The XC8102 series is a low ON resistance load switch IC with ON/OFF control and output current protection which integrates
a P-channel MOSFET.
By connecting the XC8102 to the output pin of a step-down DC/DC converter, the CE pin controls ON/OFF for each
distribution switch to deliver power per requirements and maximize total power efficiency. As a result, the XC8102 helps to
extend battery life and product operation time.
The series contains a current limit and protection circuit so these are not required externally unlike discrete circuit solutions
where MOSFETs and resistors are used.
When a low signal is input to the CE pin, the series enters stand-by mode. Even where a load capacitor is connected to the
output pin during stand-by, the electric charge stored at the load capacitor is discharged through the internal switch. As a
result, the V
The series contains over current protection with fold-back current circuitry which operates as over current protection and
short circuit protection for the output pin.
Short current= 30mA (TYP.)
ON/OFF Function : High Active Enable
High-Speed Discharge Function
Operating Temperature Range : -40℃~+85℃
Packages
Environmentally Friendly
: USP-4,SSOT-24, SOT-25
USPN-4
: EU RoHS Compliant, Pb Free
■ TYPICAL PERFORMANCE
CHARACTERISTICS
IN
CPU
IN
CPU
IN
CPU
●On Resistance vs. Input Voltage
XC8102AA01M/XC8102AA01G
1.0
0.8
0.6
0.4
0.2
ON Resistance : RON (Ω
0.0
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.55.0 5.5 6.0
Input Voltage : VIN (V)
V IN=CE
IOUT= 50 mA
CIN=Non e, CL=No ne
Ta=8 5
25
-40
℃
℃
℃
1/20
XC8102 Series
■PIN CONFIGURATION
*The heat dissipation pad of the USP-4 package is recommended to solder as shown in the
recommended mount pattern and metal mask pattern for mounting strength. The heat
dissipation pad should be electrically opened or connected to the V
■PIN ASSIGNMENT
■PRODUCT CLASSIFICATION
●Ordering Information
USP-4 SOT-25 SSOT-24 USPN-4
4 1 4 4 VIN Power Input
1 5 3 1 V
2 2 2 2 VSS Ground
3 3 1 3 CE ON/OFF Control
-
XC8102①②③④⑤⑥-⑦
PIN NUMBER
4
(*1)
-
- NC No Connection
(No. 2) pin.
SS
PIN NAME FUNCTIONS
Output
OUT
DESIGNATOR ITEM SYMBOL DESCRIPTION
①
②
③④
⑤⑥-⑦
(*1)
The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
(*1)
CE pin logic
C
Discharge FunctionA
L
Internal Standard Number01 Fixed
Packages
(Order Unit)
A CE High active
Output capacitor (C
GR-G
MR-G
NR-G
7R-G
integrated
USP-4 (3,000/Reel)
SOT-25 (3,000/Reel)
SSOT-24 (3,000/Reel)
USPN-4
(5,000/Reel)
2/20
) auto-discharge function
L
A
■FUNCTION CHART
■BLOCK DIAGRAM
●XC8102AA Series
BSOLUTE MAXIMUM RATINGS
■
* Please make sure that I
SERIES CE
XC8102AA01
VIN
GATE
CONTROL
CE
ON/OFF
Control
* Diodes inside the circuit are an ESD protection diode and a parasitic diode.
High ON
Low OFF
Current
Limit
each
circuit
XC8102AAシリーズ
PAR AMETE R SYMBOLRATINGS UNITS
Input Voltage
Output Current
Output Voltage
CE Input Voltage
USP-4 120
Power Dissipation
SSOT-24 150
SOT-25 250
USPN-4
Operating Temperature Range
Storage Temperature Range
is less than Pd/ (VIN-V
OUT
IC OPERATIONAL STATUS
ON/OFF
Rdischg
CE/
V
IN
I
850* mA
OUT
V
OUT
VCE
Pd
Topr
Ts tg
)
OUT
VOUT
VSS
V
SS
V
SS
V
SS
-40~+85
-55~+125
-0.3~+6.5
-0.3~VIN
-0.3~+6.5
100
V
V
V
mW
o
C
o
C
XC8102
Series
3/20
XC8102 Series
■ELECTRICAL CHARACTERISTICS
●XC8102AA Series
PARAMETER SYMBOLCONDITIONS MIN.TYP.MAX. UNITS CIRCUITS
Input Voltage V
On Resistance
(SSOT-24/USPN-4)
On Resistance
(SOT-25/USP-4)
Supply Current IDD
Stand-by Current I
Switch Leakage Current
Current Limit I
Short Circuit Current I
CE High Level Voltage
CE Low Level Voltage
CE High Level Current
CE Low Level Current
CL Auto-Discharge
Resistance
Turn On Time
Turn Off Time
(*1)
(*2)
NOTE:
*1: Time to reach 90% of V
