Themis 200 Installation Manual

Rugged Enterprise Server 200

Installation Guide

Version 2.1 — September 2001

Themis Computer—Americas and Pacific Rim
3185 Laurelview Court
Fremont, CA 94538
Phone [phone]
Fax [phone]
World Wide Web http://www.themis.com

Themis Computer—Rest of World
1, Rue Des Essarts
Z.A. De Mayencin
38610 Gieres, France
Phone [phone]
Fax [phone]

Copyright © 2001 Themis Computer, Inc.
ALL RIGHTS RESERVED. No part of this publication may be reproduced in any form, by

photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without
the prior written permission of Themis Computer.

The information in this publication has been carefully checked and is believed to be accurate. However,
Themis Computer assumes no responsibility for inaccuracies. Themis Computer retains the right to
make changes to this publication at any time without prior notice. Themis Computer does not assume
any liability arising from the application or use of this publication or the product(s) described herein.

RESTRICTED RIGHTS LEGEND: Use, duplication, or disclosure by the United States Government
is subject to the restrictions set forth in DFARS 252.227-7013 (c)(1)(ii) and FAR 52.227-19.

TRADEMARKS

THEMIS™ is a registered trademark of Themis Computer, Inc.
SOLARIS™ is a registered trademark of Sun Microsystems
SPARC™ is a registered trademark of SPARC International

All other trademarks used in this publication are the property of their respective owners.

Themis Customer Support

North America, South America, and Pacific Rim

Telephone: [phone]

Fax: [phone]

E-mail: [email protected]

Web Site: http://www.themis.com

Rugged Enterprise Server 200 Installation Guide

September 2001
Part Number:110041-021

Version Revision History

Version 2.1 ..................................................................................September 2001

• Added recommended procedure for removing Server Assembly (Chapter 2, p. 2-4).

• Revised procedure for installing CPU Modules (Chapter 2, p. 2-12).

• Assorted minor revisions.

Version 2.0 ............................................................................................. July 2001

• Described new rear I/O panel (Chapter 1).

• Modified text and figures describing new rear AC panel and power supplies (Chapters 2 and 4).

• Added Chapter 5, “Alarm Monitoring”.

• Assorted minor revisions.

Version 1.0 ................................................................................... December 2000

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Table of Contents

Preface .................................................................................................................................. xix

1. Product Overview ......................................................................................................... 1-1

1.1 Basic Design .......................................................................................................... 1-2

1.1.1 System I/O Panel ....................................................................................... 1-4

1.1.1.1 Custom VME P2 I/O Interface Panel ......................................... 1-7

1.1.2 Memory System ......................................................................................... 1-7

1.1.2.1 Memory Interleaving .................................................................. 1-8

1.1.2.2 Memory System Timing ........................................................... 1-11

2. Major Assembly Installation ........................................................................................ 2-1

2.1 Server Subsystem Assembly .................................................................................. 2-1

2.1.1 Powering Off the System ........................................................................... 2-2

2.1.2 Removing the Server Assembly ................................................................ 2-4

2.1.3 Jumper-Pin Configurations ....................................................................... 2-8

2.1.3.1 Serial-Port Configuration ............................................................ 2-8

2.1.3.2 Flash-PROM Configuration ........................................................ 2-9

2.1.4 CPU Module ............................................................................................ 2-10

2.1.4.1 Installing and Removing a CPU Module .................................. 2-10

2.1.5 PCI Card .................................................................................................. 2-14

2.1.5.1 Installing a PCI Card ................................................................. 2-14

2.1.5.2 Removing a PCI Card ............................................................... 2-15

2.1.6 UPA Graphics Card ................................................................................. 2-16

2.1.6.1 Installing a Graphics Card ........................................................ 2-16

2.1.6.2 Removing a Graphics Card ....................................................... 2-17

2.1.6.3 Elite3D UPA Graphics Card .................................................... 2-17

2.1.6.4 Elite3D UPA Graphics Card Patch Information ....................... 2-19

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2.1.7 DIMM ...................................................................................................... 2-20

2.1.7.1 Removing the Memory Riser Assembly ................................... 2-20

2.1.7.2 Removing a DIMM ................................................................... 2-24

2.1.7.3 Replacing a DIMM ................................................................... 2-25

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2.1.7.4 Replacing the Memory Riser Assembly ................................... 2-27

2.1.8 Audio Module Assembly ......................................................................... 2-29

2.1.8.1 Removing the Audio Module Assembly .................................. 2-29

2.1.8.2 Replacing the Audio Module Assembly ................................... 2-30

2.1.9 NVRAM/TOD Assembly ........................................................................ 2-31

2.1.9.1 Removing the NVRAM/TOD Assembly .................................. 2-31

2.1.9.2 Replacing the NVRAM/TOD Assembly .................................. 2-32

2.1.10 DC-to-DC Converter Assembly .............................................................. 2-33

2.1.10.1 Removing the DC-to-DC Converter Assembly ........................ 2-33

2.1.10.2 Replacing the DC-To-DC Converter Assembly ....................... 2-34

2.2 VME I/O Boards .................................................................................................. 2-35

2.2.1 Removing a VME Board ......................................................................... 2-36

2.2.2 Replacing a VME Board .......................................................................... 2-36

2.3 Hard-Disk Drives ................................................................................................. 2-37

2.3.1 Removing a Hard-Disk Drive .................................................................. 2-37

2.3.2 Replacing a Hard-Disk Drive .................................................................. 2-37

2.4 CD-ROM Drive ................................................................................................... 2-39

2.4.1 Removing a CD-ROM Drive ................................................................... 2-39

2.4.2 Replacing a CD-ROM Drive ................................................................... 2-39

2.5 Power Supplies .................................................................................................... 2-41

2.5.1 Removing a Power Supply ...................................................................... 2-41

2.5.2 Replacing a Power Supply ....................................................................... 2-41

2.6 Server Assembly Fans ......................................................................................... 2-43

2.6.1 Removing the Server Fans ....................................................................... 2-44

2.6.2 Replacing the Server Fans ....................................................................... 2-45

2.6.3 Removing and Replacing the Server Fan Filter ....................................... 2-46

2.7 VME I/O Fan Tray ............................................................................................... 2-47

3. Configuring Your System ............................................................................................. 3-1

3.1 Introduction ............................................................................................................ 3-1

3.2 Server Configuration .............................................................................................. 3-2

3.2.1 RES-204 Server Checklist ......................................................................... 3-2

3.3 VME I/O Configuration ......................................................................................... 3-2

3.3.1 RES-204 VME I/O Checklist .................................................................... 3-2

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4. Managing Your System ................................................................................................ 4-1

4.1 Sun Management Software .................................................................................... 4-1

4.2 Themis Management Applications ........................................................................ 4-2

4.2.1 Power Supply Status LEDs ........................................................................ 4-2

4.2.2 VME DC Power Voltage Monitoring ........................................................ 4-4

4.2.3 Cooling System Monitoring and Control ................................................... 4-4

4.2.3.1 Server Subsystem Fans ............................................................... 4-4

4.2.3.2 VME I/O Subsystem Fans .......................................................... 4-5

4.2.3.3 Power Supply Fan ....................................................................... 4-7

4.2.4 System Air Flow Monitoring ..................................................................... 4-7

4.3 Status/Alarm Monitoring and Control ................................................................... 4-8

4.3.1 Front-Panel Status LEDs ........................................................................... 4-9

4.3.2 VME Buffer/Alarm Jumper-Pin Configurations ..................................... 4-10

4.4 VME-Bridge Card Jumper-Pin Configurations ................................................... 4-12

5. Alarm Monitoring ......................................................................................................... 5-1

5.1 Monitoring Power Supplies ................................................................................... 5-2

5.2 Monitoring Cooling Devices ................................................................................. 5-2

5.3 Monitoring the VME IO Subsystem ...................................................................... 5-2

5.3.1 Air Flow ..................................................................................................... 5-2

5.3.2 Temperature Sensors .................................................................................. 5-2

5.3.3 VME Backplane DC Voltage .................................................................... 5-3

5.3.4 User Interface I/O ...................................................................................... 5-3

5.3.4.1 Input Signals ............................................................................... 5-3

5.3.4.2 Output Signals ............................................................................. 5-3

5.3.4.3 Connectors .................................................................................. 5-4

5.4 VME Buffer/Alarm Card Registers ....................................................................... 5-5

5.4.1 LED Control/Status Register: Address Offset 0x00 ................................. 5-6

5.4.2 Air Flow Status Register: Address Offset 0x04 ........................................ 5-6

5.4.3 User Input Status Register: Address Offset 0x08 ..................................... 5-7

5.4.4 Relay Control Register: Address Offset 0x0c ........................................... 5-7

5.4.5 PS1 / PS2 / PS3 Status Register:

Address Offset 0x10 / 0x14 / 0x18 ............................................................ 5-8

5.4.6 DC Control/Status Register: Address Offset 0x1c ................................... 5-8

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5.4.7 Thermal Sensor Control/Status Registers:

Address Offset 0x20, 0x24, 0x28 ............................................................ 5-10

5.4.8 VME Fans Control/Status Register:

Address Offset 0x2c ................................................................................. 5-11

5.4.9 Revision/ID Register: Address Offset 0x30 ........................................... 5-12

5.4.10 Interrupt Enable Register: Address Offset 0x34 ..................................... 5-13

5.4.11 Interrupt Status Register: Address Offset 0x38 ...................................... 5-14

5.5 VME Bridge Card Registers ................................................................................ 5-16

5.5.1 Server Temperature Sensor Auxiliary Register

(Address 1ff.f172.0000) ........................................................................... 5-16

5.5.2 Server Warning Temperature Flag Register

(Address 1ff.f170.0000) ........................................................................... 5-16

5.5.3 VME Buffer/Alarm Card Interrupt Control Register

(Address 1ff.f170.4000) ........................................................................... 5-17

5.5.4 Server Shutdown Temperature Flag Register

(Address 1ff.f170.2000) ........................................................................... 5-17

5.5.5 Server Air Flow Interrupt Register

(Address 1ff.f170.6000) ........................................................................... 5-17

5.5.6 Server Fan Status Register

(Address 1ff.f100.0000) ........................................................................... 5-18

5.6 Address map ........................................................................................................ 5-19

5.6.1 Alarm Monitoring User Interface ............................................................ 5-20

5.7 Specific OBP variables ........................................................................................ 5-23

5.8 Register Address Map Summary ......................................................................... 5-24

Appendix A. Regulatory and Safety Compliance Statements ...................................... A-1

A.1 FCC and DOC Class Notices ................................................................................ A-2

A.1.1 FCC Class A Notice .................................................................................. A-2

A.1.2 DOC Class A Notice - Avis DOC, Classe A ............................................ A-2

A.2 VCCI Statement .................................................................................................... A-3

A.3 Declaration of Conformity .................................................................................... A-4

A.4 Regulatory Compliance Statements ...................................................................... A-5

A.5 Agency Compliance .............................................................................................. A-7

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A.6 German Acoustic Compliance .............................................................................. A-7

A.7 Safety Agency Compliance Statement ................................................................. A-8

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Table of Contents

Appendix B. Rugged Enterprise Server 200Model Specifications ...............................B-1

B.1 Model RES-204 .....................................................................................................B-1

B.1.1 Physical Specifications .............................................................................B-1

B.1.2 Electrical Specifications ............................................................................B-2

B.1.3 Environmental Requirements ....................................................................B-3

Appendix C. Connector Signal and Pinout Assignments ..............................................C-1

C.1 Power Connectors ..................................................................................................C-2

C.2 Serial Ports COM1 and COM2 ............................................................................C-11

C.3 UltraSCSI Connector ...........................................................................................C-12

C.4 Parallel Port Connector ........................................................................................C-16

C.5 Keyboard/Mouse Connector ................................................................................C-17

C.6 Twisted-Pair Ethernet Connector .........................................................................C-18

C.6.1 TPE Cable-Type Connectivity .................................................................C-18

C.6.2 External UTP-5 Cable Lengths ................................................................C-19

C.7 Audio Connectors ................................................................................................C-19

C.8 UPA Graphics Card Connectors ..........................................................................C-20

C.8.1 Expert3D Graphics Card ..........................................................................C-21

C.8.1.1 Video Output Port .....................................................................C-21

C.8.1.2 Stereo Output Port ....................................................................C-22

C.8.1.3 External Video Synchronization Port .......................................C-23

C.8.2 Creator3D Graphics Card ........................................................................C-23

C.8.3 Elite3D Graphics Card .............................................................................C-23

Index ........................................................................................................................I-1

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List of Figures

Figure 1-1 The RES-204 (Front View).............................................................................. 1-1

Figure 1-2 RES-204 Functional Flow Diagram ................................................................ 1-2

Figure 1-3 RES-204 Components (Front View)................................................................ 1-3

Figure 1-4 RES-204 Components (Rear View)................................................................. 1-4

Figure 1-5 Memory System Functional Block Diagram ................................................... 1-8

Figure 1-6 Memory Module Functional Block Diagram................................................... 1-9

Figure 1-7 DIMM Mapping............................................................................................... 1-9

Figure 2-1 The RES-204 Server Subsystem Assembly..................................................... 2-2

Figure 2-2 The Ultra 80 Motherboard ............................................................................... 2-3

Figure 2-3 Turn the RES-204 Key-Switch to the OFF Position........................................ 2-4

