<Engineering Department to contact as per SPECIFICATION>
TV/PC/Monitor-Use Marketing & Engineering Dept.
AVC-Use LTD Div.
Toshiba Matsushita Display Technology Co.,Ltd
1-9-2, Hatara-cho, Fukaya-shi, Saitama, 366-0032, JAPAN
Specification No.
Sheet 1
Revision History
Date Sheet
(New)
2003-03-20 New
2003-04-15 24 Product Label Rev.0 Rev.Z To separate Module
Item Old New Reason
Rank
New No.
Toshiba Matsushita Display Technology Co.,Ltd
Date: 2003-04-15
Date: 2003-03-20
New No. LTD141ECEF
Old
No. NL-LTD141ECEE
←# Special ←& Addition ← Change
Specification No.
Sheet 2
Caution and Handling Precaution
For your end user's safety, it is strongly advised that the items with"Σ"should be included in the instruction manual of the
system which may be issued by your organization.
For SafetyWarning
(1) Toshiba Matsushita Display Technology's Standard LED modules have not been customized for operation in extreme
environments or for use in applications where performance failures could be life-threatening or otherwise catastrophic.
Since they must never be installed in aircraft navigation control systems (such as, but not limited to Traffic Collision
System and Air traffic Indicator), in military defense or weapons systems, in critical industrial process-control systems
(e.g., those involved in the production of nuclear energy), or in critical medical device or patient life-support systems.
(2) DISCONNECT POWER SUPPLY before handling LED module.
DO NOT TOUCH the parts inside LED module and the fluorescent lamp's (hereinafter called "FL") connector or cable in
order to prevent electric shock, because high voltage is supplied to these parts from the inverter unit while power supply
is turned on.
(3) Make sure to insert the module FL connector to the inverter connector in correct position.
Do not insert in irregular position.
If incorrect, this may cause smoke or burn of electrical parts by high voltage of FL circuit.
If there is a possibility that the connector has been inserted incorrectly, please re-insert the connector only after you
confirm the module and FL power is completely off.
DO NOT USE the mating FL connector which Toshiba Matsushita Display Technology does not specify.
Otherwise, Toshiba Matsushita Display Technology shall not be liable for any damages caused by the connector.
Caution
(1) DO NOT DISASSEMBLE OR MODIFY the module.
Sensitive parts inside LED module may be damaged, and dusts or scratches may mar the displays.
Toshiba Matsushita Display Technology does not warrant the modules, if customer disassembled or modified them.
Σ(2) DO NOT INGEST liquid crystal material, DO NOT INHALE this material, and DO NOT PERMIT this material to contact
the skin, if LED panel is broken and liquid crystal material spills out.
In the event of inadvertent contact, immediately rinse the mouth or eyes with adequate water. If this material should
inadvertently contact the skin or clothing, wash immediately with alcohol and then rinse thoroughly with water.
Σ(3) BE CAREFUL WITH CHIPS OF GLASS that may cause injuring fingers or skin, when the glass is broken.
(4) DO NOT EXCEED the absolute maximum rating values under the worst probable conditions caused by the supply
voltage variation, input voltage variation, variation in parts' constants, ambient temperature, etc., otherwise LED module
may be damaged.
(5) Suitable protection circuit should be applied for each system design.
DO NOT MODIFY the fuse used in the module. It may cause overheat and/or burning if dusts or metal particles are on
the PCBs in the LED module.
Toshiba Matsushita Display Technology Co.,Ltd
Date: 2003-04-15
Date: 2003-03-20
New No.LTD141ECEF
Old
No. NL-LTD141ECEE
←# Special ←& Addition ← Change
Specification No.
Sheet 3
(6) Be sure that power supply output from the system should be limited to smaller values than listed shown below. (For
example Quick Arcing Fuse with listed ratings can be used.)
It is because this LED module explained in this specification has a current limiter, with such function at power input
line(s). But it may be some possibility of overheat and/or burning of LED module and its peripheral devices before
current limiter of the module when open-short test of the module is performed by using power supply higher than
following recommended value.
Power
supply
VDD 4.0 A 3.0 A 1.5 A
(7) Always comply with all applicable environmental regulations, when disposing of LCD.
Recommended maximum
output current of
power supply
Recommended Fuse Rating
(in case of using fuse
for current limiter)
Built-in Fuse Rating
(for reference)
For Designing the System
(1) LED module should be assembled to the system by using all mounting holes specified in this specification and with the
specified screws.
(2) Power supply lines should be designed as follows.
Power supplies should always be turned on before the input signals are supplied to LED module, and the input signals
should be disconnected before power supplies are turned off.
If the sequence does not satisfy specified conditions, it may cause miss-operation of the panel.
Refer to "2.4.2 Sequence of Power Supplies and Signals" for the detailed specification.
(3) DO NOT GIVE high voltage to "Low Voltage" side of the FL.
For example, DO NOT USE a floating inverter which gives high voltage to "Low Voltage" side. That's because it has a
possibility to burn or smoke around the FL.
