TEXAS INSTRUMENTS XTR112, XTR1144 Technical data

®
XTR114
XTR112
XTR112
4-20mA CURRENT TRANSMITTERS
with Sensor Excitation and Linearization
FEATURES
LOW UNADJUSTED ERROR
PRECISION CURRENT SOURCES
XTR112: Two 250µA XTR114: Two 100µA
RTD OR BRIDGE EXCITATION
LINEARIZATION
TWO OR THREE-WIRE RTD OPERATION
LOW OFFSET DRIFT: 0.4µV/°C
LOW OUTPUT CURRENT NOISE: 30nAp-p
HIGH PSR: 110dB min
HIGH CMR: 86dB min
WIDE SUPPLY RANGE: 7.5V TO 36V
SO-14 SOIC PACKAGE
XTR114
APPLICATIONS
INDUSTRIAL PROCESS CONTROL
FACTORY AUTOMATION
SCADA REMOTE DATA ACQUISITION
REMOTE TEMPERATURE AND PRESSURE
TRANSDUCERS
Pt1000 NONLINEARITY CORRECTION
5
4
3
2
USING XTR112 and XTR114
Uncorrected
RTD Nonlinearity
SBOS101
DESCRIPTION
The XTR112 and XTR114 are monolithic 4-20mA, two-wire current transmitters. They provide complete current excitation for high impedance platinum RTD temperature sensors and bridges, instrumentation am­plifier, and current output circuitry on a single inte-
1
Nonlinearity (%)
0
–1
–200°C
Process Temperature (°C)
Corrected
Nonlinearity
+850°C
grated circuit. The XTR112 has two 250µA current sources while the XTR114 has two 100µA sources for RTD excitation.
Versatile linearization circuitry provides a 2nd-order correction to the RTD, typically achieving a 40:1 improvement in linearity.
I
R
I
R
V
LIN
V
+
REG
7.5V to 36V
Instrumentation amplifier gain can be configured for a
= 100µA
R
4-20 mA
wide range of temperature or pressure measurements. Total unadjusted error of the complete current trans­mitter is low enough to permit use without adjustment in many applications. This includes zero output cur­rent drift, span drift and nonlinearity. The XTR112 and XTR114 operate on loop power supply voltages down to 7.5V.
Both are available in an SO-14 surface-mount pack-
RTD
R
G
XTR112 XTR114
XTR112: IR = 250µA XTR114: I
age and are specified for the –40°C to +85°C indus­trial temperature range.
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
Twx: 910-952-1111 • Internet: http://www.burr-brown.com/ • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
©
1998 Burr-Brown Corporation PDS-1473A Printed in U.S.A. December, 1998
1
XTR112, XTR114
V
V
O
R
L
®
SPECIFICATIONS
At TA = +25°C, V+ = 24V, and TIP29C external transistor, unless otherwise noted.
XTR112U XTR112UA
XTR114U XTR114UA PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS OUTPUT
Output Current Equation A Output Current, Specified Range 4 20 ✻✻mA
Over-Scale Limit 24 27 30 ✻✻✻ mA Under-Scale Limit: XTR112 I
XTR114 0.6 1 1.4 ✻✻✻ mA
ZERO OUTPUT
(1)
= 0 0.9 1.3 1.7 ✻✻✻ mA
REG
VIN = 0V, RG = 4 mA
Initial Error ±5 ±25 ±50 µA
vs Temperature ±0.07 ±0.5 ±0.9 µA/°C vs Supply Voltage, V+ V+ = 7.5V to 36V 0.04 0.2 ✻✻ µA/V vs Common-Mode Voltage vs V
Output Current 0.3 µA/mA
REG
Noise: 0.1Hz to 10Hz 0.03 µAp-p
VCM = 1.25V to 3.5V
(2)
SPAN
Span Equation (transconductance) Initial Error
Nonlinearity: Ideal Input
INPUT
(3)
vs Temperature
(5)
(3)
(4)
Full Scale (VIN) = 50mV ±0.05 ±0.2 ±0.4 %
Full Scale (VIN) = 50mV 0.003 0.01 ✻✻ %
Offset Voltage VCM = 2V ±50 ±100 ±250 µV
vs Temperature ±0.4 ±1.5 ±3 µV/°C vs Supply Voltage, V+ V+ = 7.5V to 36V ±0.3 ±3 ✻✻ µV/V vs Common-Mode Voltage, V
RTI (CMRR)
Common-Mode Input Range
(2)
= 1.25V to 3.5V
CM
(2)
Input Bias Current 525 50 nA
vs Temperature 20 pA/°C
Input Offset Current ±0.2 ±3 ±10 nA
vs Temperature 5 pA/°C
Impedance: Differential 0.1 || 1 G|| pF
Common-Mode 5 || 10 G|| pF
Noise: 0.1Hz to 10Hz 0.6 µVp-p CURRENT SOURCES V
Current: XTR112 250 µA
= 2V
O
(6)
XTR114 100 µA
Accuracy ±0.05 ±0.2 ±0.4 %
vs Temperature ±15 ±35 ±75 ppm/°C vs Power Supply, V+ V+ = 7.5V to 36V ±10 ±25 ✻✻ ppm/V
Matching ±0.02 ±0.1 ±0.2 %
vs Temperature ±3 ±15 ±30 ppm/°C vs Power Supply, V+ V+ = 7.5V to 36V 1 10 ✻✻ ppm/V
Compliance Voltage, Positive (V+) –3
Negative
(2)
Output Impedance: XTR112 500 M
XTR114 1.2 G
Noise: 0.1Hz to 10Hz: XTR112 0.001 µAp-p
XTR114 0.0004 µAp-p
(2)
V
REG
Accuracy ±0.02 ±0.1 ✻✻ V
vs Temperature ±0.2 mV/°C vs Supply Voltage, V+ 1 mV/V
Output Current: XTR112 –1, +2.1 mA
XTR114 –1, +2.4 mA
Output Impedance 75
LINEARIZATION
R
(internal) 1 k
LIN
Accuracy ±0.2 ±0.5 ±1% vs Temperature ±25 ±100 ✻✻ ppm/°C
POWER SUPPLY
Specified Voltage +24 V Operating Voltage Range +7.5 +36 ✻✻V
TEMPERATURE RANGE
Specification, T Operating /Storage Range –55 +125 ✻✻°C Thermal Resistance,
SO-14 Surface-Mount 100 °C/W
MIN
to T
MAX
θ
JA
Specification same as XTR112U, XTR114U. NOTES: (1) Describes accuracy of the 4mA low-scale offset current. Does not include input amplifier effects. Can be trimmed to zero. (2) Voltage measured with
respect to I include Zero Output initial error. (6) Current source output voltage with respect to I
pin. (3) Does not include initial error or TCR of gain-setting resistor, RG. (4) Increasing the full-scale input range improves nonlinearity. (5) Does not
RET
®
XTR112, XTR114
IO = VIN • (40/RG) + 4mA, VIN in Volts, RG in
0.02 µA/V
S = 40/R
G
A/V
±3 ±25 ✻✻ ppm/°C
±10 ±50 ±100 µV/V
1.25 3.5 ✻✻V
(V+) –2.5
✻✻ V
0 –0.2 ✻✻ V
5.1 V
–40 +85 ✻✻°C
pin.
