High Speed "Green Operation" LDO Voltage Regulators
☆GreenOperation Compatible
■GENERAL DESCRIPTIO N
The XC6217 series are precise, low noise, high speed, low dropout regulators with green operation (GO) function. They are
fabricated using Torex’s CMOS process. Performance features of the series include high ripple rejection and low dropout
voltage, and the series include a reference voltage source, an error amplifier, a current limiter, and a phase compensation
circuit.
GO provides high speed operation, low power consumption and high efficiencies by automatica lly switching between a high
speed mode (HS) and a power save mode (PS) depending upon the load current level. The s witching point of the GO to the
output current is being fixed inside the IC. When only high-speed operation is required, it can be fixed by inputting a high level
signal to the GO pin, thus providing operating conditions with the most suitable level of supply current for the appl ication.
The CE function enables the output to be turned off resulting in greatly reduced po wer consumption. In this state, with the
XC6217B/D series, the IC turns on the internal switch located between the V
charge at the output capacitor (CL) to be discharged via the internal auto-discharge resistance, and as a result the V
quickly returns to the VSS level. The series' output stabilization capacitor (CL) is also compatible with low ESR ceramic
capacitors.
Output voltage is selectable in 0.05V increments within a range of 0.80V~4.00V, using laser trimming technologies.
The current limiter's foldback circuit also operates as a short circuit protection for the output current limiter and the output pin.
■
PPLICATIONS
●Cellular phones
●Cordless phones
●Wireless communication equipment
●Portable games
●Cameras, VCRs
●Portable A V equipment
●PDAs
■FEATURES
Output Current : 200mA <Limit: 250mA (TYP.)>
Dropout Voltage : 80mV@ I
Operating Voltage Range : 1.6V ~ 6.0V (0.8V≦V
Output Voltage Range : 0.80V~4.00V (0.05V increments)
Accuracy : +2% (HS: V +30mV (HS: V +2.5%, -3.5% (PS: V +3.5%, -4.5% (PS:1.60≦V
Low Power Consumption : 4.5μA (TYP.) w hen PS mode 25μA (TYP.) when HS mode
Standby Current : Less than 0.1μA
High Ripple Rejection : 70dB @ 1kHz (When HS mode)
Operating Temperature : -40℃~85℃
Low ESR Capacitor : 1.0μF Ceramic capacitor
Regulators with Green Operation (GO) Function
CL High-Speed-Discharge (XC6217B/D)
Packages : USP-4D, SOT-25(XC6217A/B Type)
Environmentally Friendly : EU RoHS Compliant, Pb Free
■TYPICAL APPLICATION CIRCUIT
■ TYPICAL PERFORMANCE
CHARACTERISTICS
V
IN
V
OUT
CIN
1.0μF
(ceramic)
CE
V
SS
GO
C
L
1.0μF
(ceramic)
2.9
2.85
2.8
2.75
2.7
2.65
2.6
VOUT_H Smode(V)
2.55
2.5
2.45
2.4
and VSS pins. T his short enables the electric
OUT
=100mA, V
OUT
: 1.8V ~ 6.0V (1.6V≦V
>2.00V) (Standard)
OUT
≦1.95V) (Standard)
OUT
+70mV, -90mV (PS:0.80≦V
1% (HS: V
+
+
20mV (HS: V
>2.00V) (High Accuracy)
OUT
≦1.95V) (High Accuracy)
OUT
+1.5%, -2.5% (PS: V
+2.5%, -3.5% (PS:1.60≦V
+50mV, -70mV (PS:0.80
=3.0V
OUT
≦1.55V
OUT
≦4.0V
OUT
>2.60V) (Standard)
OUT
≦2.55V) (Standard)
OUT
≦1.55V) (Standard)
OUT
>2.60V) (High Accuracy)
OUT
≦
2.55V) (High Accuracy)
OUT
≦
V
≦
1.55V) (High Accuracy)
OUT
SSOT-24,USPN-4(XC6217C/D Type)
XC6217B281MR
V
V
Output Cu rrent
I
=0.1mA
OUT
Time (500usec/div)
VIN=3.8V,Tr=Tf= 5usec, Ta=25℃
C
_HSmode
OUT
_GOmode
OUT
=C
=1.0uF(Ceramic)
=50mA
I
OUT
3
2.95
2.9
2.85
2.8
2.75
2.7
2.65
=0.1mA
2.6
2.55
2.5
I
OUT
VOUT_GOmode(V)
OUT
pin
1/33
XC6217Series
■PIN CONFIGURATION
2
GO
OUT
1
V
V
OUT
The USP-4D heat dissipation pad is
recommended to solder in use of the
reference mount pattern and metal mask
pattern for the mounting strength and
heat dissipation.