(4) Make sure to connect correctly high-voltage wire and low-voltage wire between FL tube and inverter unit.
(5) Input FL starting voltage(V
If it were less than one second, it may cause unstable operation of FL.
Please adjust inverter circuit parameters, such as capacitor, resistor, to assure the display quality is maintained.
There is a possibility that flicker is observed by the interference of LED operating signal timing and FL driving condition
(especially driving frequency).
(6) In case of severe environmental condition like outdoor usage, a proper transparent protective cover(lens) over LED
module is recommended to apply in order to prevent scratches, and invasion of dust, water, etc., from the system's
window onto LED module.
Ultra-violet ray cut filter is recommended to apply onto LED module for outdoor operation. Strong ultra-violet ray may
cause damage the panel.
(7) Design the system not to display same pattern for a long time in order to prevent image sticking on the panel. Note that
incorrect sequence of power supplies and input signals may cause the sticking on the panel, too.
) should not be less than one second.
SFL
Toshiba Matsushita Display Technology Co.,Ltd
Date: 2003-04-15
Date: 2003-03-20
New No. LTD141ECEF
Old
No.
←# Special ←& Addition ← Change
NL-NL-NL-LTD141ECEE
Specification No.
Sheet 4
For Installation in Assembly
(1) The C-MOS LSIs used in LED module are very sensitive to ESD (Electro-static Discharge).
Ambient humidity of working area is recommended to be higher than 50%(RH).
Person handling LED modules should be grounded with wrist band. Tools like soldering iron and screw driver, and
working benches should be grounded.
The grounding should be done through a resistor of 0.5-1MΩ in order to prevent spark of ESD.
(2) When remove protection film from LED panel, peer off the film slowly (more than three seconds) from the edge of the
panel, using a soft-pointed tweezers covered by Teflon or adherent tape.
(3) Reduce dust level in working area. Especially the level of metal particle should be decreased.
Use finger stalls or soft and dust-free gloves in order to keep clean appearance of LED module when handled for
incoming inspection and assembly.
Σ(4) When LED panel becomes dirty, wipe off the panel surface softly with absorbent cotton or another soft cloth.
If necessary, breathe upon the panel surface and then wipe off immediately and softly again.
If the dirt can not be wiped off, absorbent cotton wetted a little with normal-hexane or petroleum benzine can be used for
wiping the panel.
Be careful not to spill this solvent into the inside of LED module. Driver ICs and PCB area used inside LED module may
be damaged by the solvent.
Σ(5) AVOID THE CONDENSATION OF WATER
Wipe off a spot or spots of water of mist and chemicals of mist on LED panel softly with absorbent cotton or another
cloth as soon as possible if happened, otherwise discoloration or stain may be caused. If water invade into LED module,
it may cause LED module damages.
Σ(6) Do not expose LED module to the gas (which is not normally contained in the atmosphere), it may cause mis-operation
or defects.
Σ(7) DO NOT APPLY MECHANICAL FORCES.
Do not bend or twist LED module even momentary when LED module is installed an enclosure of the system. Bending
or twisting LED module may cause its damages.
Make sure to design the enclosure that bending/twisting forces are not applied to LED module when it is installed in the
system.
Refrain from strong mechanical shock like dropping from the working bench or knocking against hard object.
These may cause glass of the panel crack, damage of FL or other mis-operation.
Σ(8) Refrain from excessive force like pushing the surface of LED panel. This may cause damage of the panel or electrical
parts on PCB.
Σ(9) Do not put heavy object such as tools, books, etc., and do not pile up LED modules.
Be careful not to touch surface of the polarizer laminated to the panel with any hard and sharp object. The polarizer is so
soft that it can easily scratched, even the protect film covers it.
(10) When inserting or disconnecting the connectors to LED module, be sure not to apply force against PCB, nor connecting
cables, otherwise internal connection of PCB and TAB drivers may be damaged.
Do not fasten screws while putting cables like those for interface or FL between LED module and the enclosure.
Make sure to insert the module FL connector to the inverter connector in correct position.
If incorrect, this may cause smoke or burn of electrical parts by high voltage of FL circuit.
Toshiba Matsushita Display Technology Co.,Ltd
Date: 2003-04-15
Date: 2003-03-20
New No.LTD141ECEF
Old
No. NL-LTD141ECEE
←# Special ←& Addition ← Change
ion, discoloration of light guide or optical sheet will be happened due to ultra violet
Specification No.
(11) Be careful not to pull the FL cables of the backlight in order to avoid mechanical damage in FL lamp and soldering area.
Be careful not to pull or not to hurt the FPC (Flexible Printed Circuit) cables.
(12) Power supplies should always be turned off in assembling process.
Do not connect or disconnect the power cables and connectors with power applied to LED module. This may cause
damage of module circuit.
The signal should be applied after power are turned on. And the signal should be removed before power supplies are
turned off. (Refer to "For Designing The System"(2).)Σ(13) In case of LED long period operat
and heat from LED. As the result, there is possibility to have out of specification for the optical characteristic as “5.2”.
But this is not irregular phenomena. Moreover,LED also has the characteristic of color shift by long period operation.
