4−1 GPIO Assignment for Matrix Scan and LED Drive4−1. . . . . . . . . . . . . . . . . . . . .
v
vi
1 Introduction
The TUSB2136 is an integrated universal serial bus (USB) hub with a general-purpose 8052 microcontroller that can
be used for various USB controller applications. The TUSB2136 has 8K × 8 RAM space for application development.
Using a 12-MHz crystal, the onboard oscillator generates the internal system clocks. No additional programming is
required for any part of the hub functions. The device is programmed via an inter-IC (I
on from an EEPROM, or optionally, the application firmware can be downloaded from a host PC via USB. The
8052-based microprocessor allows several third-party standard tools to be used for application development. In
addition, the application code available in the general market can also be used (this may or may not require some
code modification due to hardware variations).
1.1Features
•Multiproduct support with one code and one chip (up to 16 products with one chip)
•Fully compliant with the USB specification as a compound full-speed device: TID #30270119
•Supports 1.5- and 12-Mbits/s USB data rates
•Supports USB suspend/resume and remote wake-up operation
•Integrated two-port hub with individual power management per port
•Integrated 8052 microcontroller with:
−256 × 8 RAM for internal data
−8K × 8 RAM code space available for downloadable firmware from host or I
−512 × 8 shared RAM used for data buffers and endpoint descriptor blocks (EDB) [1]
−Four 8052 GPIO ports (ports 0,1, 2 and 3)
−Master I
−Watchdog timer
2
C controller for external slave device access
2
C) serial interface at power
2
C port.
•Operates from a 12-MHz crystal
•On-chip PLL generates 48 MHz
•Supports a total of three input and three output (interrupt, bulk) endpoints
•Power-down mode
•64-pin TQFP package
[1] This is the buffer space for USB packet transactions.
DM019I/ODifferential data-minus USB port 0: upstream
DM16I/ODifferential data-minus port 1: downstream
DM263I/ODifferential data-minus port 2: downstream
DP018I/ODifferential data-plus USB port 0: upstream
DP17I/ODifferential data-plus port 1: downstream
DP264I/ODifferential data-plus port 2: downstream
GND5, 20, 24,
P3.256I/OGeneral-purpose I/O port 3 bit 2, Schmitt-trigger input, 100-µA active pullup, open-drain output†; INT0
P3.355I/OGeneral-purpose I/O port 3 bit 3, Schmitt-trigger input, 100-µA active pullup, open-drain output
P3.[4:7]54, 53, 52,51I/OGeneral-purpose I/O port 3 bit 4, Schmitt-trigger input, 100-µA active pullup, open-drain output
—Power supply ground
I/OGeneral-purpose I/O port 0 bits 0−7, Schmitt-trigger input, 100-µA active pullup, open-drain output
I/OGeneral-purpose I/O port 1 bits 0−7, Schmitt-trigger input, 100-µA active pullup, open-drain output
I/OGeneral-purpose I/O port 2 bits 0−7, Schmitt-trigger input, 100-µA active pullup, open-drain output
P3.0: General-purpose I/O port 3 bit 0, Schmitt-trigger input, 100-µA active pullup, open-drain output
S0: See Section 2.6.12
RXD: Can be used as a UART interface
I/OP3.1: General-purpose I/O port 3 bit 1, Schmitt-trigger input, 100-µA active pullup, open-drain output
I/OS1: See Section 2.6.12
I/OTXD: Can be used as a UART interface
only used internally (see Section 2.9.4)
†;
may support INT1
input, depending on configuration (see Figure 2−5)
†
†
†
†
†
†
1−4
PUR17OPullup resistor connection pin (3-state); push-pull CMOS output (±8 mA)
PWRO13OPort 1: power on/off control signal; push-pull CMOS output (±8 mA)
PWRO22OPort 2: power on/off control signal; push-pull CMOS output (±8 mA)
RST13IController master reset signal, Schmitt-trigger input, 100-µA active pullup
S28IGeneral-purpose input; can be used for VID/PID selection under firmware control. This input has no
S39IGeneral-purpose input. This input has no internal pullup, so it must be driven/pulled either low or high
SCL12OSerial clock I2C; push-pull output
SDA11I/OSerial data I2C; open-drain output
SELF/BUS21IUSB power MODE select: self powered (HIGH), bus powered (LOW)
SUSP16OSuspend status signal: suspended (HIGH); unsuspended (LOW)
‡
TEST0
‡
TEST1
†
All open-drain output pins can sink up to 8 mA.
‡
The functions controlled by TEST0 and TEST1 are shown in the following table. Because these two pins have internal pullups, they can be left
unconnected for the default mode.
14ITest input 0, Schmitt-trigger input, 100-µA active pullup
15ITest input 1, Schmitt-trigger input, 100-µA active pullup
internal pullup, so it must be driven/pulled either low or high and connot be left unconnected.
and connot be left unconnected.
†
1.5Terminal Functions (Continued)
I/O
DESCRIPTION
TERMINAL
NAMENO.
V
CC
VDD18
VREN38IVoltage regulator enable: enable active LOW; disable active HIGH
X260O12-MHz crystal output
X161I12-MHz crystal input
†
During normal o p e r a t i o n , t h e i n t e r n a l 3 . 3 - t o 1 . 8 - V v o ltage regulator of the TUSB2136 is enabled and provides power to the core. To save power
during the suspend mode, the internal regulator is disabled. In this case, the pin becomes an input, and a simple external power source is required
to provide power to the core. This source needs to supply a very limited amount of power (10 µA maximum) within the voltage range of 1 V to
1.95 V.
NOTE 1: The MCU treats the outputs as open-drain types in that the output can be driven low continuously, but a high output is driven for two
10,39,62—Power supply input, 3.3 V typical
†
371.8 V. When VREN is low, 1.8 V must be applied to provide current for the core during suspend.
clock cycles and then the output is placed in a high-impedance state.