Figure 2-4 Remove the Disk-Tray Dust Cover and Loosen Assembly Bolts ................... 2-5

Figure 2-5 Remove the Server Subsystem Assembly ....................................................... 2-6

Figure 2-6 Left- (A) and Right-Hand Views of Removed Server Assembly.................... 2-6

Figure 2-7 Remove the Server Assembly Protective Cover Plate..................................... 2-7

Figure 2-8 Location of the Motherboard Serial-Port Jumpers .......................................... 2-8

Figure 2-9 Location of the Motherboard Flash-PROM Jumpers ...................................... 2-9

Figure 2-10 Remove Screws holding the CPU Module Cover Plate ................................ 2-10

Figure 2-12 Locate the CPU Module Slot ......................................................................... 2-11

Figure 2-11 CPU Module Cover Plate Removed .............................................................. 2-11

Figure 2-13 Locate and Remove the CPU Module ........................................................... 2-12

Figure 2-14 Installing or Removing a CPU Module ......................................................... 2-13

Figure 2-15 Placement of the PCI Card............................................................................. 2-14

Figure 2-16 Placement of the Graphics Card .................................................................... 2-16

Figure 2-17 Placement of the Elite3D Card ...................................................................... 2-19

Figure 2-18 Removing the Memory Riser Assembly........................................................ 2-21

Figure 2-19 Remove the Riser Assembly from the Motherboard ..................................... 2-22

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Figure 2-20 Remove the 8 Screws from the Riser Support Plate (A and B),

then remove DIMM(s) from the Riser Assembly or

Motherboard Surface (C)............................................................................... 2-23

Figure 2-21 Removing and Replacing a DIMM................................................................ 2-24

Figure 2-22 Allocation of DIMMs according to Bank ...................................................... 2-25

Figure 2-23 Setting the Memory Riser Assembly Thumbscrew Torque........................... 2-28

Figure 2-24 Removing and Replacing the Audio Module Assembly ............................... 2-29

Figure 2-25 Locate and Remove the NVRAM/TOD carrier............................................. 2-31

Figure 2-26 Locate and Remove the DC-to-DC Converter............................................... 2-33

Figure 2-27 The VME I/O Subsystem............................................................................... 2-35

Figure 2-28 Replacing the RES-204 Hard-Disk Drives .................................................... 2-38

Figure 2-29 Location of the RES-204 CD-ROM Drive .................................................... 2-40

Figure 2-30 Location of the RES-204 Server Fans ........................................................... 2-43

Figure 2-31 Remove Each Server Fan, Starting with Fan 3.............................................. 2-45

Figure 2-32 Remove the Server Fan Filter by Pulling Evenly at Both Corners................ 2-46

Figure 2-33 Replace the Server Fan Filter by Inserting Evenly into the Slot ................... 2-47

Figure 2-34 The VME I/O Fan Tray ................................................................................. 2-48

Figure 4-1 RES-204 Power Supply Status LEDs .............................................................. 4-2

Figure 4-2 The RES-204 Cooling System......................................................................... 4-5

Figure 4-3 Air is Pulled through Vents at the Front of the Cabinet .................................. 4-6

Figure 4-4 Hot Air is Exhausted from the RES-204 through Rear Vents ......................... 4-6

Figure 4-5 Data Flow through the VME Buffer/Alarm Card within the RES-204 ........... 4-8

Figure 4-6 RES-204 Front-Panel LEDs and VME Reset Switch (SYSR) ...................... 4-10

Figure 4-7 Location of Jumper-Pins on the VME Buffer/Alarm Board.......................... 4-10

Figure 4-8 Location of Jumper Pins on the VME-Bridge PCI Card ............................... 4-12

Figure C-1 Ultra 80 Motherboard Connectors ................................................................... C-3

Figure C-2 DC-to-DC Converter Connector J4105 ........................................................... C-4

Figure C-3 Power Supply Connector J4106....................................................................... C-5

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Figure C-4 Power Supply Connector J4107....................................................................... C-6

Figure C-5 DC-to-DC Converter Connector J4108 ........................................................... C-7

Figure C-6 PCI Fan Connector J4109 ................................................................................ C-8

Figure C-7 CPU Fan Connector J4110 .............................................................................. C-8

Figure C-8 Combined Cable Assembly Connector J4111 ................................................. C-9

Figure C-9 Peripheral Power Cable Assembly Connector J4112 .................................... C-10

Figure C-10 Serial Ports COM 1 and COM2 Connector Pin Configuration ..................... C-11

Figure C-11 UltraSCSI Connector Pin Configuration ....................................................... C-13

Figure C-12 Parallel Port Connector Pin Configuration .................................................... C-16

Figure C-13 Keyboard/Mouse Connector Pin Configuration ............................................ C-17

Figure C-14 TPE Connector Pin Configuration................................................................. C-18

Figure C-15 Audio Connector Configuration (I/O Panel is Opposite Order) ................... C-19

Figure C-16 Parallel Port Connector Pin Configuration .................................................... C-20

Figure C-17 Expert3D Connector Panel ............................................................................ C-21

Figure C-18 Expert3D 7-Pin DIN Female Stereo Connector ............................................ C-22

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List of Tables

Table 1-1 Major Components of the RES-204................................................................. 1-5

Table 1-2 I/O Panel Connection IDs and Definitions ...................................................... 1-6

Table 1-3 1-Gbyte DIMM Configuration Scenario........................................................ 1-10

Table 1-4 Memory Relative Starting Address with No Interleaving ............................. 1-10

Table 1-5 Memory Addressing for 2-Way Interleaving................................................. 1-11

Table 1-6 Memory Addressing for 4-Way Interleaving................................................. 1-11

Table 2-1 Serial-Port Jumper Settings ............................................................................. 2-8

Table 2-2 Flash-PROM Jumper Settings ......................................................................... 2-9

Table 2-3 Order of CPU Module Installation................................................................. 2-12

Table 2-4 DIMM Allocation on the RES-204................................................................ 2-26

Table 3-1 RES-204 Server Configuration........................................................................ 3-3

Table 3-2 RES-204 VME-I/O Configuration—Arbitration/Address Mapping ............... 3-5

Table 3-3 RES-204 VME-I/O Configuration—Master and Slave Access Modes........... 3-7

Table 4-1 Power Key-Switch LED Interpretation............................................................ 4-3

Table 4-2 VME Subsystem Front-Panel LED and Switch Interpretation........................ 4-9

Table 4-3 VME Buffer/Alarm Jumper-Pin Configurations ........................................... 4-11

Table 4-4 VME-Bridge PCI Card Jumper-Pin Configurations...................................... 4-13

Table 5-5 Led control register (read mode) ..................................................................... 5-6

Table 5-6 Air flow sensor register (read mode) ............................................................... 5-6

Table 5-7 User input status register (read mode) ............................................................. 5-7

Table 5-8 User relay control register (read mode) ........................................................... 5-7

Table 5-9 Power Supply status register (read mode) ....................................................... 5-8

Table 5-10 DC voltage source control/status register (read mode).................................... 5-8

Tab le 5- 11 Thermal sensor control/status register (read mode)....................................... 5-10

Table 5-12 VME fan control/status register (read mode) ................................................ 5-11

Table 5-13 DC voltage source status register (read mode) .............................................. 5-12

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Table 5-14 Interrupt Enable Register (Read Mode)......................................................... 5-13

Table 5-15 Interrupt status register (read mode).............................................................. 5-14

Table 5-16 Server temperature auxiliary register (read/write mode)............................... 5-16

Table 5-17 Server temperature warning register (read/write mode) ................................ 5-16

Table 5-18 VME Buffer/Alarm Card interrupt control register (read/write mode) ......... 5-17

Table 5-19 Server temperature shutdown register (read/write mode).............................. 5-17

Table 5-20 Server temperature shutdown register (read/write mode).............................. 5-17

Table 5-21 Server fan status register (read/write mode) .................................................. 5-18

Table 5-22 RES-204 Monitoring Register Address Summary......................................... 5-24

Tab le B-1 RES-204 Physical Specifications..................................................................... B-1

Tab le B-2 RES-204 Clearance and Service Access.......................................................... B-2

Tab le B-3 RES-204 Shipping Specifications.................................................................... B-2

Tab le B-4 RES-204 Electrical Specifications................................................................... B-2

Tab le B-5 RES-204 Temperature, Humidity, and Altitude Limits................................... B-3

Tab le C-1 Power Connectors ............................................................................................ C-2

Tab le C-2 DC-to-DC Converter Connector J4105 Pin Description ................................. C-4

Tab le C-3 Power Supply Connector J4106 Pin Description............................................. C-5

Tab le C-4 Power Supply Connector J4107 Pin Description............................................. C-6

Tab le C-5 DC-to-DC Converter Connector J4108 Pin Description ................................. C-7

Tab le C-6 PCI Fan Connector J4109 Pin Description ...................................................... C-8

Tab le C-7 CPU Fan Connector J4110 Pin Description .................................................... C-8

Tab le C-8 Combined Cable Assembly Connector J4111 Pin Description ....................... C-9

Tab le C-9 Peripheral Power Cable Assembly Connector J4112 Pin Description .......... C-10

Tab le C-1 0 Serial Port A and B Connector Pin Assignments .......................................... C-11

Tab le C-11 UltraSCSI Connector Pin Assignments ......................................................... C-13

Tab le C-1 2 Parallel Port Connector Pin Assignments ...................................................... C-16

Tab le C-1 3 Keyboard/Mouse Connector Pin Assignments .............................................. C-17

Tab le C-1 4 TPE Connector Pin Assignments................................................................... C-18

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Tab le C-1 5 CPU Fan Connector J4110 Pin Description .................................................. C-19

Tab le C-1 6 Audio Connector Line Assignment ............................................................... C-19

Tab le C-1 7 Parallel Port Connector Pin Assignments ...................................................... C-20

Tab le C-1 8 Expert3D Video Output Port ......................................................................... C-21

Tab le C-1 9 Expert3D Stereo Output Port ......................................................................... C-22

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Preface

This document, entitled Rugged Enterprise Server 200 Installation Guide, Version

1.0, provides instructions on how to install, configure, power up, boot, and perform
diagnostics on Model RES-204 of the Rugged Enterprise Server 200 family of Sun
Microsystems UltraSPARC-II-based servers. These instructions are intended for an
experienced system administrator with a knowledge of both networking and high­speed server systems.

Note: Whenever this manual refers to the Rugged Enterprise Server 200, the de-

scription describes properties and configurations common to all models of the

family. In the case of Version 1.0 of this manual, all descriptions apply to only

one model—the RES-204.

General Overview

Themis Computer

Model RES-204 is based on the Sun Microsystems Ultra 80TM workstation Mother­board, combined with a high-speed VME I/O subsystem that communicates with the
PCI bus of the Ultra 80 through a specially designed VME interface. To withstand
the extreme shock (over 15Gs), temperature conditions (over 50°C), and EMI asso­ciated with such demanding markets as military/aerospace and telecommunications,
Themis engineers have added custom hardware (protective plates, high-dissipation
heat sinks, ultra-high-air cooling, and component strengtheners, for example) to all
Sun CPU/Memory boards and PCI/Graphics I/O boards. With its fast computer
power, diverse I/O, and unyielding ruggedness, the RES-204 joins the larger Rugged
Enterprise Server 2000 family as one of the first Sun-based servers designed from
the ground up to withstand military and aerospace environmental requirements.

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V

V

V

V

Major Features

The major features of the RES-204 are incorporated into its ability to perform faster
processing and greater I/O throughput, and withstand harsh environments through
added ruggedness. The RES-204 consists of two major sections: the Server Sub-
system containing the Ultra 80 Motherboard and all of its CPU Modules, DIMMs,
and I/O boards, and the VME I/O Subsystem (see Figure below). There are a total
of 16 I/O slots, divided between six slots in the Server Subsystem and ten slots in the
VME Subsystem.

85 to 265 VAC

47 to 440 Hz

Ultra 80 Motherboard

UltraSPARC-II

CPU Module

450 MHz
4-MB Cache

s

t

o

l

s

4

DIMM
Modules

Memory

s

t

o

l

s

2

x

8

System
Control

Up to 4 GB

112 .5

MHz

UPA

Graphics

UPA-to-PCI

Interface Chip

PCI Bus

s

t

o

l

s

2

(U2P)

ME Bridge Card

PCI I/O
Boards

Ultrawide

SCSI

ME Interface

s

t

o

l

s

4

Power

Supply

Supply

1

ME I/O Subsystem

ME

Buffer/Alarm

Board

1

0

s

l

o

t

s

Power

2

VME64

cPCI

I/O Expansion

Board

Power

Supply

3

or

Dual-Channel

Parallel

Port

Serial

Ports

Ethernet

Port

AudioInAudio

Out

Keyboard

/ Mouse

xx

Ultrawide

SCSI

Port

CD-ROM Hard-Disk Drives (3)

32X

18 GB each

Themis Computer

Preface

General Overview

Server Subsystem

The Server Subsystem consists primarily of the Ultra 80 Motherboard, which sup­ports up to four 450-MHz UltraSPARC-II CPUs, with up to 4 GigaBytes of DIMM
modules, 4 MegaBytes of L2 cache, and 8 MB of Ecache, all contributing to faster
processing speeds. Of the six I/O slots on the Motherboard, two reside on the Ultra
80 UPA bus at 112.5 MHz, and four on the PCI bus at 33 or 66 MHz. A high-speed
interface chip serves to connect the PCI bus with the 3.2 GB/sec UPA bus.