Sheet 5
For Transportation and Storage
(1) Do not store LED module in high temperature, especially in high humidity for a long time (approximately more than one
month).
It is recommended to store LED module where the temperature is in the range of 0 to 35 °C and the relative humidity is
lower than 70%.
(2) Store LED module without exposure to direct sunlight or fluorescent lamps in order to prevent the module from strong
ultra violet ray.
Σ(3) Avoid condensation of water on LED module, otherwise it may cause mis-operation or defects. Keep away LED module
from such ambient.
(4) In case of transportation of storage after opening the original packing. LED module are recommended to be repacked
into the original packaging with the same method, especially with same kind of desiccant.
Toshiba Matsushita Display Technology Co.,Ltd
Date: 2003-04-15
Date: 2003-03-20
New No.LTD141ECEF
Old
No. NL-LTD141ECEE
←# Special ←& Addition ← Change
Specification No.
Sheet 6
- CONTENTS -
Revision History Sheet 1
Caution and Handling Precaution 2
1. Scope 7
2. Product Specifications 7
2.1 General Specifications
2.2 Absolute Maximum Ratings
2.3 Mechanical Specifications
2.3.1 Weight
2.3.2 Dimensional Outline
2.4 Electrical Specifications
2.4.1 Circuit Diagram
2.4.2 Sequence of Power Supplies and Signals
2.4.3 Timing Chart
2.4.4 Timing Specifications
2.4.5 Interface Connector
2.4.6 Colors Combination Table
3. Recommended Operating Conditions 17
4. Electrical Characteristics 18
4.1 Test Conditions
4.2 Specifications
5. Optical Characteristics 19
5.1 Test Conditions
5.2 Optical Specifications
6. Quality 20
6.1 Inspection AQL
6.2 Test Conditions
6.3 Dimensional Outline
6.4 Appearance Test
6.4.1 Test Conditions
6.4.2 Specifications
6.5 Display Quality
6.5.1 Test Conditions
6.5.2 Specifications
6.6 Reliability Test
6.6.1 Test Conditions
6.6.2 Specifications
6.7 Labels
7. Lifetime 25
7.1 Module
7.2 Lamp
7.2.1 Test Conditions
7.2.2 Specifications
8. Packaging 26
8.1 Carton
9. Warranty 27
10. Regulation 27
11. Measuring Method 27
11.1 Measuring Systems
11.2 Measuring Methods
Toshiba Matsushita Display Technology Co.,Ltd
Date: 2003-04-15
Date: 2003-03-20
New No.LTD141ECEF
Old
No. NL-LTD141ECEE
←# Special ←& Addition ← Change
(Dots)
Specification No.
1. Scope
This specification is applicable to Toshiba Matsushita Display Technology's 36cm diagonal size TFT-LED module
"LTD141ECEF" designed for Personal Computer.
Transmissive type, Normally white
Viewing Direction 6 o'clock (in direction of maximum contrast)
Driving Method TFT active matrix
Input Signals LVDS interface
CLK+,CLK-
IN0+,IN0-
IN1+,IN1-
IN2+,IN2Active Area
Bezel Opening
Number of Pixels
Pixel Pitch
Pixel Arrangement RGB vertical stripes 1)
Surface Treatment Anti-glare and hard coat 3H on LED surface
Backlight Single cold-cathode fluorescent lamp for sidelighting
Dimensional Outline
Item Symbol Min. Max. Unit Checked Terminal 4)
Supply Voltage VDD -0.3 +4.0 V VDD - GND
Input Voltage of Signals VIN -0.3 VDD+0.3 V LVDS interface
FL Driving Voltage VFL - 2.0 kVrms
FL Driving Frequency fFL 0 100 kHz
Operating Ambient Temperature 2) TOP 0 +50
Operating Ambient Humidity 2) HOP 10 90 %(RH)
Storage Temperature 2) T
Storage Humidity 2) H
Operating Temperature for Panel 3) - 0 +60
Note1) Do not exceed the maximum rating values under the worst probable conditions taking into account the supply voltage
variation, input voltage variation, variation in part constants, and ambient temperature and so on. Otherwise the module
may be damaged.
Note 2) Wet bulb temperature should be 39°C Max, and no condensation of water. See figure below.
Note 3) The surface temperature caused by self heat radiation of cell itself is specified on this item.
Note 4) Refer to 2.4.5
-20 +60
STG
10 90 %(RH)
STG
°C
°C
°C
80%90%
40%
60%
40
50
20%
10%
]
)
H
R
(
%
[
y
t
i
d
i
m
u
H
Storage
Operation
Wet Bulb
Temperature [ C]
-20
10
0
0
10
Dry Bulb Temperature [ C]
30
20
20304050607080
2.3 Mechanical Specifications
2.3.1 Weight
460 ± 20 (g)
Toshiba Matsushita Display Technology Co.,Ltd
Date: 2003-04-15
Date: 2003-03-20
New No.LTD141ECEF
Old
No. NL-LTD141ECEE
←# Special ←& Addition ← Change
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