TEST0
00Selects 48-MHz clock input (from an oscillator or other onboard clock source)
01Reserved for testing purposes
10Reserved for testing purposes
11Selects 12-MHz crystal as clock source (default)
TEST1FUNCTION
1.6Revision History
VersionDateChanges
Dec−2000Initial Release
AFeb−20011. Clarified pin descriptions for P3.2 (56), P3.3 (55), and VDDOUT (37).
BJun−20021. Changed name of pin 37 from VDDOUT to VDD18 and enhanced pin description.
CApr−20031. Simplified Terminal Function Table for GPIO Ports
2. Add red/write capability for each of the register bits.
3. Corrected Quiescent and Suspend current figures in Table 3.3.
4. Added Section 4.2 Reset Timing
5. Added NOTE to cover page.
2. Removed NOTE from cover page.
2. Clarified GPIO Port 3 pin descriptions in Terminal Function Table
3. Clarified functional description for Pins S2 and S3 (8 & 9)
5. Added note on open-drain output pins for Terminal Functions Table
6. Added additional note for operation of VDD18 (pin 37) to Terminal Functions Table.
7. Removed most references to ROM version including Fig 2.2.
8. Added USB Logo to Cover page
1−5
1−6
2 Functional Description
2.1MCU Memory Map
Figure 2−1 illustrates the MCU memory map under boot and normal operation. It must be noted that the internal 256
bytes of IDATA are not shown since it is assumed to be in the standard 8052 location (0000 to 00FF). The shaded
areas represent the internal ROM/RAM. For more information regarding the integrated 8052, see the TUSBxxxxMicrocontroller Reference Guide (SLLU044).
When the SDW bit = 0 (boot mode): The 6K ROM is mapped to address (0000−17FF) and is duplicated in location
(8000−97FF) in code space. The internal 8K RAM is mapped to address range (0000−1FFF) in data space. Buffers,
memory-mapped registers (MMRs), and I/O are mapped to address range (FD80−FFFF) in data space.
When the SDW bit = 1 (normal mode): The 6K ROM is mapped to (8000−97FF) in code space. The internal 8K RAM
is mapped to address range (0000−1FFF) code space. Buffers, MMR, and I/O are mapped to address range
(FD80−FFFF) in data space.
0000
17FF
1FFF
8000
97FF
FD80
Boot Mode (SDW = 0)
CODE
6K Boot ROM
6K Boot ROM
XDATA
8K
RAM
Read/Write
512 Bytes
RAM
Normal Mode (SDW = 1)
CODE
8K
Code RAM
Read Only
6K Boot ROM
XDATA
512 Bytes
RAM
FF80
FFFF
MMR
MMR
Figure 2−1. MCU Memory Map (TUSB2136B)
2.2Miscellaneous Registers
2.2.1TUSB2136 Boot Operation
Because the code space is in RAM (with the exception of the boot ROM), the TUSB2136 firmware must be loaded
from an external source. Two options for booting are available: an external serial EEPROM source connected to the
2−1
I2C bus, or the host can be used via the USB. On device reset, the SDW bit (in the ROM register) and the CONT bit
0
SDW
0
5
OVCE
0
6
XINT
0
in the USB control register (USBCTL) are cleared. This configures the memory space to boot mode (see memory
map, Table 2−2) and keeps the device disconnected from the host.
The first instruction is fetched from location 0000 (which is in the 6K ROM). The 8K RAM is mapped to XDATA space
(location 0000h). The MCU executes a read from an external EEPROM and tests to see if it contains the code (test
for boot signature). If it contains the code, the MCU reads from EEPROM and writes to the 8K RAM in XDATA space.
If not, the MCU proceeds to boot from USB.
Once the code is loaded, the MCU sets SDW to 1. This switches the memory map to normal mode, i.e. the 8K RAM
is mapped to code space, and the MCU starts executing from location 0000h. Once the switch is done, the MCU sets
CONT to 1 (in the USBCTL register) This connects the device to the USB, resulting in the normal USB device
enumeration.
2.2.2MCNFG: MCU Configuration Register
This register is used to control the MCU clock rate.
4−1R[3:0]No effect These bits reflect the device revision number.
5OVCE0
6XINT0
7RSV0Reserved
This bit enables/disables boot ROM.
SDW = 0When clear, the MCU executes from the 6K boot ROM space. The boot ROM appears in two
locations: 0000 and 8000h. The 8K RAM is mapped to XDATA space; therefore, read/write
operation is possible. This bit is set by the MCU after the RAM load is completed. The MCU
cannot clear this bit. It is cleared on power-up reset or function reset.
SDW = 1When set by MCU, the 6K boot ROM maps to location 8000h, and the 8K RAM is mapped to
code space, starting at location 0000h. At this point, the MCU executes from RAM, and write
operation is disabled (no write operation is possible in code space).
Hub overcorrect detection enable/disable bit.
OVCE = 0 Hub overcorrect detection is disabled.
OVCE = 1 Hub overcorrect detection is enabled.
INT1 source control bit
XINT = 0INT1 is connected to the P3.3 pin and operates as a standard INT1 interrupt.
XINT = 1INT1 is connected to the OR of port-2 inputs.
