TOREX SOT-25 Technical data
●SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data t aken in the described condition.
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 40×40mm（1600mm
2
in one side）
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used)
Material : Glass Epoxy（FR-4）
Thickness : 1.6mm
Through-hole : 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature（85℃）
Board Mount ( Tjmax=125℃)
Ambient
Temperature
(℃)
Power
Dissipation
Pd (mW)
25 600
85 240
Thermal
Resistance
(℃/W）
166.67
Evaluation Board (Unit: mm)
Pd vs Ta
700
600
500
400
300
200
100
Power Dissipation Pd（mW）
0
25 45 65 85 105 125
Ambient Temperature Ta（℃）
3. Power Dissipation vs. Ambient temperature（105℃）
Board Mount ( Tjmax=125℃)
Ambient
Temperature
(℃)
Power
Dissipation
Pd (mW)
25 600
105 120
Thermal
Resistance
(℃/W）
166.67
Pd vs Ta
700
600
500
400
300
200
100
0
Power Dissipation Pd（ mW）
25 45 65 85 105 125
Ambient Temparature Ta（℃）
1/2
4. Power Dissipation vs. Ambient temperature（Tj=150℃）
Board Mount ( Tjmax=150℃)
Ambient
Temperature
(℃)
Power
Dissipation
Pd (mW)
25 750
105 270
Thermal
Resistance
(℃/W）
166.67
TVS DATA
Pd vs Ta
800
700
600
500
400
300
200
100
0
Power Dssipation Pd（mW）
25 50 75 100 125 150
Ambient TemperatureTa（℃）
2/2
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