. GENERAL DESCRIPTION

MK6017MAP

The a series of intelligent disk drives .

The drive features an ATA-2 / 3 / 4 /5 interface embedded controller that requires a simplified adapter board for interfacing to an AT or AT compatible bus. The drives employ Winchester technology and a closed loop

servo control system which have made high recording density of 34.6 M bit/mm2 (22.35G bit/in2)and average access time of 13 msec with highest reliability of 300,000 hours for MTTF (Mean Time to Failure) possible.

The drive is distinctive for its small and light body with 9.5mm height and 92 grams of weight.

MK6017MAP

The sealed module which contains a disk spindle assembly, a head actuator assembly and an air filtration system. This HDA adopts Winchester technology which enhances high reliability. The actuator is a rotary voice coil motor which enables high-speed access.

The disk is driven directly by a DC spindle motor. Air filtration is provided by a high performance air filtration system using both breather and circulation filters.

which is noted hereinafter as 

consists of an HDA (Head Disk Assembly) and a printed circuit board. The HDA has a

MK6017MAP

 or as  the drive  comprises

The drive provides a carriage lock mechanism which is activated automatically upon power down in order to prevent head/media from being damaged when it is not operating or under shipment.

The printed circuit board which is set externally to the HDA and equipped with all the electric circuitry necessary to operate the drive except the head drivers . The power supply and interface signal connectors are mounted on the board. Only the head control IC’s are located within the HDA. The circuitry perform the following functions:

Read/Write, Task File Control, Spindle Motor Control, Seek and Head Positioning Servo Control, Abnormal Condition Detection and Shock Sensor Control.

511 -

360014937



SAFETY

●There is a certain probability of the drive causing failure including data error or data

 Take preventive steps such as backing up data etc. without exception in order t o

loss.

Do not disassemble, remodel or repair.

■■■■

Disassembly, remodeling or repair may cause injur y,



failure, or data loss.

NOTE

 prevent loss etc. in cases where data loss may result in loss or damage.

●Do not touch the top cover since application of force to it may cause damage to the

drive.

●Do not stack the drive on another drive or on other par t s et c. or stack them on top of it during storage or transportation.

 Shock or weight may cause parts distortion etc. .

●Labels and the like attached to the drive are also used as herm et ic sealing for

maintenance of its performance.

 Do not remove them from t he dr ive.

- 512 -

3. KEY FEATURES

High capacity in smallest size

•

. 2.5inch-type 1platters accommodating formatted capacity of 6.007GB,

Slim ( 9.5 mm in height ) and light (92 gram in weight) design.

Fast access and fast transfer rate

•

. Quick spin up of Spindle Motor 4 sec.

. Average access time 13 msec enabled by optimized balance of a head actuator assembly and an efficiently

designed magnet of rotary VCM.

. Bus transfer rate up to 66.7 megabytes per second and disk transfer 253 megabits maximum per second.

. Read ahead cache and write cache enhancing system throughput.

Intelligent Interface

•

360014937

ATA-2/ATA-3/ATA-4/ATA-5 interface supported.

Ultra66 supported.

Quick address conversion in translation mode.

Translation mode which enables any drive configuration.

LBA (Logical Block Address) mode.

. Single/Multi word DMA,Ultra-DMAmodesand Advanced PIO mode supported.

Data integrity

•

. Automatic retries and corrections for read errors.

. 368 bit computer generated ECC polynomial with 17 bit five burst and 113 bit single burst on-the-fly error

correction capability or 17 bit seven burst and 161 bit single burst error correction capability at retry. High reliability

•

. Powerful self- diagnostic capability.

. Shock detection with shock sensor circuit for high immunity against operating shock up to 1470 m/s2

( 150 G ).

. Automatic carriage lock secures heads on the ramp with high immunity against non operating shock up to

6,860 m/s2 (700G). Low power consumption

•

. Low power consumption by Adaptive Power Mode Control .