The two UPA-based I/O slots are ideal for high-speed graphics boards such as the
Creator3D or Elite3D. Of the four PCI slots, at least one must contain a PCI I/O
board required to interface with the VME I/O Subsystem.

VME I/O Subsystem

The VME I/O Subsystem can be configured to support either ten single slots or two
separate units of 5 slots each, all slots accommodating either 6U VME boards or,
optionally, 6U cPCI boards. To connect with the PCI bus of the Server Motherboard,
VME slot 1 must be reserved for a customized VME Buffer/Alarm Board that serves
not only as a bridge to the Ultra 80 UPA bus through the PCI bus, but as an alarm
monitoring system to help manage RES-204 operations and functions.(see for more
detail).

Added Ruggedness

Themis redesigned the server system to provide a suitable platform for demanding
federal and aerospace markets—including expanded I/O capability, improved tem­perature handling, and extreme mechanical ruggedness—all contained in an open,
modular system. In addition, the RES-204 contains a high-capacity multiple-fan sys­tem that extends operational temperature range to over 50°C.

The RES-204 chassis can withstand up to 15Gs of shock. All mechanical structures
have natural vibration modes exceeding 28 Hz. Additionally, all critical electronic
components are designed to sustain high shock loads, while heat sinks have been
redesigned to minimize unsupported mass and moment of inertia.

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

UNIX Commands

This document may not contain information on basic UNIX® commands and proce­dures such as shutting down the system, booting the system, and configuring
devices.

See one or more of the following for this information:

• Solaris Handbook for Sun Peripherals, which contains SolarisTM 2.x software
commands

• AnswerBookTM on-line documentation for the Solaris software environment

• Other software documentation that you received with your system

Shell Prompts

Shell Prompt

C shell machine_name%

C shell superuser machine_name#

Bourne shell and Korn shell $

Bourne shell and Korn shell superuser #

Website Information

Themis Computer corporate and product information may be accessed on the World
Wide Web by browsing the website http://www.themis.com.

xxii

Themis Computer

Preface

Notes, Cautions, Warnings, and Sidebars

Notes, Cautions, Warnings, and Sidebars

The following icons and formatted text are included in this document for the reasons
described:

Note: A note provides additional information concerning the procedure or action
being described that may be helpful in carrying out the procedure or action.

Caution: A caution describes a procedure or action that may result in injury to the
operator or equipment damage. This may involve—but is not restricted to—heavy
equipment or sharp objects. To reduce the risk, follow the instructions accompany­ing this symbol.

Warnin g : A warning describes a procedure or action that may cause injury to the
operator or equipment as a result of hazardous voltages. To reduce the risk of elec­trical shock and danger, follow the instructions accompanying this symbol.

Sidebar: A “sidebar” adds detail to the section within which it is placed,
but is not absolutely vital to the description or procedure of the section.

Your Comments are Welcome

We are interested in improving our documentation and welcome your comments and
suggestions. You can email your comments to us at [email protected].
Please include the document part number in the subject line of your email.

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

xxiv

Themis Computer

Overview

1

Section

This document described how to install Model RES-204 (see Figure 1-1) of the
Rugged Enterprise Server 200 family of UltraSPARC-II-based servers. Designed for
high survivability under extreme environmental shock and temperature conditions,
the RES-204 is based on the Sun Microsystems Ultra 80TM workstation Motherboard.
It is ideal for both military/aerospace and telecommunications markets that demand

high computer power with diverse I/O capability.

Chapter

Product Overview

Themis Computer

Figure 1-1. The RES-204 (Front View)

1-1

Rugged Enterprise Server 200 Installation Guide

V

V

V

V

1.1 Basic Design

Designed to fit a 19-inch RETMA rack on fully rotating, retractable slides, RES-204
measures 16.875” wide (excluding rack flange) by 17.5” high (10U) by 18.5” deep.
It consists of the following two main functional components (see Figure 1-2):

• Server Subsystem based on the Ultra 80 quad-processor Motherboard

• VME I/O Subsystem with 10 slots to accommodate 6U-high VME cards

85 to 265 VAC

47 to 440 Hz

Ultra 80 Motherboard

UltraSPARC-II

CPU Module

450 MHz
4-MB Cache

s

t

o

l

s

4

DIMM
Modules

Up to 4 GB

Memory

s

t

o

l

s

2

x

8

System
Control

112 .5

MHz

UPA

Graphics

UPA-to-PCI

Interface Chip

PCI Bus

s

t

o

l

s

2

(U2P)

ME Bridge Card

PCI I/O
Boards

Ultrawide

SCSI

ME Interface

s

t

o

l

s

4

Power

Supply

1

ME I/O Subsystem

ME

Buffer/Alarm

Board

1

0

s

l

o

t

s

Power

Supply

2

VME64

I/O Expansion

Board

Power

Supply

3

or

cPCI

Dual-Channel

Parall el

Port

Serial

Ports

Ethernet

Port

AudioInAudio

Out

Keyboard

/ Mouse

Figure 1-2.

RES-204 Functional Flow Diagram

1-2

Ultrawide

SCSI

Port

CD-ROM Hard-Disk Drives (3)

32X

18 GB each

Themis Computer

1—Product Overview

Basic Design

Major components of the RES-204 are shown in Figure 1-3, Figure 1-4 on page 1-4,
and Table 1-1 on page 1-5.

The RES-204 weighs approximately 135 pounds (61 kilograms) with all components
installed; see Appendix B, “Rugged Enterprise Server 200 Model Specifications” for
complete product specifications.

The VME64 bus of the VME I/O Subsystem connects to the UPA bus of the Ultra
80 Motherboard through a VME interface or bridge comprised of an internal
shielded flat-cable connecting one PCI card on the Ultra 80 Motherboard to a special
VME Buffer/Alarm Board in slot 1 of the VME I/O Subsystem (see Figure 1-2).

Themis Computer

Figure 1-3.

RES-204 Components (Front View)

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Rugged Enterprise Server 200 Installation Guide

1.1.1 System I/O Panel

Primary I/O to and from the RES-204 is carried out from the rear of the system
through connectors attached to the System I/O Panel (see Figure 1-4). A description
of these connections is contained in Table 1-2 on page 1-6.

Note: Of the seven (7) PCI I/O slots accessible from the rear of the RES-204, slot
2 is reserved for the VME-Bridge PCI Card, and slot 5 is unoccupied.

1-4

Figure 1-4.

RES-204 Components (Rear View)

Themis Computer

1—Product Overview

Basic Design

Table 1-1.

Major Components of the RES-204

RES-204 Components Quantity Performance / Characteristics

z 450 MHz

z 4-MB L2 Cache

z 4 GigaBytes

(256-MB DIMMs)

Server
Subsystem

(Ultra 80

Motherboard)

UltraSPARC-II
CPU Module

DIMM
Module

4

16 slots

(8 x 2 banks,
fast-page mode)

PCI
I/O Slots

UPA Graphics I/O
Slots

Ultrawide
SCSI Port
(40 MBytes/sec)

Parallel Port 1

4

z Slots 1, 2, 3 =

full-size

z Slot 4 = short

2*

2

z 1 slot @ 33 or 66 MHz; 32- or 64-bit bus, 3.3VDC

z 2 slots @ 33 MHz; 32- or 64-bit bus, 5VDC

z 1 slot @ 33 MHz; 32-bit bus, 5VDC

z Each slot @112.5 MHz;

64-bit UPA interface

z 1 channel for internal devices (CD-ROM and

disk drives, for example)

z 1 channel for external use

z DB25, female (Centronics-compatible)

z Extended Capability Port (ECP) support

Serial Ports 2

Ethernet Port 1

Keyboard/Mouse 1

Audio interface 4 pair + ground

VME I/O
Subsystem

VME I/O Slots (6U) 10**

System Power Supplies 3 (1 mandatory)

Peripherals CD-ROM Drive 1

Hard-Disk Drives

When UPA slot 2 is populated (with an Expert3D or Creator3D card, for example), PCI slot 1 cannot be used.

*

3 (1 mandatory
boot drive)

z DB25, female (synchronous/asynchronous)

z RJ45, 10/100 Base-T (Mbits/sec)

z Serial DIN

z 8 16-bit stereo channels (2 input, 2 output,

2 microphone, 2 earphone)

z 80 MB/second VME64 bus

z 400 watts each; autoranging; load sharing

z 32X

z 18 GB each drive

** The VME Buffer/Alarm Board must be installed in VME slot 1.

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

Table 1-2. I/O Panel Connection IDs and Definitions

I/O Port ID Definition

Ultrawide SCSI z 40-Mbytes/second

Serial A (COM 1; DB25) A z Synchronous

and asynchronous

Serial B (COM 2; DB25) B

protocols

Parallel
(Centronics-compatible)

z Extended capability

port (ECP) support

z Keyboard and mouse

Keyboard / Mouse

functions are
combined through
one cable

Ethernet (RJ45) z 10/100-Mbits/second

Video 0 (13W3) with

Stereo Goggles
(left channel)

Video 1 (13W3) with

Stereo Goggles
(right channel)

Microphone

(2 channels)

z UPA graphics slot

(optional)

z UPA graphics slot

(optional)

z Stereo microphone

input

Audio In (2 channels) z Stereo audio input

Note:

• Cable clamps have been removed from this view.

• Slot 2 is reserved for the VME Buffer/Alarm Board.

• Slot 4 may be used for either a PCI card or a

graphics card, but not both.

1-6

Audio Out (2 channels) z Stereo audio output

Headphones

(2 channels)

z Stereo speaker

output

Power Supply 1

(not shown)

z Each power supply

Power Supply 2

(not shown)

socket is separately
fused (see Figure
1-4, page 1-4)

Power Supply 3

(not shown)

Themis Computer

1.1.1.1 Custom VME P2 I/O Interface Panel

The RES-204 has room to add a second I/O panel (to the left of the System I/O
Panel; see Figure 1-4) that is custom-defined by the user to access P2 signals on the
backplane. Contact your authorized Themis distributor or the Themis Sales Depart­ment at [phone] (Fax: [phone]; Email: [email protected]).

[Details on System I/O Panel connectors, along with their signals and pin assign­ments, are given in Appendix C, “Connector Signal and Pinout Assignments”.]

Note: Additional I/O is carried out through the ports of each I/O card or board
installed on the Server Motherboard or VME Subsystem.

1.1.2 Memory System

The RES-204 Ultra 80 Motherboard provides sixteen slots for high-capacity dual
inline memory modules (DIMMs). Eight of the sixteen slots are located on the
Motherboard and the other eight memory slots are located on the Memory Riser
Assembly. The system supports Sun standard 168-pin, 5-volt, 60-nanosecond
DIMMs, of which 16-, 32-, 64-, 128-, and 256-Mbyte capacities can be installed. but
only DIMMs of 64- and 256-Mbyte capacities are supported. Total supported system
memory capacity ranges from 256 Mbytes to 4 Gbytes.

1—Product Overview

Basic Design

Themis Computer

Memory slots are organized into four banks (bank 0 through bank 3), with each bank
comprising four slots. Each bank is divided between the Motherboard and the mem­ory riser assembly. Consequently, the DIMMs must be installed in groups of four,
with two DIMMs being installed in a Motherboard bank, and the second set of two
DIMMs being installed in the associated memory riser assembly bank.The system
reads from, or writes to, all four DIMMs in a bank at the same time.

The memory system (see Figure 1-5) consists of four components: the QSC ASIC,
the XB9++ ASIC, the CBT switching network, and the memory module.

The QSC ASIC generates memory addresses and control signals to the memory
module. The QSC ASIC also coordinates the two 288-bit-wide data bus
{MEM_DAT0 and MEM_DAT1) data transfers between the XB9++ ASIC. Coordi­nation is provided by the BANK_SEL control signal to the CBT switching network.

The XB9++ ASIC exchanges 144-bit-wide bus data with the two CPU data buses:
UPA_DATA0 and UPA_DATA1; exchanges 64-bit-wide bus (UPA_E_DAT) data
with the two UPA graphic slots; and exchanges 72-bit-wide bus (UPA_D_DAT)
data with the U2P ASIC. This data is placed on a 576-bit-wide bus and exchanged

1-7

Rugged Enterprise Server 200 Installation Guide

Figure 1-5. Memory System Functional Block Diagram

with the CBT switching network where it is divided on to two 276-bit-wide data
buses and exchanged with the memory module.

Figure 1-6 on page 1-9 illustrates the memory module arranged in four banks; 0, 1,
2, and 3. Figure 1-7, page 1-9, shows the DIMM slot mapping for the Motherboard
and the memory riser assembly.

1.1.2.1 Memory Interleaving

Whenever banks 0 and 1 are populated with identical capacity DIMMs and banks 2
and 3 are empty, memory reads and writes are automatically interleaved between the
two banks. This is called two-way interleaving. Two-way interleaving significantly
reduces the average memory latency, thus improving overall system performance.
When all four banks contain identical capacity DIMMs, the system interleaves
across all four banks (called four-way interleaving), to further reduce average mem­ory latency.

The system can operate with memory DIMMs of different capacities in different
banks (for example four 64-Mbyte DIMMs in bank 0 and four 256-Mbyte DIMMs in
bank 1), but for improved performance, populate all banks with DIMMs of identical
capacity.

