TOREX XCL201, XCL202 User Manual

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X
XCL201/XCL202 Series
ETR2802-003
Inductor Built-in Step-Down “micro DC/DC” Converters
GENERAL DESCRIPTION
The XCL201/XCL201 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC in one tiny package (2.5mm×2.0mm, h=1.0mm). A stable power supply with an output current of 400mA is configured using only two capacitors connected externally. Operating voltage range is from 2.0V to 6.0V. Output voltage is internally set in a range from 0.8V to 4.0V in increments of
0.05V. The device is operated by 1.2MHz, and includes 0.42P-channel driver transistor and 0.52N-channel switching transistor. As for operation mode, the XCL201 series is PWM control, the XCL202 series is automatic PWM/PFM switching control, allowing fast response, low ripple and high efficiency over the full range of loads (from light load to heavy load). During stand-by, the device is shutdown to reduce current consumption to as low as 1.0μA or less. With the built-in UVLO (Under Voltage Lock Out) function, the internal driver transistor is forced OFF when input voltage becomes 1.4V or lower. The series provide short-time turn-on by the soft start function internally set in 0.25ms (TYP). The series integrate C discharge function which enables the electric charge stored at the output capacitor C auto-discharge switch located between the LX and VSS pins. When the devices enter stand-by mode, output voltage quickly returns to the V
APPLICATIONS
Mobile phones, Smart phones
Bluetooth Headsets
WiMAX PDAs, MIDs, UMPCs
Portable game consoles
Digital cameras, Camcorders
SSD(Solid State Drive)
PND(Portable Navigation Device)
TYPICAL APPLICATION CIRCUIT
C
L
10μF
400mA
* “L1 and L
level as a result of this function.
SS
XCL201/XCL202 Series
L1
L
Vss
V
OUT
(TOP VIEW)
”, and “L2 and V
X
VIN
Vss
CE
L2
” is connected by wiring.
OUT
C
IN
4.7μF
FEATURES
Ultra Small : 2.5mm×2.0mm, h=1.0mm
Input Voltage : 2.0V ~ 6.0V Output Voltage : 0.8V ~ 4.0V (±2.0%)
High Efficiency : 92%(VIN=4.2V,V
Output Current : 400mA Oscillation Frequency : 1.2MHz (±15%)
Maximum Duty Cycle : 100%
Output Capacitor : Low ESR Ceramic
Current Limiter Circuit : Constant Current & Latching
Control Methods : PWM (XCL201)
PWM/PFM Auto (XCL202)
CE Function : Soft-Start Circuit Built-In
Operating Ambient Temperature
Environmentally Friendly : EU RoHS Compliant, Pb Free
TYPICAL PERFORMANCE
CHARACTERISTICS
100
80
60
40
Efficency:EFFI(%
20

to be discharged via the internal
L
XCL201B331BR/XCL202B331BR
XCL202(PWM/PFM)
4.2V
0
GreenOperation Compatible
: -40℃〜+85℃
VIN = 5.5V
5.0V
Output Curr ent:I
XCL201(PWM)
VOUT=3.3V
(mA)
OUT
auto
L
OUT
=3.3V)
1/21
XCL201/XCL202 Series
PIN CONFIGURATION
L1
7
1
6
V
IN
5
Vss
CE
4
8
L2
(BOTTOM VIEW)
PIN ASSIGNMENT
Lx
Vss
2
VOUT
3
* It should be connected the VSS pin (No. 2 and 5) to the GND pin.
* If the dissipation pad needs to be connected to other pins, it should be connected to the GND pin.
* Please refer to pattern layout page for the connecting to PCB.
PIN NUMBER PIN NAME
FUNCTION
1 Lx Switching Output
2,5 VSS Ground
3 V
Output Voltage
OUT
4 CE Chip Enable 6 VIN Power Input 7 L1 8 L2
Inductor Electrodes
PRODUCT CLASSIFICATION
Ordering Information XCL201①②③④⑤⑥-⑦ XCL202①②③④⑤⑥-⑦
(*1)
Fixed PWM control
(*1)
PWM / PFM automatic switching control
DESIGNATOR ITEM SYMBOL DESCRIPTION
②③
Functions selection B C
Output Voltage
(*2)
auto discharge, High speed soft-start
L
10 1.0V 12 1.2V 15 1.5V
18 1.8V 25 2.5V 28 2.8V 30 3.0V 33 3.3V
⑤⑥-⑦
(*1)
The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant.
(*2)
When other output voltages are needed, please contact your local Torex sales office for more information.
Output voltage range is 0.8~4.0V.
(*1)
Oscillation Frequency 1 1.2MHz
Package
(Order Unit)
BR-G CL-2025 (3,000/Reel)
2/21
BLOCK DIAGRAM

XCL201B / XCL202B Series
XCL201/XCL202
Series
L2 L1
VOUT
CFB
R1
FB
V
R2
VIN
SS
R3
R4
Vref with
Soft Start,
CE
UVLO
VSHORT
Phase
Compensation
Error Amp.