RET
2
PIN CONFIGURATION
Top View SO-14
XTR112 and XTR114
1
I
R1 –+
2
VIN
3
R
G
4
R
G
5
NC
6
I
RET
7
I
O
NC = No Connection
14 13 12 11 10
9 8
I
R2
V
IN
V
LIN
V
REG
V+ B (Base) E (Emitter)
ABSOLUTE MAXIMUM RATINGS
Power Supply, V+ (referenced to IO pin).......................................... 40V
Input Voltage, V
Storage Temperature Range ....................................... –55°C to +125°C
Lead Temperature (soldering, 10s) .............................................. +300°C
Output Current Limit ............................................................... Continuous
Junction Temperature ................................................................... +165°C
NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability.
+
, VIN (referenced to IO pin) ............................ 0V to V+
IN
(1)
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT SOURCES PACKAGE NUMBER
CURRENT DRAWING TEMPERATURE ORDERING TRANSPORT
XTR112U 2 x 250µA SO-14 Surface Mount 235 –40°C to +85°C XTR112U Rails
" " " " " XTR112U/2K5 Tape and Reel
XTR112UA 2 x 250µA SO-14 Surface Mount 235 –40°C to +85°C XTR112UA Rails
" " " " " XTR112UA/2K5 Tape and Reel
XTR114U 2 x 100µA SO-14 Surface Mount 235 –40°C to +85°C XTR114U Rails
" " " " " XTR114U/2K5 Tape and Reel
XTR114UA 2 x 100µA SO-14 Surface Mount 235 –40°C to +85°C XTR114UA Rails
" " " " " XTR114UA/2K5 Tape and Reel
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/ ) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “XTR112UA/2K5” will get a single 2500-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.
PACKAGE SPECIFIED
(1)
RANGE NUMBER
(2)
MEDIA
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
®
3
XTR112, XTR114
FUNCTIONAL BLOCK DIAGRAM
V
LIN
I
R1
12
13
+
V
IN
I
R2
1
14
I
R1
I
R2
V
REG
11
5.1V
V+
10
XTR112: I XTR114: I
= I
= 250µA
R1
R2
= I
= 100µA
R1
R2
4
R
LIN
1k
R
G
100µA
3
V
2
V
IN
I = 100µA +
IN
R
G
975
25
B
Q
9
1
E 8
7
IO = 4mA + V
IN
40
( )
R
G
6
I
RET
®
XTR112, XTR114
4
TYPICAL PERFORMANCE CURVES
10 100 1k 10k 100k
Frequency (Hz)
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
1M
140
120
100
80
60
40
20
0
Power Supply Rejection Ratio (dB)
RG = 2k
RG = 125
At TA = +25°C, and V+ = 24V, unless otherwise noted.
50
40
30
20
10
Transconductance (20 Log mA/V)
0
100 1k 10k 100k
110 100
90 80 70 60 50 40 30
Common-Mode Rejection Ratio (dB)
20
10 100 1k 10k 100k
TRANSCONDUCTANCE vs FREQUENCY
RG = 500
RG = 2k
Frequency (Hz)
COMMON-MODE REJECTION RATIO vs FREQUENCY
R
G
RG = 2k
Frequency (Hz)
RG = 125
= 125
1M
1M
STEP RESPONSE
RG = 2k
20mA
RG = 125
4mA/div
4mA
25µs/div
29
28
27
26
25
Over-Scale Current (mA)
24
23
OVER-SCALE CURRENT vs TEMPERATURE
V+ = 36V
–75 –50 –25 0 25 50 75 100
With External Transistor
V+ = 7.5V
V+ = 24V
Temperature (°C)
125
1.45
1.4
1.35
1.3
1.25
1.2
1.15
1.1
Under-Scale Current (mA)
1.05 1
0.95
5
UNDER-SCALE CURRENT vs TEMPERATURE
XTR112
XTR114
–75 –50 –25 0 25 50 75 100
Temperature (°C)
XTR112, XTR114
125
®
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, and V+ = 24V, unless otherwise noted.
INPUT VOLTAGE AND CURRENT
10k
1k
100
Input Voltage Noise (nV/Hz)
10
1 10 100 1k 10k
25
20
15
10
5
Input Bias and Offset Current (nA)
0
–75 –50 –25 0 25 50 75 100
NOISE DENSITY vs FREQUENCY
Current Noise
Voltage Noise
Frequency (Hz)
INPUT BIAS AND OFFSET CURRENT
vs TEMPERATURE
Temperature (°C)
ZERO OUTPUT AND REFERENCE
10k
1k
100
Input Current Noise (fA/Hz)
10
100k
+I
B
–I
B
I
OS
125
10k
1k
100
Noise (pA/Hz)
XTR114
10
1 10 100 1k 10k
4 2
0 –2 –4 –6 –8
Zero Output Current Error (µA)
–10 –12
–75 –50 –25 0 25 50 75 100
CURRENT NOISE vs FREQUENCY
Zero Output Current
XTR112
Reference Current
100k
Frequency (Hz)
ZERO OUTPUT CURRENT ERROR
vs TEMPERATURE
125
Temperature (°C)
80 70 60 50 40 30
Percent of Units (%)
20 10
0
0
0.2
0.4
®
XTR112, XTR114
INPUT OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
Typical production distribution
of packaged units. XTR112 and
XTR114 included.