1-8

For maximum performance, install identical capacity DIMMs in all four memory

Themis Computer

1—Product Overview

Basic Design

Figure 1-6. Memory Module Functional Block Diagram

Themis Computer

Figure 1-7. DIMM Mapping

1-9

Rugged Enterprise Server 200 Installation Guide

banks. Table 1-3 on page 1-10 lists how to best populate the memory banks when
configuring the system for 1 Gbyte of memory.

Table 1-3.

Memory

Performance

Level

Good Bank 0 has four, 64-Mbyte DIMMs (no interleaving)

Better

Best Banks 0, 1, 2, and 3 all have four 64-Mbyte DIMMs (4-way interleaving)

Banks 0 and 1 each have four 64-Mbyte DIMMs and banks 2 and 3 are empty
(2-way interleaving)

Memory Slot Population

1-Gbyte DIMM Configuration Scenario

Table 1-4 lists the starting relative address of memory with no interleaving with four
DIMMs of a particular size being installed in a particular memory bank. For
instance, if four 64-Mbyte DIMMs are in bank 0, the relative starting addresses are
from 0 x 0000.0000 to 0 x 0fff.ffc0. Likewise, if four 256-Mbyte DIMMs are in bank
2, the relative starting addresses are from 0 x 8000.0000 to 0 x bfff.ffc0.

Table 1-4. Memory Relative Starting Address with No Interleaving

DIMM Size/Quantity

Memory

Bank

Addressing

1-10

64-Mbyte/4 0 0 x 0000.0000 to 0 x 0fff.ffc0

64-Mbyte/4 1 0 x 4000.0000 to 0 x 4fff.ffc0

64-Mbyte/4 2 0 x 8000.0000 to 0 x 8fff.ffc0

64-Mbyte/4 3 0 x c000.0000 to 0 x cfff.ffc0

256-Mbyte/4 0 0 x 0000.0000 to 0 x 3fff.ffc0

256-Mbyte/4 1 0 x 4000.0000 to 0 x 7fff.ffc0

Table 1-5, page 1-11, lists memory addressing with 2-way interleaving with eight
DIMMs of a particular size being installed in banks 0 and 1. Table 1-6, page 1-11,
lists memory addressing with 4-way interleaving with 16 DIMMs of a particular size
being installed in banks 0, 1, 2, and 3.

Themis Computer

1—Product Overview

Basic Design

Table 1-5.

DIMM Size/Quantity

64-Mbyte/4 0 0 x 0000.0000 to 0 x 1fff.ff80

64-Mbyte/4 1 0 x 0000.0040 to 0 x 1fff.ffc0

256-Mbyte/4 0 0 x 0000.0000 to 0 x 3fff.ffff)

256-Mbyte/4 1 0 x 0000.0040 to 0 x 7fff.ffco

Memory Addressing for 2-Way Interleaving

Memory

Bank

Addressing

Table 1-6. Memory Addressing for 4-Way Interleaving

DIMM Size/Quantity

64-Mbyte/4 0 0 x 0000.0000 to 0 x 3fff.ff00

64-Mbyte/4 1 0 x 0000.0040 to 0 x 3fff.ff40

64-Mbyte/4 2 0 x 0000.0080 to 0 x 3fff.ff80

Memory

Bank

Addressing

64-Mbyte/4 3 0 x 0000.00c0 to 0 x 8fff.ffco

256-Mbyte/4 0 0 x 0000.0000 to 0 x ffff.ff00

256-Mbyte/4 1 0 x 0000.0040 to 0 x ffff.ff40

256-Mbyte/4 2 0 x 0000.0080 to 0 x ffff.ff80

256-Mbyte/4 3 0 x 0000.00c0 to 0 x ffff.ffc0

1.1.2.2 Memory System Timing

The QSC ASIC generates the memory addresses and control signals to the memory
system. The UPA clock is the clock source for the QSC ASIC and operates as fast as
120 MHz.

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

1-12

Themis Computer

Installation

2

Section

Major Assembly Installation

This chapter shows how to remove and replace major assemblies of the RES-204.

2.1 Server Subsystem Assembly

The Server Subsystem Assembly (see Figure 2-1, page 2-2) must first be removed
from the RES-204 before installing or removing any of the following Ultra 80 Moth­erboard (see Figure 2-2, page 2-3) components (online readers may click on the
page link to go directly to the appropriate section):

Chapter

Themis Computer

2.1.1 Powering Off the System............................................................................ 2-2

2.1.2 Removing the Server Assembly ................................................................. 2-4

2.1.3 Jumper-Pin Configurations ......................................................................... 2-8

2.1.4 CPU Module ............................................................................................. 2-10

2.1.5 PCI Card ................................................................................................... 2-14

2.1.6 UPA Graphics Card .................................................................................. 2-16

2.1.7 DIMM ....................................................................................................... 2-20

2.1.8 Audio Module Assembly .......................................................................... 2-29

2.1.9 NVRAM/TOD Assembly ......................................................................... 2-31

2.1.10 DC-to-DC Converter Assembly................................................................ 2-33

2-1

Rugged Enterprise Server 200 Installation Guide

Before proceeding with the removal of the Server Subsystem Assembly, the system
must be properly backed up and powered off (see next section). After the system has
been powered off, remove the Server Assembly and go to the section of this chapter
for the component to be installed, replaced, or removed.

Server Subsystem Assembly

Figure 2-1. The RES-204 Server Subsystem Assembly

2.1.1 Powering Off the System

1. Back up all system files and data according to standard operating-system pro­tocols.

2. “Halt” the system from the command line of your terminal to return to the
“OK” prompt.

Caution: Prior to turning off system power, exit from the operating system. Failure
to do so may result in loss of data.

2-2

Themis Computer

Top of Board

2—Major Assembly Installation

Server Subsystem Assembly

Front of Board

Themis Computer

Figure 2-2. The Ultra 80 Motherboard

2-3

Rugged Enterprise Server 200 Installation Guide

3. Power off the system by turning the key-switch to the OFF position (see Figure
2-3 and Chapter 4, "Managing Your System" for details on system LEDs).

Figure 2-3. Turn the RES-204 Key-Switch to the OFF Position

Important: Remember that the power key itself has two positions only—ON

when turned clockwise (vertical), and OFF when turned counterclockwise.

Warning: Turning the system OFF does not remove power from the system. To re­move all power from the system, disconnect all power cords.

2.1.2 Removing the Server Assembly

1. Release the four Phillips-head screws holding the disk-tray dust cover to the
Server Subsystem Assembly and remove the cover (see A, Figure 2-4 on page
2-5).

2. Using a 1/2-inch socket driven by a ratchet wrench, unloosen the two hex­head bolts holding the Assembly to the cabinet (see B, Figure 2-4, page 2-5).

Caution: When removing the two hex-head bolts, alternate from one bolt to the
other after three (3) full turns on each until they are fully loosened. Failure to follow
this procedure may cause the Assembly to bind and/or damage the bolts.
The two hex bolts are captive, hence cannot be removed from the Assembly. If a
bolt has not been fully released, continue to turn it counter-clockwise.

Repeat this procedure (alternate tightening of bolts) when reinstalling the Server
Assembly.

2-4

Themis Computer

Assembly

Handle

2—Major Assembly Installation

Server Subsystem Assembly

Disk-Tray

Dust cover

1/2-inch

Screws (2)

Remove
Cover

Hex Bolt

1/2-inch
Hex Bolt

Hard-Disk
Drive

Screws (2)

Disk Tray

B

Figure 2-4.

A

Remove the Disk-Tray Dust Cover and Loosen Assembly Bolts

3. Firmly grasping the Assembly handle, pull the Server Subsystem until it is al­most out of its enclosure (see Figure 2-5, page 2-6).

Caution: To protect the Server Subsystem from falling, support it from the bottom
as it is pulled from the RES-204 cabinet.

Themis Computer

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

2-5

Rugged Enterprise Server 200 Installation Guide

Pull
Assembly Handle
Forward

(Hold bottom to

prevent Assembly
from falling)

Figure 2-5. Remove the Server Subsystem Assembly

2-6

AB

Figure 2-6. Left- (A) and Right-Hand Views of Removed Server Assembly

Themis Computer

2—Major Assembly Installation

Server Subsystem Assembly

Figure 2-6 shows both sides of the removed Server Subsystem Assembly.

4. Lay the Server Assembly on its right side to access its protective cover plate.

5. Loosen and remove each of the 22 Phillips-head screws securing the Server

Assembly cover plate (see Figure 2-7).

6. Removal of the Server Assembly protective cover plate will expose most of
the Motherboard slots and connectors used for major components.

Go to the following sections to:

• Configure the Motherboard jumper-pins

• Install, remove, or replace a particular component or module

Cover Plate

Server Subsystem Assembly

(open)

Screw Hole

(22 total)

Themis Computer

Figure 2-7. Remove the Server Assembly Protective Cover Plate

2-7

Rugged Enterprise Server 200 Installation Guide

2.1.3 Jumper-Pin Configurations

Caution: Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.
Handle the Motherboard by the back panel or edges only.

2.1.3.1 Serial-Port Configuration

1. Using long-nose pliers, set the Motherboard serial-port jumpers J2804 and
J2805 according to Figure 2-8 and Table 2-1. Jumpers J2804 and J2805 can
be set to either an RS-423 (default) or RS-232 serial interface. The jumpers
are preset for RS-423. RS-232 is required for digital telecommunication with­in the European Community.

Top of Board

Figure 2-8. Location of the Motherboard Serial-Port Jumpers

Table 2-1. Serial-Port Jumper Settings

Jumper Select Pins 1 + 2

J2804 RS232 RS423 [default]

J2805 RS232 RS423 [default]

Select Pins 2 + 3

Note: Jumpers J2804 and J2805 can be set to either RS-423 (default) or RS-232
serial interface. The jumpers are preset for RS-423. RS-232 is required for digital
telecommunication within the European community.

2-8

Themis Computer

Note: Motherboard jumper-pins are identified with a reference designation—an
asterisk—located on the PCB surface immediately adjacent to jumper-pin 1. In
the diagrams of this manual, pin 1 is indicated with a square.

2.1.3.2 Flash-PROM Configuration

Flash PROM jumpers J3001 and J3002 are for reprogramming specific code blocks
and remote programming of the flash PROM. Table 2-2 identifies the flash-PROM
jumper settings. Figure 2-9 shows the location of the jumper-pins.

1. Using long-nose pliers, set the Motherboard flash-PROM jumpers J3001 and
J3002 according to Table 2-2.

2—Major Assembly Installation

Server Subsystem Assembly

Table 2-2. Flash-PROM Jumper Settings

Jumper-

Pins

J3001 Write protect (default) Write Enable

J3002 Select (default) No select XOR LOGIC SET

Jumper on

Pins 1 + 2

Jumper on

Pins 2 + 3

Signal Controlled

FLASH PROM
PROG ENABLE

Top of Board

Themis Computer

Figure 2-9. Location of the Motherboard Flash-PROM Jumpers

2-9

Rugged Enterprise Server 200 Installation Guide

2.1.4 CPU Module

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

2.1.4.1 Installing and Removing a CPU Module

1. Power off the system (see “Powering Off the System”, page 2-2) and remove
the Server Subsystem Assembly (see “Removing the Server Assembly”, page
2-4, including its protective cover plate).

2. Loosen and remove the four Phillips-head screws that secure the CPU Module
Cover Plate, then remove the Cover Plate (see Figure 2-10 and Figure 2-11,
page 2-11).

Screw

Screw

Screw

Screw

CPU Module Air Guide

CPU Module Cover Plate

2-10

Figure 2-10. Remove Screws holding the CPU Module Cover Plate

Themis Computer

Figure 2-11. CPU Module Cover Plate Removed

2—Major Assembly Installation

Server Subsystem Assembly

CPU Module 0

CPU Module 1

CPU Module 2

CPU Module 3

3. Locate the CPU Module slot (0, 1, 2, or 3) on the Motherboard (see Figure
2-11 and Figure 2-12).

Top of Board

Themis Computer

Figure 2-12. Locate the CPU Module Slot

2-11

Rugged Enterprise Server 200 Installation Guide

4. Installation Only. If you are installing a CPU Module, move the extraction

levers to the 135-degree position (see Figure 2-13 and Figure 2-14, page 2-

13), insert it into the appropriate slot (Table2-3), lower the CPU Module
along the vertical plastic guides, and press firmly until seated. Push the two
extraction levers on the CPU module toward the middle until they are locked
in place.
Important: CPU Modules must be installed according to the slot allocations
indicated in Table2-3. Any other CPU allocation will result in faulty opera­tion and damage to the CPU.

Caution: After the CPU Module is seated, press it firmly downward until a “snap”
is heard; this indicates that the Module is properly seated.

2-12

Figure 2-13. Locate and Remove the CPU Module

Table 2-3. Order of CPU Module Installation

CPU Module

Slot

Slot 0 YES
Slot 1 YES YES YES

Slot 2* YES YES YES YES

Slot 3 YES YES

*A CPU Module must be installed in slot 2.

Total Number of CPUs to be Installed

1 2 3 4

Themis Computer

2—Major Assembly Installation

Server Subsystem Assembly

5. Removal Only. Using the thumbs of both hands, simultaneously lift the two
extraction levers on the CPU Module up and away to approximately 135-de­grees (see Figure 2-14) Lifting the extraction levers may require more force
than you think is necessary, but continue to pull until the levers are free.