PWM/PFM
Selector
UVLO Cmp
Inductor
Current Feedback
PWM
Comparator
Current Limit
Logic
Ramp Wave
Generator
OSC
CE
Control
Logic
Synch Buffer
Drive
Lx
VSS
CE/
CE
NOTE: The XCL201 offers a fixed PWM control, a signal from CE Control Logic to PWM/PFM Selector is fixed to "L" level inside. The
XCL202 control scheme is PWM/PFM automatic switching, a signal from CE Control Logic to PWM/PFM Selector is fixed to "H" level
inside. The diodes placed inside are ESD protection diodes and parasitic diodes.
ABSOLUTE MAXIMUM RATINGS
Ta = 2 5
PAR AMET ER SYMBOL RATINGS UNITS
VIN Pin Voltage VIN - 0.3 ~ 6.5 V
LX Pin Voltage VLX - 0.3 ~ V
V
Pin Voltage V
OUT
- 0.3 ~ 6.5 V
OUT
CE Pin Voltage VCE - 0.3 ~ 6.5 V
LX Pin Current I
±1500 mA
LX
Power Dissipation Pd 1000 *1 mW
Operating Ambient Temperature Topr - 40~ +85
Storage Temperature Tstg - 40 ~ +105
*1: The power dissipation figure shown is PCB mounted (40mm×40mm, t=1.6mm, Glass Epoxy FR-4).
Please refer to page 12 for details.
+ 0.36.5 V
IN
3/21
XCL201/XCL202 Series
ELECTRICAL CHARACTERISTICS
XCL201B121BR/XCL202B121BR, V
OUT
=1.2V, f
=1.2MHz, Ta=25
OSC
PARAMETER SYMBOL CONDITIONS
Output Voltage V
Operating Voltage Range
Maximum Output Current
UVLO Voltage V
Supply Current (XCL201) - 22 50
Supply Current (XCL202)
Stand-by Current I
Oscillation Frequency
PFM Switching Current
PFM Duty Limit
(*11)
I
(*11)
DTY
OUT
V
I
OUTMAX
UVLO
I
DD
STB
f
OSC
PFM
LIMIT_PFM
IN
Maximum Duty Cycle MAXDTY VIN=VCE=5.0V, V
Minimum Duty Cycle MINDTY VIN=VCE=5.0V, V
Efficiency
Lx SW "H" ON Resistance 1 Lx SW "H" ON Resistance 2 Lx SW "L" ON Resistance 1 Lx SW "L" ON Resistance 2
Lx SW "H" Leakage Current
Current Limit
Output Voltage
Temperature Characteristics
CE "H" Voltage V
CE "L" Voltage V
CE "H" Current I CE "L" Current I
Soft Start Time
Latch Time
Short Protection
Threshold Voltage
CL Discharge
Inductance Value
Allowed Inductor Current I
Test conditions: Unless otherwise stated, VIN=5.0V, V NOTE:
(*1)
Including hysteresis operating voltage range.
(*2)
EFFI= { ( output voltage×output current ) / ( input voltage×input current) }×100
(*3)
ON resistance (Ω)=(VIN - Lx pin measurement voltage) / 100mA
(*4)
Design value
(*5)
When temperature is high, a current of approximately 10μA (maximum) may leak.
(*6)
Time until it short-circuits V
(*7)
When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
(*8)
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*9)
Current limit denotes the level of detection at peak of coil current.
(*10)
“H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
(*11)
I
and DTY
PFM
(*2)
EFFI
R
LxH1
R
LxH2
R
LxL1
R
(*5)
(*9)
I
LxL2
I
LeakH
LIM
V
OUT
(V
・△
OUT
CEH
CEL
CEH
CEL
t
SS
t
LAT
V
SHORT
R
DCHG
L Test frequency=1MHz - 4.7 - μH-
DC
with GND via 1 of resistor from an operational state and is set to Lx=0V from current limit pulse generating.
OUT
are defined only for the XCL202 series which have PFM control function. (Not for the XCL201 series)
LIMIT_PFM
When connected to external components, V
IN=VCE
=5.0V, I
OUT
=30mA
2.0 - 6.0 V
V
IN=VOUT(T)
When connected to external components V
CE=VIN,VOUT
Voltage which Lx pin holding “L” level
V
IN=VCE
VIN=5.0V, VCE=0V, V
When connected to external components, V
IN=VOUT(T)
When connected to external components, V
IN=VOUT(T)
VCE=VIN = 2.0V, I
+2.0V, VCE=1.0V
=0V
=5.0V, V
OUT=VOUT(T)
OUT
+2.0V, VCE=1.0V , I
+2.0V, VCE=VIN , I
=1mA - 200 300 %
OUT
OUT=VOUT (T)
OUT=VOUT (T)
When connected to external components, V
CE=VIN=VOUT (T)
VIN=VCE=5.0V, V VIN=VCE=3.6V, V VIN=VCE=5.0V VIN=VCE=3.6V
VIN=V
V
/
Topr)
OUT
IN=VCE
I
=30mA
OUT
-40℃≦Topr85
V
=0V, Applied voltage to VCE,
OUT
Voltage changes Lx to “H” level V
=0V, Applied voltage to VCE,
OUT
Voltage changes Lx to “L” level VIN=VCE=5.0V, V V
=5.0V, VCE=0V, V
IN
When connected to external components,
=0V→V
V
CE
V
IN=VCE
Short Lx at 1 resistance
Sweeping V
1 resistance, V
level within 1ms
+1.2V, I
=0V,ILX=100mA
OUT
=0V,ILX=100mA
OUT
(*4)
- 0.45 0.66 -
(*4)
- 0.52 0.77 -
=5.0V, VCE=0V, LX=0V - 0.01 1.0 μA
=5.0V, V
=5.0V, V
OUT=VOUT (T)
=0V - 0.1 - 0.1 μA
OUT
OUT
, I
=1mA
IN
OUT
=0.8×V
OUT
, VIN=VCE=5.0V, Short Lx at
OUT
voltage which Lx becomes “L”
OUT
VIN=5.0V, LX=5.0V, VCE=0V, V
ΔT=40 - 600 - mA -
=Nominal Voltage
OUT(T)
(*8)
(*1, *10)
×1.1V
= V
×1.1V - 0 1.0 μA
OUT(T)
=100mA
OUT
=1mA
OUT
×0.9V 100 - - % ×1.1V - - 0 %
=100mA
OUT
×0.9V
(*10)
(*10)
(*3)
- 0.35 0.55
(*3)
- 0.42 0.67
(*7)
700 800 1000 mA
=0V - 0.1 - 0.1 μA
OUT(T)
(*6)
=open 200 300 450
OUT
MIN. TYP. MAX.