2.2.3PUR_n: GPIO Pullup Register for Port n (n = 0 to 3)
PUR_0: GPIO pullup register for port 0
PUR_1: GPIO pullup register for port 1
PUR_2: GPIO pullup register for port 2
PUR_3: GPIO pullup register for port 3
0The MCU can write to this register. If the MCU sets this bit to 1, the pullup resistor is disconnected from
the pin. If the MCU clears this bit to 0, the pullup resistor is connected to the pin. The pullup resistor is
connected to the VCC power supply.
2.2.4INTCFG: Interrupt Configuration
7
WDE
0
76 5 43210
RSVRSVRSVRSVI3I2I1I0
R/OR/OR/OR/OR/WR/WR/WR/W
BITNAMERESETFUNCTION
0−3I[3:0]0010The MCU can write to this register to set the interrupt delay time for port 2 on the MCU. The value of the
4−7RSV0Reserved
lower nibble represents the delay in ms. Default after reset is 2 ms.
2.2.5WDCSR: Watchdog Timer, Control, and Status Register
A watchdog timer (WDT) with 1-ms clock is provided. The watchdog timer only works when a USB start-of-frame has
been detected by the TUSB3210. If this register is not accessed for a period of 32 ms, the WDT counter resets the
MCU (see Figure 2−2, Reset Diagram). When the IDL bit in PCON is set, the WDT is suspended until an interrupt
is detected. At this point, the IDL bit is cleared and the WDT resumes operation. The WDE bit of this register is cleared
only on power-up or USB reset (if enabled). When the MCU writes a 1 to the WDE bit of this register the WDT starts
running.
76 5 43210
WDEWDRRSVRSVRSVRSVRSVWDT
R/WR/WR/OR/OR/OR/OR/OW/O
BITNAMERESETFUNCTION
0WDT0The MCU must write a 1 to this bit to prevent the WDT from resetting the MCU. If MCU does not write a 1 in a
5−1RSV0Reserved
6WDR0
7WDE0
period of 31 ms, the WDT resets the device. Writing a 0 has no effect on the WDT. (The WDT is a 5-bit
counter using a 1-ms CLK). This bit is read as 0.
Watchdog reset indication bit. This bit indicates if the reset occurred due to power-on reset or watchdog
timer reset.
WDR = 0A power-up or USB reset occurred.
WDR = 1A watchdog time-out reset occurred. To clear this bit, the MCU must write a 1. Writing a 0 has
1RSV0Reserved
3−2GF[1:0]00General-purpose bits. The MCU can write and read them.
6−4RSV0Reserved
7SMOD0Double baud-rate control bit. For more information see the UART serial interface in the M8052 core
MCU idle mode bit. This bit can be set by the MCU and is cleared only by the INT1 interrupt.
IDL = 0The MCU is not in idle mode. This bit is cleared by the INT1 interrupt logic when INT1 is
IDL = 1The MCU is in idle mode and RAM is in low-power mode. The oscillator/APLL is off and the
specification.
asserted for at least 400 µs.
WDT is suspended. When in suspend mode, only INT1
and generate an interrupt. INT1
recognized.
must be asserted for at least 400 µs for the interrupt to be
can be used to exit from the idle state
2.3Buffers + I/O RAM Map
The address range from FD80 to FFFF is reserved for data buffers, setup packet, endpoint descriptor blocks (EDB),
and all I/O. RAM space of 512 bytes [FD80−FF7F] is used for EDB and buffers. The FF80−FFFF range is used for
memory-mapped registers (MMR). Table 2−1 represents the internal XDATA space allocation.
Data transfers between USB, MCU and external devices are defined by an endpoint descriptor block (EDB). Four
input and four output EDBs are provided. With the exception of EDB-0 (I/O endpoint 0), all EDBs are located in SRAM
as shown in Table 2−3. Each EDB contains information describing the X and Y buffers. In addition, it provides general
status information.
2−5
Table 2−3. EDB and Buffer Allocations in XDATA
32 bytes
RESERVED
8 bytes
Input endpoint 3: configuration
8 bytes
Input endpoint 2: configuration
8 bytes
Input endpoint 1: configuration
8 bytes
Output endpoint 3: configuration
8 bytes
Output endpoint 2: configuration
8 bytes
Output endpoint 1: configuration
8 bytes
Setup packet block
8 bytes
Input endpoint 0: buffer
8 bytes
Output endpoint 0: buffer
ADDRESSSIZEDESCRIPTION
FF7F
↑
FF60
FF5F
↑
FF58
FF57
↑
FF50
FF4F
↑
FF48
FF47
↑40 bytesRESERVED
FF20
FF1F
↑
FF18
FF17
↑
FF10
FF0F
↑
FF08
FF07
↑
FF00
FEFF
↑
FEF8
FEF7
↑
FEF0
FEEFTop of buffer space
↑
368 bytesBuffers space
FD80Start of buffer space
32 bytesRESERVED
8 bytesInput endpoint 3: configuration
8 bytesInput endpoint 2: configuration
8 bytesInput endpoint 1: configuration
8 bytesOutput endpoint 3: configuration
8 bytesOutput endpoint 2: configuration
8 bytesOutput endpoint 1: configuration
8 bytesSetup packet block
8 bytesInput endpoint 0: buffer
8 bytesOutput endpoint 0: buffer
2−6
Table 2−4 illustrates the EDB entries for EDB-1 to EDB-3. EDB-0 registers are described separately.