513 -

360014937

4. BASIC SPECIFICATION

MODEL MK6017MAP Formatted Capacity( gigabytes ) 6.007 Servo design method Sector Servo

Recording method 32/34 TC-MEEPR4+PP Recording density Track / mm (TPI ) 1667 (42.3k) Bit / mm ( BPI ) 20.8k (528k ) max. Flux change / mm ( FRPI ) 22.1k(561k ) max. Number of disks 1 Number of data heads 1 Number of user data cylinders 24,800 Bytes per sector 512

- 514 -

5. PERFORMANCE

Access time ( msec ) <*1> Track to track seek <*2> 3 Average seek <*3> 13



Rotation speed ( RPM ) 4,200 + 0.1% Average Latency Time ( msec ) 7.14 Internal Transfer rate ( Mbits / sec )

Host Transfer rate ( Mbytes / sec ) Ultra DMA mode 66.7 PIO mode 16.6 Sector Interleave 1:1 Track skew Yes Buffer size ( Kbytes ) 256 Cache Read Ahead Cache

Start time <*5> Recovery time from Stand- by <*5> 4 sec ( Typical ) Command Overhead ( msec ) 1

<*1> Under the condition of normal voltage, 25oC normal temperature and bottom side down.

Max. seek <*4> 24

133.0〜253.5

Write Cache

4 sec ( Typical )

( Up to Drive Ready)

20 sec ( Maximum ) 20 sec ( Maximum )

360014937

<*2> Average time to seek all possible adjacent track without head switching. <*3> Weighted average time to travel between all possible combination of track calculated as below. Weighted average access time = [ Sum of P(n)*t(n) ] / [ Sum of P(n) ], n = 1 to N.

Where, N ; Total number of tracks. P(n); Total number of seek for stroke n [ = 2*(N - n) ].

t(n); Average seek time for stroke n. Average seek time to seek to stroke n is the average time to 1,000 seeks for stroke n, with random head switch.

<*4> Average time for 1,000 full stroke seeks with random head switches.

<*5> Typical values are for the condition of normal voltage, 25oC normal temperature and placing bottom side down. Maximum values are for all conditions specified in this document.

515 -

360014937

6. POWER REQUIREMENTS

6.1 Supply Voltage

6.1.1 Supply for Logic

Allowable voltage 5V + 5% Allowable noise/ripple 100 mV p-p or less

6.1.2 Supply for Motor

Allowable voltage 5V + 5% Allowable noise/ripple 100 mV p-p or less

6.2 Power Consumption

Average (note 3) Maximum (note 4) Start 2.7 W Typical 5.6 W (note5) Seek (note 7) 2.3 W Typical 3.8 W (note6) Read / Write(note 8) 1.9 W Typical 3.0 W Active idle (note 1) 0.78 W Typical 0.9 W Low power idle (note 9) 0.58 W Typical 0.8 W Stand- by (note 2) 0.25 W Typical 0.3 W Sleep 0.1 W Typical 0.15 W

(note 1) Motor is rotating at normal speed but none of Read, Write or Seek is executed. (note 2) Motor is not rotating and heads are unloaded on the ramp.

(note 3) Under normal condition ( 25oC, 101.3 kPa ( 1,013 mb ) ) and 5V + (note 4) Under all the specified conditions. (note 5) Only when motor start retry, it may last for 2 seconds. (note 6) Peak value during seek operation (note 7) The seek average current is specified based on three operations per 100 ms. (note 8) The read/write current is specified based on three operations of 63 sector read/write per 100 ms. (note 9) Motor is rotating at normal speed but heads are unloaded on the ramp.

6.3 Energy Consumption Efficiency

Energy consumption efficiency Average(W/GB) Max.(W/GB) Classification

Power consumption at Low power idle / Capacity

Energy consumption efficiency is calculated in accordance with the law regarding efficiency of energy consumption :Energy saving law,1979 law number 49. Calculation of Energy consumption is dividi ng consumed energy by the capacit y. The consumed energy and capacity shall be measured and specified by the Energy saving low.

6.4 Power Sequence

If the 5V Logic is separated from 5V Motor, both lines should be turned on and off at the same time within the time period of one second .

0%.

0.097 0.116 D

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7. MECHANICAL SPECIFICATIONS

7.1 Dimension

Width 69.85mm ( 2.75” )

Height 9.5 mm ( 0.37”)

Depth 100.0 mm ( 3.94” )

Figure 1 and Table 7.4-1 show an outline of the drive.

7.2 Weight

92gram(Typ.) 94gram(max.)

7.3 Drive Orientation

The drive can be installed in all axes (6 directions).

7.4 Mounting Instructions

360014937



SAFETY

●

Take anti-static measur es in order to avoid damage to the drive when handling it.

The drive uses parts susceptible to damage due to ESD ( electrostatic discharge).