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Input Offset Voltage Drift (µV/°C)
2.2
2.4
2.6
2.8
3.0
ZERO OUTPUT DRIFT
40 35 30 25 20 15
Percent of Units (%)
10
5
0
0
0.025
PRODUCTION DISTRIBUTION
Typical production distribution
0.05
0.075
0.1
0.2
0.15
0.125
0.175
0.225
Zero Output Drift (µA/°C)
of packaged units. XTR112
and XTR114 included.
0.25
0.3
0.275
0.35
0.325
0.4
0.375
0.425
0.45
0.5
0.475
6
TYPICAL PERFORMANCE CURVES (CONT)
Typical production distribution
of packaged units. XTR112 and
XTR114 included.
Current Source Matching Drift (ppm/°C)
CURRENT SOURCE MATCHING
DRIFT PRODUCTION DISTRIBUTION
90 80 70 60 50 40 30 20 10
0
Percent of Units (%)
0
2
4
6
8
1012141618202224262830
–1 –0.5 0 0.5 1 2.521.5
V
REG
Output Current (mA)
XTR112 V
REG
OUTPUT VOLTAGE
vs V
REG
OUTPUT CURRENT
3
5.35
5.30
5.25
5.20
5.15
5.10
5.05
5.00
V
REG
Output Voltage (V)
NOTE: Above 2.1mA, zero output degrades
25°C
125°C
–55°C
At TA = +25°C, and V+ = 24V, unless otherwise noted.
CURRENT SOURCE DRIFT
40 35 30 25 20 15
Percent of Units (%)
10
5 0
0
PRODUCTION DISTRIBUTION
Typical production distribution
of packaged units.
XTR112 and XTR114 included.
5
10152025303540455055606570
Current Source Drift (ppm/°C)
75
XTR114 V
vs V
5.35
REG
125°C
5.30
5.25
5.20
25°C
5.15
Output Voltage (V)
–55°C
5.10
REG
V
5.05
5.00 –1 –0.5 0 0.5 1 2.521.5
V
REG
OUTPUT VOLTAGE
REG
OUTPUT CURRENT
NOTE: Above 2.4mA, zero output degrades
Output Current (mA)
+0.05
0
–0.05
3
REFERENCE CURRENT ERROR
vs TEMPERATURE
–0.10
–0.15
Reference Current Error (%)
–0.20
–75 –50 –25 0 25 50 75 100 125
Temperature (°C)
7
®
XTR112, XTR114
APPLICATION INFORMATION
Figure 1 shows the basic connection diagram for the XTR112 and XTR114. The loop power supply, VPS, provides power for all circuitry. Output loop current is measured as a voltage across the series load resistor, RL.
Two matched current sources drive the RTD and zero­setting resistor, RZ. These current sources are 250µA for the XTR112 and 100µA for the XTR114. Their instrumentation amplifier input measures the voltage difference between the RTD and RZ. The value of RZ is chosen to be equal to the resistance of the RTD at the low-scale (minimum) measure­ment temperature. RZ can be adjusted to achieve 4mA output at the minimum measurement temperature to correct for input offset voltage and reference current mismatch of the XTR112 and XTR114.
RCM provides an additional voltage drop to bias the inputs of the XTR112 and XTR114 within their common-mode input range. RCM should be bypassed with a 0.01µF capacitor to minimize common-mode noise. Resistor RG sets the gain of the instrumentation amplifier according to the desired tem­perature range. R correction to the RTD, typically achieving a 40:1 improve­ment in linearity. An additional resistor is required for three­wire RTD connections, see Figure 3.
provides second-order linearization
LIN1
The transfer function through the complete instrumentation amplifier and voltage-to-current converter is:
IO = 4mA + V
• (40/RG)
IN
(VIN in volts, RG in ohms)
where VIN is the differential input voltage. As evident from the transfer function, if RG is not used the gain is zero and the output is simply the XTR’s zero current. The value of R varies slightly for two-wire RTD and three-wire RTD con­nections with linearization. RG can be calculated from the equations given in Figure 1 (two-wire RTD connection) and Table I (three-wire RTD connection).
The I sources and V
pin is the return path for all current from the current
RET
REG
. The I
pin allows any current used in
RET
external circuitry to be sensed by the XTR112 and XTR114 and to be included in the output current without causing an error.
The V
pin provides an on-chip voltage source of approxi-
REG
mately 5.1V and is suitable for powering external input circuitry (refer to Figure 6). It is a moderately accurate voltage reference—it is not the same reference used to set the precision current references. V
is capable of sourcing
REG
approximately 2.1mA of current for the XTR112 and 2.4mA for the XTR114. Exceeding these values may affect the 4mA zero output. Both products can sink approximately 1mA.
G
RTD
I
R2
I
R1
12
1
V
LIN
13
+
V
IN
4
R
G
(2)
R
G
3
(3)
R
LIN1
(1)
R
Z
R
CM
0.01µF
R
G
V
2
IN
I
RET
6
I
R1
I
XTR112 XTR114
14
11
R2
V
REG
V+
I
O
7.5V to 36V
10
9
B
E
7
Q
1
8
I = 4mA + V
O
NOTES: (1) RZ = RTD resistance at minimum measured temperature.
Possible choices for Q
0.01µF
40
• ( )
IN
R
G
2.5 • I
(2)
RG =
(3)
=
R
LIN1
TYPE
2N4922 TIP29C TIP31C
I
PACKAGE
TO-225 TO-220 TO-220
R
[R1(R2 + RZ) – 2(R2RZ)]
REF
R
2
0.4 • R
LIN(R2
(2R1 – R2 – RZ)
REF
1
4-20 mA
L
– R
1
– R1)
(see text).
I
O
V
O
+
V
PS
= RTD Resistance at (T
where R
1
= RTD Resistance at T
R
XTR112: I XTR114: I
R1 R1
= I
R2
= I
R2
= 250µA, R = 100µA, R
CM CM
= 3.3k = 8.2k
2
R
= 1k (Internal)
LIN
= 0.25 for XTR112
I
REF
= 0.1 for XTR114
I
REF
FIGURE 1. Basic Two-Wire RTD Temperature Measurement Circuit with Linearization.
