TOSHIBA CMS06 Technical data

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TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS06
CMS06
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
· Forward voltage: VFM = 0.37 V (max)
· Average forward current: I
· Repetitive peak reverse voltage: V
· Suitable for compact assembly due to small surface-mount package
“M−FLATTM” (Toshiba package name)
Maximum Ratings
Characteristics Symbol Rating Unit
Repetitive peak reverse voltage V
Average forward current I
Peak one cycle surge forward current
(non-repetitive)
Junction temperature Tj -40~125 °C
Storage temperature T
(Ta ==== 25°C)
F (AV)
= 2.0 A
RRM
F (AV)
I
FSM
= 30 V
RRM
40 (50 Hz) A
stg
30 V
2.0
(Note)
-40~150 °C
A
Unit: mm
JEDEC
JEITA
Note: T= 82.8°C: Rectangular waveform (a = 180°C), VR = 15 V
TOSHIBA 3-4E1A
Weight: 0.023 g (typ.)
Electrical Characteristics
Characteristics Symbol Test Condition Min Typ. Max Unit
Peak forward voltage
Repetitive peak reverse current
Junction capacitance Cj VR = 10 V, f = 1.0 MHz ¾ 130 ¾ pF
Thermal resistance R
Thermal resistance R
(Ta ==== 25°C)
V
IFM = 0.5 A ¾ 0.26 ¾
FM (1)
V
IFM = 1.0 A ¾ 0.28 ¾
FM (2)
V
IFM = 2.0 A ¾ 0.32 0.37
FM (3)
I
V
RRM
I
V
RRM
th (j-a)
th (j-ℓ)
= 5 V ¾ 0.09 ¾
RRM
= 30 V ¾ 1.4 3.0
RRM
Device mounted on a ceramic board
(soldering land: 2 mm ´ 2 mm)
Device mounted on a glass-epoxy board
(soldering land: 6 mm ´ 6 mm)
¾ ¾ ¾ 16 °C/W
¾ ¾ 60
¾ ¾ 135
°C/W
V
mA
1
2003-02-17
CMS06
y
Marking Following Indicates the Data of Manufacture
Type code
Lot No.
0 1 2 3 4
Month of
S6
Cathode mark
manufac­ture
Year of manufac­ture
January to December are denoted by letter A to L respectivel
Last decimal digit of the year of manufacture
.
5 6 7 8 9
Standard Soldering Pad
Unit: mm
2.1
1.4
3.0 1.4
Handling Precaution
Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier
products. This current leakage and improper operating temperature or voltage may cause thermal runaway.
Please take forward and reverse loss into consideration when you design.
2
2003-02-17
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