2
USBIE
x
3
STALL
0
4
DBUF
x
7
UBME
x
Table 2−4. EDB Entries in RAM (n = 1 to 3)
OffsetENTRY NAMEDESCRIPTION
07EPSIZXY_nI/O endpoint_n: X/Y buffer size
06EPBCTY_nI/O endpoint_n: Y byte count
05EPBBAY_nI/O endpoint_n: Y buffer base address
04SPARENot used
03SPARENot used
02EPBCTX_nI/O endpoint_n: X byte count
01EPBBAX_nI/O endpoint_n: X buffer base address
00EPCNF_nI/O endpoint_n: configuration
2.4.1OEPCNF_n: Output Endpoint Configuration (n = 1 to 3)
76 5 43210
UBMEISOTOGLEDBUFSTALLUSBIERSVRSV
R/WR/WR/WR/WR/WR/WR/OR/O
BITNAMERESETFUNCTION
1−0RSVxReserved = 0
2USBIEx
3STALL0
4DBUFx
5TOGLExUSB toggle bit. This bit reflects the toggle sequence bit of DATA0, DATA1
6ISOxISO = 0Non-isochronous transfer. This bit must be cleared by the MCU because only
7UBMEx
USB interrupt enable on transaction completion. Set/clear by MCU.
USBIE = 0 No interrupt
USBIE = 1 Interrupt on transaction completion
USB stall condition indication. Set/clear by MCU.
STALL = 0 No stall
STALL = 1 USB stall condition. If set by the MCU, a STALL handshake is initiated and the bit is cleared by
the MCU.
Double buffer enable. Set/clear by MCU.
DBUF = 0Primary buffer only (X-buffer only)
DBUF = 1Toggle bit selects buffer
non-isochronous transfer is supported.
USB buffer manager (UBM) enable/disable bit. Set/clear by MCU.
UBME = 0 UBM cannot use this endpoint.
UBME = 1 UBM can use this endpoint.
2.4.2OEPBBAX_n: Output Endpoint X-Buffer Base-Address (n = 1 to 3)
76 5 43210
A
10
R/WR/WR/WR/WR/WR/WR/WR/W
BITNAMERESETFUNCTION
7−0A[10:3]xA[10:3] of X-buffer base address (padded with 3 LSB of zeros for a total of 11-bits). This value is set by the
A
9
A
8
A
7
MCU. UBM or DMA uses this value as the start address of a given transaction. Furthermore, UBM or DMA
does not change this value at the end of a transaction.
A
6
A
5
A
4
A
3
2−7
2.4.3OEPBCTX_n: Output Endpoint X-Byte Count (n = 1 to 3)
76 5 43210
NAKC
R/WR/WR/WR/WR/WR/WR/WR/W
BITNAMERESETFUNCTION
6−0C[6:0]xX-buffer byte count:
7NAKxNAK= 0 No valid data in buffer. Ready for host out
NAK= 1 Buffer contains a valid packet from host (host-out request is NAK)
C
3
C
2
C
1
C
0
2.4.4OEPBBAY_n: Output Endpoint Y-Buffer Base-Address (n = 1 to 3)
76 5 43210
A
10
R/WR/WR/WR/WR/WR/WR/WR/W
BITNAMERESETFUNCTION
7−0A[10:3]xA[10:3] of Y-buffer base address (padded with 3 LSB of zeros for a total of 11 bits). This value is set by the
A
9
A
8
A
7
MCU. UBM or DMA uses this value as the start address of a given transaction. Furthermore, UBM or DMA
does not change this value at the end of a transaction.
A
6
A
5
A
4
A
3
2.4.5OEPBCTY_n: Output Endpoint Y-Byte Count (n = 1 to 3)
76 5 43210
NAKC
R/WR/WR/WR/WR/WR/WR/WR/W
BITNAMERESETFUNCTION
6−0C[6:0]xY -buffer byte count:
7NAKxNAK= 0 No valid data in buffer. Ready for host out
2.4.7IEPCNF_n: Input Endpoint Configuration (n = 1 to 3)
76 5 43210
UBME
R/WR/WR/WR/WR/WR/WR/OR/O
BITNAMERESETFUNCTION
1−0RSVxReserved = 0
2USBIEx
3STALL0
4DBUFx
5TOGLExUSB toggle bit. This bit reflects the toggle sequence bit of DATA0, DATA1
6ISOxISO = 0Non-isochronous transfer. This bit must be cleared by the MCU because only
7UBMEx
ISOTOGLEDBUFSTALLUSBIERSVRSV
USB interrupt enable on transaction completion
USBIE = 0 No interrupt
USBIE = 1 Interrupt on transaction completion
USB stall condition indication. Set by UBM, but can be set/cleared by the MCU.
STALL = 0 No stall
STALL = 1 USB stall condition. If set by the MCU, a ST ALL handshake is initiated and the bit is cleared
automatically.
Double buffer enable
DBUF = 0Primary buffer only (X-buffer only)
DBUF = 1Toggle bit selects buffer
non-isochronous transfer is supported.
UBM enable/disable bit. Set/clear by MCU.
UBME = 0 UBM cannot use this endpoint.
UBME = 1 UBM can use this endpoint.
2.4.8IEPBBAX_n: Input Endpoint X-Buffer Base-Address (n = 1 to 3)
76 5 43210
A
10
R/WR/WR/WR/WR/WR/WR/WR/W
BITNAMERESETFUNCTION
7−0A[10:3]xA[10:3] of X-buffer base address (padded with 3 LSB of zeros for a total of 11 bits). This value is set by the
A
9
A
8
A
7
MCU. UBM or DMA uses this value as the start-address of a given transaction. Furthermore, UBM or DMA
does not change this value at the end of a transaction.
