Exploded View of 40L3443DG
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Description
23161143 LCD PANEL, 40L3433DG, 23161143 (include F-bezel) 75038545
1 M/B 23167494 PC BOARD ASSY, MAIN, 40L3443DG, 23167494 75038638
2 F-bezel 23144821 FRONT BEZEL ASSY, 23144821 75036609
cosmatic Lens 40057270 LENS, LED, 40L1333DG, 40057270 75037278
4 B-cover 23180599 BACK COVER ASSY, 40L3433DG, 23180599 75038547
Lens 40055433 LENS, IR, 32W1333DB, 40055433 75036095
6 IR/B 23123271 PC BOARD ASSY, IR, 23123271 75036603
7 Button Board 23078192 PC BOARD ASSY, KEY, 40L1333B, 23078192 75033184
8 LVDS 23152437 LVDS CABLE, 40L3433DG, 23152437 75038544
9 SPK 23153301 SPEAKER, 40L1333DG, 23153301 75037280
10 Stand Assy 45012055 STAND ASSY, 40L1433DG, 45012055 75038541
11 P cord 30078717 POWER CORD, 32W1333DG, 30078717 75036101
12 P/B 23158490 POWER MODULE, 40L3453R, 23158490 75037530
Carton 50268058 CARTON BOX, 40L3443DG, 50268058 75038639
14 Side IO bezel 40056742 IO BRACKET, 32W3455DB, 40056742 75037337
15 Foot Screw 45011725 SCREW FOR STAND, 45011725 75036610
16 Cover Gromet 40046136
back CVR.Screw 35027715 SCREW, 22B2LF1G, 35027715 75028539
Panel
23162545 LCD PANEL, 40L1433DG, 23162545 (include F-bezel) 75038536
RELEASE PROTECTIVE COVER, AC CABLE, 26DL833B, 40046136
75025759
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MODEL ID and PANEL ID
Total digits YWK Model ID (SET ID) SERIAL Panel ID
Panel ID in Global Serial No.
When the panel version is updated within the same panel vendor, the last digit will be incremented
by 1.
Max 14 YWK *** ****** **
3 digits 3 digits
(A00001-Z99999)
YWK
Y: Year 8 2008 WK: Week 01 WK01
9 2009 02 WK02
A 2010 03 WK03
B 2011 04 WK04
C 2012
53 WK53
Panel vendor Information (Panel ID)
Marking Marking Marking
A J S
B K T
C L U
D M V
E N W
F P X
G Q Y
H R Z
1-9
Model/Panel I n fo r mation
Model
40L3443DG 8J5 K1 75038638 10088605
Model ID
(SET ID)
Panel ID Main PCB
DVD Module
-
Panel
40FHD50 SAM
Product
REVISION HISTORY
- Replacement for Main Schematic with correct ones
- Correction of Step 3 in "FIRMWARE UPDATING"
CONTENTS
1. IMPORTANT NOTICE
2. GREEN PRODUCT PROCUREMENT
3. LEAD-FREE SOLDER
4. SAFETY INSTRUCTION
5. FIRMWARE UPDATING
6. INTERCONNECT
7. EXPLODED VIEW
8. HOTEL MODE / HOTEL CLONE
9. SCHEMATIC DIAGRAM
1
IMPORTANT NOTICE
WARNING:
You are requested that you shall not modify or alter the information or data provided
herein without prior written consent by Toshiba. Toshiba shall not be liable to
anybody for any damages, losses, expenses or costs, if any, incurred in connection
with or as a result of such modification or alteration.
THE INFORMATION OR DATA HEREIN SHALL BE PROVIDED "AS IS" WITHOUT ANY
WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED WARRANTY OF
MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
Toshiba shall not be liable for any damages, losses, expenses or costs, if any,
incurred in connection with or as a result of use of any information or data provided
herein.
GREEN PRODUCT PROCUREMENT
The EC is actively promoting the WEEE & RoHS Directives that define standards for
recycling and reuse of Waste Electrical and Electronic Equipment and for the Restriction of
the use of certain Hazardous Substances. From July 1, 2006, the RoHS Directive will
prohibit any marketing of new products containing the restricted substances.
Increasing attention is given to issues related to the global environmental. Toshiba
Corporation recognizes environmental protection as a key management tasks, and is doing
its utmost to enhance and improve the quality and scope of its environmental activities. In
line with this, Toshiba proactively promotes Green Procurement, and seeks to purchase
and use products, parts and materials that have low environmental impacts.
Green procurement of parts is not only confined to manufacture. The same green parts
used in manufacture must also be used as replacement parts.
LEAD-FREE SOLDER
This product is manufactured using lead-free solder as a part of a movement within the
consumer products industry at large to be environmentally responsible. Lead-free solder
must be used in the servicing and repair of this product.
WARNING: This product is manufactured using lead free solder.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT!
The melting temperature of lead-free solder is higher than that of leaded solder by 30ºC to
40ºC (54ºF to 72ºF). Use of a soldering iron designed for lead-based solders to repair
product made with lead-free solder may result in damage to the component and or PCB
being soldered. Great care should be made to ensure high-quality soldering when servicing
this product especially when soldering large components, through-hole pins, and on PCBs
as the level of heat required to melt lead-free solder is high.