1.176 1.200 1.224 V
400 - - mA
1.00 1.40 1.78 V
- 15 33
1020 1200 1380 kHz
140 180 240 mA
- 86 - %
- ±100 - ppm/
0.65 - 6.0 V
- 0.25 V
V
SS
- 0.25 0.40 ms
1.0 - 20 ms
0.450 0.600 0.750 V
UNITS
CIRCUIT
μA
4/21
ELECTRICAL CHARACTERISTICS (Continued)
XCL201B181BR/XCL202B181BR, V
OUT
=1.8V, f
=1.2MHz, Ta=25
OSC
XCL201/XCL202
Series
PARAMETER SYMBOL CONDITIONS
Output Voltage V
Operating Voltage Range
Maximum Output Current
UVLO Voltage V
Supply Current (XCL201) - 22 50
Supply Current (XCL202)
Stand-by Current I
Oscillation Frequency
PFM Switching Current
PFM Duty Limit
(*11)
(*11)
DTY
I
OUT
V
I
OUTMAX
UVLO
I
DD
STB
f
OSC
PFM
LIMIT_PFM
IN
Maximum Duty Cycle MAXDTY VIN=VCE=5.0V, V
Minimum Duty Cycle MINDTY VIN=VCE=5.0V, V
Efficiency
Lx SW "H" ON Resistance 1 Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1 Lx SW "L" ON Resistance 2
Lx SW "H" Leakage Current
Current Limit Output Voltage
Temperature Characteristics
CE "H" Voltage V
CE "L" Voltage V
CE "H" Current I
CE "L" Current I
Soft Start Time
Latch Time
Short Protection
Threshold Voltage
CL Discharge
Inductance Value
Allowed Inductor Current I
Test conditions: Unless otherwise stated, VIN=5.0V, V NOTE:
(*1)
Including hysteresis operating voltage range.
(*2)
EFFI={ ( output voltage×output current ) / ( input voltage×input current) }×100
(*3)
ON resistance (Ω)=(VIN - Lx pin measurement voltage) / 100mA
(*4)
Design value
(*5)
When temperature is high, a current of approximately 10μA (maximum) may leak.
(*6)
Time until it short-circuits V
(*7)
When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
(*8)
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*9)
Current limit denotes the level of detection at peak of coil current.
(*10)
“H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
(*11)
I
and DTY
PFM
(*2)
EFFI
R
LxH1
R
LxH2
R
LxL1
R
(*5)
(*9)
I
LxL2
I
LeakH
LIM
V
OUT
(V
・△
OUT
CEH
CEL
CEH
CEL
t
SS
t
LAT
V
SHORT
R
DCHG
L Test frequency=1MHz - 4.7 - μH-
DC
with GND via 1 of resistor from an operational state and is set to Lx=0V from current limit pulse generating.