A
6
A
5
A
4
A
3
2−9
2.4.9IEPBCTX_n: Input Endpoint X-Byte Count (n = 1 to 3)
76 5 43210
NAKC
R/WR/WR/WR/WR/WR/WR/WR/W
BITNAMERESETFUNCTION
6−0C[6:0]xX-buffer byte count:
7NAKxNAK = 0 Buffer contains a valid packet for host-in transaction
7−0A[10:3]xA[10:3] of Y-buffer base address (padded with 3 LSB of zeros for a total of 11 bits). This value is set by the
A
9
A
8
A
7
MCU. UBM or DMA uses this value as the start-address of a given transaction. Furthermore, UBM or DMA
does not change this value at the end of a transaction.
Unlike EDB-1 to EDB-3, which are defined as memory entries in SRAM, endpoint-0 is described by a set of 4 registers
(two for output and two for input). Table 2−5 defines the registers and their respective addresses used for EDB-0
description. EDB-0 has no Base-Address Register, because these addresses are hardwired to FEF8 and FEF0. Note
that the bit positions have been preserved to provide consistency with EDB-n (n = 1 to 3).
4RSV0Reserved = 0
5TOGLE0USB toggle bit. This bit reflects the toggle sequence bit of DATA0, DATA1.
6RSV0Reserved = 0
7UBME0
RSVTOGLERSVSTALLUSBIERSVRSV
USB interrupt enable on transaction completion. Set/clear by MCU.
USBIE = 0 No interrupt
USBIE = 1 Interrupt on transaction completion
USB stall condition indication. Set/clear by MCU.
STALL = 0 No stall
STALL = 1 USB stall condition. If set by the MCU, a ST ALL handshake is initiated and the bit is cleared
automatically by the next setup transaction.
UBM enable/disable bit. Set/clear by MCU.
UBME = 0 UBM cannot use this endpoint.
UBME = 1 UBM can use this endpoint.
5TOGLE0USB toggle bit. This bit reflects the toggle sequence bit of DATA0, DATA1.
6RSV0Reserved = 0
7UBME0
RSVTOGLERSVSTALLUSBIERSVRSV
USB interrupt enable on transaction completion. Set/clear by MCU.
USBIE = 0 No interrupt
USBIE = 1 Interrupt on transaction completion
USB stall condition indication. Set/clear by MCU.
STALL = 0 No stall
STALL = 1 USB stall condition. If set by the MCU, a ST ALL handshake is initiated and the bit is cleared
automatically.
UBM enable/disable bit. Set/clear by MCU.
UBME = 0 UBM cannot use this endpoint.
UBME = 1 UBM can use this endpoint.
0111b ³ Count = 7
1000b ³ Count = 8
1001b to 1111b are reserved. (If used, defaults to 8)
6−4RSV0Reserved = 0
7NAK1NAK= 0 No valid data in buffer. Ready for host out
NAK= 1 Buffer contains a valid packet from the host (NAK the host).
3
C
2
C
1
C
2.6USB Registers
2.6.1FUNADR: Function Address Register
This register contains the device function address.
76 5 43210
RSVFA6FA5FA4FA3FA2FA1FA0
R/OR/WR/WR/WR/WR/WR/WR/W
0
BITNAMERESETFUNCTION
6−0FA[6:0]0000000These bits define the current device address assigned to the function. The MCU writes a value to this
7RSV0Reserved = 0
register as a result of the SET-ADDRESS host command.
2−13
2.6.2USBSTA: USB Status Register
5
RESR
0
6
SUSR
0
All bits in this register are set by the hardware and are cleared by the MCU when writing a 1 to the proper bit location
(writing a 0 has no effect). In addition, each bit can generate an interrupt if its corresponding mask bit is set (R/C
notation indicates read and clear only by the MCU).
76 5 43210
RSTRSUSRRESRPWOFFPWONSETUPRSVSTPOW
R/CR/CR/CR/CR/CR/CR/OR/C
BITNAMERESETFUNCTION
0STPOW0
1RSV0Reserved = 0
2SETUP0
3PWON0
4PWOFF0
5RESR0
6SUSR0
7RSTR0
SETUP overwrite bit. Set by hardware when a setup packet is received while there is already a packet in the
setup buffer.
STPOW = 0The MCU can clear this bit by writing a 1. (Writing a 0 has no effect.)
STPOW = 1SETUP overwrite
SETUP transaction received bit.
As long as SETUP is 1, IN and OUT on endpoint-0 are NAK regardless of the value of their real NAK bits.
SETUP = 0The MCU can clear this bit by writing a 1. (Writing a 0 has no effect.)
SETUP = 1SETUP transaction received.
Power on request for port 3.
This bit indicates if power-on to port 3 has been received. This bit generates a PWON interrupt (if enabled).
PWON = 0The MCU can clear this bit by writing a 1. (Writing a 0 has no effect.)
PWON = 1Power on to port 3 has been received.
Power off request for port 3. This bit indicates whether power-off to port 3 has been received. This bit
generates a PWOFF interrupt (if enabled).
PWOFF = 0The MCU can clear this bit by writing a 1. (Writing a 0 has no effect.)
PWOFF = 1Power off to port 3 has been received.
Function resume request bit
RESR = 0The MCU can clear this bit by writing a 1. (Writing a 0 has no effect.)
RESR = 1Function resume is detected.
Function suspended request bit. This bit is set in response to a global or selective suspend condition.
SUSR = 0The MCU can clear this bit by writing a 1. (Writing a 0 has no effect.)
SUSR = 1Function suspend is detected.
Function reset request bit. This bit is set in response to the host initiating a port reset. This bit is not af fected
by a USB function reset.
RSTR = 0The MCU can clear this bit by writing a 1. (Writing a 0 has no effect.)
RSTR = 1Function reset is detected.
Unlike the other registers, this register is cleared by the power-up-reset signal only . The USB reset cannot reset this
register (see the reset diagram in Figure 2−2).