Wear ESD proof wrist strap in accordance with the usage specified when

handling a drive that is not in an anti-static pr otection bag.

●

Extreme shock to the drive may cause damage to it, data corruption, etc..



Do not subject the drive to extreme shock such as dropping, upsetting or crashing

against other objects.

●

Do not place objects which generate magnetic fields such as magnets, speakers,

etc. near the drive.

Magnetism may cause damage to the drive or data loss.

NOTE



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360014937

7.4.1 Screwing

Four screws should be tightened equally with 0.3 N.m ( 3 kgf.cm ) torque. The depth should be 3.0 mm min. and 3.5 mm maximum.

7.4.2 Installation

①

The drive should be mounted carefully on the surface of 0.1mm or less flatness to avoid excessive

distortion.

②

In order to prevent short-circuit under any circumstances, the space of 0.5mm or more should be kept under

the PCB and the design have to be checked carefully (See fig. 2).

③

Enough space should be kept around the drive especially around the convex portion of HDA (See fig. 2) to

avoid any contact with other parts, which may be caused by receiving shock or vibration.

④

The temperature of the top cover and the base must always be kept under 60℃ to maintain the required

reliability. ( If the drive runs continuously or spins-up frequently, the temperature of the top cover may rise to 15℃ maximum. If the drive is used in ambient temperature of 45℃ or more, it should be kept where

adequate ventilation is available to keep the temperature of top cover under 60℃)

⑤

M3 mounting screw holes are tapped directly on the base for electrical grounding between the drive and the

base. In order to prevent the drive performance from being affected by the system noise, appropriate evaluation should be conducted before deciding loading method.

⑥

Be sure not to cover the breathing hole ( See fig. 1) to keep the pressure inside the drive at a certain level.

⑦

Don’t apply any force to the top cover except to the screw areas ( See fig. 2) on top cover. The maximum

force to the specified area is 2N.

⑧ The drive contains several parts which may be easily damaged by ESD(Electric Static Discharge). Avoid

touching the interface connector pins and the surface of PCB. Be sure to use ESD proof wrist strap when handling the drive.

⑨ A rattle heard when the drive is moved is not a sign of failure.

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360014937

Figure 1

MK6017MAP Dimensions

UNIT: mm

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360014937

SFF-8200 Rev1.1(*)

SFF-8201 Rev1.2 SFF-8212 Rev1.2

Dimension Millimeters Inches Millimeters Inches

A1 A2 A3 A4 69.85 2.750

A5 0.25 0.010 A6 101.85 max 4.010 max

A9 3.99 0.157 A10 10.14 0.399 A11 2.00 0.079 A12 2.00 0.079 A13 0.50 0.020 A14 0.05 0.002 A17 0.50 0.020 A18 0.05 0.002 A21 3.86 0.152 A22 0.20 0.008 A23 3.00 0.118 A26 M3 N/A A28 4.07 0.160 A29 61.72 2.430 A32 M3 N/A A34 1.00 min 0.039 min A35 8.00 max 0.315 max A36 60.20 min 2.370 min A37 8.00 0.315 5.00 0.197 A38 3.00 min 0.118 min 3.50 min 0.137 min A41 2.50 min 0.980 min 3.50 min 0.137 min A50 14.00min 0.551min A51 90.60min 3.567min A52 14.00min 0.551min A53 90.60min 3.567min A54 10.24min 0.403min

(*)SFF-8200,8201,8212:Small Form Factor Standard

− − − − − −

MK6017MAP (Differences only)

9.5 0.374

0.20 0.008

100.00 ±0.41 3.973 ±0.016

3.99 ±0.43 0.157 ±0.017

10.14 ±0.51 0.399 ±0.020

61.72 ±0.30 2.430 ±0.012

14.00 ±0.30 0.551 ±0.012

90.60 ±0.30 3.567 ±0.012

14.00 ±0.30 0.551 ±0.012

90.60 ±0.30 3.567 ±0.012

10.24 ±0.51 0.403 ±0.020

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Table 7.4-1 Dimensions

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Figure 2

Mounting Recommendation

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360014937

8. ENVIRONMENTAL LIMITS

8.1 Temperature and Humidity

8.1.1 Temperature

Operating

Non- operating

Under shipment

The temperature of top cover and base must be kept under 60℃ at any moment to maintain the desire reliability.