OUT
are defined only for the XCL202 series which have PFM control function. (Not for the XCL201 series)
LIMIT_PFM
When connected to external components, V
IN=VCE
=5.0V, I
OUT
=30mA
2.0 - 6.0 V
V
IN=VOUT(E)
When connected to external components V
CE=VIN,VOUT
Voltage which Lx pin holding “L” level
V
IN=VCE
VIN=5.0V, VCE=0V, V
When connected to external components, V
IN=VOUT(T)
When connected to external components, V
IN=VOUT(T)
VCE=VIN=V
+2.0V, VCE=1.0V
=0V
=5.0V, V
OUT=VOUT(T)
OUT=VOUT(T)
+2.0V, VCE=1.0V , I
+2.0V, VCE=VIN , I
+0.5V, I
OUT(T)
OUT=VOUT (T)
OUT=VOUT (T)
(*8)
(*1, *10)
×1.1V
×1.1V - 0 1.0 μA
=100mA
OUT
=1mA
OUT
=1mA - 200 300 %
OUT
×0.9V 100 - - % ×1.1V - - 0 %
When connected to external components, V
CE=VIN=VOUT (T)
VIN=VCE=5.0V, V VIN=VCE=3.6V, V VIN=VCE=5.0V VIN=VCE=3.6V
VIN=V
V
/
Topr)
V
OUT
IN=VCE
=30mA
I
OUT
-40℃≦Topr85
V
=0V, Applied voltage to VCE,
OUT
Voltage changes Lx to “H” level V
=0V, Applied voltage to VCE,
OUT
Voltage changes Lx to “L” level
IN=VCE
VIN=5.0V, VCE=0V, V
When connected to external components, V
=0V→V
CE
V
IN=VCE
Short Lx at 1 resistance Sweeping V 1 resistance, V “L” level within 1ms
VIN=5.0V LX=5.0V VCE=0V V
+1.2V, I
OUT
OUT
(*4)
- 0.45 0.66 Ω -
(*4)
- 0.52 0.77 Ω -
=5.0V, VCE=0V, L
= 5.0V, V
=5.0V, V
=5.0V, V
OUT=VOUT (T)
OUT
, I
IN
OUT
OUT
, VIN=VCE=5.0V, Short Lx at
OUT
OUT
=100mA
OUT
=0V, ILX=100mA =0V, ILX=100mA
X
=0V - 0.1 - 0.1 μA
=0V - 0.1 - 0.1 μA
OUT
=1mA
=0.8×V
(*6)
voltage which Lx becomes
(*3)
- 0.35 0.55
(*3)
- 0.42 0.67
=0V - 0.01 1.0 μA
(*7)
×0.9V
OUT(T)
700 800 1000 mA
(*10)
(*10)
=open 200 300 450
OUT
ΔT=40 - 600 - mA -
=Nominal Voltage
OUT (T)
MIN. TYP. MAX.
1.764 1.800 1.836 V
400 - - mA
1.00 1.40 1.78 V
- 15 33
1020 1200 1380
120 160 200 mA
- 89 - %
- ±100 - ppm/
0.65 - 6.0 V
- 0.25 V
V
SS
- 0.32 0.50 ms
1.0 - 20 ms
0.675 0.900 1.125 V
UNITS
CIRCUIT
μA
kHz
5/21
XCL201/XCL202 Series
ELECTRICAL CHARACTERISTICS (Continued)
The value and conditions are depends on setting output voltage.
PFM Switching Current (I
) (XCL202)
PFM
NOMINAL OUTPUT VOLTAGE MIN. TYP. MAX.
0.8V≦V
1.2V<V
1.8V≦V
OUT(T)
OUT(T)
OUT(T)
1.2V 1.8V 4.0V
140mA 180mA 240mA
130mA 170mA 220mA
120mA 160mA 200mA
PFM Duty Limit DTY
LIMIT_PFM
(XCL202)
SETTING VOLTAGE CONDITIONS
0.8V≦V
1.0V≦V
1.0V
OUT(T)
4.0V V
OUT(T)
=2.0V, I
V
CE=VIN
CE=VIN=VOUT(T)
=1mA
OUT
+0.5V, I
OUT
Soft-Start Time t
SERIES OUTPUT VOLTAGE MIN. TYP. MAX.
SS
=1mA
- 0.25ms 0.40ms
- 0.32ms 0.50ms
- 0.28ms 0.40ms
- 0.32ms 0.50ms
- 0.28ms 0.40ms
- 0.32ms 0.50ms
XCL201B
XCL202B
0.8V≦V
1.5V≦V
1.8V≦V
2.5V≦V
0.8V≦V
2.5V≦V
OUT(T)
OUT(T)
OUT(T)
OUT(T)
OUT(T)
OUT(T)
1.5V
1.8V
2.5V
4.0V
2.5V
4.0V
TYPICAL APPLICATION CIRCUIT
XCL201/XCL202 Series
L1
Lx
Vss
C
L
OUT
V
External Components
C
: 10V/4.7μF(Ceramic)
IN
C
: 6.3V/10μF(Ceramic)
L
NOTE:
The Inductor can be used only for this DC/DC converter.
Please do not use this inductor for the other reasons.
Please use B, X5R, and X7R grades in temperature characteristics for C
These grade ceramic capacitors minimize capacitance-loss as a function of voltage stress.
L2
V
IN
Vss
CE
C
IN
and CL capacitors.
IN
6/21
XCL201/XCL202
Series
OPERATIONAL DESCRIPTION
The XCL201/XCL202 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation circuit, output voltage adjustment resistors, P-channel MOSFET driver transistor, N-channel MOSFET switching transistor for the synchronous switch, current limiter circuit, UVLO circuit with control IC, and an inductor. (See the block diagram below.) Using the error amplifier, the voltage of the internal voltage reference source is compared with the feedback voltage from the V compensation is performed on the resulting error amplifier output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to ensure stable output voltage. The current feedback circuit monitors the P-channel MOS driver transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple feedback signals. This enables a stable feedback loop even when a low ESR capacitor such as a ceramic capacitor is used ensuring stable output voltage.
L2 L1
Inductor
VOUT
V
VIN
CFB
R1
FB
R2
Vref with
Soft Start,
R3
SS
R4
CE
UVLO
Phase
Compensation
Error Amp.
VSHORT
UVLO Cmp
PWM/PFM
Selector
Current Feedback
PWM
Comparator
Current Limit
Logic
Ramp Wave
Generator
OSC
CE
Control
Logic
Synch Buffer
Drive
Lx
VSS
CE/
CE
<Reference Voltage Source> The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
<Ramp Wave Circuit> The ramp wave circuit determines switching frequency. The frequency is fixed internally 1.2MHz. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits.