* 1: Unless otherwise stated regarding input voltage conditions, V
* 2: V
(I.e. the output voltage when an amply stabilized "V
* 3: V
* 4: Vdif={V
* 5: V
* 6: V
* 7: Time until HS mode is changed to PS mode by I
= Effective output voltage (Refer to the voltage chart E-0 to E-3)
OUT (E)
GOR
OUT (T)
= Nominal output voltage
OUT (T)
(*6)-V
IN1
=A voltage equal to 98% of the output voltage whenever an amply stabilized I
OUT1
=The input voltage when V
IN1
OUT1
(*5)}
appears as input voltage is gradually decreased.
OUT1
IN=VOUT(T)
+1.0V" is provided at the VIN pin while maintaining a certain I
+1.0V.
OUT
{V
+1.0V} is input in the HS mode.
OUT(T)
OUT
* 8: For the XC6217B series only. The XC6217A series discharges by resistors R1 and R2 only as shown in the block diagrams.
6/33
value.)
■ELECTRICAL CHARACTERISTICS (Continued)
●XC6217C/D series
PARAMETER SYMBOL CONDITIONS MIN.TYP. MAX. UNITS CIRCUIT
High Speed Mode (HS)
V
≧2.00V
OUT(T)
= V
V
CE
IN, IOUT
=10mA
High Speed Mode(HS)
≦1.95V
V
OUT(T)
Output Voltage
(Standard)
V
OUT(E)
(* 2)
V
Power Save Mode (PS)
V
V
CE=VIN
OUT(T)
= VIN, I
CE
, I
=10mA
OUT
≧2.60V
OUT
=0.1mA
Power Save Mode (PS)
, I
OUT(T)
OUT
≦2.55V
=0.1mA
1.60V≦V
V
CE=VIN
Power Save Mode(PS)
0.80V≦V
V
CE=VIN
, I
OUT(T)
=0.1mA
OUT
≦1.55V
High Speed Mode (HS)
V
≧2.00V
OUT(T)
= V
V
CE
IN, IOUT
=10mA
High Speed Mode(HS)
≦1.95V
V
OUT(T)
Output Voltage
(High Accuracy)
V
OUT(E)
(* 2)
VCE=VIN, I
Power Save Mode (PS)
V
OUT(T)
VCE= VIN, I
=10mA
OUT
≧2.60V
OUT
=0.1mA
Power Save Mode (PS)
1.60V≦V
VCE=VIN, I
OUT(T)
OUT
≦2.55V
=0.1mA
Power Save Mode(PS)
Output Current I
Load Regulation V
OUTMAX
OUT
Dropout Voltage (*4) Vdif VCE=VIN, I
Supply Current 1 I
Supply Current 2 I
Standby Current I
SS1
SS2
STBY
V
OUT
Line Regulation
V
IN・VOUT
Input Voltage VIN
0.80V≦V
V
CE=VIN
V
CE=VIN
0.80V≦V
VCE=VIN,8mA≦I
VCE=VIN, I
VCE=VIN, I
VIN=6.0V, VCE=VSS - 0.01 0.10 μA2
V
+0.5V≦VIN≦6.0V
OUT(T)
V
≧1.10V
OUT(T)
V
CE=VIN
1.6V≦V
V
≦1.05V
OUT(T)
V
CE=VIN
0.80V≦V
1.60V≦V
≦1.55V
OUT(T)
, I
=0.1mA
OUT
, VIN=V
OUT(T)
OUT
OUT
OUT
, I
OUT
≦6.0V
IN
, I
OUT
OUT(T)
OUT(T)
+1.0V,
OUT(T)
≦4.00V
≦100mA - 10 40 mV 1
OUT
=100mA E-4 mV 1
=8mA - 25 50 μA4
=0mA - 4.5 8.0 μA2
=10mA
=10mA
≦1.55V 1.6 - 6.0
≦4.00V 1.8 - 6.0
XC6217
Series
Ta=25℃
x 0.98
(*3)
-0.03
(*3)
x0.965
(*3)
x 0.955
(*3)
-0.09
(*3)
V
OUT(T)
(*3)
x 1.02
+0.03
x1.025
x 1.035
+0.07
V 1
x 0.99x 1.01
-0.02+0.02
V
x0.975x1.015
OUT(T)
(*3)
V 1
x 0.965x 1.025
-0.07
+0.05
200 250 - mA 1
- 0.01 0.20 %/V1
V 1
7/33
XC6217Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC6217C/D series (Continued)
PARAMETER SYMBOL CONDITIONS MIN.TYP. MAX. UNITS CIRCUIT
V
Output Voltage
Temperature Characteristics
Ripple Rejection Rate PSRR
Limit Current I
Short Current I
PS Switching Current I
HS Switching Current IGO VCE=VIN, I
Switch Current
Hysteresis Range
PS Switching Delay Time (*7) t
CE High Level Voltage V
CE Low Level Voltage V
CE High Level Current I
CE Low Level Current I
CL Auto-Discharge
Resistance (*8)
NOTE:
* 1: Unless otherwise stated regarding input voltage conditions, VIN=V
* 2: V
(I.e. the output voltage when an amply stabilized "V
I
* 3: V
* 4: Vdif={V
* 5: V
* 6: V
* 7: Time until HS mode is changed to PS mode by I
* 8: For the XC6217D series only. The XC6217C series discharges by resistors R1 and R2 only as shown in the
block diagrams.