5oC- 55oC Gradient 15oC / Hour maximum

- 20oC- 60oC Gradient 15oC / Hour maximum

- 40oC- 70oC Gradient 30oC / Hour maximum

( Packed in Toshiba’s original shipping package. )

8.1.2 Humidity

Operating 8%- 90% R.H. ( No condensation. ) Non- operating 8%- 90% R.H. ( No condensation. ) Under shipment 5%- 90% R.H. ( Packed in Toshiba’s original shipping package. ) Max. wet bulb 29o

C (Operating)

40oC (Non- operating)

8.2 Vibration

Operating

Non operating 25.4 mm p-p displacement.

9.8 m/s2 ( 1.0G ) 5- 500 Hz Sine wave sweeping 1 oct./ minute No unrecoverable error.

5-10 Hz No unrecoverable error.

49 m/s2 ( 5.0G ) 10- 500 Hz Sine wave sweeping 1 oct./ minute No unrecoverable error.

8.3 Shock

Operating

Non- operating

Under shipment 70 cm free drop

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1,470 m/s2 ( 150G ) 2 msec half sine wave Repeated twice maximum / second No unrecoverable error.

6,860 m/s2 ( 700G ) 1 msec half sine wave 1,960 m/s2 ( 200G ) 11 msec half sine wave

Repeated twice maximum / second No unrecoverable error.

No unrecoverable error. Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time. ( Packed in Toshiba’s original shipping package. )

8.4 Altitude

Operating - 300 m to 3,000 m Non operating - 400 m to 15,000 m

360014937

8.5 Acoustics

36 dBA MAX. For idle mode ( Spindle in rotating ). 39 dBA MAX. For repetition of random seek with full cylinder read operation.

Measurements are to be taken in accordance with ISO 7779.

（（（（

Sound Power

））））

8.6 Safety Standards

The drive satisfies the following standards .

Underwriters Laboratories ( UL ) 1950 Canadian Standard Association ( CSA ) C22.2 No.950 TUV Rheinland EN 60 950

8.7 EMC Adaptability

The drive satisfies the following standards .

EN50081-1 EN55022 : 1994 Class B EN61000-3-2 : 1995 EN61000-3-3 : 1995 EN50082-1 EN61000-4-2 : 1995 EN61000-4-3 : 1998 ENV50204 : 1995 EN61000-4-4 : 1995 EN61000-4-5 : 1995 EN61000-4-6 : 1996 EN61000-4-11 : 1994

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360014937

9. RELIABILITY

A failure is defined as an inability of the drive to perform its specified function described in the requirements of this document when being operated under the normal conditions or conditions specified in this document. However , damages caused by operation mistake, mishandling, accidents, system errors and other damages that can be induced by the customers are not defined as failure.

9.1 Error Rate

9.1.1 Non- Recoverable Error Rate

1 error per 1013 bits read

The defective sectors allocated to the spare locations in the factory are not counted in the error rate.

9.1.2 Seek Error Rate

1 error per 106 seeks

A seek error is a positioning error recoverable by a retry including recalibration.

9.2 Mean Time to Failure (MTTF)

A failure means that the drive can not execute the function defined in this document under the nominal temperature, humidity and the other conditions specified in this document . Damages caused by operation mistake, mishandling, system failure and other damages occurred under the conditions which are not described in this document are not considered as the failure.

MTTF 300,000 hours Conditions Power on hours 2,800 hours ( 200 days x 14 hours ) / year) Operating hours 600 hours ( 200 days x 3 hours ) / year) Seek hours

Number of load / unload 70 times / hour ( 60,000 times / year ) Environment

1.30 x 106 seeks / month

Normal ( 25oC, 101.3 kPa ( 1,013 mb ) )

9.3 Product Life

5 years or 20,000 power on hours whichever comes earlier

9.4 Repair

A defective drive should be replaced. Parts and subassemblies should not be repaired individually .

9.5 Preventive Maintenance (PM)

No preventive maintenance is required.

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9.6 Load/Unload

Be sure to issue and complete the following commands for unloading before cutting off the power supply. 300,000 times of normal Load / Unload can be performed by a command. Unload is executed by the following commands :

Soft Reset

・

Standby

・

Standby Immediate

・

Sleep

・

If the power supply is cut when the head is on a media, Emergency Unload is performed by routing the back-EMF of SPM to the voice coil. In this case, Emergency Unload is performed 20,000 times maximum. Emergency Unload should be used only when the host-system cannot perform normal operation.