76 5 43210
CONT
R/WR/WR/WR/WR/WR/WR/WR/W
BITNAMERESETFUNCTION
0DIR0
1SIR0
2B/S0
3RWE0
4FRSTE1
5RWUP0
6U1/20
7CONT0
U1/2RWUPFRSTERWEB/SSIRDIR
As a response to a setup packet, the MCU decodes the request and sets or clears this bit to reflect the data
transfer direction.
DIR = 0USB data OUT transaction (from host to TUSB2136)
DIR = 1USB data IN transaction (from TUSB2136 to host)
SETUP interrupt status bit. This bit is controlled by the MCU to indicate to the hardware when SETUP
interrupt is being served.
SIR = 0SETUP interrupt is not served. The MCU clears this bit before exiting the SETUP interrupt
routine.
SIR = 1SETUP interrupt is in progress. The MCU sets this bit when servicing the SETUP interrupt.
Bus/self power control bit
B/S = 0The device is bus powered.
B/S = 1The device is self powered.
Remote wake-up enable bit
RWE = 0The MCU clears this bit when the host sends a command to clear the feature.
RWE = 1The MCU writes 1 to this bit when the host sends set device feature command to enable the
remote wake-up feature.
Function reset connection bit. This bit connects/disconnects the USB function reset from the MCU reset.
FRSTE = 0 Function reset is not connected to MCU reset.
FRSTE = 1 Function reset is connected to MCU reset.
Device remote wake-up request. This bit is set by the MCU and is cleared automatically.
RWUP = 0 Writing a 0 to this bit has no effect.
RWUP = 1 When the MCU writes a 1, a remote wake-up pulse is generated.
USB hub version
U1/2 = 0This is a USB1.x hub.
U1/2 = 1This is a USB2.x hub.
Connect/disconnect bit
CONT = 0Upstream port is disconnected. Pullup disabled.
CONT = 1Upstream port is connected. Pullup enabled.
5−4P3[1:0]00Hub port-3 embedded-function control field
6I/G0
7OCP0
Hub port-1 enable/disable control bit
P1E = 0Port 1 is disabled.
P1E = 1Port 1 is enabled.
Hub port−1; permanent attachment control bit.
P1A = 0Port 1 is connected to a removable function.
P1A = 1Port 1 is connected to a permanent attachment function.
Hub port-2 enable/disable control bit
P2E = 0Port 2 is disabled.
P2E = 1Port-2 is enabled.
Hub port-2 permanent-attachment control bit
P2A = 0Port 2 is connected to a removable function.
P2A = 1Port 2 is connected to a permanent-attachment function.
00b = Port 3 is disabled (doesn’t exist).
01b = Port 3 is permanently attached.
10b = Port 3 is connected to a removable function, but is not attached.
11b = Port 3 is connected to a removable function, and is attached.
Individual/gang power control bit
I/G = 0Overcurrent and power control are controlled individually.
I/G = 1Overcurrent and power control are gang controlled.
Overcurrent protection control bit
OCP = 0Overcurrent protection is disabled.
OCP = 1Overcurrent protection is enabled.
2.6.6HUBPOTG: Hub Power-On to Power-Good Descriptor Register
This register is used to read the value on four external pins. The firmware can use this value to select one of the vendor
identification/product identifications (VID/PID) stored in memory. The TUSB2136 supports up to 16 unique VID/PIDs
with application code to support different products. This provides a unique opportunity for original equipment
manufacturers (OEMs) to have one device to support up to 16 dif ferent product lines by using S0−S3 to select VID/PID
and behavioral application code for the selected product.
3−0S[3:0]xVID/PID selection bits. These bits reflect the status of the external pins as defined by Table 2−6. Note that a
7−4RSV0Reserved = 0
pin tied low is reflected as a 0 and a pin tied high is reflected as a 1.
2−18
Table 2−6. External Pins Mapping to S[3:0] in VIDSTA Register
COMMENTS
VIDSTA REGISTERPIN
S[3:0]NO.NAME
S058P3.0Dual function, P3.0 I/O or S0 input
S157P3.1Dual function, P3.1 I/O or S1 input
S28S2S2-pin is input
S39S3S3-pin is input
2.7Function Reset and Power-Up Reset Interconnect
Figure 2−2 represents the logical connection of USB-function reset (USBR) and power-up reset (RST) pins. The
internal RESET
can be enabled or disabled by the FRSTE bit in the USBCTL register (on power up FRSTE = 0). The internal RESET
is used to reset all registers and logic, with the exception of the USBCTL and MISCTL registers. The USBCTL and
MCU configuration registers (MCNFG) are cleared by the PURS
signal is generated from the RST pin (PURS signal) or from the USB reset (USBR signal). The USBR
signal only.
USBCTL Register
MCNFG Register
All Internal MMR
RST
WDT Reset
WDE
PURS
USBR
RESET
USB Function Reset
FRSTE
MCU
Figure 2−2. Reset Diagram
2.8Pullup Resistor Connect/Disconnect
After reading firmware into RAM, the TUSB2136 can reenumerate using the new firmware (no need to physically
disconnect and re-connect the cable). Figure 2−3 shows an equivalent circuit implementation for Connect and
Disconnect from a USB upstream port (also see Figure 4−4b). When the CONT bit in the USBCTL register is 1, the
CMOS driver sources V
(high speed). When the CONT bit is 0, the PUR pin is driven low . In this state, the 1.5-kΩ resistor is connected to GND,
resulting in device disconnection state. The PUR driver is a CMOS driver that can provide V
8-mA source current.