®
XTR112, XTR114
8
MIN
MAX
+ T
MAX
)/2
A negative input voltage, VIN, will cause the output current to be less than 4mA. Increasingly negative VIN will cause the output current to limit at approximately 1.3mA for the XTR112 and 1mA for the XTR114. Refer to the typical curve “Under-Scale Current vs Temperature.”
Increasingly positive input voltage (greater than the full­scale input) will produce increasing output current according to the transfer function, up to the output current limit of approximately 27mA. Refer to the typical curve “Over­Scale Current vs Temperature.”
EXTERNAL TRANSISTOR
Transistor Q1 conducts the majority of the signal-dependent 4-20mA loop current. Using an external transistor isolates the majority of the power dissipation from the precision input and reference circuitry of the XTR112 and XTR114, maintaining excellent accuracy.
Since the external transistor is inside a feedback loop its characteristics are not critical. Requirements are: V
CEO
= 45V min, β = 40 min and PD = 800mW. Power dissipation requirements may be lower if the loop power supply voltage is less than 36V. Some possible choices for Q1 are listed in Figure 1.
The XTR112 and XTR114 can be operated without this external transistor, however, accuracy will be somewhat degraded due to the internal power dissipation. Operation without Q1 is not recommended for extended temperature ranges. A resistor (R = 3.3k) connected between the I
RET
pin and the E (emitter) pin may be needed for operation below 0°C without Q1 to guarantee the full 20mA full-scale output, especially with V+ near 7.5V.
LOOP POWER SUPPLY
The voltage applied to the XTR112 and XTR114, V+, is measured with respect to the IO connection, pin 7. V+ can
10
V+
8
E
I
RET
XTR112 XTR114
6
R
Q
= 3.3k
I
O
7
0.01µF
For operation without external transistor, connect a 3.3k resistor between pin 6 and pin 8. See text for discussion of performance.
FIGURE 2. Operation Without External Transistor.
range from 7.5V to 36V. The loop supply voltage, VPS, will differ from the applied voltage according to the voltage drop on the current sensing resistor, RL (plus any other voltage drop in the line).
If a low loop supply voltage is used, RL (including the loop wiring resistance) must be made a relatively low value to assure that V+ remains 7.5V or greater for the maximum loop current of 20mA:
RLmax =
 
20mA
 
–R
WIRING
(V+)–7.5V
It is recommended to design for V+ equal or greater than
7.5V with loop currents up to 30mA to allow for out-of­range input conditions.
The low operating voltage (7.5V) of the XTR112 and XTR114 allow operation directly from personal computer power supplies (12V ±5%). When used with the RCV420 Current Loop Receiver (Figure 7), load resistor voltage drop is limited to 3V.
ADJUSTING INITIAL ERRORS
Many applications require adjustment of initial errors. Input offset and reference current mismatch errors can be cor­rected by adjustment of the zero resistor, RZ. Adjusting the gain-setting resistor, RG, corrects any errors associated with gain.
TWO-WIRE AND THREE-WIRE RTD CONNECTIONS
In Figure 1, the RTD can be located remotely simply by extending the two connections to the RTD. With this remote two-wire connection to the RTD, line resistance will intro­duce error. This error can be partially corrected by adjusting the values of RZ, RG, and R
LIN1
.
A better method for remotely located RTDs is the three-wire RTD connection shown in Figure 3. This circuit offers improved accuracy. RZ’s current is routed through a third wire to the RTD. Assuming line resistance is equal in RTD lines 1 and 2, this produces a small common-mode voltage which is rejected by the XTR112 and XTR114. A second resistor, R
, is required for linearization.
LIN2
Note that although the two-wire and three-wire RTD con­nection circuits are very similar, the gain-setting resistor, RG, has slightly different equations:
IRRR RR
•+
25 2
.()()
R
Two-wire:
Three-wire:
=
G
R
=
G
where RZ = RTD resistance at T
R1 = RTD resistance at (T R2 = RTD resistance at T I
= 0.25 for XTR112
REF
I
= 0.1 for XTR114
REF
9
XTR112, XTR114
[]
REF Z Z
12 2
RR
21
IRRRR
25
.()()
REF Z Z
21
RR
21
MIN
MIN
MAX
+ T
MAX
)/2
®
Table I summarizes the resistor equations for two-wire and three-wire RTD connections. An example calculation is also provided. To maintain good accuracy, at least 1% (or better) resistors should be used for RG. Table II provides standard 1% RG values for a three-wire Pt1000 RTD connection with linearization for the XTR112. Table III gives RG values for the XTR114.
LINEARIZATION
RTD temperature sensors are inherently (but predictably) nonlinear. With the addition of one or two external resistors, R
LIN1
and R
, it is possible to compensate for most of this
LIN2
nonlinearity resulting in 40:1 improvement in linearity over the uncompensated output.
TWO-WIRE
General Equations
XTR112 (I (see Table II)
XTR114 (I (see Table III)
= 0.25)
REF
= 0.1)
REF
R
G
I
• 2.5 [R1 (R2 + RZ) – 2 (R2RZ)]
REF
=
0.625 • [R1 (R2 + RZ) – 2 (R2RZ)]
=
=
0.25 • [R
1
(R
– R1)
2
(R
– R1)
2
(R2 + RZ) – 2 (R2RZ)]
(R
– R1)
2
0.4 • R
=
I
• (2R1 – R2 – RZ)
REF
1.6 • R
=
(2R
4 • R
=
(2R
R
LIN1
(R2 – R1)
LIN
(R2 – R1)
LIN
– R2 – RZ)
1
(R2 – R1)
LIN
– R2 – RZ)
1
where RZ = RTD resistance at the minimum measured temperature, T
R1 = RTD resistance at the midpoint measured temperature, T R2 = RTD resistance at maximum measured temperature, T R
= 1k (internal)
LIN
MAX
R
G
• 2.5 (R2 – RZ) (R1 – RZ)]
I
REF
=
=
=
MIN
= (T
+ T
MID
MIN
(R
0.625 • (R (R
0.25 • (R (R
)/2
MAX
– R1)
2
– RZ) (R1 – RZ)]
2
– R1)
2
– RZ) (R1 – RZ)]
2
– R1)
2
THREE-WIRE
0.4 • R
=
I
• (2R1 – R2 – RZ)
REF
1.6 • R
=
(2R
4 • R
=
(2R
XTR112 RESISTOR EXAMPLE:
The measurement range is –100°C to +200°C for a 3-wire Pt100 RTD connection. Determine the values for RS, RG, R from the chart or calculate the values according to the equations provided.