= Effective output voltage (Refer to the voltage chart E-0 to E-3 chart)
OUT(E)
value.)
OUT
= Nominal output voltage
OUT (T)
(*6)-V
IN1
=A voltage equal to 98% of the output voltage whenever an amply stabilized I
OUT1
OUT1
(*5)}
the HS mode.
=The input voltage when V
IN1
8/33
OUT
Ta・V
OUT
-40℃<Ta<85℃
VIN={V
0.85V≦V
V
CE=VIN
V
=1.85VDC+0.5V
IN
V
OUT(T)
V
CE=VIN
VCE=VIN 200250 - mA 1
LIM
V
CE=VIN
VCE=VIN,I
SHORT
VCE=VIN, I
GOR
I
I
GOhys
VCE=VIN E-5 μs 4
DPS
1.2- 6.0 V 4
CEH
- - 0.3 V 4
CEL
VCE=VIN -0.1- 0.1 μA 4
CEH
VCE=VSS -0.1- 0.1 μA 4
CEL
VIN=6.0V, V
R
DCHG
OUT1
is short-circuited at the VSS level.
V
OUT
GOhys=IGO
appears as input voltage is gradually decreased.
=30mA
OUT
+1.0}VDC+0.5V
OUT(T)
OUT(T)
, I
=30mA, f=1kHz
OUT
≦4.00V
P-PAC
P-PAC
- ±100 - ppm/℃1
- 70 - dB 3
=0.80V
, I
=30mA, f=1kHz
OUT
: heavy to light load 0.5- - mA 4
OUT
: light to heavy load - - 8.0 mA 4
OUT
- I
- 3.5 - mA 4
GOR
=4.00V, VCE=VSS - 780 - Ω 1
OUT
+1.0V.
OUT(T)
+1.0V" is provided at the VIN pin while maintaining a certain
The voltage divided by resistors R1 & R2 is compared with the internal reference voltage by the error amplifier. The
P-channel MOSFET , w hich is connected to the V
at the V
operate in relation to the level of output current. The GO function monitors the output current and switches a supply current
to two values according to the level of output current. Further, the IC's internal circuitry can be shutdown via the CE pin's
signal.
<Green Operation>
XC6217A and B series can be set as a fixed high-speed mode or a green operation (GO) mode via a signal to the green
operation (GO) pin. Under the condition that the GO pin becomes low level, the IC operates in the GO mode and the IC
operates in the fixed high-speed mode when the GO pin is at high level. The GO mode enables the IC to switch
automatically the supply current to the high speed (HS) mode or the power save (PS) mode according to the level of output
current. While having both high-speed operation and low supply current state, the series can acquire hi gh efficiency. At the
HS/PS automatic switching mode (GO mode), the switching point of the HS mode and the PS mode is being fixed inside the
IC. When the output current becomes I
delay time of hundreds μsec(s), and it can reduce supply current in light load. Also when the output current becomes IGO
8mA (MAX.) or more, the mode changes automatically to the HS mode and the IC becomes high speed operation.
When the XC6217 is used in the GO mode, stable operation range is over 8.0mA is HS mode and below 0.5mA in PS mode.
<Low ESR capacitor>
With the XC6217 series, a stable output voltage is achievable even if used with low ESR capacitors, as a phase
compensation circuit is built-in. Values required for the phase compensation are as the chart below. In order to ensure the
stable phase compensation while avoiding run-out of values, pleas e use the capacitor which does not depend on bias or
temperature too much. For a stable power input, please connect an input capacitor (C
the V
・Excluding USPN-4
pin is controlled & stabilized by a system of negative feedback. The current limit circuit and short protect circuit
OUT
0.5mA (MIN.) or below, the mode changes automatically to the PS mode after the
GOR
pin.
SS
OUTPUT VOLTAGE (V) OUTPUT CAPACITOR VALUE
0.8 ~ 1.15
1.2 ~ 1.35
1.4 ~ 4.0
・USPN-4
OUTPUT VOLTAGE (V) OUTPUT CAPACITOR VALUE
1.6 ~ 4.0
12/33
pin, is then driven by the subsequent output signal. The output voltage
OUT
More than C
More than C
More than C
More than C
=4.7μF
L
=2.2μF
L
=1.0μF
L
=2.2μF
L
) of 1.0μF between the VIN pin and
IN
<CL Auto-Discharge Function>
XC6217B/D series can quickly discharge the electric charge at the output capacitor (C
which enables a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the V
and the V
typical). The discharge time of the o utput capacitor (C
capacitor (C
) as τ(τ=C x R
(C
L
formulas.