Extraction

Empty
slot

lever (2)

AB

Figure 2-14. Installing or Removing a CPU Module

Pull the CPU Module out until it clears the chassis and place it on an anti­static mat.

Important: Remember to follow the CPU slot allocation indicated in
Table 2-3. Any other CPU allocation will result in faulty operation and dam­age to the CPU.

Note: All CPU modules in the system must be of the same clock speed. When
installing CPU modules, fill the CPU slots in this order: 2, 1, 3, 0. Slot 0 is closest
to the system bottom when the CPU air guide is oriented on the right side of the
CPU shroud.

Caution: To ensure proper system cooling, any unused CPU slot(s) must contain a
CPU filler panel in place of a CPU Module.
Remember to replace the CPU Module Cover Plate and the four screws that secure
it when installation or removal of a CPU Module has been completed.

Themis Computer

2-13

Rugged Enterprise Server 200 Installation Guide

2.1.5 PCI Card

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

2.1.5.1 Installing a PCI Card

1. Power off the system (see “Powering Off the System”, page 2-2) and remove
the Server Subsystem Assembly (see “Removing the Server Assembly”, page
2-4), including its protective cover plate.

2. Position the PCI card over one of the four slots on the Motherboard.

3. Guide the card bracket tab into the chassis back-panel opening; guide the op-

posite end of the card into the fan bracket card guide so that the card is aligned
evenly with the Motherboard slot (see Figure 2-15).

2-14

Figure 2-15. Placement of the PCI Card

4. At the two upper corners of the PCI card, push the PCI card straight down into
the slot until the PCI card is fully seated.

Themis Computer

5. Using a No. 2 Phillips screwdriver, replace the screw securing the PCI card
bracket tab to the system chassis.

6. Connect cables to all PCI connectors.

Note: Read the PCI card product guide for information about jumper or switch
settings, slot requirements, and required tools.

2.1.5.2 Removing a PCI Card

1. Power off the system (see “Powering Off the System”, page 2-2) and remove
the Server Subsystem Assembly (see “Removing the Server Assembly”, page
2-4), including its protective cover plate.

2. Disconnect all external cables from the PCI card being removed.

3. Using a No. 2 Phillips screwdriver, remove the screw securing the PCI card

bracket tab to the system chassis.

2—Major Assembly Installation

Server Subsystem Assembly

4. Pull the upper two corners of the card straight up from the slot and remove it
from the chassis.

5. Place the PCI card on an antistatic mat.

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

2.1.6 UPA Graphics Card

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

2.1.6.1 Installing a Graphics Card

1. Power off the system (see “Powering Off the System”, page 2-2) and remove
the Server Subsystem Assembly (see “Removing the Server Assembly”, page
2-4), including its protective cover plate.

Note: Some UPA Graphics cards have a double-row connector that requires two
levels of insertion. When installing this graphics card, ensure that each connector
is fully seated into its slot.

2. Position the UPA Graphics card over one of the two slots on the Motherboard.

3. Guide the card bracket tab into the chassis back-panel opening; guide the op-

posite end of the card into the fan bracket card guide so that the card is aligned
evenly with the Motherboard slot (see Figure 2-16).

2-16

Figure 2-16.

Placement of the Graphics Card

Themis Computer

4. At the two upper corners of the PCI card, push the PCI card straight down into
the slot until the PCI card is fully seated.

5. Using a No. 2 Phillips screwdriver, replace the screw securing the PCI card
bracket tab to the system chassis.

6. Connect cables to all PCI connectors.

Note: Read the PCI card product guide for information about jumper or switch
settings, slot requirements, and required tools.

2.1.6.2 Removing a Graphics Card

1. Power off the system (see “Powering Off the System”, page 2-2) and remove
the Server Assembly (see “Removing the Server Assembly”, page 2-4), in­cluding its protective cover plate.

2—Major Assembly Installation

Server Subsystem Assembly

2. Disconnect all video cables from the Graphics card being removed.

3. Using a No. 2 Phillips screwdriver, remove the screw securing the Graphics

card bracket tab to the system chassis.

4. Pull the upper two corners of the card straight up from the slot and remove it
from the chassis.

5. Place the UPA Graphics card on an antistatic mat.

2.1.6.3 Elite3D UPA Graphics Card

Note: If you are installing or using the Solaris 2.6 5/98 operating environment,
and you are installing an Elite3D UPA Graphics card, see “Elite3D UPA Graphics
Card Patch Information”, page 2-19.

Installation

1. Power off the system (see “Powering Off the System”, page 2-2) and remove
the Server Subsystem Assembly (see “Removing the Server Assembly”, page
2-4), including its protective cover plate.

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

Note: The Elite3D Graphics card has a double-row connector that requires two
levels of insertion. When installing this graphics card, ensure that the connector
is fully seated into the slot.

2. Position the Elite3D card over one of the four slots on the Motherboard.

3. Guide the card bracket tab into the chassis back-panel opening; guide the op-

posite end of the card into the fan bracket card guide so that the card is aligned
evenly with the Motherboard slot (see Figure 2-16 on page 2-16).

4. At the two upper corners of the Elite3D card, push the card straight down into
the slot until it is fully seated.

5. Using a No. 2 Phillips screwdriver, replace the screw securing the Elite3D
card bracket tab to the system chassis.

6. Insert the AFB serial port cable assembly bracket tab into an available chassis
PCI slot (see Figure 2-17 on page 2-19).

Note: Read the PCI card product guide for information about jumper or switch
settings, slot requirements, and required tools.

7. Using a No. 2 Phillips screwdriver, replace the screw securing the AFB serial
bracket tab to the system chassis.

8. Connect the two 10-position sockets to the mating connectors on the Elite3D.

9. Move the cables away from the adjacent PCI slot.

Note: One cable is shorter than the other to provide easy insertion. Sockets are
polarized and marked.

10. Connect the external video cable to the Graphics card video connector.

2-18

Themis Computer

2—Major Assembly Installation

Server Subsystem Assembly

2.1.6.4 Elite3D UPA Graphics Card Patch Information

Themis Computer

Figure 2-17.

Placement of the Elite3D Card

If you are installing or using the Solaris 2.6 5/98 operating environment, and you are
also installing an Elite3D UPA graphics card, you must install the respective soft­ware patch:

• Solaris 2.6 5/98—After installing the Elite 3D UPA graphics card, software
patch 105363-06 (or a more current version of the patch, if available) should be
installed.

This patch is available through the upgrade CD included with your system (part 704-

6657), the SunSolve Online website at

index.html, or by contacting your authorized Themis representative.

http://www.sun.com/service/online/

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Rugged Enterprise Server 200 Installation Guide

2.1.7 DIMM

Use the following procedures to remove and replace a DIMM.

Warnin g : DIMMs consist of electronic components that are extremely sensitive to
static electricity. Ordinary amounts of static electricity from clothing or work envi­ronment can destroy the DIMM.

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

Caution: When removing and replacing a single DIMM, an identical replacement
is required. The replacement DIMM must be inserted into the same socket as the
removed DIMM.

Caution: Each DIMM bank must contain at least four DIMMs of equal density (for
example: four 64-Mbyte DIMMs) to function properly. Do not mix DIMM densi­ties in any bank.

2.1.7.1 Removing the Memory Riser Assembly

The Memory Riser Assembly must first be removed before any DIMM can be
removed. Use the following procedures to remove the Memory Riser Assembly.

1. Power off the system (see “Powering Off the System”, page 2-2) and remove
the Server Subsystem Assembly (see “Removing the Server Assembly”, page
2-4), including its protective cover plate.

2-20

Themis Computer

2—Major Assembly Installation

Server Subsystem Assembly

2. Using the short leg of the torque-indicator driver (shipped with the RES-204),
loosen the Riser Assembly thumbscrews by alternately turning each screw
one turn in a counter-clockwise direction (see Figure 2-18 and Figure 2-19 on
page 2-22).

Caution: When removing the Memory Riser Assembly, loosen both of the thumb­screws at the same time to avoid connector damage.

Themis Computer

Figure 2-18. Removing the Memory Riser Assembly

3. Using your hands, loosen the thumbscrews simultaneously until the assembly
is loose.

Caution: The memory riser assembly must come straight out of the Motherboard
connectors to avoid damaging the connectors.

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Rugged Enterprise Server 200 Installation Guide

Short leg

Torque

Indicator

Driver

Detailed View

Thumbscrew Thumbscrew

Riser Support Plate

Figure 2-19. Remove the Riser Assembly from the Motherboard

4. When the thumbscrews have reached their full travel path, lift the Memory
Riser Assembly straight up and out of the system.

Note: To give components on the Memory Riser Assembly additional support,
Themis has added a Riser Support Plate to the Assembly. This must be removed
to access the DIMMs on the Riser Assembly.

2-22

5. Remove the eight (8) screws securing the Riser Support Plate to the Assembly

(see Figure 2-20 on page 2-23).

6. Place the Memory Riser Assembly on an antistatic mat.

You may now remove or insert a DIMM on either the Memory Riser Assembly or
the Motherboard surface as necessary (see following sections).

Themis Computer

Riser Support Plate

Motherboard connector

AB

2—Major Assembly Installation

Server Subsystem Assembly

Plate screws

(8 total; 2 at each end

4 on one side)

Memory Riser Assembly

Thumbscrew

DIMM (1 of 8)

in Riser Assembly

Figure 2-20. Remove the 8 Screws from the Riser Support Plate (A and B),

then remove DIMM(s) from the Riser Assembly or Motherboard Surface (C)

Motherboard

C

DIMM (1 of 8)

on Motherboard

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

2.1.7.2 Removing a DIMM

1. If you have not already done so, power off the system (see “Powering Off the
System”, page 2-2) and remove the Server Subsystem Assembly (see “Re­moving the Server Assembly”, page 2-4), including its protective cover plate.

Warnin g : Do not remove any DIMM from its antistatic package until ready to in­stall it in the RES-204. Handle DIMMs only by their edges. Do not touch DIMM
components or metal parts. Always wear a grounding strap when handling DIMMs.

2. Remove the memory riser assembly (see “Removing the Memory Riser As­sembly”, page 2-20).

3. Locate the DIMM(s) to be removed on either the Memory Riser Assembly
(see A in Figure 2-21) or the Motherboard (see B in Figure 2-21).

DIMM

B

A

Figure 2-21. Removing and Replacing a DIMM

4. Press down the ejection lever at the end of the DIMM connector.

DIMM

2-24

5. Lift the DIMM straight out of the connector and place it on an antistatic mat.

Themis Computer

2.1.7.3 Replacing a DIMM

1. If you have not already done so, power off the system (see “Powering Off the
System”, page 2-2) and remove the Server Subsystem Assembly (see “Re­moving the Server Assembly”, page 2-4), including its protective cover plate.

Warnin g : Do not remove any DIMM from its antistatic package until ready to in­stall it in the RES-204. Handle DIMMs only by their edges. Do not touch DIMM
components or metal parts. Always wear a grounding strap when handling DIMMs.

2. Remove the memory riser assembly (see “Removing the Memory Riser As­sembly”, page 2-20).

3. Using Figure 2-22, locate the DIMM(s) to be replaced on either the Memory
Riser Assembly (see A in Figure 2-21, page 2-24) or the Motherboard (see B
in Figure 2-21, page 2-24).

2—Major Assembly Installation

Server Subsystem Assembly

Note: For optimum memory performance, consider interleaving issues when in­stalling DIMMs. See section on “Memory Interleaving”, page 1-8, in Chapter 2.

Figure 2-22. Allocation of DIMMs according to Bank

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

Important: Review the important memory installation information below
before you begin replacing or installing the memory.

DIMMs are arranged in four banks, each bank consisting of four slots. The
four slots in each bank are separated, with two slots on the Motherboard, and
two slots on the memory riser assembly.

Figure 2-22 on page 2-25 shows the placement of the DIMM banks on the
Memory Riser Assembly and the Motherboard. On the Motherboard, bank 3
is closest to the system top, bank 0 is closest to the CPU shroud.

It is important that DIMMs be added to the memory banks according to the
scheme outlined in Table 2-4, page 2-26. Options are a single bank (bank 0;
the default), two-way interleaving (banks 0 and 1, and 4-way interleaving
(banks 0, 1, 2, and 3).

4. Remove the DIMM from the antistatic container.

5. Install the DIMM in a slot connector according to the diagram of Figure 2-22

and the rules of Table 2-4.

Caution: Failure to populate a memory bank with DIMMs of equal capacity will
result in inefficient use of memory resource or system failure.

Table 2-4. DIMM Allocation on the RES-204

For Default: For 2-Way Interleaving: For 4-Way Interleaving:

DIMM**

Bank 0

(default)

Bank 2 None None None None

Bank 1 None None

Bank 3 None None None None

** All 4 slots in a Bank must be filled with DIMMs. Only same-capacity DIMMs may be installed in a Bank (all 128

MB, for example).

Mother-

board Slot

U1301,

U1302

Riser Card

Slot

U0301,

U0302

Mother-

board Slot

U1301,

U1302

U1401,

U1402

Riser Card

Slot

U0301,

U0302

U0401,

U0402

Mother-

board Slot

U1301,

U1302

U1303,

U1304

U1401,

U1402

U1403,

U1404

Riser Card

Slot

U0301,

U0302

U0303,

U0304

U0401,

U0402

U0403,

U0404

2-26

Themis Computer

2—Major Assembly Installation

Server Subsystem Assembly

Note: Bank 0 is the default DIMM position for DIMMs installed at the factory.
If DIMMs are being installed rather than being replaced, fill additional DIMM
banks with identical capacity DIMMs in this order: bank 0 and bank 1 (for 2-way
interleaving); or bank 0, bank 1, bank 2, and bank 3 (for 4-way interleaving).