*2: Time to fall to 10% of V
1.2 - 6.0 V -
IN
V
=6.0V, VCE=VIN - 0.280.425
IN
V
=4.0V, VCE=VIN - 0.310.475
IN
VIN =2.9V, VCE=VIN - 0.350.475
R
ON
VIN =1.8V, VCE=VIN - 0.520.625
VIN =1.5V, VCE=VIN - 0.600.80
=1.2V, VCE=VIN - 0.801.60
V
IN
V
=6.0V, VCE=VIN - 0.350.475
IN
V
=4.0V, VCE=VIN - 0.380.525
IN
VIN =2.9V, VCE=VIN - 0.430.525
R
ON
VIN =1.8V, VCE=VIN - 0.590.675
VIN =1.5V, VCE=VIN - 0.670.85
=1.2V, VCE=VIN - 0.871.65
V
IN
VIN =6.0V, VCE=VIN, V
VIN =4.0V, VCE=VIN, V
VIN =2.9V, VCE=VIN, V
VIN =1.8V, VCE=VIN, V
VIN =1.5V, VCE=VIN, V
=1.2V, VCE=VIN, V
V
IN
VIN =6.0V, VCE=VSS, V
STBY
VIN =6.0V, VCE=VSS, V
I
LEAK
VIN≧2.9V, V
LIM
1.5V≦VIN<1.8V, V
1.8V≦VIN<2.9V, V
1.2V≦V
VCE=VIN, V
SHORT
V
1.1 - 6.0
CEH
V
- - 0.3
CEL
I
VCE=VIN -0.1 - 0.1
CEH
I
VCE=VSS -0.1 - 0.1
CEL
VIN=4.0V, V
R
DCHG
t
DLY(ON)
t
DLY(OFF)
after VCE entering the V
OUT
after VCE entering the V
OUT
VIN =4.0V, VCE=0.3V→1.2V, RL=80Ω, without CIN, CL
VIN =4.0V, VCE=1.2V→0.3V, RL=80Ω, without CIN, CL
Ω ①
Ω ①
=OPEN - 4.0 7.0
OUT
=OPEN - 3.8 6.5
OUT
=OPEN - 3.6 6.3
OUT
=OPEN - 3.4 5.7
OUT
=OPEN - 3.2 5.5
OUT
=OPEN - 3.0 4.9
OUT
=OPEN - 0.010.10 μA ②
OUT
=0V - 0.010.10
OUT
= VIN -0.8V 400 480 -
OUT
= VIN -0.6V 400 480 -
OUT
=1.2V 200 - -
OUT
<1.5V, V
IN
=0V - 30 75 mA ①
OUT
=1.0V 90 - -
OUT
μA ②
μA
mA ①
V
V ③
μA ③
μA ③
=4.0V, VCE=VSS 380 480 570 Ω ④
OUT
8.5
threshold.
CEH
threshold.
CEL
-
3.0
-
18 μs ⑤
7.5 μs ⑤
Ta =2 5 ℃
②
③
4/20
■TEST CIRCUITS
XC8102
Series
Circuit ①
V
VINVOUT
CE
A
IOUT
Ishort
V
VSS
Circuit ②
Circuit ③
5/20
XC8102 Series
■TEST CIRCUITS (Continued)
Circuit ④
The measurement point of wave form
Circuit ⑤
6/20
The measurement point of wave form
RL
XC8102
Series
■OPERATIONAL EXPLANATION
<CE Pin>
The XC8102 enables an output P-channel MOSFET switch and the IC internal circuitry to turn off by the signal to the CE pin. In
the shutdown mode, the V
pin will be pulled down to the VSS by the CL auto-discharge function.
OUT
The output voltage becomes unstable when the CE pin is opened. If the input voltage to the CE pin is within the specified
threshold voltages, the logic is fixed and the XC8102 will operate normally. However, supply current may increase as a result
of the shoot-through current of internal circuitry when the medium level voltage is input to the CE pin.
<Input/Output Capacitor>
The XC8102 works well without an input and output capacitors. Also, an output capacitor of the power source can be used as
an input capacitor of the XC8102 and a bypass capacitor of the driving IC can be used as an output capacitor of the XC8102.
<CL Auto-Discharge Function>
The XC8102AA contains a C
device quickly discharge the electric charge in the output capacitor (C
whole IC circuit. The C
output capacitor (C
) is determined by a CL auto-discharge resistor value (Rdischg) and an output capacitor value. Time
L
auto-discharge resistor and an N-channel transistor between the VOUT pin and the VSS pin. The
L
) when a low signal to the CE pin is input to turn off a
L
auto-discharge resistance is set at 480Ω (V
L
=4.0V TYP. @ VIN=4.0). Discharge time of the
OUT
constant τ is defined as (τ = C x Rdischg). Output voltage after starting discharge can be calculated by the following
formula.
V = V
OUT x e
–t/
τ
, or t=τIn (VOUT / V)
V: Output voltage after starting discharge,
V
OUT: Output voltage,
t : Discharge time,
τ: Output discharge resistor value Rdischg×Output capacitor (C
L) value C
<Current Limiter, Short-Circuit Protection>
The XC8102 series contains a constant current limiter and fold-back current circuitry. The constant current limiter operates to
limit output current and the fold-back current circuitry operates as short circuit protection for the output pin.