V = V
( V : Output voltage after discharge, V
τ: C
<Current Limiter, Short-Circuit Protection>
The XC6217 series’ foldback circuit operates as an output current limiter and a short protection of the output pin. When
the load current reaches the current limit level, the fixed current limiter circuit operates a nd output voltage drops. As a
result of this drop in output voltage, the foldback circuit operates, output voltage drops further and output current
decreases. When the output pin is shorted to the V
<CE Pin>
The IC's internal circuitry can be shutdown via the signal from the CE pin with the XC6217 series. In shutdown mode,
output at the V
auto-discharge resistor is connected in parallel to R1 and R2 while the power supply is applied to the VIN pin.
Therefore, time until the V
CE pin is open. If this IC is used with the correct output voltage for the CE pin, the logic is fixed and the IC will operate
normally. However, supply current may increase as a result of through current in the IC's internal circuitry when medium
voltage is input.
■NOTES ON USE
1. Please use this IC within the stated absolute maximum ratings. The IC is li able to malfunction should the ratings be
exceeded.
2.
Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current.
Please strengthen V
3. Please wire the input capacitor (C
pin (cf. BLOCK DIAGRAM). The CL auto-discharge resistance value is fixed to 780Ω(VIN=6.0V, V
SS
) is set by the CL auto-discharge resistance (R) and the output
L
). By setting time constant of a CL auto-discharge resistance value [R
L
), the output voltage after discharge via the N channel transistor is calculated by the following
DCHG
OUT(E)
auto-discharge resistance R
L
–t/
τ
x e
, or t=τIn ( V / V
OUT(E)
×Output capacitor (CL) value C)
DCHG
pin will be pulled down to the VSS level via R1 & R2. However, as for the XC6217B/D series, the C
OUT
pin reaches the V
OUT
and VSS wiring in particular.
IN
) and the output capacitor (CL) as close to the IC as possible.
IN
)
OUT(E)
: Output voltage, t: Discharge time,
level, a current of about 30mA flows.
SS
level becomes short. The output voltage becomes unstable, when the
SS
), when a low signal to the CE pin,
L
OUT
] and an output capacitor value
DCHG
XC6217
Series
pin
OUT
=4.0V at
13/33
L
XC6217Series
■TEST CIRCUITS
Circuit 1: Output Voltage, Output Current, Dropout V olt age, Input/Operating Voltage, Line Regulation, Load Regulation,
Current Limit, Short Current, C
(6) PS Switching Delay Time vs. Ambient Temperature
=2.8V , VGO=V
V
2500
IN=VCE
=10mA→0 .1mA, CIN=CL=1.0μF (ceramic)
I
OUT
XC6217x182
(A/B Type)
SS
2000
1500
1000
500
PS Switching Delay Time TDPS (μs)
0
-50-250255075100
Ambient Temperature: Topr (℃)
18/33
(V)
IN
(V)
IN
PowerSave mode
HighSpeed mode
GO mode
XC6217x302
V
, VGO=V
CE=VIN
20
18
16
14
(uA)
SS
12
10
8
6
Su pply Curren t: I
4
2
0
0123456
V
CE=VIN
70
60
50
(uA)
SS
40
30
Su pply Curr ent: I
20
10
0
0123456
=4.0V , VGO=V
V
IN=VCE
=10mA→0 .1mA , CIN=CL=1.0μF (ceramic)
I
OUT
2500
2000
1500
1000
500
PS Switching Delay TimeTDPS (μs)
0
-50-250255075100
(A/B Type) , CIN=CL=1.0μF (ceramic)
SS
Ta=85℃
Ta=25℃
Ta=-40℃
Input Voltage:V
XC6217x302
, VGO=V
(A/B Type) , CIN=CL=1.0μF (ceramic)
IN
Ta=85℃
Ta=25℃
Ta=-40℃
Input Voltage:V
XC6217x302
(A/B Type)
SS