Note: Fill additional DIMM banks in this order: bank 2, bank 1, bank 3. Bank 0
is the default DIMM position for DIMMs installed at the factory.

6. Align the DIMM in the memory slot so that the DIMM's double notch is near­est the memory connector ejection lever.

7. Using your thumbs, press the DIMM straight down into the connector until
the ejection lever clicks, locking the DIMM in the connector.

8. Replace the Memory Riser Assembly after all DIMMs have been installed
(see next section).

2.1.7.4 Replacing the Memory Riser Assembly

Caution: Memory Riser Assembly connectors must be seated straight into the
Motherboard connectors to avoid damaging the Motherboard connector pins.

Replace the memory riser assembly as follows:

1. Replace the eight screws (previously removed) securing the Riser Support
Plate to the Assembly.

2. Position the Memory Riser Assembly on the Motherboard connectors (see
Figure 2-18 on page 2-21).

Caution: Be careful to stay within the internal board guides when inserting the
Memory Riser Assembly. The Assembly will not seat if it is not between the guides.

3. Using your hands, tighten the thumbscrews simultaneously until they are both
finger-tight.

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

Torque-Indicator
Driver

Thumbscrew

Stop turning thumbscrew
when torque-indicator
driver touches

Figure 2-23. Setting the Memory Riser Assembly Thumbscrew Torque

4. Using the short leg of the torque-indicator driver, alternately turn each thumb­screw clockwise one turn at a time. Stop turning each thumbscrew as soon as
the torque indicator driver gap closes (Figure 2-23)

Caution: Do not apply more torque than needed to close the
torque-indicator drivers's gap. If you apply more torque than
needed to close the gap, you might damage the connectors.

5. Press straight down on the middle of the top of the memory riser assembly to
ensure that it is firmly seated in the Motherboard connector.

2-28

6. Using the torque-indicator driver, alternately turn each thumbscrew clockwise

to ensure that the thumbscrews remained properly torqued after you pressed
downward on the assembly in the previous step.

Themis Computer

2.1.8 Audio Module Assembly

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

Use the following procedures to remove and replace the audio module assembly.

2.1.8.1 Removing the Audio Module Assembly

1. Power off the system (see “Powering Off the System”, page 2-2) and remove
the Server Subsystem Assembly (see “Removing the Server Assembly”, page
2-4), including its protective cover plate.

2. Disconnect any external audio cables from the Audio Module Assembly.

2—Major Assembly Installation

Server Subsystem Assembly

3. Using a No. 2 Phillips screwdriver, remove the screw securing the Audio
Module Assembly bracket tab to the system chassis (see Figure 2-24).

Warnin g : Avoid damaging the connector by not applying force to one end or one
side of the module.

Themis Computer

Figure 2-24. Removing and Replacing the Audio Module Assembly

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Rugged Enterprise Server 200 Installation Guide

4. At the two upper corners of the audio module assembly, pull the module
straight up from the slot.

5. Remove the audio module assembly.

6. Place the audio module assembly on an antistatic mat.

2.1.8.2 Replacing the Audio Module Assembly

1. If you have not already done so, power off the system (see “Powering Off the
System”, page 2-2) and remove the Server Subsystem Assembly (see “Re­moving the Server Assembly”, page 2-4), including its protective cover plate.

2. Position the Audio Module Assembly into the chassis.

3. Lower the audio module assembly connector so that it touches its associated
card slot J3701 on the Motherboard (see Figure 2-2 on page 2-3).

4. Align the Audio Module Assembly bracket tab with the chassis back panel

cutout.

5. At the two upper corners of the module, push the module straight down into
slot J3701 until the module is fully seated.

6. Using a No. 2 Phillips screwdriver, replace the screw previously removed and
secure the Audio Module Assembly to the system chassis.

7. Connect any external audio cables to the Audio Module.

2-30

Themis Computer

2.1.9 NVRAM/TOD Assembly

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

The NVRAM/TOD Assembly consists of the 28-pin NVRAM/TOD chip and its car­rier. Use the following procedure to remove and replace the NVRAM/TOD chip.

Note: The NVRAM/TOD contains the system host identification (ID) and Ether­net address. If the same ID and Ethernet address are to be used, consult your au­thorized Themis sales representative to confirm a NVRAM/TOD part number
prior to replacement.

2—Major Assembly Installation

Server Subsystem Assembly

2.1.9.1 Removing the NVRAM/TOD Assembly

1. Power off the system (see “Powering Off the System”, page 2-2) and remove
the Server Subsystem Assembly (see “Removing the Server Assembly”, page
2-4), including its protective cover plate.

2. Locate the NVRAM/TOD and its carrier on the Motherboard (see Figure 2-2,
page 2-3, and Figure 2-25).

Themis Computer

Figure 2-25. Locate and Remove the NVRAM/TOD carrier

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Rugged Enterprise Server 200 Installation Guide

3. Grasp the NVRAM/TOD carrier at each end and pull straight up. It is OK to
gently wiggle the carrier as necessary.

4. Place the removed NVRAM/TOD and carrier on an antistatic mat.

2.1.9.2 Replacing the NVRAM/TOD Assembly

1. Power off the system (see “Powering Off the System”, page 2-2) and remove
the Server Subsystem Assembly (see “Removing the Server Assembly”, page
2-4), including its protective cover plate.

2. Position the NVRAM/TOD and carrier on the Motherboard after aligning the
carrier key.

Caution: The NVRAM/TOD chip is marked with a half-circle at one end and a
small circle to indicate pin 1. When re-inserting the chip into its carrier, make sure
the half-circle end is inserted into the end of the carrier with a matching half-circle.
The carrier itself is keyed at the bottom, hence can only be inserted one way into its
socket on the Motherboard.

3. Carefully insert the NVRAM/TOD/carrier into the socket.

4. Firmly push the NVRAM/TOD Assembly until properly seated.

2-32

Themis Computer

2.1.10 DC-to-DC Converter Assembly

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

Use the following procedure to remove and replace the DC-to-DC Converter Assem­bly.

2.1.10.1 Removing the DC-to-DC Converter Assembly

1. Power off the system (see “Powering Off the System”, page 2-2) and remove
the Server Subsystem Assembly (see “Removing the Server Assembly”, page
2-4), including its protective cover plate.

2—Major Assembly Installation

Server Subsystem Assembly

2. Locate the DC-to-DC Converter Assembly on the Motherboard (see Figure
2-2, page 2-3, and Figure 2-26).

Figure 2-26. Locate and Remove the DC-to-DC Converter

3. Remove the DC-to-DC Converter Assembly as follows:

a. Using a long-shaft No. 2 Phillips screwdriver, loosen the captive screw se-

curing the DC-to-DC Converter Assembly to the Motherboard.

b. Using the two holes in the metal shroud as a grip, lift the Converter

straight up. This will automatically disconnect the Converter from con­nectors J4105 and J4108 on the Motherboard.

Themis Computer

c. Remove the Converter from the chassis.

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Rugged Enterprise Server 200 Installation Guide

2.1.10.2 Replacing the DC-To-DC Converter Assembly

Replace the DC-to-DC Converter Assembly as follows:

1. Position the DC-to-DC Converter Assembly connectors over the Mother­board connectors J4105 and J4108.

2. Using a No. 2 Phillips screwdriver, tighten the captive screw securing the DC­to-DC converter assembly to the Motherboard.

2-34

Themis Computer

2.2 VME I/O Boards

The RES-204 VME I/O Subsystem can support up to 10 VME I/O boards (see Fig­ure 2-27. The only requirement is that the VME Buffer/Alarm Board be installed in

slot 1 to communicate with the Server Subsystem Ultra 80 Motherboard, and to

VME
act as the system controller for any other VME boards that may be installed.

2—Major Assembly Installation

System I/O Panel

SLOT:

1

234 5678910

Figure 2-27.

VME I/O Board (10 total)

VME I/O Fan Tray

The VME I/O Subsystem

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

Use the following procedure to remove or replace a VME board.

2.2.1 Removing a VME Board

1. Disconnect any external cables connected to the VME board.

2. Unscrew the top and bottom screws holding the VME board to the RES-204.

3. Carefully pull the VME board from its RES-204 cabinet slot.

4. Place the VME board on an antistatic mat.

2.2.2 Replacing a VME Board

1. Carefully place the VME board into its RES-204 chassis slot.

2. Push the VME board until it rear connector seats with the VME backplane.

When properly seated, the VME board’s front panel will be flush with the
RES-204 cabinet.

3. Secure the top and bottom screws of the VME board to the cabinet.

4. Reconnect external cables with the VME board.

2-36

Themis Computer

2.3 Hard-Disk Drives

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

The RES-204 can support up to three hard-disk drives, all contained in a disk-drive
tray; one drive is mandatory for booting the Solaris operating system. The disk-drive
tray is located within the right side of the Server Subsystem Assembly (see section
“Server Subsystem Assembly”, page 2-1). To remove a disk drive, however, the
Server Subsystem Assembly does not have to be removed from the RES-204 chas­sis. Use the following procedure to remove and replace a disk drive.

2—Major Assembly Installation

2.3.1 Removing a Hard-Disk Drive

1. Power off the system (see “Powering Off the System”, page 2-2).

2. Release the four Phillips-head screws that hold the disk-tray dust cover to the

Server Subsystem Assembly; remove the cover (see Figure 2-4 on page 2-5).

3. Reach into the small U-shaped depression in the disk-drive Latch Lock and
push down (see Figure 2-28). This will cause the Drive Latch to release and
swing away from the disk drive.

4. Pull the Drive Latch forward until the disk drive has cleared the chassis.

Caution: When pulling the disk drive from the RES-204 chassis, hold it at the bot­tom to prevent it from falling and damaging the drive.

2.3.2 Replacing a Hard-Disk Drive

1. If you have not already so, power off the system (see “Powering Off the Sys­tem”, page 2-2).

Themis Computer

2. Carefully insert the disk drive into one of the empty drive slots and push its
Drive Latch until the drive has mated with its connector at the back of the slot.

Before the drive has fully mated with its connector, the Drive Latch will

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Rugged Enterprise Server 200 Installation Guide

Hard-Disk
Drive slot

A

Hard-Disk
Drive slot

Drive Latch

Latch Lock

Locate the drive, ...

Hard-Disk
Drive

[1 boot drive

is mandatory]

B

push down the Latch Lock, ...

C

Disk Tray

Figure 2-28.

Replacing the RES-204 Hard-Disk Drives

and pull drive out

swing forward as a result of coming into contact with the RES-204 chassis.
Further pushing will engage the Latch Lock, which will lock the drive into
place.

2-38

3. After all disk drives have been installed, fasten the four Phillips-head screws

to secure the disk-tray dust cover to the Server Subsystem Assembly (see Fig­ure 2-4 on page 2-5).

Themis Computer

2.4 CD-ROM Drive

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

The RES-204 contains one CD-ROM drive that is shock-mounted to prevent signal
interruption in case the cabinet is suddenly jarred. Use the following procedure to
remove and replace a disk drive.

2.4.1 Removing a CD-ROM Drive

1. If you have not already done so, power off the system (see “Powering Off the
System”, page 2-2) and remove the Server Subsystem Assembly (see “Re­moving the Server Assembly”, page 2-4), including its protective cover plate.

2—Major Assembly Installation

2. Release the Phillips-head mounting screws that hold the CD-ROM to the
Server Subsystem Assembly (see Figure 2-29 on page 2-40).

3. Disconnect the single cable (combined power and data) to the CD-ROM.

4. Remove the CD-ROM.

2.4.2 Replacing a CD-ROM Drive

5. Reconnect the single cable (combined power and data) to the CD-ROM.

6. Position the CD-ROM drive within the Server Subsystem Assembly so that

the mounting screw holes are aligned (see Figure 2-29 on page 2-40).

7. Insert and tighten all Phillips-head mounting screws previously removed.

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

CD-ROM Drive

A

Detailed Top View

Figure 2-29. Location of the RES-204 CD-ROM Drive

B

2-40

Themis Computer

2.5 Power Supplies

The RES-204 can support up to three power supplies, which are at the rear of the
cabinet (see Figure 1-4, page 1-4). One power supply is sufficient to power a basic
system with one CPU Module installed. As a rule,
power a system with two CPU Modules, and
three or more CPU Modules.

Each power supply has an LED associated with it that describes its operational status
(details are described in Chapter 4, "Managing Your System", in the section “Power
Supply Status LEDs”, page 4-2). The power-supply status LEDs are on the front of
the RES-204 above the power key-switch.

Use the following procedure to remove and replace a power supply.

2—Major Assembly Installation

two power supplies are required to

three power supplies for a system with

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

2.5.1 Removing a Power Supply

1. If you have not already so, power off the system (see “Powering Off the Sys­tem”, page 2-2)

2. Unlatch the at the top of the power supply (see Figure 1-4, page 1-4).

3. Using the latch, pull the power supply away from the cabinet.

Caution: When pulling the power supply from the RES-204 chassis, hold it at the
bottom to prevent it from falling and damaging the unit.