METHOD 1: TABLE LOOK UP
T
= –100°C and T = 300°C (T
MIN
Using Table II the 1% values are:
R
= 604 R
Z
R
= 750 R
G
METHOD 2: CALCULATION Step 1: Determine RZ, R1, and R2.
RZ is the RTD resistance at the minimum measured temperature, T Using Equation (1) at right gives R
is the RTD resistance at the maximum measured temperature, T
R
2
Using Equation (2) at right gives R R
is the RTD resistance at the midpoint measured temperature,
1
T
= (T
+ T
MID
MIN
Using Equation (2) at right gives R1 = 1194Ω.
Step 2: Calculate R
R
G
R
LIN1
R
LIN2
) /2 = (–100 + 200)/2 = 50°C. R1 is NOT the average of RZ and R2.
MAX
, R
, and R
G
LIN1
= 757 (1% value is 750Ω)
= 33.322k (1% value is 33.2kΩ) = 58.548k (1% value is 59kΩ)
= +200°C),
MAX
= 33.2k
LIN1
= 59k
LIN2
= 602.5 (1% value is 604Ω).
Z
= 1758.4Ω.
2
using equations above.
LIN2
= –100°C.
MIN
= 200°C.
MAX
Calculation of Pt1000 Resistance Values
(according to DIN IEC 751) Equation (1) Temperature range from –200°C to 0°C:
R
= 1000 [1 + 3.90802 • 10–3 • T – 0.5802 • 10–6 • T
(T)
– 4.27350 • 10
Equation (2) Temperature range from 0°C to +850°C:
R
= 1000 (1 + 3.90802 • 10–3 • T – 0.5802 • 10–6 • T2)
(T)
where: R
(T)
T is the temperature in °C.
NOTE: Most RTD manufacturers provide reference tables for resistance values at various temperatures.
Resistor values for other RTD types (such as Pt2000) can be calculated using the XTR resistor selection program in the Applications Section on Burr-Brown’s web site (www.burr­brown.com)
–12
• (T – 100) • T3]
is the resistance in at temperature T.
R
LIN1
(R2 – R1)
LIN
(R2 – R1)
LIN
– R2 – RZ)
1
(R2 – R1)
LIN
– R2 – RZ)
1
LIN1
, and R
R
LIN2
0.4 • (R
+ RG)(R2 – R1)
LIN
=
• (2R1 – R2 – RZ)
I
REF
1.6 • (R
+ RG)(R2 – R1)
LIN
=
=
LIN2
– R2 – RZ)
(2R
1
4 • (R
+ RG)(R2 – R1)
LIN
(2R
– R2 – RZ)
1
. Look up the values
2
TABLE I. Summary of Resistor Equations for Two-Wire and Three-Wire Pt1000 RTD Connections.
®
XTR112, XTR114
10
XTR112 1% RESISTOR VALUES FOR A THREE-WIRE RTD CONNECTION
MEASUREMENT TEMPERATURE SPAN T (°C)
T
–200°C 187/267 187/536 187/806 187/1050 187/1330 187/1580 187/1820 187/2100 187/2370 187/2670
–100°C 604/255 604/499 604/4750 604/1000 604/1270 604/1500 604/1780 604/2050 604/2260
0°C 1000/243 1000/487 1000/732 1000/976 1000/1210 1000/1470 1000/1740 1000/1960
100°C 1370/237 1370/475 1370/715 1370/953 1370/1180 1370/1430 1370/1690
200°C 1740/232 1740/464 1740/698 1740/931 1740/1150 1740/1400
300°C 2100/221 2100/442 2100/665 2100/887 2100/1130
400°C 2490/215 2490/432 2490/649 2490/866
500°C 2800/210 2800/412 2800/619
600°C 3160/200 3160/402
700°C 3480/191
800°C 3740/187
100°C 200°C 300°C 400°C 500°C 600°C 700°C 800°C 900°C 1000°C
MIN
48700 31600 25500 21500 17800 15000 13000 11300 9760 8660 61900 48700 46400 44200 41200 39200 36500 34800 33200 31600
86600 49900 33200 24900 19600 15800 13300 11500 10000
110000 75000 59000 49900 44200 40200 37400 34800 32400
105000 51100 33200 24300 19100 15400 13000 11000 130000 76800 57600 48700 42200 38300 35700 33200
102000 49900 32400 23700 18700 15000 12400 127000 73200 56200 46400 40200 36500 33200
100000 48700 31600 23200 17800 14300 121000 69800 53600 44200 38300 34800
95300 46400 30100 22100 17400
118000 68100 51100 42200 36500
93100 45300 29400 21500
113000 64900 48700 40200
887000 43200 28000 107000 61900 45300
86600 42200
102000 59000
82500
100000
80600 95300
where R1 = RTD resistance at the midpoint measured temperature, (T
NOTE: The values listed in the table are 1% resistors (in ). Exact values may be calculated from the following equations:
R
= RTD resistance at minimum measured temperature, T
Z
.(–)(–)
RRRR
0 625
ZZ
R
=
G
=
R
LIN
1
R
2
LIN
R2 = RTD resistance at T
= 1k (Internal)
R
LIN
21
(–)
RR
21
16
.()
RRR
LIN
2
(––)
16
=
21
RRR
12
•+.( )(–)
Z
RRRR
LIN
G
2
(––)
RRR
12
MAX
21
Z
RZ/R
R
LIN1
R
LIN2
G
.