Ambient Temperature: Topr (℃)
(V)
IN
(V)
IN
PowerSave mode
HighSpeed mode
GO mode
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) CL Auto-Discharge Resistance vs. Ambient Temperature
1200
(Ω)
1000
DCHG
=6.0V , VCE=V
V
IN
CIN=CL=1.0μF (ceramic)
800
XC6217B/D
, VGO=V
SS
(B Type) V
SS
OUT
=4.0V
600
400
200
Auto-Discharge Resistance: R
L
C
0
-50-250255075100
(9) Load Transient Response
1.9
V
Ta=2 5 ℃ , C
1.8
Ambient Temperature: Topr (℃)
XC6217x182
=2.8V , VGO=V
IN=VCE
=1μF (ceramic)
IN=CL
Output Voltage
(A/B Type) , Tr=Tf=5 μs
SS
GO mode
300
250
(V)
1.7
OUT
1.6
200
150
(mA)
OUT
1.5
Output Voltage: V
1.4
1.3
50mA
0.1mA
Output Current
Time (5 0 0μs/ div)
1.9
=2.8V , VGO=V
V
IN=VCE
Ta=25℃ , C
1.8
(V)
1.7
OUT
XC6217x182
=1μF (ceramic)
IN=CL
Output Voltage
(A/B Type) , Tr=Tf=5 μs
IN
1.6
Output Voltage: V
1.5
1.4
1.3
100mA
10mA
Output Current
Time (5 0 0μs/ div)
100
Output Current: I
50
0
High Spee d mode
300
250
200
150
100
50
0
(mA)
OUT
Output Current: I
(8) PS/HS Switching Current vs. Ambient Temperature
=2.8V , VGO=V
V
IN=VCE
=1.0μF (ceramic)
C
IN=CL
10
9
8
7
(mA)
OUT
6
5
4
3
Output Current I
2
1
0
-50-250255075100
V
=2.8V , VGO=V
IN=VCE
Ta=25℃ , C
1.9
1.8
(V)
1.7
OUT
1.6
100mA
1.5
Output Voltage: V
1.4
0.1mA
1.3
V
=4.0V , VGO=V
IN=VCE
Ta=25℃ , C
3.1
3
(V)
2.9
OUT
2.8
2.7
Output Voltage: V
50mA
2.6
0.1mA
2.5
XC6217x181
(A/B Type)
SS
HS Sw itching Current
PS Sw itching Current
Ambie nt Te mper ature : To pr (℃)
XC6217x182
(A/B Type) , Tr=Tf=5 μs
SS
=1μF (ceramic)
IN=CL
Output Voltage
Output Current
Time (5 0 0μs/ div)
XC6217x302
(A/B Type) , Tr=Tf=5 μs
SS
=1μF (ceramic)
IN=CL
Output Voltage
Output Current
Time (5 0 0μs/ div)
XC6217
Series
GO mode
GO mode
300
250
200
(mA)
OUT
150
100
Output Current: I
50
0
GO mode
300
250
200
(mA)
OUT
150
100
Output Current: I
50
0
19/33
XC6217Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(9) Load Transient Response
V
=4.0V , VGO=V
3.1
IN=VCE
Ta=25℃ , C
3
XC6217x302
=1μF (ceramic)
IN=CL
Output Voltage
SS
(V)
2.9
OUT
2.8
100mA
2.7
Output Voltage: V
2.6
2.5
0.1mA
Output Current
Time (500μs/div)
(10) Line Transient Response
VCE=V
, VGO=V
IN
=1mA , Ta=25℃, CL=1μF (ceramic)
I
OUT
5
4
3
(V)
IN
2
1
Input Voltage: V
0
-1
XC6217x182
(A/B Type) , Tr=Tf=5 μs
IN
Input Voltage
Output Voltage
Time (20μs/div)
V
CE=VIN
=100mA , Ta=25℃ , CL=1μF (ceramic)
I
OUT
5
4
XC6217x182
, VGO=V
(A/B Type) , Tr=Tf=5μs
IN
Input Voltage
3
(V)
IN
2
1
Input Voltage: V
0
-1
Output Voltage
Time (20μs/div)
20/33
(A/B Type) , Tr=Tf=5μs
GO mode
300
250
200
150
100
50
0
HighSpeed mode
2
1.95
1.9
1.85
1.8
1.75
1.7
HighSpeed mode
2
1.95
1.9
1.85
1.8
1.75
1.7
=4.0V , VGO=V
V
IN=VCE
Ta=25℃ , C
3.1
3
(mA)
OUT
Output Current: I
(V)
OUT
Output Voltage: V
(V)
OUT
Output Voltage: V
(V)
2.9
OUT
2.8
100mA
2.7
Output Voltage: V
2.6
10mA
2.5
, VGO=V
V
CE=VIN
=30mA , Ta=25℃ , CL=1μF (ceramic)
I
OUT
5
4
3
(V)
IN
2
1
Input Voltage: V
0
-1
XC6217x302
(A/B Type) , Tr=Tf=5 μs
IN
=1μF (ceramic)
IN=CL
Output Voltage
Output Current
Time (5 0 0μs/ div)
XC6217x182
(A/B Type) , Tr=Tf=5 μs
IN
Input Voltage
Output Voltage
Time (20μs/div)
High Spee d mode
300
250
200
150
100
50
0
HighSpeed mode
2
1.95
1.9
1.85
1.8
1.75
1.7
(mA)
OUT
Output Current: I
(V)
OUT
Output Voltage: V
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(10) Line Transient Response