<Error Amplifier> The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by the internal split resistors, R1 and R2. When a feed back voltage is lower than the reference voltage, the output voltage of the error amplifier is increased. The gain and frequency characteristics of the error amplifier output are fixed internally to deliver an optimized signal to the mixer.
pin through split resistors, R1 and R2. Phase
OUT
7/21
estart
XCL201/XCL202 Series
OPERATIONAL DESCRIPTION (Continued)
<Current Limit> The current limiter circuit of the XCL201/XCL202 series monitors the current flowing through the P-channel MOS driver transistor connected to the Lx pin, and features a combination of the current limit mode and the operation suspension mode.
When the driver current is greater than a specific level, the current limit function operates to turn off the pulses from the Lx pin at any given timing. When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state. At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over current state. When the over current state is eliminated, the IC resumes its normal operation.
The IC waits for the over current state to end by repeating the steps through . If an over current state continues for a few milliseconds and
the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of the driver transistor, and goes into operation suspension state. Once the IC is in suspension state, operations can be resumed by either turning the IC off via the CE pin, or by restoring power to the V therefore, the internal circuitry remains in operation. The current limit of the XCL201/XCL202 series can be set at 800mA at typical. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, an input capacitor is placed as close to the IC as possible.
pin. The suspension state does not mean a complete shutdown, but a state in which pulse output is suspended;
IN
Limit < # ms
Limit > # ms
Current Limit LEVEL
ILx
V
OUT
0mA
Vss
Lx
V
CE
R
VIN
<Short-Circuit Protection> The short-circuit protection circuit monitors the internal R1 and R2 divider voltage from the V shown in the previous page). In case where output is accidentally shorted to the Ground and when the FB point voltage decreases less than half of the reference voltage (Vref) and a current more than the I operates to turn off and to latch the driver transistor. In the latch state, the operation can be resumed by either turning the IC off and on via the CE pin, or by restoring power supply to the V When sharp load transient happens, a voltage drop at the V may operate in the voltage higher than 1/2 V
<UVLO Circuit> When the V unstable operation of the internal circuitry. When the V the UVLO function, the IC performs the soft start function to initiate output startup operation. The soft start function operates even when the VIN pin voltage falls momentarily below the UVLO operating voltage. The UVLO circuit does not cause a complete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry remains in operation.
pin voltage becomes 1.4V or lower, the P-channel output driver transistor is forced OFF to prevent false pulse output caused by
IN
voltage.
OUT
IN
pin.
is propagated to the FB point through CFB, as a result, short circuit protection
OUT
pin voltage becomes 1.8V or higher, switching operation takes place. By releasing
IN
flows to the driver transistor, the short-circuit protection quickly
LIM
pin (refer to FB point in the block diagram
OUT
8/21
XCL201/XCL202
Series
OPERATIONAL DESCRIPTION (Continued)
<PFM Switch Current> In PFM control operation, until coil current reaches to a specified level (I the P-ch MOSFET is kept on can be given by the following formula.
t
ON
= L×I
PFM
/ (V
IN
V
) IPFM
OUT
<PFM Duty Limit> In the PFM control operation, the PFM Duty Limit (DTY
) is set to 200% (TYP.). Therefore, under the condition that the duty increases (e.g.
LIMIT_PFM
the condition that the step-down ratio is small), it’s possible for P-ch MOSFET to be turned off even when coil current doesn’t reach to IPFM. →IPFM
tON
), the IC keeps the P-ch MOSFET on. In this case, on-time (tON) that
PFM
DTY
最大 IPFM 制限
LIMIT_PFM
Lx
ILx
PFM
I
0mA
Lx
ILx
f
OSC

I
<C
High Speed Discharge>
L
PFM
The XCL201/XCL202 series can quickly discharge the electric charge at the output capacitor (C
a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the L
electric charge at the output capacitor (C
capacitor (C
) is set by the CL auto-discharge resistance (R) and the output capacitor (CL). By setting time constant of a CL auto-discharge
L
resistance value [R] and an output capacitor value (C
) is quickly discharged so that it may avoid application malfunction. Discharge time of the output
L
) as τ(τ=C x R), discharge time of the output voltage after discharge via the N channel
L
I
PFM
) when a low signal to the CE pin which enables
L
X
transistor is calculated by the following formula.
–t/
V = V
OUT(T)
x e
τ
or t=τln (V
OUT(T)
/ V)
V : Output voltage after discharge
V
: Output voltage
OUT(T)
t: Discharge time,
τ: C x R
C=Capacitance of output capacitor (C
R=C
auto-discharge resistance
L
100
)
L
Output Voltage Discharge Characteristics
R
=300Ω(TYP.)
DCHG
80
CL=10μF CL=20μF CL=50μF
PFM
I
0mA
pin and the VSS pin. When the IC is disabled,
60
40
20
100 = Setting Voltage Value
Output Voltage (Relative Value)
0
0 20 40 60 80 100
Discharge Time t(ms)
9/21
XCL201/XCL202 Series
OPERATIONAL DESCRIPTION (Continued)
<CE Pin Function>
The operation of theXCL201/XCL202 series will enter into the shut down mode when a low level signal is input to the CE pin. During the shutdown mode, the current consumption of the IC becomes 0μA (TYP.), with a state of high impedance at the Lx pin and V starts its operation by inputting a high level signal to the CE pin. The input to the CE pin is a CMOS input and the sink current is 0μA (TYP.).