When the load current reaches the limit current, the constant current limiter operates and the output voltage drops. The output
voltage further, then the fold-back current circuitry operates to decrease the output current. When the output pin is
short-circuited to the ground, the output current drops and maintains a flow about 30mA.
■NOTES ON USE
1. Please use this IC within the stated absolute maximum ratings. Operation beyond these limits may cause degrading or
permanent damage to the device.
2. The X8102 goes into an undefined operation when the CE pin is left open. The CE pin shall be tied to low or high level.
3. V
4.
pin voltage should not be applied beyond the VIN pin voltage.
OUT
The IC may get damage due to the reverse current toward the VIN pin.
Current limit function is integrated. However, power dissipation may be beyond the limit before starting a fold-back current
protection when used in high temperature. For the power dissipation of each package, please refer to the graphs of Package
Power vs. Operating Temperature in page 15 to 18.
VIN=6.0V
CE=1. 2V→0.3V
tr=tf=5μs , IOUT=50mA
CIN=No ne , CL= Non e
CE Input Voltage
Output Voltage
Time: 5μs/div
XC8102
12.0
10.0
8.0
6.0
4.0
2.0
Output Voltage :VOUT (V)
0.0
-2.0
Series
13/20
XC8102 Series
■PACKAGING INFORMATION
●SOT-25
●USP-4
Unit : mm
Unit : mm
●SSOT-24
Unit : mm
●USPN-4
Unit : mm
14/20
XC8102
Series
■PACKAGING INFORMATION (Continued)
● SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used)
Material:Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2
in one side)
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
Evaluation Board (Unit: mm)
評価基板レイアウト(単位:mm)
Ambient Temperature(℃) Power Dissipation Pd(mW)Thermal Resistance (℃/W)
25 600
166.67
85 240
Pd-Ta特性グラフ
Pd vs. Ta
700
600
500
400
300
200
100
許容損失Pd(mW)
Power Dissipation Pd (mW)
0
25456585105125
Ambient Temperature Ta (℃)
周辺温度Ta(℃)
15/20
mW
XC8102 Series
■PACKAGING INFORMATION (Continued)
● SSOT-24 Power Dissipation
Power dissipation data for the SSOT-24 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
2. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
2
in one side)
28.9
40.0
28.9
1.4
2.54
Evaluation Board (Unit: mm)
40.0
2.5
Ambient Temperature(℃) Power Dissipation Pd(mW)Thermal Resistance (℃/W)
25 500
200.00
85 200
600
500
400
300
200
許容損失Pd(
100
0
Power Dissipation Pd (mW)
25456585105125
Pd-Ta特性グラフ
Pd vs. Ta
Ambient Temperature Ta (℃)
周辺温度Ta(℃)
16/20
■PACKAGING INFORMATION (Continued)
● USP-4 Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
2
in one side)
28.9
Evaluation Board (Unit: mm)
XC8102
Series
40.0
2.5
Ambient Temperature(℃) Power Dissipation Pd(mW)Thermal Resistance (℃/W)
25 1000
100.00
85 400
1200
1000
800
600
400
200
Power Dissipation Pd (mW)
0
25456585105125
Pd vs Ta
Ambient Temperature Ta(℃)
17/20
)
XC8102 Series
■PACKAGING INFORMATION (Continued)
● USPN-4 Power Dissipation
Power dissipation data for the USPN-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
2. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
2
in one side)
40.0
2.5
28.9
Evaluation Board (Unit: mm)
Ambient Temperature(℃) Power Dissipation Pd(mW)Thermal Resistance (℃/W)
25 640
166.67
85 240
700
600
500
400
300
200
許容損失Pd(mW)
100
Power Dissipation Pd (mW)
0
25456585105125
Pd-Ta特性グラフ
Pd vs Ta
周囲温度Ta(℃)
Ambient Temperature Ta(℃
18/20
■MARKING RULE
●SOT-25、USP-4
① represents product series
MARK PRODUCT SERIES
C XC8102******
② represents CE pin logic
MARK PRODUCT SERIES
F XC8102A*****
③ represents CL Discharge Function
MARK PRODUCT SERIES
C XC8102*A****
④⑤ represents production lot number
01, …,09, 0A, …,0Z, 11,…,9Z, A1, …, A9, AA, …, Z9, ZA,…,ZZ repeated.
(G, I, J, O, Q, W excluded)
*No character inversion used.
●SSOT-24、USPN-4
① represents product series
MARK PRODUCT SERIES
C XC8102******
② represents CE pin logic and CL Discharge Function
MARK PRODUCT SERIES
5 XC8102AA****
③④ represents production lot number
01, …,09, 0A, …,0Z, 11,…,9Z, A1, …, A9, AA, …, Z9, ZA,…,ZZ repeated.
(G, I, J, O, Q, W excluded)
*No character inversion used.
SOT-25
(TOP VIEW)
SSOT-24
(TOP VIEW)
XC8102
Series
USP-4
(TOP VIEW)
USPN-4
(TOP VIEW)
19/20
XC8102 Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.