6
, VGO=V
V
CE=VIN
=1 mA , Ta=2 5 ℃ , CL=1μF (ceramic)
I
OUT
5
XC6217x302
(A/B Type) , Tr=Tf=5 μs
IN
Input Voltage
HighSpeed mode
3.2
3.15
XC6217x302
V
, VGO=V
CE=VIN
=30mA , Ta=25℃ , CL=1μF (ceramic)
I
OUT
6
5
(A/B Type) , Tr=Tf=5 μs
IN
Input Voltage
4
(V)
IN
3
2
Input Voltage: V
1
Output Voltage
3.1
3.05
3
2.95
(V)
OUT
Output Voltage: V
4
(V)
IN
3
2
Input Voltage: V
1
Output Voltage
0
V
CE=VIN
=100mA , Ta=25℃ , CL=1μF (ceramic)
I
OUT
6
5
4
(V)
IN
3
2
Input Voltage: V
1
0
Time (20μs/div)
XC6217x302
, VGO=V
(A/B Type) , Tr=Tf=5 μs
IN
Input Voltage
Output Voltage
Time (20μs/div)
2.9
HighSpeed mode
3.2
3.15
3.1
3.05
3
2.95
2.9
(V)
OUT
Output Voltage: V
0
Time (20μs/div)
(1 1) T urn-On Response
V
CE=VIN
=1 mA , Ta=2 5 ℃ , CL=1.0μF (ceramic)
I
OUT
4
3
2
(V)
IN
1
, VGO=V
(A/B Type) , Tr=5μs
IN
XC6217x182xx
Input Voltage
HighSpeed mode
7
6
5
4
, VGO=V
V
CE=VIN
=30mA , Ta=25℃ , CL=1.0μF (ceramic)
I
OUT
4
3
(V)
OUT
2
(V)
IN
1
XC6217x182xx
(A/B Type) , Tr=5μs
IN
Input Voltage
0
Input Voltage: V
-1
-2
-3
Output Voltage
Time (4 0 μs/ div)
3
Output Voltage: V
2
1
0
0
Input Voltage: V
-1
-2
-3
Output Voltage
Time (4 0 μs/ div)
XC6217
Series
HighSpeed mode
3.2
3.15
3.1
3.05
3
2.95
2.9
HighSpeed mode
7
6
5
4
3
2
1
0
21/33
(V)
OUT
Output Voltage: V
(V)
OUT
Output Voltage: V
XC6217Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(11) Turn-On Response (Continued)
4
3
, VGO=V
V
CE=VIN
=100mA , Ta=25℃ , CL=1.0μF (ceramic)
I
OUT
(A/B Type) , Tr=5μs
IN
2
(V)
IN
1
0
Input Voltage: V
-1
-2
-3
V
, VGO=V
CE=VIN
=30mA , Ta=25℃ , CL=1.0μF (ceramic)
I
OUT
5
4
(A/B Type) , Tr=5μs
IN
3
(V)
IN
2
1
0
Input Voltage: V
-1
-2
-3
(12) CE Turn-On Response
=2 .8V , VGO=V
V
IN
=1mA , Ta=25℃ , CIN=CL=1.0μF (ceramic)
I
OUT
5
4
IN
3
(V)
CE
2
1
0
CE In put Vo ltage: V
-1
-2
-3
22/33
XC6217x182xx
Input Voltage
Output Voltage
Time (4 0 μs/ div)
XC6217x302xx
Input Voltage
Output Voltage
Time (4 0 μs/ div)
XC6217x182
(A/B Type) , Tr=5μs
CE Input Voltage
Output Voltage
Time (40μs/div)
HighSpeed mode
7
6
5
4
3
2
1
0
HighSpeed mode
8
7
6
5
4
3
2
1
0
HighSpeed mode
8
7
6
5
4
3
2
1
0
, VGO=V
V
CE=VIN
=1mA , Ta=25℃ , CL=1.0μF (ceramic)
I
OUT
5
4
3
(V)
OUT
Output Voltage: V
(V)
OUT
Output Voltage: V
(V)
OUT
Output Voltage: V
(V)
IN
2
1
0
Input Voltage: V
-1
-2
-3
V
, VGO=V
CE=VIN
=100mA , Ta=25℃ , CL=1.0μF (ceramic)
I
OUT
5
4
3
(V)
IN
2
1
0
Input Voltage: V
-1
-2
-3
=2.8V , VGO=V
V
IN
=30mA , Ta=25℃ , CIN=CL=1.0μF (ceramic)
I
OUT
5
4
3
(V)
CE
2
1
0
CE Input Voltage: V
-1
-2
-3
XC6217x302xx
(A/B Type) , Tr=5μs
IN
Input Voltage
Output Voltage
Time (4 0 μs/ div)
XC6217x302xx
(A/B Type) , Tr=5μs
IN
Input Voltage
Output Voltage
Time (4 0 μs/ div)
XC6217x182
(A/B Type) , Tr=5μs
IN
CE Input Voltage
Output Voltage
Time (40μs/div)
HighSpeed mode
8
7
6
5
4
3
2
1
0
HighSpeed mode
8
7
6
5
4
3
2
1
0
HighSpeed mode
8
7
6
5
4
3
2
1
0
(V)
OUT
Output Voltage: V
(V)
OUT
Output Voltage: V
(V)
OUT
Output Voltage: V
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(12) CE Turn-On Response (Continued)
(V)
CE
=2.8V , VGO=V
V
IN
=100mA , Ta=25℃ , CIN=CL=1.0μF (ceramic)
I
OUT
5
4
3
2
XC6217x182
(A/B Type) , Tr=5μs
IN
CE Input Voltage
1
0
CE Input Voltage: V
-1
-2
Output Voltage
HighSpeed mode
8
7
6
5
4
3
2
1
=4.0V , VGO=V
V
IN