DD to the pullup resistor (PUR pin), presenting a normal connect condition to the USB hub
All seven 8052-standard interrupt sources are preserved. SIE is the standard interrupt enable register, which controls
the seven interrupt sources. All the additional interrupt sources are connected together as an OR to generate INT0
The INT0
signal is provided to interrupt the MCU (see interrupt connection diagram, Figure 2−4).
Table 2−7. 8052 Interrupt Location Map
INTERRUPT
SOURCE
ET2Timer-2 interrupt002BH
ESUART interrupt0023H
DESCRIPTIONSTART
ADDRESS
COMMENTS
.
ET1Timer-1 interrupt001BH
EX1Internal INT1 or INT10013HUsed for P2[7:0] interrupt
ET0Timer-0 interrupt000BH
EX0Internal INT00003HUsed for all internal peripherals
Reset0000H
2−20
2.9.18052 Standard Interrupt Enable Register
0
INT0
0
1
ET0
0
2
EX1
0
3
ET1
0
4ES0
5
ET2
0
7EA0
76 5 43210
EARSVET2ESET1EX1ET0INT0
R/WR/OR/OR/WR/WR/WR/WR/W
BITNAMERESETFUNCTION
0INT00
1ET00
2EX10
3ET10
4ES0
5ET20
6RSV0Reserved
7EA0
Enable or disable external interrupt-0
EX0 = 0External interrupt-0 is disabled.
EX0 = 1External interrupt-0 is enabled.
Enable or disable timer-0 interrupt
ET0 = 0Timer-0 interrupt is disabled.
ET0 = 1Timer-0 interrupt is enabled.
Enable or disable external interrupt-1
EX1 = 0External interrupt-1 is disabled.
EX1 = 1External interrupt-1 is enabled.
Enable or disable timer-1 interrupt
ET1 = 0Timer-1 interrupt is disabled.
ET1 = 1Timer-1 interrupt is enabled.
Enable or disable serial port interrupts
ES = 0Serial port interrupt is disabled.
ES = 1Serial port interrupt is enabled.
Enable or disable timer-2 interrupt
ET2 = 0Timer-2 interrupt is disabled.
ET2 = 1Timer-2 interrupt is enabled.
Enable or disable all interrupts (global disable)
EA = 0Disable all interrupts.
EA = 1Each interrupt source is individually controlled.
2.9.2Additional Interrupt Sources
All nonstandard 8052 interrupts (USB, I2C, etc.) are connected as an OR to generate an internal INT0. It must be
noted that the external INT0
interrupt (not edge-triggered). A vector interrupt register is provided to identify all interrupt sources (see vector
interrupt register definition, Section 2.9.3). Up to 64 interrupt vectors are provided. It is the responsibility of the MCU
to read the vector and dispatch the proper interrupt routine.
and INT1 are not used. Furthermore, INT0 must be programmed as an active-low level
2−21
2.9.3VECINT: Vector Interrupt Register
This register contains a vector value identifying the internal interrupt source that trapped to location 0003h. Writing
any value to this register removes the vector and updates the next vector value (if another interrupt is pending). Note
that the vector value is offset. Therefore, its value is in increments of two (bit 0 is set to 0). When no interrupt is pending,
the vector is set to 00h. Table 2−8 is a table of the vector interrupt values. As shown, the interrupt vector is divided
into two fields, I[2:0] and G[3:0]. The I-field defines the interrupt source within a group (on a first-come, first-served
basis) and the G-field defines the group number. Group G0 is the lowest and G15 is the highest priority.
76 5 43210
G3
R/WR/WR/WR/WR/WR/WR/WR/O
BITNAMERESETFUNCTION
3−1I[2:0]000This field defines the interrupt source in a given group. See Table 2−8, Vector Interrupt Values.
7−4G[3:0]0000This field defines the interrupt group. I[2:0] and G[3:0] combine to produce the actual interrupt vector.
G2G1G0I2I1I00
Bit 0 is always 0; therefore, vector values are offset by two.
Figure 2−4 represents the logical connection of the interrupt sources and the relation of the logical connection with
INT0
. The priority encoder generates an 8-bit vector, corresponding to 64 interrupt sources (not all are used). The
interrupt priorities are hard wired. V ector 46h is the highest and 12h is the lowest. Table 2−8 lists the interrupt source
for each valid interrupt vector.
Interrupts
Priority
Encoder
46h
Interrupt Sources
L
12h
Vector
INT0
Figure 2−4. Internal Vector Interrupt (INT0)
2.9.5P2[7:0] Interrupt (INT1)
Figure 2−5 illustrates the conceptual port-2 interrupt. All port-2 input signals are connected in a logical OR to generate
the INT1
addition, INT1
the MCU configuration register (MCNFG) is used to select the EX1 interrupt source. When XINT = 0, P3.3 is the
source, and when XINT = 1, P2[7:0] is the source.
interrupt. Note that the inputs are active low and INT1 is programmed as a level-triggered interrupt. In
is connected to the suspend/resume logic for remote wake-up support. As illustrated, the XINT bit in
P2[7:0]
INT1
P3.3
Suspend/
Resume
Logic
XINT Bit
Figure 2−5. P2[7:0] Input Port Interrupt Generation
2−23
2.10 I2C Registers
2
TIE
0
4
1/4
0
6
RIE
0
The TUSB2136 only supports a master-slave relationship; therefore, it does not support bus arbitration.
2.10.1 I2CSTA: I2C Status and Control Register
This register is used to control the stop condition for read and write operations. In addition, it provides transmitter and
receiver handshake signals with their respective interrupt enable bits.
76 5 43210
RXF
R/CR/WR/CR/WR/CR/WR/WR/W
BITNAMERESETFUNCTION
0SWR0
1SRD0
2TIE0
3TXE1
41/40
5ERR0
6RIE0
7RXF0
RIEERR1/4TXETIESRDSWR
Stop write condition. This bit defines whether the I2C controller generates a stop condition when data from
the I2CDAO register is transmitted to an external device.