2.5.2 Replacing a Power Supply

Themis Computer

1. If you have not already so, power off the system (see “Powering Off the Sys­tem”, page 2-2).

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Rugged Enterprise Server 200 Installation Guide

2. Carefully insert the power supply into an empty slot and push it until it has
mated with its connector at the backplane.

3. Refasten the latch at the top of the power supply.

Note: When the system is turned on, a green Status LED on the front of the RES-
204 above the key-switch will indicate that the corresponding power supply is ful­ly operational.

2-42

Themis Computer

2.6 Server Assembly Fans

There are three 120-mm Server Assembly fans in the RES-204, each of which has a
separate 3-wire harness cable for power and control (see Figure 2-30). All of the
fans must be removed from the system in order to replace any one of them. Use the
following procedure to remove and replace a Server fan.

[A more detailed description of the Server fans is provided in the section “Cooling
System Monitoring and Control”, page 4-4, in Chapter 4, "Managing Your Sys­tem".]

Fan Slots

Server Fan Filter

2—Major Assembly Installation

Server Assembly Fans

Themis Computer

Fan 3

Fan 2

Fan 1

Detailed Top View

Figure 2-30. Location of the RES-204 Server Fans

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Rugged Enterprise Server 200 Installation Guide

Warni ng : Use proper ESD grounding techniques when handling components.
Wear an antistatic wrist strap and use an ESD-protected mat. Store ESD-sensitive
components in antistatic bags before placing them on any surface.

2.6.1 Removing the Server Fans

1. If you have not already so, power off the system (see “Powering Off the Sys­tem”, page 2-2) and remove the Server Subsystem Assembly (see “Removing
the Server Assembly”, page 2-4), including its protective cover plate.

2. Start by pulling Fan 3 from its fan slot. Prying up the outside corner makes it
easier. [Each fan is held in place by friction fit.]

3. Lay Fan 3 on its side and begin pulling Fan 2 from its fan slot.

4. Lay Fan 2 on its side and pull Fan 1 from its slot.

5. Cut the tie-wraps used to bundle all three sets of fan leads together.

6. Disconnect the 3-wire lead connector from the faulty fan. If more than one fan

is being removed, carefully note which fan is connected to each connector.

2-44

Themis Computer

Fan 3

Pull Fan 3 from its slot, . . .

2—Major Assembly Installation

Server Assembly Fans

Fan 2

lay it on its side, . . .

Fan 1

followed by Fan 1, . . .

until all fans are removed.

Figure 2-31.

Remove Each Server Fan, Starting with Fan 3

2.6.2 Replacing the Server Fans

1. Reconnect the removed fan-lead connector to its counterpart on the RES-204
chassis.

then pull Fan 2 from its slot, . . .

Disconnect all fan leads.

Themis Computer

2. After all fan leads are connected, reinstall each fan starting with Fan 1, then
Fan 2, and finally Fan 3 (reverse the procedure of Figure 2-31). Make sure
each fan is seated in its slot by pushing firmly on the top of the fan.

Caution: Improper seating of any of the three Server fans will cause reduced air
flow to the Server Assembly and its CPU Modules, resulting in excessive heat and
a resulting shutdown.

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Rugged Enterprise Server 200 Installation Guide

2.6.3 Removing and Replacing the Server Fan Filter

Improper cooling of the Server Assembly when all three fans are working optimally
may be the result of a dirty Server Fan Filter. Use the following procedure to remove
and replace this Filter.

1. If you have not already so, power off the system (see “Powering Off the Sys­tem”, page 2-2) and remove the Server Subsystem Assembly (see “Removing
the Server Assembly”, page 2-4), including its protective cover plate.

2. Begin carefully prying out the corners at each end of the Server Fan Filter. The
Filter is held in place by friction fit (see Figure 2-32 on page 2-46).

Important: Within the first inch of travel upwards, the Filter may have to be
pushed slightly toward the rear to allow its bottom edge to clear a retaining
flange at the bottom of the Filter slot.

3. When the Fan Filter is removed, wash it gently in mild soapy water and let it
dry in open air.

2-46

Figure 2-32. Remove the Server Fan Filter by Pulling Evenly at Both Corners

Themis Computer

2—Major Assembly Installation

VME I/O Fan Tray

Figure 2-33.

Replace the Server Fan Filter by Inserting Evenly into the Slot

4. After the Fan Filter is completely dry, return it to its slot and push down equal­ly at both corners (see Figure 2-33 on page 2-47) until firmly seated.

2.7 VME I/O Fan Tray

Fail of one or more of the four fans in the VME I/O Fan Tray requires replacement of
the complete Fan Tray.

[A more detailed description of the VME I/O Fan Tray is provided in the section
“Cooling System Monitoring and Control”, page 4-4, in Chapter 4, "Managing Your
System".]

Use the following procedure to remove and replace the VME Fan Tray.

1. Before starting, a spare VME Fan Tray must be available for installation.
[Call your authorized Themis representative to place an order.]

2. Unfasten the two captive thumbscrews at the front of the VME Fan Tray (see
Figure 2-34).

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Rugged Enterprise Server 200 Installation Guide

Caution: The VME I/O Subsystem does not have to be shut down during replace­ment of the VME I/O Fan Tray if the procedure is performed quickly (in minutes).
During Fan Tray removal, however, the VTAC status LED on the Front Panel display
of the RES-204 will turn red.
If longer time is required, however, system alarms will detect the loss of cooling and
begin to shut the RES-204 down.

Thumbscrew

Handle

Thumbscrew

Figure 2-34. The VME I/O Fan Tray

3. Pull the Fan Tray from the RES-204 chassis by pulling on its handle. The Fan
Tray will automatically disconnect from its backplane connector, removing
both power and control capability.

4. Immediately insert the spare Fan Tray into the chassis, push until the rear con­nector engages its backplane counterpart, and tighten the two thumbscrews.

The VTAC status LED on the RES-204 Front Panel should turn green. If the
LED remains red, the Fan Tray may not be seated properly, may be defec­tive, or there may be a problem with the alarm circuitry.

Caution: If the VTAC status LED stays red after you have determined that the Fan
Tray has been correctly installed, the system will have to be shut down until the
problem has been corrected. Call your authorized Themis representative or Themis
Customer Service for assistance.

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Themis Computer

Operation
Section

This chapter describes details of your system configuration that can be used to opti­mize and balance CPU processing speed with I/O throughput across all components
of the RES-204.

3.1 Introduction

Because of the great diversity in CPU processing and I/O data-handling capacity of
the RES-204, different components of the system may contribute to an overall sys­tem slowdown—and even actual stoppage—because of the conflicting way in which
they are configured. The extent of these conflicting configurations can be devastat­ing to system performance, and cause CPU processing time to be unknowingly
wasted on unnecessary overhead rather than data-handling and signal-routing expe­diency.

Chapter

3

Configuring Your System

Themis Computer

This chapter is designed to capture the details of your system by listing the initializa­tion and operational parameters of each major component (Server CPU & I/O, and
VME I/O boards). By carefully filling out the tables that follow, a more complete
picture of your system operation can be presented. This, in turn, can be extremely
helpful in quickly analyzing any problems in performance that you may be experi­encing.

Note: Themis Computer strongly recommends that the information requested in
the tables of this chapter be completed so that, when you call to report a particular
problem, experienced technicians and engineers can arrive at a quick diagnosis
and successful solution.

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Rugged Enterprise Server 200 Installation Guide

3.2 Server Configuration

3.2.1 RES-204 Server Checklist

To record the configuration of the Server subsystem of your Rugged Enterprise
Server 200, please fill out Table 3-1, "RES-204 Server Configuration" on the follow-
ing fold-out page as accurately as you can.

If you require help entering particular details, call your Themis Computer distributor
directly or Themis Customer Service at [phone].

3.3 VME I/O Configuration

3.3.1 RES-204 VME I/O Checklist

To record the configuration of the VME I/O subsystem of your RES-204, please fill
out Table 3-2, "RES-204 VME-I/O Configuration—Arbitration/Address Mapping",
and Table 3-3, "RES-204 VME-I/O Configuration—Master and Slave Access
Modes", on the following fold-out pages as accurately as you can.

If you require help entering particular details, call your Themis Computer distributor
directly or Themis Customer Service at [phone].

3-2

Themis Computer

3

3–Configuring Your System

Table information is for a RES-204

Ultra 80 Motherboard

.

Ultra 80

Motherboard

CPU

Slot 2* Yes Yes Yes Yes

Bank 0

(default)

DIMM**

Bank 2 None None None None U1303, U1304 U0303, U0304
Bank 1 None None U1401, U1402 U0401, U0402 U1401, U1402 U0401, U0402
Bank 3 None None None None U1403, U1404 U0403, U0404

How Many CPU Modules

are Installed?

1 2 3 4 Motherboard Slot Riser Card Slot Motherboard Slot Riser Card Slot Motherboard Slot Riser Card Slot

Slot 0
Slot 1

Slot 3

Table 3-1. RES-204 Server Configuration

How Much Memory is Installed?

For Default: For 2-Way Interleaving: For 4-Way Interleaving:

U1301, U1302 U0301, U0302 U1301, U1302 U0301, U0302 U1301, U1302 U0301, U0302

DIMM Memory

Performance Parameters Description of Boards Installed on Ultra 80 Motherboard

Slot 1 33 MHz, 32- or 64-bit bus width, 5-volt interface

PCI

Card

Slot 2 33 MHz, 32- or 64-bit bus width, 5-volt interface
Slot 3 33 or 66 MHz, 32- or 64-bit bus width, 3.3-volt interface l PCI I/O Card (with Themis VME-Bridge circuitry) - Required
Slot 4 33 MHz, 32-bit bus width, 5-volt interface

UPA

Card

*A CPU Module must be installed in slot 2.

**All 4 slots in a Bank must be filled with DIMMs. Only same-capacity DIMMs may be installed in a Bank (all 128 MB, for example).

PCI I/O Card

Slot 1 120 MHz, 64-bit UPA bus width
Slot 2 120 MHz, 64-bit UPA bus width

Graphics I/O (UPA) Card

Themis Computer

Creator3DQuad FastEthernet NIC Elite3D m3/m6

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Rugged Enterprise Server 200 Installation Guide

3-4

Themis Computer

3–Configuring Your System

Table 3-2. RES-204 VME-I/O Configuration—Arbitration/Address Mapping

VME

Slot

1

Type and/or Description

of VME Board Installed

VME Buffer/Alarm Board

- Required

2 No

3 No

4 No

5 No

6 No

VME Master

(see Table3-3)

4

Level

System Controller

Bus Request

5

Mode

Bus Request

6

Bus Release

Yes * 3 Fair ROR

A16 Space

Base Address

Mode

Window Size

h 1000
h 1000

h__ __ __ __
h__ __ __ __

h__ __ __ __
h__ __ __ __

h__ __ __ __
h__ __ __ __

h__ __ __ __
h__ __ __ __

h__ __ __ __
h__ __ __ __

(Bytes)

VME Slave 1 (see Table3-3)

A24 Space (Bytes) A32 Space (Bytes)

Base Address

Window Size

h 40.0000
h 10.0000

h__ __ . __ __ __ __
h__ __ . __ __ __ __

h__ __ . __ __ __ __
h__ __ . __ __ __ __

h__ __ . __ __ __ __
h__ __ . __ __ __ __

h__ __ . __ __ __ __
h__ __ . __ __ __ __

h__ __ . __ __ __ __
h__ __ . __ __ __ __

Base Address

Window Size

h 0050.0000
h 0010.0000

h__ __ __ __ .__ __ __ __
h__ __ __ __ .__ __ __ __

h__ __ __ __ .__ __ __ __
h__ __ __ __ .__ __ __ __

h__ __ __ __ .__ __ __ __
h__ __ __ __ .__ __ __ __

h__ __ __ __ .__ __ __ __
h__ __ __ __ .__ __ __ __

h__ __ __ __ .__ __ __ __
h__ __ __ __ .__ __ __ __

3

Interrupt Requester

2

Interrupt Handler

(check all that apply)

1 2 3 4 5 6 7 1 2 3 4 5 6 7

h_ _ h_ _ h_ _ h_ _ h_ _ h_ _ h_ _

h_ _ h_ _ h_ _ h_ _ h_ _ h_ _ h_ _

h_ _ h_ _ h_ _ h_ _ h_ _ h_ _ h_ _

h_ _ h_ _ h_ _ h_ _ h_ _ h_ _ h_ _

h_ _ h_ _ h_ _ h_ _ h_ _ h_ _ h_ _

h_ _ h_ _ h_ _ h_ _ h_ _ h_ _ h_ _

7 No

8 No

9 No

10 No

* System Controller Settings

Parameter Comments

Arbitration

VME
Buffer/Alarm Board
in Slot 1

Mode
(select one
only)

Timeout

h__ __ __ __
h__ __ __ __

h__ __ __ __
h__ __ __ __

h__ __ __ __
h__ __ __ __

h__ __ __ __
h__ __ __ __

For example:Round-Robin, or Fixed Priority
(for example, 3 > 2 > 1 > 0)
Other variations: For example, 3 > (2, 1, 0 Round-Robin)

Can be any value:
For example, 64 microseconds, 16 microseconds, or None

h__ __ . __ __ __ __
h__ __ . __ __ __ __

h__ __ . __ __ __ __
h__ __ . __ __ __ __

h__ __ . __ __ __ __
h__ __ . __ __ __ __

h__ __ . __ __ __ __
h__ __ . __ __ __ __

h__ __ __ __ .__ __ __ __
h__ __ __ __ .__ __ __ __

h__ __ __ __ .__ __ __ __
h__ __ __ __ .__ __ __ __

h__ __ __ __ .__ __ __ __
h__ __ __ __ .__ __ __ __

h__ __ __ __ .__ __ __ __
h__ __ __ __ .__ __ __ __

Round-Robin

Timeout=64 us

h_ _ h_ _ h_ _ h_ _ h_ _ h_ _ h_ _

h_ _ h_ _ h_ _ h_ _ h_ _ h_ _ h_ _

h_ _ h_ _ h_ _ h_ _ h_ _ h_ _ h_ _

h_ _ h_ _ h_ _ h_ _ h_ _ h_ _ h_ _

1

Specify the base address and window size of the VME board.

