Datasheet XCB170STR, XCB170S, XCB170 Datasheet (CPCLARE)

Part # Description

XCB170 6 Pin DIP (50/Tube)
XCB170S 6 Pin Surface Mount (50/Tube)
XCB170STR 6 Pin Surface Mount (1000/Reel)

XCB170 Units

Load Voltage 350 V
Load Current 100 mA
Max R

ON

50 Ω

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DS-XBA170-R2.0

XCB170

Single Pole OptoMOS®Relays

1

Applications

Features

Description

Approvals

Ordering Information

Pin Configuration

• Telecommunications

• Telecom Switching

• Tip/Ring Circuits

• Modem Switching (Laptop, Notebook, Pocket

Size)

• Hookswitch

• Dial Pulsing

• Ground Start

• Ringer Injection

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Meters (Watt-Hour, Water, Gas)

• Medical Equipment-Patient/Equipment Isolation

• Security

• Aerospace

• Industrial Controls

• Small 6 Pin DIP Package

• Low Drive Power Requirements (TTL/CMOS

Compatible)

• No Moving Parts

• High Reliability

• Arc-Free With No Snubbing Circuits

• 3750V

RMS

Input/Output Isolation

• No EMI/RFI Generation

• Machine Insertable, Wave Solderable

• Surface Mount and Tape & Reel

Versions Available

The XCB170 is a 1-Form-B relay which uses optically
coupled MOSFET technology to provide 3750V of
input to output isolation. The efficient MOSFET switch­es and photovoltaic die use Clare’s patented
OptoMOS®architecture. A highly efficient GaAIAs
infrared LED controls the optically coupled input. The
device is available in small 6-pin dual in line package
in standard through hole and surface mount lead bend.

• UL Recognized: File Number E76270

• CSA Certified: File Number LR 43639-10

• BSI Certified to:

• BS EN 60950:1992 (BS7002:1992)

Certificate #: 7344

• BS EN 41003:1993

Certificate #: 7344

1

3

2

4

5

6

+ Control

– Control

Do Not Use

Load

Do Not Use

Load

AC/DC Configuration

XCB170 Pinout

1

3

2

4

5

6

+ Control

– Control

Do Not Use

+ Load

– Load

DC Only Configuration

XCB170 Pinout

Switching Characteristics of

Normally Closed (Form B) Devices

CONTROL

10ms

10%

90%

90%

+

+

T

ON

T

OFF

+

Parameter Conditions Symbol Min Typ Max Units

Output Characteristics @ 25°C

Load Voltage (Peak) - V

L

- - 350 V

Load Current (Continuous)

AC/DC Configuration - I

L

- - 100 mA

DC Configuration - I

L

- - 180 mA

Peak Load Current 10ms I

LPK

- - 350 mA

On-Resistance

AC/DC Configuration IL=120mA R

ON

-3150 Ω

DC Configuration IL=200mA R

ON

-1015 Ω

Off-State Leakage Current VL=35OV I

LEAK

-- 1µA

Switching Speeds

Turn-On IF=5mA, VL=10V T

ON

-- 5ms

Turn-Off IF=5mA, VL=10V T

OFF

-- 5ms

Output Capacitance 50V; f=1MHz C

OUT

-25 - pF

Capacitance

Input to Output - - - 3 - pF

Input Characteristics @ 25°C

Input Control Current IL=120mA I

F

5-50mA

Input Dropout Current - I

F

0.4 0.7 - mA

Input Voltage Drop IF=5mA V

F

0.9 1.2 1.4 V

Reverse Input Voltage - V

R

-- 5 V

Reverse Input Current VR=5V I

R

- - 10 µA

Input to Output Capacitance - C

I/O

-3 -pF

Parameter Min Typ Max Units

Input Power Dissipation - - 1501mW
Input Control Current - - 50 mA
Peak (10ms) - - 1 A
Reverse Input Voltage - - 5 V
Total Power Dissipation - - 8002mW
Isolation Voltage

Input to Output 3750 - - V

RMS

Operational Temperature -40 - +85 °C
Storage Temperature -40 - +125 °C
Soldering Temperature

DIP Package - - +260 °C
Surface Mount Package - - +220 °C

(10 Seconds Max.)

1

Derate Linearly 1.33 mw/˚C

2

Derate Linearly 6.67 mw/˚C

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2

XCB170

Rev. 2.0

Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at these or
any other conditions beyond those indicated in the opera­tional sections of this data sheet is not implied. Exposure of
the device to the absolute maximum ratings for an extend­ed period may degrade the device and effect its reliability.

Absolute Maximum Ratings (@ 25˚ C)

Electrical Characteristics

XCB170

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3

Rev. 2.0

PERFORMANCE DATA*

* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.