MIN
+ T
)/2
MIN
MAX
TABLE II. XTR112 RZ, RG, R
XTR114 1% RESISTOR VALUES FOR A THREE-WIRE RTD CONNECTION
T
–200°C 187/107 187/215 187/316 187/422 187/523 187/634 187/732 187/845 187/953 187/1050
–100°C 604/102 604/200 604/301 604/402 604/511 604/604 604/715 604/806 604/909
0°C 1000/97.6 1000/196 1000/294 1000/392 1000/487 1000/590 1000/681 1000/787
100°C 1370/95.3 1370/191 1370/287 1370/383 1370/475 1370/576 1370/665
200°C 1740/90.9 1740/182 1740/274 1740/365 1740/464 1740/549
300°C 2100/88.9 2100/178 2100/267 2100/357 2100/348
400°C 2490/86.6 2490/174 2490/261 2490/249
500°C 2800/82.5 2800/165 2800/49
600°C 3160/80.6 3160/162
700°C 3480/76.8
800°C 3740/75
100°C 200°C 300°C 400°C 500°C 600°C 700°C 800°C 900°C 1000°C
MIN
121000 78700 64900 53600 45300 38300 32400 28000 24900 21500 133000 95300 84500 76800 68100 68100 56200 52300 47500 45300
221000 124000 84500 61900 48700 40200 33200 28700 24900 243000 150000 110000 86600 73200 63400 57600 52300 47500
261000 130000 84500 61900 47500 39200 32400 27400 287000 154000 107000 84500 71500 61900 54900 49900
255000 124000 80600 59000 46400 37400 31600 280000 147000 105000 82500 68100 59000 52300
249000 121000 78700 57600 44200 36500 267000 143000 100000 78700 64900 56200
237000 118000 75000 54900 43200 261000 137000 95300 75000 61900
232000 113000 73200 53600 249000 133000 93100 71500
221000 110000 69800 243000 127000 88700
215000 105000 215000 121000
205000 221000
200000 215000
LIN1
, and R
Standard 1% Resistor Values for Three-Wire Pt1000 RTD Connection with Linearization.
LIN2
MEASUREMENT TEMPERATURE SPAN T (°C)
RZ/R
G
R
LIN1
R
LIN2
NOTE: The values listed in the table are 1% resistors (in ). Exact values may be calculated from the following equations:
= RTD resistance at minimum measured temperature, T
R
Z
RRRR
025
.(–)(–)
R
=
G
4
(–)
=
R
LIN
1
2
(––) 4
=
R
LIN
2
ZZ
21
RR
(–)
21
RRR
LIN
21
RRR
12
•+()()
Z
RRRR
LIN
2
(––)
RRR
12
G
21 Z
where R1 = RTD resistance at the midpoint measured temperature, (T
R2 = RTD resistance at T R
= 1k (Internal)
LIN
MAX
.
MIN
+ T
)/2
MIN
MAX
TABLE III. XTR114 RZ, RG, R
LIN1
, and R
Standard 1% Resistor Values for Three-Wire Pt1000 RTD Connection with Linearization.
LIN2
11
XTR112, XTR114
®
A typical two-wire RTD application with linearization is shown in Figure 1. Resistor R back and controls linearity correction. R
provides positive feed-
LIN1
is chosen ac-
LIN1
cording to the desired temperature range. An equation is given in Figure 1.
In three-wire RTD connections, an additional resistor, R is required. As with the two-wire RTD application, R provides positive feedback for linearization. R
LIN2
LIN2
LIN1
provides an offset canceling current to compensate for wiring resis­tance encountered in remotely located RTDs. R
LIN1
and R
LIN2
are chosen such that their currents are equal. This makes the voltage drop in the wiring resistance to the RTD a common­mode signal which is rejected by the XTR112 and XTR114. The nearest standard 1% resistor values for R
LIN1
and R
LIN2
should be adequate for most applications. Tables II and III provide the 1% resistor values for a three-wire Pt1000 RTD connection.
If no linearity correction is desired, the V
pin should be
LIN
left open. With no linearization, RG = 2500 • VFS, where VFS = full-scale input range.
RTDs
The text and figures thus far have assumed a Pt1000 RTD. With higher resistance RTDs, the temperature range and input voltage variation should be evaluated to ensure proper common-mode biasing of the inputs. As mentioned earlier,
RCM can be adjusted to provide an additional voltage drop to bias the inputs of the XTR112 and XTR114 within their common-mode input range.
ERROR ANALYSIS
,
Table IV shows how to calculate the effect various error sources have on circuit accuracy. A sample error calculation for a typical RTD measurement circuit (Pt1000 RTD, 200°C measurement span) is provided. The results reveal the XTR112’s and XTR114’s excellent accuracy, in this case 1% unadjusted for the XTR112, 1.16% for the XTR114. Adjusting resistors RG and RZ for gain and offset errors improves the XTR112’s accuracy to 0.28% (0.31% for the XTR114). Note that these are worst-case errors; guaranteed maximum values were used in the calculations and all errors were assumed to be positive (additive). The XTR112 and XTR114 achieve perfor­mance which is difficult to obtain with discrete circuitry and requires less space.
OPEN-CIRCUIT PROTECTION
The optional transistor Q2 in Figure 3 provides predictable behavior with open-circuit RTD connections. It assures that if any one of the three RTD connections is broken, the XTR’s output current will go to either its high current limit ( 27mA) or low current limit ( 1.3mA for XTR112 and 1mA for XTR114). This is easily detected as an out-of-range condition.
EQUAL line resistances here creates a small common-mode voltage which is rejected by XTR112 and XTR114.
Resistance in this line causes a small common-mode voltage which is rejected by XTR112 and XTR114.
(1)
R
LIN1
2
(R
)(R
LINE2
RTD
(R
)
LINE3
3
12
1
V
13
(1)
R
LIN2
(1)
R
Z
1
)
LINE1
(2)
Q
2
2N2222
+
V
IN
4
R
G
(1)
R
G
3
R
G
2
V
IN
I
RET
R
CM
14
LIN
I
R1
11
I
R2
10
V
REG
V+
XTR112 XTR114
6
0.01µF
NOTES: (1) See Table I for resistor equations and 1% values. (2) Q output current if any one RTD connection is broken:
9
B
Q
1
E
8
I
O
7
optional. Provides predictable
2
OPEN RTD
TERMINAL
1 1.3mA 1mA 2 27mA 27mA 3 1.3mA 1mA
XTR112 XTR114
I
O
0.01µF
I
O
I
O
I
O
FIGURE 3. Three-Wire Connection for Remotely Located RTDs.