2

Enter the interrupt vector provided by the interrupter (from h00 to hFF).

3

Only one interrupt handler is allowed for each interrupt level.

4

Enter 0, 1, 2, or 3 (3 = highest priority).

5

Enter Fair mode (F) or Demand (non-Fair) mode (D). See http://www.vita.com, Section 3.3.2.

6

ROR (Release On Request) or RWD (Release When Done). See http://www.vita.com for details.

Themis Computer

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3-6

Themis Computer

Table 3-3. RES-204 VME-I/O Configuration—Master and Slave Access Modes

VME Master Access Mode VME Slave Access Mode

3–Configuring Your System

VME Slot

Slot 1

Type and/or Description

of Board Installed

VME Buffer/Alarm Board

- Required

Slot 2 (See Table3-2 for description)

Slot 3 (See Table3-2 for description)

Slot 4 (See Table3-2 for description)

System Controller

Yes *

No

No

No

Enter SGL or BLT**;

(A)ddress and (D)ata are in bits

AD16 32 64

16

24
32

SGL SGL
BLT BLT BLT BLT BLT BLT
BLT BLT BLT BLT BLT BLT

Can the

Installed

Board

Handle an

Address

Pipeline

(Y/N)?

Y Y

Is

Early Bus Ar-

bitration

Allowed

(Y/N)?

SGL SGL

Enter SGL or BLT**;

(A)ddress and (D)ata are in bits

AD16 32 64

16

24
32

Themis Computer

No

Slot 5 (See Table3-2 for description)

No

Slot 6 (See Table3-2 for description)

No

Slot 7 (See Table3-2 for description)

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Rugged Enterprise Server 200 Installation Guide

Table 3-3. RES-204 VME-I/O Configuration—Master and Slave Access Modes

VME Master Access Mode VME Slave Access Mode

VME Slot

Type and/or Description

of Board Installed

Slot 8 (See Table3-2 for description)

Slot 9 (See Table3-2 for description)

Slot 10 (See Table3-2 for description)

* Only one System Controller is allowed; see Table3-2. ** SGL = Single Transfer; BLT = Block Transfer.

No

No

No

Enter SGL or BLT**;

(A)ddress and (D)ata are in bits

AD16 32 64

16

24

System Controller

32

Can the

Installed

Board

Handle an

Address

Pipeline

(Y/N)?

Is

Early Bus Ar-

bitration

Allowed

(Y/N)?

Enter SGL or BLT**;

(A)ddress and (D)ata are in bits

AD16 32 64

16

24
32

3-8

Themis Computer

Operation
Section

This chapter contains information about managing your system after it has become
operational. A Rugged Enterprise Server 200 system requires two general types of
management applications: software to manage the Sun Solaris operating system that
runs the Server portion of the system, and both hardware and software to monitor
and control critical aspects of RES-204 performance.

Chapter

4

Managing Your System

4.1 Sun Management Software

The latest management software from SunTM Microsystems® Computer Company
consists of Sun Management Center 2.1. Available documentation is available from
the following Sun website:

http://www.sun.com/software/sunmanagementcenter/docs/

This website contains—among other useful documents—a User’s Guide, Release
Notes, and a Supplement for Workstations, all of which may be downloaded to your

local computer platform in either PDF or PostScript format.

Note: If your have questions concerning the use of software to manage your
RES-204 system, call your Themis Computer distributor or Themis Customer
Service directly at [phone].

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

4.2 Themis Management Applications

Themis management applications consist of hardware and software that monitor and
control several components and parameters of the system that are critical to main­taining safe operating power and cooling levels. These components/parameters
include:

• Power supply status LEDs

• VME DC power voltage monitoring

• Cooling system monitoring and control

• System air-flow monitoring

In addition, RES-204 systems contain a Themis-designed circuit called Watchdog
that monitors a malfunction in any of the up-to-4 CPUs contained on the Ultra 80
Motherboard:

• Watchdog (see “Front-Panel Status LEDs”, page 4-9, for more details)

4.2.1 Power Supply Status LEDs

The three LEDs located above the key-switch (see Figure 4-1) at the front of the
RES-204 are used to monitor the performance of each installed power supply. Each
LED is associated with one of the three power supplies installed in the back of the
system. An interpretation of these 2-state LEDs is given in Table 4-1.

4-2

Figure 4-1.

RES-204 Power Supply Status LEDs

Themis Computer

4—Managing Your System

Themis Management Applications

Important: Remember that the power key itself has two positions only—ON when
turned clockwise, and OFF when turned counterclockwise.

LED Status

Green

(normal)

1

Red *

Off (no light) z AC power problem **

Green

(normal)

2

Red *

Off (no light) z AC power problem **

Green

(normal)

3

Red *

Table 4-1.

Power Key-Switch LED Interpretation

z Power Supply 1 is powered up with all outputs op-

erational (key-switch is in ON position)

z Power Supply 1 is NOT fully operational;

however, at least one power supply is outputting
5-volt standby power to the system

z Power Supply 2 is powered up with all outputs op-

erational (key-switch is in ON position)

z Power Supply 2 is NOT fully operational;

however, at least one power supply is outputting
5-volt standby power to the system

z Power Supply 3 is powered up with all outputs op-

erational (key-switch is in ON position)

z Power Supply 3 is NOT fully operational;

however, at least one power supply is outputting
5-volt standby power to the system

Themis Computer

Off (no light) z AC power problem **

* A red LED can be caused by one of three conditions:

1. The power supply module is inhibited (for example, the key-switch is turned off),

even though AC power is applied to the power supply.

2. An internal fault is being reported by the power supply module (the Power_OK
signal from the module is deasserted).

3. There is no power supply module installed in this slot, or the installed power sup­ply has no AC power applied, even though at least one other module is powered up
and supplying 5-volt standby power.

** If one or more LEDs are turned off, one of three conditions may exist:

1. No AC power has been applied to any of the power supply modules in the system

(this is the cause over 99% of the time).

2. If AC power is applied to one or more of the power supply modules, then ALL of
the modules receiving AC power may have defective (i.e., no voltage output) 5-volt
standby power outputs (this is an extremely rare condition).

3. If AC power is applied to one or more of the power supply modules, and at least
one of the modules receiving AC power is properly generating 5-volt standby power,
then the LED illumination circuitry is faulty or the LED itself is burned out (this is an
extremely rare condition).

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Rugged Enterprise Server 200 Installation Guide

4.2.2 VME DC Power Voltage Monitoring

Each VME DC power voltage (+2V, +3.3V, +5V, +12V, -12V, and +28V) is moni­tored to make sure that it does not exceed overvoltage (125%) and overload (115%)
conditions. If the condition cannot be corrected by the system, it will begin a shut­down of all VME power voltages except +28V.

4.2.3 Cooling System Monitoring and Control

The RES-204 cooling system has three sources of air flow (Figure 4-2, page 4-5):

• Three 120-mm fans to cool the Server Subsystem

• Four 80-mm fans in a hot-swappable fan tray to cool the VME Subsystem

• Three fans within each Power Supply (total of nine)

The cooling system is capable of maintaining a maximum ambient temperature of
50°C across the entire system without airflow assist from the outside rack system.
[Maximum temperature rise through the RES-204 does not exceed 10°C.]

4.2.3.1 Server Subsystem Fans

Each of the three 120-mm fans used to cool the Server Subsystem have a separate
harness cable for power and control. Numbered 1, 2, and 3 from top to bottom, the
three fans (configured as N+1 redundant) direct air across the Server Subsystem by
specially placed baffles in the following way:

• Air from Fan 1 (top) and Fan 2 (middle) is directed across the CPU and
DIMM Modules on the Ultra 80 Motherboard

• Air from Fan 3 (bottom) is directed across all installed UPA and PCI boards

In the event of a fan failure, a fan controller detects the faulty condition and instructs
the remaining two fans to run at a faster speed to make up the initial reduction in air
flow. Each fan contains a thermal sensor to record the temperature of the air being
passed through the system. Regulating the speed of each fan not only acts as a tem­perature control, but as a noise-reduction mechanism as well. In addition to regulat­ing fan speed, the controller can turn the fans completely off.

Note: If a Server Subsystem fan fails, its baffles do not stop air from being de­livered to it from other parts of the system. In the event of a failure of any fan in
the system, the remaining fans in the system will accommodate the air flow that
is required to maintain optimum system temperature.

4-4

Air for the Server Fans is pulled through vents at the front of the cabinet on the left­hand side, as indicated in Figure 4-3 on page 4-6, and exhausted through vent-holes

Themis Computer

at the rear of the cabinet (see Figure 4-4 on page 4-6).

4—Managing Your System

Themis Management Applications

4.2.3.2 VME I/O Subsystem Fans

Themis Computer

Figure 4-2.

The RES-204 Cooling System

The three 80-mm fans used to cool the VME I/O Subsystem are contained in a single
tray that provides 200 CFM (cubic feet per minute) of air to all installed boards in
the 10 VME slots above it. Easily removed and hot-swappable, the VME I/O Fan
Tray (see Figure 4-2) contains a thermal sensor to record the temperature of the air
being passed through the system. To monitor air flow, each fan in the Fan Tray has
has a tachometer output that is routed to the Buffer/Alarm Board in slot 1 of the

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Rugged Enterprise Server 200 Installation Guide

VME I/O Subsystem, and a speed-control input with read-write access through pro­grammable registers. By reading the status of the tachometer output, the fan control-

Air Intake Vents; 6 total

(Disk Drive section)

Air Intake Vents

(Server Subsystem)

Note: Server Fans are

behind Vents

Figure 4-3. Air is Pulled through Vents at the Front of the Cabinet

VME I/O Fan Tray

Air Intake Vents

(VME Subsystem)

VME I/O Subsystem

Air Exhaust Vents

Power Supply

(Total of 3)

ler can determine if it is working properly and act on the speed-control input to

Server Subsystem
Air Exhaust Vent

Figure 4-4. Hot Air is Exhausted from the RES-204 through Rear Vents

4-6

Themis Computer

increase or decrease the amount of air flow through the system. Regulating the speed
of the Fan Tray not only acts as a temperature control, but as a noise-reduction
mechanism as well. In addition to regulating Fan Tray speed, the controller can turn
the Fan Tray completely off.

4.2.3.3 Power Supply Fan

Up to three power supplies can be installed in the RES-204, with only one necessary
to operate the system. Each power supply has three fans capable of maintaining an
air flow that can sustain the optimum operational temperature of the power supply.
Air is pulled in through the vents at the front of the cabinet directly under the VME
I/O Fan Tray (Figure 4-3) and exhausted through the vents at the rear directly above
the power-supply slots (Figure 4-4).

4.2.4 System Air Flow Monitoring

In addition to the monitoring and control of individual fans throughout the system,
three thermal sensors have been placed in the air-intake path to record the tempera­ture of the air coming into the system. Controlled through the front VME backplane,
the air-intake temperature is compared with thermal sensors placed at the air-exhaust
path, and measures a temperature gradient through the entire system in order to
report abnormal overheating.

4—Managing Your System

Themis Management Applications

Should an abnormal temperature condition be reported, an attempt is made to correct
the cause of the abnormality by increasing the speed of the fans directly affecting
that area of the system. If the temperature continues to rise, the system will begin an
orderly shutdown of both Server and VME I/O Subsystems.

Themis Computer

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Rugged Enterprise Server 200 Installation Guide

V

V

4.3 Status/Alarm Monitoring and Control

All of the monitoring and control status information discussed in the previous sec­tion is collected onto the VME Buffer/Alarm Board in VME slot 1, which in turn
communicates through a VME Bridge Cable interface connected to a Themis
VME-Bridge PCI Card (see Figure 4-5) installed in PCI slot 3 of the Server Sub­system (see Figure 2-15 on page 2-14). This specialized PCI card contains a Tundra
Universe II IC chip that performs a VME-to-PCI conversion before sending signals
to the PCI bus. In effect, the VME bus operates as a virtual extension of the local
PCI bus of the Server Subsystem.

[See Sidebar, next page, for more details on the VME Buffer/Alarm Board.]

Ultra 80 Motherboard

UPA-to-PCI

(U2P)

Interface Chip

PCI Bus

VME- Bridge PCI Card

PCI

Slot 3

s

VME I/O Subsystem

VME
Slot 1

ME Interface

ME Buffer/Alarm Board

Figure 4-5. Data Flow through the VME Buffer/Alarm Card within the RES-204

The VME Buffer/Alarm Board is unique in that it is the only circuit board connected
directly with both the Server GigaplaneTM bus (100 MHz) and the VME bus (80
Mbps) of the RES-204).

4-8

Themis Computer