XCL20/XCL202 series - Examples of how to use CE pin
pin. The IC
OUT
V
V
V
DD
<Soft Start>
Soft start time is internally set 0.25ms to 0.32ms (TYP). Soft start time is defined as the time to reach 90% of the output nominal voltage when the CE pin is turned on.
IN
CE
< IC inside >
VDD
SW_CE
IN
CE
< IC inside >
(A)
SW_CE SELECTED STATUS
ON Stand-by
OFF Operation
(B)
SW_CE SELECTED STATUS
ON Operation
OFF Stand-by
tSS
V
CEH
0V
V
OUT
0V
FUNCTION CHART
CE OPERATIONAL STATES
VOLTAGE
LEVEL
(*1)
H Level
L Level
* CE pin voltage level range
(*1)
H level: 0.65V<VCE<6V
(*2)
L level: 0V<VCE<0.25V
(*3)
CE pin should not be left open to avoid unstable operation.
(*2)
Stand-by Stand-by
XCL201 XCL202
Synchronous
PWM Fixed Control
Synchronous
PWM/PFM Automatic Switching
10/21
XCL201/XCL202
Series
NOTE ON USE
1. The XCL201/XCL202 series is designed for use with ceramic output capacitors. If, however, the potential difference is too large between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the resulting high switching energy and oscillation could occur on the output. If the input-output potential difference is large, connect an electrolytic capacitor in parallel to compensate for insufficient capacitance.
2. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the design has been completed, verification with actual components should be done.
3. Depending on the input-output voltage differential, or load current, some pulses may be skipped, and the ripple voltage may increase.
4. When the difference between input and output is large in PWM control, very narrow pulses will be outputted, and there is the possibility that some cycles may be skipped completely.
5. When the difference between input and output is small, and the load current is heavy, very wide pulses will be outputted and there is the possibility that some cycles may be skipped completely.
6. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak current becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate the peak current according to the following formula:
Ipk = (V
L: Coil Inductance Value f
OSC
7. When the peak current which exceeds limit current flows within the specified time, the built-in P-ch driver transistor turns off. During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit current flows; therefore, care must be taken when selecting the rating for the external components such as a coil.
- V
) x OnDuty / (2 x L x f
IN
OUT
: Oscillation Frequency
OSC
) + I
OUT
8. When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
9. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible.
10. Use of the IC at voltages below the recommended voltage range may lead to instability.
11. This IC should be used within the stated absolute maximum ratings in order to prevent damage to the device.
12. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the leak current of
the driver transistor.
13. The current limit is set to 1000mA (MAX.) at typical. However, the current of 1000mA or more may flow.
In case that the current limit functions while the V input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By contrast, when N-ch MOSFET is ON, there is almost no potential difference at both ends of the coil since the V rate of coil current becomes quite small. According to the repetition of this operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the amount of current, which is supposed to be limited originally. Even in this case, however, after the over current state continues for several ms, the circuit will be latched. A coil should be used within the stated absolute maximum rating in order to prevent damage to the device.
Current flows into P-ch MOSFET to reach the current limit (IThe current of IBecause of no potential difference at both ends of the coil, the time rate of coil current becomes quite small. Lx oscillates very narrow pulses by the current limit for several ms. The circuit is latched, stopping its operation.
or more flows since the delay time of the circuit occurs during from the detection of the current limit to OFF of P-ch MOSFET.
LIM
pin is shorted to the GND pin, when P-ch MOSFET is ON, the potential difference for
OUT
Duty
).
LIM
Limit > #ms
pin is shorted to the GND pin. Consequently, the time
OUT
I
L
LIM
x
ILx
11/21
XCL201/XCL202 Series
NOTE ON USE (Continued)
14. In order to stabilize V possible to the V
15. High step-down ratio and very light load may lead an intermittent oscillation when PWM mode.
16. When PWM/PFM automatic switching goes into continuous mode, the IC may be in unstable operation for the range of MAXDUTY area
with small input/output differential.
17. Please use within the power dissipation range below. Please also note that the power dissipation may changed by test conditions, the power dissipation figure shown is PCB mounted.
1.2
1.0
0.8
0.6
0.4
0.2
Maximum Power Disspation Pd (W)
0.0
the power loss of micro DC/DC according to the following formula:
V
OUT
I
OUT
EFFI: Conversion Efficiency (%)
0 25 50 75 100
power loss = V
: Output Voltage (V)
: Output Current (A)
Measurement Condition (Reference data)
Condition: Mount on a board
Ambient:
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6mm
Through-hole: 4 x 0.8 Diameter
voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be connected as close as
IN
& VSS pins.
IN
Operating Temperature Ta (℃)
×
I
×
OUT
Natural convection
((100/EFFI) – 1)(W)
OUT
2
in one side)
40.0
28.9
.
2.54
Evaluation Board (unit: mm)
1.4
28.9
40.0
.
2.5
12/21
XCL201/XCL202
Series
NOTE ON USE (Continued)
Instructions of pattern layouts
1. In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN (No.6) & VSS
(No.5) pins.