=1mA , Ta=25℃ , CIN=CL=1.0μF (ceramic)
I
OUT
5
4
3
(V)
OUT
Output Voltage: V
(V)
CE
2
1
0
CE Input Voltage: V
-1
-2
XC6217x302
(A/B Type) , Tr=5μs
IN
CE Input Voltage
Output Voltage
-3
(V)
CE
CE In put Vo ltage: V
=4.0V , VGO=V
V
IN
=30mA , Ta=25℃ , CIN=CL=1.0μF (ceramic)
I
OUT
5
4
3
2
1
0
-1
Time (4 0 μs/ div)
XC6217x302
(A/B Type) , Tr=5μs
IN
CE In put Vo ltage
Output Voltage
HighSpeed mode
0
8
7
6
(V)
OUT
5
4
3
Output Voltage: V
2
-3
Time (4 0 μs/ div)
=4.0V, VGO=V
V
IN
=100mA , Ta=25℃ , CIN=CL=1.0μF (ceramic)
I
OUT
5
4
3
(V)
CE
2
1
0
CE Input Voltage: V
-1
XC6217x302
(A/B Type), Tr=5μs
IN
CE In put Vo ltage
Output Voltage
-2
-3
Time (4 0 μs/ div)
1
0
-2
-3
Time (40μs/div)
XC6217
Series
HighSpeed mode
8
7
6
5
4
3
2
1
0
HighSpeed mode
8
7
6
5
4
3
2
1
0
23/33
(V)
OUT
Output Voltage: V
(V)
OUT
Output Voltage: V
XC6217Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(13) Ripple Rejection Rate
(A/B Type)
HighSpeed mode
HighSpeed mode
=2.8VDC+0.5V
V
IN=VCE
I
=0.1mA , Ta=25℃ , CL=1.0μF (ceramic)
OUT
70
60
50
40
30
20
Ripple R eject io n Rate : P SRR (dB)
10
0
0.010.11101001000
V
=4.0VDC+0.5V
IN=VCE
I
=0.1mA , Ta=25℃ , CL=1.0μF (ceramic)
OUT
70
60
50
40
30
20
Ripple Rejection Rate: PSRR (dB)
10
0
0.010.11101001000
XC6217x182
, VGO=V
, VGO=V
(A/B Type)
SS
(A/B Type)
SS
P-PAC
Ripple Frequency: f (kHz)
XC6217x302
P-PAC
Ripple Fre quen c y: f (kHz)
V
=2.8VDC+0.5V
IN=VCE
I
=30mA , Ta=25℃ , CL=1.0μF (ceramic)
OUT
80
70
60
50
40
30
20
Ripple Rejection Rate: PSRR (dB)
10
0
0.010.11101001000
XC6217x182
, VGO=V
P-PAC
Ripple Fre quen c y: f (kHz)
IN
XC6217x302
VIN=VCE=4.0VDC+0.5V
=30mA , Ta=25℃ , CL=1.0μF (ceramic)
I
OUT
80
70
60
P-PAC
, VGO=V
(A/B Type)
IN
50
40
30
20
Ripple Rejection Rate: PSRR (dB)
10
0
0.010.11101001000
Ripple Frequency: f (kHz)
24/33
PowerSave mode
PowerSave mode
(
■PACKAGING INFORMATION
●USP-4D●SOT-25
(unit : mm) (unit : mm)
●SSOT-24
unit : mm)
*Soldering fillet surface is not formed because
the sides of the pins are plated.
+0.1
0.4
-0.05
54
1
●USPN-4
(unit : mm)
(0.95)
2.9±0.2
2
1.9±0.2
XC6217
Series
0~0.1
+0.2
-0.1
1.6
2.8±0.2
3
1.1±0.1
0.15
1.3MAX
+0.1
-0.05
0.2MIN
25/33
XC6217Series
■PACKAGING INFORMATION (Continued)
●USP-4D Reference Pattern Layout Dimension ●USP-4D Reference metal mask design
●USPN-4 Reference Pattern Layout Dimension ●USPN-4 Reference metal mask design
26/33
(Tj
A
(
)
p
(
)
● USP-4D Power Dissipation
Power dissipation data for the USP-4D is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data t aken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
2
in one side)
28.9
2. Power Dissipation vs. Ambient Temperature
Board Mount
Ambient Temperature(℃) Power Dissipation Pd (mW) Thermal Resistance(℃/W)
max = 125℃)
25 650
85 260
評価基板レイアウト(単位:mm)
Pd-Ta特性グラフ
Pd vs Ta
700
600
mW
500
400
ation Pd
300
200
許容損失Pd(mW)
100
0
Power Dissi
25456585105125
周囲温度Ta: (℃)
mbient Temperature Ta
℃
40
28.9
2.54
Evaluation Board (Unit: mm)
153.8
1.4
XC6217
Series
40
2.5
27/33
(Tj
XC6217Series
● USPN-4 Power Dissipation
Power dissipation data for the USPN-4 is shown in this p age.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data t aken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the front and 50%
The copper area is divided into four block, one block is
The USPN-4 package has for terminals.