®
XTR112, XTR114
12
SAMPLE ERROR CALCULATION FOR XTR112
(1)
RTD value at 4mA Output (R RTD Measurement Range 200°C Ambient Temperature Range (∆T Supply Voltage Change (∆V+) 5V
) 1000
RTD MIN
)20°C
A
Common-Mode Voltage Change (∆CM) 0.1V
ERROR SOURCE ERROR EQUATION ERROR CALCULATION
SAMPLE
INPUT
Input Offset Voltage V
vs Common-Mode CMRR • ∆CM/(V Input Bias Current I Input Offset Current I
/(V
OS
B/IREF
• R
OS
RTD MIN
EXCITATION
Current Reference Accuracy I
vs Supply (I Current Reference Matching I
vs Supply (I
Accuracy (%)/100% • 10
REF
vs V+) • V+ 25ppm/V • 5V 125 125
REF
Matching (%)/100% • I
REF
R
/(V
RTD MIN
matching vs V+) • V+ • 10ppm/V • 5V • 250µA • 1000Ω/(250µA • 3.8Ω/°C • 200°C) 66 66
REF
R
RTD MIN
GAIN
Span Span Error (%)/100% • 10 Nonlinearity Nonlinearity (%)/100% • 10
OUTPUT
Zero Output (I
vs Supply (I
DRIFT (∆T
= 20°C)
A
Input Offset Voltage Drift • ∆T Input Bias Current (typical) Drift • ∆T Input Offset Current (typical) Drift • ∆T Current Reference Accuracy Drift • ∆T Current Reference Matching Drift • ∆T Span Drift • ∆T Zero Output Drift • ∆T
- 4mA) /16000µA • 10
ZERO
vs V+) • ∆V+/16000µA • 10
ZERO
A
• R
A
RTD MIN
• I
A
REF
A
NOISE (0.1Hz to 10Hz, typ)
Input Offset Voltage v Current Reference I Zero Output I
NOTES: (1) For XTR114, I otherwise stated.
= 100µA. Total unadjusted error is 1.16%, adjusted error 0.31%. (2) All errors are min/max and referred to input, unless
REF
n
Noise • R
REF
Noise/16000µA • 10
ZERO
/(V
IN MAX
RTD MIN
6
) • 10
IN MAX
) • 10
IN MAX
6
• 10
/(V
) • 10
IN MAX
) • 10
IN MAX
/(V
)
IN MAX
/(V
) • 10
IN MAX
6
• 10
A/IREF
/(V
IN MAX
A
• R
/(V
RTD MIN
A
/16000µA • 10
6
) • 10
/(V
IN MAX
6
6
6
0.1%/100% • 250µA • 1000Ω/(250µA • 3.8Ω/°C • 200°C) • 10
REF
6
6
6
6
6
6
6
) • 10
100µV/(250µA • 3.8/°C • 200°C) • 10
50µV/V • 0.1V/(250µA • 3.8/°C • 200°C) • 10
0.025µA/250µA • 10
3nA • 1000Ω/(250µA • 3.8Ω/°C • 200°C) • 10
0.2%/100% • 10
0.2%/100% • 10
0.01%/100% • 10
25µA/16000µA • 10
0.2µA/V • 5V/16000µA • 10
1.5µV/°C • 20°C/(250µA • 3.8/°C • 200°C) • 10 20pA/°C • 20°C/250µA • 10
5pA/°C • 20°C • 1000/(250µA • 3.8/°C • 200°C) • 10
35ppm/°C • 20°C 700 700
) 15ppm/°C • 20°C • 250µA • 1000Ω/(250µA • 3.8Ω/°C • 200°C) 395 395
IN MAX
6
) • 10
6
6
3nA • 1000Ω/(250µA • 3.8Ω/°C • 200°C) • 10
25ppm/°C • 20°C 500 500
0.5µA/°C • 20°C/16000µA • 10
0.6µV/(250µA • 3.8/°C • 200°C) • 10
0.03µA/16000µA • 10
(2)
6
6
Total Excitation Error: 3507 191
6
6
6
6
6
6
ERROR
(ppm of Full Scale)
UNADJ. ADJUST.
6
6
6
526 0
26 26
100 0
16 0
Total Input Error: 668 26
2000 0
6
1316 0
2000 0
100 100
Total Gain Error: 2100 100
1563 0
63 63
Total Output Error: 1626 63
6
6
6
158 158
22
0.5 0.5
626 626
Total Drift Error: 2382 2382
6
6
33
16 16
22
Total Noise Error: 21 21
TOTAL ERROR: 10304 2783
(1.03%) (0.28%)
TABLE IV. Error Calculation.
REVERSE-VOLTAGE PROTECTION
The XTR112’s and XTR114’s low compliance rating (7.5V) permits the use of various voltage protection methods with­out compromising operating range. Figure 4 shows a diode bridge circuit which allows normal operation even when the voltage connection lines are reversed. The bridge causes a two diode drop (approximately 1.4V) loss in loop supply voltage. This results in a compliance voltage of approxi­mately 9V—satisfactory for most applications. If 1.4V drop in loop supply is too much, a diode can be inserted in series with the loop supply voltage and the V+ pin. This protects against reverse output connection lines with only a 0.7V loss in loop supply voltage.
SURGE PROTECTION
Remote connections to current transmitters can sometimes be subjected to voltage surges. It is prudent to limit the maximum surge voltage applied to the XTR to as low as practical. Various zener diode and surge clamping diodes are specially designed for this purpose. Select a clamp diode with as low a voltage rating as possible for best protection. For example, a 36V protection diode will assure proper transmitter operation at normal loop voltages, yet will provide an appropriate level of protection against voltage surges. Characterization tests on three production lots showed no damage to the XTR112 or XTR114 within loop supply voltages up to 65V.
13
XTR112, XTR114
®
Most surge protection zener diodes have a diode character­istic in the forward direction that will conduct excessive current, possibly damaging receiving-side circuitry if the loop connections are reversed. If a surge protection diode is used, a series diode or diode bridge should be used for protection against reversed connections.