2. Please mount each external component as close to the IC as possible.
3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of
switching may result in instability of the IC.
5. This series’ internal driver transistors bring on heat because of the output current and ON resistance of driver transistors.
6. Please connect Lx (No.1) pin and L1 (No.7) pin by wiring on the PCB.
7. Please connect V
(No.3) pin and L2 (No.8) pin by wiring on the PCB.
OUT
CE
IC
FRONT
CL
CL
CIN
GNDVOUT
LX
VINGND
VOUT
CE
GND
GND
LX
VIN
BACK (Flip Horizontal)
GNDVOUT
LX
CE
IC
CIN
VINGND
FRONT (PCB mounted)
13/21
XCL201/XCL202 Series
TEST CIRCUITS
< Circuit No.1 > < Circuit No.2 >
VSS
L1
L2
A
CIN
※ External Compone nts
* External Components
CIN : 4.F(ceramic)
CL : 10μF(ceramic)
CIN: 4.7μF (Ceramic) CL: 10μF (Ceramic)
VIN Lx
CE VOUT
< Circuit No.3 > < Circuit No.4 >
L1 L1
VSS
L2 L2
1μF
VIN Lx
CE VOUT
< Circuit No.5 >
L1 L1
ICEH
A
ICEL
VIN Lx
CE VOUT
L2
VSS
1μF
Wave Form Measure Point
CL
Wave Form Measure Point
Rpulldown 200Ω
ILeakH
A
ILeakL
V
A
1μF
1μF
<CircuitNo.6>
1μF
VSS
VSS
VSS
L1
L2
L2
VIN Lx
CE VOUT
VIN Lx
CE VOUT
VIN Lx
CE VOUT
V
ON resistance = (VIN-VLx)/100mA
Wave Form Measure Point
V
100mA
ILIM
< Circuit No.7 >
1μF
< Circuit No.9 >
A
CIN
VIN Lx
CE VOUT
VSS
L2 L2
L1
VIN Lx
CE VOUT
L2
VSS
Wave Form Measure Point
Ilat
Rpulldown 1Ω
<CircuitNo.8>
1uF
< Circuit No.10 >
A
CIN
※ External Compone nts
* External Components
L : 4.7uH(選)
CIN : 4.F(ceramic)
L: 4.7μH (Screening Parts)
CL : 10μF(ceramic)
CIN: 4.7μF (Ceramic) CL: 10μF (Ceramic)
L1L1
VIN Lx
CE VOUT
VSS
VSS
L1
L2
VIN Lx
CE VOUT
ILx
A
Wave Form Measure Point
L
V
CL
14/21
)
XCL201/XCL202
TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current (2) Output Voltage vs. Output Current
100
80
60
40
Efficency:EFFI(%
20
XCL201B181BR/XCL202B181BR
XCL202(PWM/PFM)
VIN= 4.2V
3.6V
2.7V
XCL201(PWM)
XCL201B181BR/XCL202B181BR
2.1
VIN=4.2V,3. 6V,2. 7V
2.0
(V)
1.9
OUT
XCL202
(PWM/PF M)
1.8
1.7
Output Voltage:V
1.6
XCL201
(PWM)
Series
0
0.01 0.1 1 10 100 1000
Output Current:I
OUT
(mA)

1.5
0.01 0.1 1 10 100 1000
Output Current:I
OUT
(mA)
(3) Ripple Voltage vs. Output Current (4) Oscillation Frequency vs. Ambient Temperature
100
80
60
VIN =4.2V
40
Ripple Voltage:Vr(mV)
20
0
0.01 0.1 1 10 100 1000
XCL201B181BR/XCL202B181BR
XCL202
(PWM/PFM)
3.6V
2.7V
Output Current:I
VIN =4.2V
(mA)
OUT
3.6V
XCL201
(PWM)
2.7V

1.5
1.4
1.3
1.2
1.1
1.0
0.9
Osc illation F requency : fosc(MHz)
0.8
-50 -25 0 25 50 75 100
XCL201B181BR/XCL202B181BR
VIN=3.6V
Ambient Temperature: Ta (℃)
(5) Supply Current vs. Ambient Temperature (6) Output Voltage vs. Ambient Temperature
40
XCL202B181BR
2.1
XCL201B181BR/XCL202B181BR
35
30
(μA)
DD
25
4.0V
VIN=6.0V
20
15
10
Supply Current : I
2.0V
5
0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
2.0
(V)
1.9
OUT
VIN =3.6V
1.8
1.7
Output Voltage : V
1.6
1.5
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
15/21
1ch
XCL201/XCL202 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) UVLO Voltage vs. Ambient Temperature (8) CE "H" Voltage vs. Ambient Temperature
XCL201B181BR/XCL202B181BR
1.8
1.5
CE=VIN
1.2
0.9
0.6
0.3
UVLO Voltage : UVLO (V)
0.0
-50 -25 0 25 50 75 100
Ambient Temperatur e: Ta (℃)
1.0
0.9
0.8
(V)
0.7
CEH
0.6
0.5
0.4
0.3
0.2
CE "H" Voltage : V
0.1
0.0
-50 -25 0 25 50 75 100
(9) CE "L" Voltage vs. Ambient Temperature (10) "Pch / Nch" Driver on Resistance vs. Input Voltage