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360014937

10. HOST INTERFACE

Related Standards

Information technology - AT Attachment Interface with Extensions (ATA-2)

X3T10.279-199x

Information technology - AT Attachment-3 Interface (ATA-3)

X3T10/2008D Revision 6 October 26, 1995

Information technology - AT Attachment with Packet Interface Extension (ATA -4) T13/1153D Revision 17 October 30, 1997

Information technology - AT Attachment with Packet Interface-5 Interface-5 (ATA-5)

T13/1321D Revision 2 December 13, 1999

10.1 Cabling

10.1.1 Interface Connector

Drive side connector Recommended host side connector for cable Berg 89361-044 or equivalent

for board straight type : Berg 86455-044 86456-044

Yamaichi GAP050K11617 or equivalent

or equivalent

10.1.2 Cable

The following table shows preferable twisted pair type of cable .

Standard diameter 0.32 mm ( 28 AWG ) Characteristics impedance

100- 132 Ω

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10.2 Electrical specification

10.2.1 Cable length and capacitance

0.46m MAX. 35pF MAX.

10.2.2 DC input/output Characteristics

10.2.2.1 Input

item unit value voltage high (note 1) V 2.0 to (supply voltage +0.5 ) low V -0.3 to 0.8 leak current

As non-connected logic voltage, input voltage level is from -0.3V to 0.5V.

(note 1) The max. input range of signal is from -0.3V to (supply voltage +0.5V ) (note 2) Except for signal lines pulled up as shown in Table 10.3.3-1

µA

+ 10 (note 2)

360014937

10.2.2.2 Output

item unit value note voltage high V 2.4 min. I low V 0.4 max.

0.4 max.

I I

OH OL OL

= - 1mA = 4mA = 8mA

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360014937

10.3 Interface connector

10.3.1 ATA interface connector

2.00

2.00 × 24 = 48.00

Polarity key

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Figure 3 ATA interface connector

10.3.2 Pin Assignment

The following table describes all of the pins on the Task File Interface.

Table 10.3-1 Signal pin assignment

PIN No. SIGNALS PIN No. SIGNALS

1 - RESET 2 GROUND 3 DD 7 4 DD 8 5 DD 6 6 DD 9 7 DD 5 8 DD 10

9 DD 4 10 DD 11 11 DD 3 12 DD 12 13 DD 2 14 DD 13 15 DD 1 16 DD 14 17 DD 0 18 DD 15 19 GROUND 20 KEY 21 DMARQ 22 GROUND 23 - DIOW 24 GROUND

STOP

25 -DIOR 26 GROUND

-DMARDY HSTROBE

27 IORDY 28 CSEL

-DMARDY

-DSTROBE 29 -DMACK 30 GROUND 31 INTRQ 32 - IOCS16 33 DA 1 34 - PDIAG／-CBLID 35 DA 0 36 DA 2 37 - CS0 38 - CS1 39 - DASP 40 GROUND 41 + 5V (LOGIC) 42 + 5V (MOTOR) 43 GROUND 44 RESERVED

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Note) Symbol (-) in front of signal name shows negative logic.

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10.3.3 Signal Treatment

Driver types and requirements for the signal pull- up and down are as follows. Resistor requirement is minimum for the host.

- IO16 is pulled up in the drive with certain value so that the Vol is obtained to run with a host that has large value of pull up resistor. - CS0 and - CS1 are also pulled up for better noise immunity.

Table 10.3-2 Signal treatment

SIGNAL Driven by TYPE By host By drive

- RESET host TP 10kΩPU DD 0:15 bi-direction TS

DMARQ drive TS 5.6 k Ω PD

- DIOR host TS

-DMARDY HSTROBE

- DIOW host TS STOP

IORDY drive TS 1.0 k Ω PU

-DDMARDY DSTROBE CSEL host GND 10 k Ω PU

- DMACK host TP INTRQ drive TS 10 k Ω PD

- IOCS16 drive OD 1.0 k Ω PU 1.2 k Ω PU DA 0:2 host TP

- PDIAG／-CBLID drive TS 10 k Ω PU

- CS0 - CS1 host TP

- DASP drive OD 10 k Ω PU

TP = Totem Pole, TS = Tri-State, PD = Pull Down, PU = Pull-Up, OD = Open Drain

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