RADIO FREQUENCY INTERFERENCE
The long wire lengths of current loops invite radio frequency interference. RF can be rectified by the sensitive input circuitry of the XTR112 and XTR114 causing errors. This generally appears as an unstable output current that varies with the position of loop supply or input wiring.
If the RTD sensor is remotely located, the interference may enter at the input terminals. For integrated transmitter as­semblies with short connection to the sensor, the interfer­ence more likely comes from the current loop connections.
Bypass capacitors on the input reduce or eliminate this input interference. Connect these bypass capacitors to the I
RET
terminal as shown in Figure 5. Although the dc voltage at the I
terminal is not equal to 0V (at the loop supply, VPS) this
RET
circuit point can be considered the transmitter’s “ground.” The 0.01µF capacitor connected between V+ and IO may help minimize output interference.
10
V+
XTR112 XTR114
I
RET
B
9
E
8
I
O
7
6
0.01µF
(1)
D
1
1N4148
Diodes
The diode bridge causes a 1.4V loss in loop supply voltage.
FIGURE 4. Reverse Voltage Operation and Over-Voltage Surge Protection.
12
1
V
LIN
13
R
G
I
R1
+
V
4
R
3
R
V
2
I
R2
IN
G
XTR112 XTR114
G
– IN
I
RET
6
R
LIN1RLIN2
1k
1k
R
Z
0.01µF 0.01µF
NOTE: (1) Zener Diode 36V: 1N4753A or General Semiconductor Transorb
TM
1N6286A. Use lower voltage zener diodes with loop power supply voltages less than 30V for increased protection. See “Over-Voltage Surge Protection.”
Maximum V less than minimum
R
L
14
11
10
V
REG
V+
9
B
E
8
I
O
7
voltage rating of zener
V
PS
diode.
0.01µF
must be
PS
RTD
(1)
R
CM
0.01µF
NOTE: (1) Bypass capacitors can be connected to either the I
FIGURE 5. Input Bypassing Technique with Linearization.
®
XTR112, XTR114
pin or the IO pin.
RET
14
I
< 2mA
Isothermal
REG
5V
Block
12
1
V
LIN
+
V
IN
4
R
G
3
R
G
V
2
IN
I
RET
I
R1
6
I
R2
XTR112 XTR114
14
11
10
V
REG
V+
9
B
E
8
I
O
7
+–
IO = 4mA + (VIN –VIN)
40 R
G
NOTES: (1) For burn-out indication.
(2) XTR112, R
XTR114, R
= 3.3k
CM
= 8.2k
CM
Type J
1N4148
50
1k
25
1M
V+
OPA277
13
V–
(1)
1M
0.01µF
R
G
1250
20k
(2)
R
CM
FIGURE 6. Thermocouple Low Offset, Low Drift Loop Measurement with Diode Cold-Junction Compensation.
12
1
V
LIN
14
I
R1
+
V
IN
R
G
11
I
R2
V
REG
XTR112
R
G
V
IN
I
RET
6
Pt1000
100°C to
600°C
RTD
R
LIN1
18.7k
R
1370
R
CM
Z
R
G
1270
13
4
3
2
0.01µF
FIGURE 7. ±12V Powered Transmitter/Receiver Loop.
1N4148
10
+12V
V+
9EB
8
I
O
7
IO = 4mA – 20mA
0.01µFQ
1
16
10
3
RCV420
2
4
–12V
NOTE: A two-wire RTD connection is shown. For remotely located RTDs, a three-wire RTD conection is recommended. R becomes 1180, R
is 40.2k. See Figure 3 and Table II.
LIN2
11
5
1µF
1µF
G
12
= 0 to 5V
V
15
O
14
13
15
®
XTR112, XTR114
RTD
12
R
LIN1
R
LIN2
13
4
R
G
3
R
Z
2
1
V
LIN
14
I
R1
I
R2
XTR112 XTR114
11
V
REG
10
V+
9
B E
8
I
O
7
IO = 4mA – 20mA
+
V
IN
R
G
R
G
V
IN
I
RET
6
1N4148
+15V
1µF
1µF
0.01µFQ
1
3
2
16
10
11
RCV420
5
4
12
15
14
13
15
ISO124
16
0
–15V
1
10
2
Isolated Power from PWS740
V+
9
7
V
8
0 – 5V
V–
O
NOTE: A three-wire RTD connection is shown.
R
CM
0.01µF
For a two-wire RTD connection, eliminate R
FIGURE 8. Isolated Transmitter/Receiver Loop.
200µA (XTR114) 500µA (XTR112)
13
R
G
.
LIN2
12
1
V
LIN
+
V
IN
4
R
G
3
R
G
I
R1
14
I
R2
V
XTR112 XTR114
REG
11
10
V+
9
B
8
E
(1)
R
CM
FIGURE 9. Bridge Input, Current Excitation.
®
XTR112, XTR114
2
V
IN
I
RET
7
6
NOTE: (1) Use RCM to adjust the common-mode voltage to within
1.25V to 3.5V.
16
PACKAGE OPTION ADDENDUM
www.ti.com
22-Oct-2007
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
XTR112U ACTIVE SOIC D 14 58 Green (RoHS &
no Sb/Br)
XTR112UA ACTIVE SOIC D 14 58 Green (RoHS &
no Sb/Br)
XTR112UAE4 ACTIVE SOIC D 14 58 Green (RoHS &
no Sb/Br)
XTR112UE4 ACTIVE SOIC D 14 58 Green (RoHS &
no Sb/Br)
XTR114U ACTIVE SOIC D 14 58 Green (RoHS &
no Sb/Br)
XTR114UA ACTIVE SOIC D 14 58 Green (RoHS &
no Sb/Br)
XTR114UAE4 ACTIVE SOIC D 14 58 Green (RoHS &
no Sb/Br)
XTR114UE4 ACTIVE SOIC D 14 58 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168HR
CU NIPDAU Level-3-260C-168HR
CU NIPDAU Level-3-260C-168HR
CU NIPDAU Level-3-260C-168HR
CU NIPDAU Level-3-260C-168HR
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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