XCL201B181BR/XCL202B181BR
1.0
0.9
0.8
(V)
0.7
CEL
0.6
VIN=5.0V
3.6V
0.5
0.4
0.3
CE "L" Voltage : V
0.2
0.1
0.0
-50 -25 0 25 50 75 100
2.4V
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Lx SW ON Resistance:RLxH,RLxL (Ω)
0.0 0123456
Ambient Temperatur e: Ta (℃)
(11) Rise Wave Form
XCL201B331BR/XCL202B331BR
VIN=5.0V IOUT=1.0mA
XCL201B181BR/XCL202B181BR
VIN =5.0V
3.6V
2.4V
Ambient Temperature: Ta (℃)
XCL201B181BR/XCL202B181BR
Nc h on Res ist ance
Pch on Res ist ance
Input Voltage : V
IN
(V)
2ch
VOUT
CE:0.0V⇒1.0V
1ch:1V/div2ch:1V/div
Time:100μs/div
16/21
)
1ch
2ch
1ch
XCL201/XCL202
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(12) Soft-Start Time vs. Ambient Temperature (13) CL Discharge Resistance vs. Ambient Temperature
500
XCL201B121BR/XCL202B121BR
XCL201B331BR/XCL202B331BR
600
400
300
200
100
Soft Start Time : tss (μs)
0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
(14) Load Transient Response
MODEPWM/PFM Automatic Switching Control
VIN=3.6V,VOUT=1.8V
XCL202B181BR
IOUT=1mA⇒100mA
VIN=5.0V IOUT=1.0mA
500
VIN =6.0V
2.0V
400
300
200
CL Discharge Res istance: (
4.0V
100
-50 -25 0 25 50 75 100
Ambient Temperatur e: Ta (℃)
XCL202B181BR
VIN=3.6V,VOUT=1.8V
IOUT=1mA⇒300mA
1ch
VOUT
2ch
1ch:100mA/div2ch:50mV/div
1ch:100mA/div2ch:50mV/div
time:200μs/div
VIN=3.6V,VOUT=1.8V
2ch
XCL202B181BR
IOUT=100mA⇒1mA
VOUT

VIN=3.6V,VOUT=1.8V
1ch
2ch
VOUT
time:200μs/div
XCL202B181BR
IOUT=300mA⇒1mA
VOUT
1ch:100mA/div2ch:50mV/div
time:200μs/div
1ch:100mA/div2ch:50mV/div
time:200μs/div
17/21
2ch
1ch
XCL201/XCL202 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(14) Load Transient Response (Continued)
MODEPWM Control
XCL201B181BR
XCL201B181BR
VIN=3.6V,VOUT=1.8V
IOUT=1mA⇒100mA
1ch
VOUT
2ch
1ch:100mA/div2ch:50mV/div
time:200μs/div

VIN=3.6V,VOUT=1.8V
IOUT=1mA⇒300mA
VOUT
1ch:100mA/div2ch:50mV/div
time:200μs/div
VIN=3.6V,VOUT=1.8V
1ch
XCL201B181BR
VIN=3.6V,VOUT=1.8V
1ch
IOUT=100mA⇒1mA
XCL201B181BR
IOUT=300mA⇒1mA
18/21
2ch
VOUT
1ch:100mA/div2ch:50mV/div
time:200μs/div

2ch
VOUT
1ch:100mA/div2ch:50mV/div
time:200μs/div
PACKAGING INFORMATION
CL-2025 (unit:mm)
XCL201/XCL202
Series
External Lead
Reference Pattern Layout (unit:mm) Reference Metal Mask Design (unit:mm)
19/21
XCL201/XCL202 Series
MARKING RULE
represents products series
1
① ②
2
3
 (G, I, J, O, Q, W excluded)
*No character inversion used.
CL-2025
6
5
4
MARK PRODUCT SERIES
F XCL201B*****-G
H XCL202B*****-G
represents integer of output voltage and oscillation frequency
OUTPUT VOLTAGE (V)
0.x F
1.x H
2.x K
3.x L
4.x M
represents the decimal part of output voltage
OUTPUT VOLTAGE (V) MARK PRODUCT SERIES
X.0 0 XCL20***0***-G
X.05 A XCL20***A***-G
X.1 1 XCL20***1***-G
X.15 B XCL20***B***-G
X.2 2 XCL20***2***-G
X.25 C XCL20***C***-G
X.3 3 XCL20***3***-G
X.35 D XCL20***D***-G
X.4 4 XCL20***4***-G
X.45 E XCL20***E***-G
X.5 5 XCL20***5***-G
X.55 F XCL20***F***-G
X.6 6 XCL20***6***-G
X.65 H XCL20***H***-G
X.7 7 XCL20***7***-G
X.75 K XCL20***K***-G
X.8 8 XCL20***8***-G
X.85 L XCL20***L***-G
X.9 9 XCL20***9***-G
X.95 M XCL20***M***-G
Example (Mark ②, ③)
OSCILLATION
FREQUENCY
1.2MHz L 3 K C H L
, represents production lot number 0109, 0A0Z, 119Z, A1A9, AAAZ, B1ZZ in order.
XCL20**33***-G XCL20**2C***-G XCL20**1L***-G
MARK
OSCILLATION FREQUENCY=1.2MHz
(XCL20****1**-G)
MARK
20/21
XCL201/XCL202
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
21/21
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