Each terminal connects one copper block in the front and one
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
of the back.
12.5% of total.
in the back.
2. Power Dissipation vs. Ambient Temperature
Board Mount
Ambient Temperature(℃) Power Dissipation Pd (mW) Thermal Resistance(℃/W)
max = 125℃)
25 600
85 240
2
in one side)
166.67
Evaluation Board (Unit: mm)
Power Dissipation Pd(mW)
28/33
Pd vs Ta
700
600
500
400
300
200
100
0
25456585105125
Ambient Temperature Ta(℃)
■MARKING RULE
●SOT-25
SOT-25
(TOP VIEW)
XC6217
Series
① repres ents product series
MARK PRODUCT SERIES
1 XC6217xxxxxx
② repres ents type of regulato rs
②Represents type of regulators
OUTPUT VOLTAGE
0.1V INCREMENTS
0.80V~3.00V 3.10V~4.00V0.85V~3.05V3.15V~3.95V
V A E L XC6217Axxxxx
X B F M XC6217Bxxxxx
③ repres ents output voltage
MARK OUTPUT VOLTAGE (V) MARKOUTP UT VOLTAGE (V)
0 - 3.10 - 3.15 F 1.60 - 1.65 1 - 3.20 - 3.25 H 1.70 - 1.75 2 - 3.30 - 3.35 K 1.80 - 1.85 3 - 3.40 - 3.45 L 1.90 - 1.95 4 - 3.50 - 3.55 M 2.00 - 2.05 5 - 3.60 - 3.65 N 2.10 - 2.15 6 - 3.70 - 3.75 P 2.20 - 2.25 7 0.80 3.80 0.85 3.85 R 2.30 - 2.35 8 0.90 3.90 0.95 3.95 S 2.40 - 2.45 9 1.00 4.00 1.05 - T 2.50 - 2.55 A 1.10 - 1.15 - U 2.60 - 2.65 B 1.20 - 1.25 - V 2.70 - 2.75 C 1.30 - 1.35 - X 2.80 - 2.85 D 1.40 - 1.45 - Y 2.90 - 2.95 E 1.50 - 1.55 - Z 3.00 - 3.05 -
④⑤ repres ents production lot number
01 to 09, 10 to 99, 0A~ 0Z, 1A in order. (G, I, J, O, Q, W excluded)
Note: No character inversion used.
MARK
OUTPUT VOLTAGE
0.05V INCREMENTS
PRODUCT SERIES
29/33
XC6217Series
■MARKING RULE (Continued)
●SSOT-24
30/33
SSOT-4
(TOP VIEW)
① repres ents type of regulato rs and output voltage range
② repres ents output voltage numbers after the decimal poi nt.
MARKOUTPUT VOLTAGE (V) MARKOUTP UT VOLTAGE (V)
0 - 3.10 - 3.15 F 1.60 - 1.65 1 - 3.20 - 3.25 H 1.70 - 1.75 2 - 3.30 - 3.35 K 1.80 - 1.85 3 - 3.40 - 3.45 L 1.90 - 1.95 4 - 3.50 - 3.55 M 2.00 - 2.05 5 - 3.60 - 3.65 N 2.10 - 2.15 6 - 3.70 - 3.75 P 2.20 - 2.25 7 0.80 3.80 0.85 3.85 R 2.30 - 2.35 8 0.90 3.90 0.95 3.95 S 2.40 - 2.45 -
9 1.00 4.00 1.05 - T 2.50 - 2.55 A 1.10 - 1.15 - U 2.60 - 2.65 B 1.20 - 1.25 - V 2.70 - 2.75 C 1.30 - 1.35 - X 2.80 - 2.85 D 1.40 - 1.45 - Y 2.90 - 2.95 E 1.50 - 1.55 - Z 3.00 - 3.05 -
*USPN-4 0.80V≦V
OUT(T)
③ repres ents production lot number
1 to 9, A to Z, repeated. (G, I, J, O, Q, W excluded)
Note: No character inversion used.
MARK
OUTPUT VOLTAGE
0.05V INCREMENTS
≦1.55V underdevelopment.
PRODUCT SERIES
32/33
XC6217
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
33/33
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