XCB170

Typical LED Forward Voltage Drop

(N=50 Ambient Temperature = 25°C)

I

F

= 5mADC

35

30

25

20

15

10

5

0

1.17 1.19 1.21 1.23 1.25

LED Forward Voltage Drop (V)

Device Count (N)

XCB170

Typical On-Resistance Distribution

(N=50 Ambient Temperature = 25°C)

(Load Current = 100mADC)

25

20

15

10

5

0

29.09 30.63 32.16 33.7029.86 31.40 32.93

On-Resistance (Ω)

Device Count (N)

XCB170

Typical Blocking Voltage Distribution

(N=50 Ambient Temperature = 25°C)

25

20

15

10

5

0

424.0 434.5 444.9 455.4429.3 439.7 450.1

Blocking Voltage (V)

Device Count (N)

XCB170

Typical IF for Switch Operation

(N=50 Ambient Temperature = 25°C)

(Load Current = 100mADC)

0.50 0.62 0.750.44 0.56 0.69 0.81

LED Current (mA)

Device Count (N)

25

20

15

10

5

0

XCB170

Typical IF for Switch Dropout

(N=50 Ambient Temperature = 25°C)

(Load Current = 100mADC

25

20

15

10

5

0

0.50 0.62 0.750.44 0.56 0.69 0.81

LED Current (mA)

Device Count (N)

)

XCB170

Typical Turn-Off Time

(N=50 Ambient Temperature = 25°C)

(Load Current = 100mADC)

0.67 0.83 0.99 1.140.75 0.91 1.06

Turn-On (ms)

Device Count (N)

25

20

15

10

5

0

XCB170

Typical Blocking Voltage

vs. Temperature

Temperature (°C)

Blocking Voltage (V

RMS

)

-40

455

450

445

440

435

430

425

420

-20 0 20 40 60 80 100

XCB170

Typical Turn-Off vs. Temperature

(Load Current = 100mADC)

Temperature (°C)

5mA

10mA

Turn-On (ms)

-40

1.80

1.60

1.40

1.20

1.00

0.80

0.60

0.40

0.20

0

-20 0 20 40 60 80 100

120

XCB170

Typical Turn-On Time

(N=50 Ambient Temperature = 25°C)

(Load Current = 100mADC)

0.11 0.17 0.22 0.280.250.190.14

Turn-Off (ms)

Device Count (N)

25

20

15

10

5

0

XCB170

Typical Load Current vs. Temperature

Temperature (°C)

Load Current (mA)

160

140

120

100

80

60

40

20

0

-40 -20 0 20 40 60 80 120100

10mA
5mA

XCB170

Typical Leakage vs. Temperature

(Measured across Pins 4 & 6)

Temperature (°C)

Leakage (µA)

-40

0.016

0.014

0.012

0.010

0.008

0.006

0.004

0.002

0

-20 0 20 40 60 80 100

XCB170

Typical Turn-On vs. Temperature

(Load Current = 100mADC)

Temperature (°C)

Turn-Off (ms)

-40

0.50

0.45

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05
0

-20 0 20 40 60 80 100 120

IF= 5mA

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4

XCB170

Rev. 2.0

PERFORMANCE DATA*

* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.

XCB170

Typical LED Forward Voltage Drop

vs. Temperature

Temperature (°C)

LED Forward Voltage Drop (V)

1.8

1.6

1.4

1.2

1.0

0.8

-40 -20 0 20 40 60 80 120100

50mA

10mA
5mA

XCB170

Typical Turn-Off vs. LED Forward Current

(Load Current = 100mADC)

LED Forward Current (mA)

Turn-On (ms)

0

5 1015202530354045

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2
0

50

XCB170

Typical Turn-On vs. LED Forward Current

(Load Current = 100mADC)

LED Forward Current (mA)

Turn-Off (ms)

0

5 1015202530354045

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1
0

50

XCB170

Typical On-Resistance vs. Temperature

(Load Current = 100mADC; IF = 5mA)

Temperature (°C)

On-Resistance (Ω)

-40

70

60

50

40

30

20

10

0

-20 0 20 40 60 80 100 120

XCB170

Typical I

F

for Switch Operation

vs. Temperature

(Load Current = 50mA)

Temperature (°C)

LED Current (mA)

-40

6.0

5.0

4.0

3.0

2.0

1.0

0

-20 0 20 40 60 80 100 120

XCB170

Typical IF for Switch Dropout

vs. Temperature

(Load Current = 50mA)

Temperature (°C)

LED Current (mA)

-40

6.0

5.0

4.0

3.0

2.0

1.0

0

-20 0 20 40 60 80 100 120

XCB170

Typical Load Current vs. Load Voltage

(Ambient Temperature = 25°C)

IF = 5mADC

Load Voltage (V)

Load Current (mA)

120
100

80
60
40
20

0

-20

-40

-60

-80

-100

-120

-3-4 -2 -1 0 1 2 3 4

XCB170

Energy Rating Curve

Time

Load Current (A)

10µs

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1
0

1ms100µs 100ms

1s

10ms 10s 100s

XCB170

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5

Rev. 2.0

Dimensions

mm

(inches)

MECHANICAL DIMENSIONS

6Pin DIP Through Hole (Standard)

6Pin DIP Surface Mount (“S” Suffix)

PC Board Pattern
(Top View)

6-.800 DIA.

(6-.031 DIA.)

6.350 ± .127

(.250 ± .005)

2.540 ± .127

(.100 ± .005)

5.080 ± .127

(.200 ± .005)

PC Board Pattern
(Top View)

1.905 ± .127

(.075 ± .005)

2.540 ± .127

(.100 ± .005)

1.499 ± .127

(.059 ± .005)

7.620 ± .127

(.300 ± .005)

8.305 ± .127

(.327 ± .005)

Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions
at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and
disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to sup­port or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or
make changes to its products at any time without notice.

Specification: DS-XCB170-R2.0
©Copyright 2001, Clare, Inc.
OptoMOS

®

is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
9/26/01

For additional information please visit our website at: www.clare.com