SWR = 0 Stop condition is not generated when data from I2CDAO register is shifted out to an external
device.
SWR = 1 Stop condition is generated when data from I2CDAO register is shifted out to an external device.
Stop read condition. This bit defines whether the I2C controller generates a stop condition when data is
received and loaded into I2CDAI register.
SRD = 0Stop condition is not generated when data from SDA line is shifted into the I2CDAI register.
SRD = 1Stop condition is generated when data from SDA line is shifted into the I2CDAI register.
I2C transmitter empty interrupt enable
TIE = 0Interrupt disabled
TIE = 1Interrupt enabled
I2C transmitter empty. This bit indicates that data can be written to the transmitter. It can be used for polling or
it can generate an interrupt.
TXE = 0Transmitter is full. This bit is cleared when the MCU writes a byte to I2CDAO register.
TXE = 1Transmitter is empty. The I2C controller sets this bit when the content of the I2CDAO register is
copied to the SDA shift register.
Bus speed selection
1/4 = 0100-kHz bus speed
1/4 = 1400-kHz bus speed
Bus error condition. This bit is set by the hardware when the device does not respond. It is cleared by the
MCU.
ERR = 0No bus error
ERR = 1Bus error condition has been detected. Clears when MCU writes a 1. Writing a 0 has no effect.
I2C receiver ready interrupt enable
RIE = 0Interrupt disabled
RIE = 1Interrupt enabled
I2C receiver full. This bit indicates that the receiver contains new data. It can be used for polling or it can
generate an interrupt.
RXF = 0Receiver is empty. This bit is cleared when MCU reads the I2CDAI register.
RXF = 1Receiver contains n e w d a t a . T h i s bit is set by the I2C controller when the received serial data has
been loaded into I2CDAI register.
2−24
2.10.2 I2CADR: I2C Address Register
0
R/W
0
This register holds the device address and the read/write command bit.
76 5 43210
A
6
R/WR/WR/WR/WR/WR/WR/WR/W
BITNAMERESETFUNCTION
0R/W0
7−1A[6:0]0000000Seven address bits for device addressing
This register holds the received data from an external device.
76 5 43210
D
7
R/OR/OR/OR/OR/OR/OR/OR/O
BITNAMERESETFUNCTION
7−0D[7:0]08-bit input data from an I2C device
D
6
D
5
D
4
D
3
D
2
D
1
D
2.10.4 I2CDAO: I2C Data-Output Register
0
This register holds the data to be transmitted to an external device. Writing to this register starts the transfer on the
SDA line.
76 5 43210
D7
R/WR/WR/WR/WR/WR/WR/WR/W
BITNAMERESETFUNCTION
7−0D[7:0]08-bit output data to an I2C device
D6D5D4D3D2D1D0
2.11 Read/Write Operations
2.11.1 Read Operation (Serial EEPROM)
A serial read requires a dummy byte write sequence to load in the 16-bit data word address. Once the device address
word and data word are clocked out and acknowledged by the device, the MCU starts a current address sequence.
The following describes the sequence of events to accomplish this transaction:
Device Address + EEPROM [high byte]
•The MCU sets I2CSTA[SRD] = 0. This prevents the I
content of the I2CDAI register is received.
•The MCU sets I2CSTA[SWR] = 0. This prevents the I
the content of the I2CDAO register is transmitted.
•The MCU writes the device address (R/W bit = 0) to the I2CADR register (write operation).
2
C controller from generating a stop condition after the
2
C controller from generating a stop condition after
•The MCU writes the high byte of the EEPROM address into the I2CDAO register, starting the transfer on
the SDA line.
2−25
•The TXE bit in I2CSTA is cleared, indicating busy.
•The content of the I2CADR register is transmitted to the EEPROM (preceded by start condition on SDA).
•The content of the I2CDAO register is transmitted to the EEPROM (EEPROM address).
•The TXE bit in I2CSTA is set, and interrupts the MCU, indicating that the I2CDAO register has been
transmitted.
•No stop condition is generated.
EEPROM [low byte]
•The MCU writes the low byte of the EEPROM address into the I2CDAO register.
•The TXE bit in I2CSTA is cleared, indicating busy.
•The content of the I2CDAO register is transmitted to the device (EEPROM address).
•The TXE bit in I2CSTA is set, and interrupts the MCU, indicating that the I2CDAO register has been
transmitted.
•This completes the dummy write operation. At this point, the EEPROM address is set and the MCU can
perform a single or a sequential read operation.
2.11.2 Current Address Read Operation
Once the EEPROM address is set, the MCU can read a single byte by executing the following steps:
1. The MCU sets I2CSTA[SRD] = 1, forcing the I
register is received.
2
C controller to generate a stop condition after the I2CDAI
2. The MCU writes the device address (R/W bit = 1) to the I2CADR register (read operation).
3. The MCU writes a dummy byte to the I2CDAO register, starting the transfer on the SDA line.
4. The RXF bit in I2CSTA is cleared.
5. The content of the I2CADR register is transmitted to the device, preceded by a start condition on SDA.
6. Data from the EEPROM is latched into the I2CDAI register (stop condition is transmitted).
7. The RXF bit in I2CSTA is set, and interrupts the MCU, indicating that the data is available.
8. The MCU reads the I2CDAI register. This clears the RXF bit (I2CSTA[RXF] = 0).
2.11.3 Sequential Read Operation
Once the EEPROM address is set, the MCU can execute a sequential read operation by executing the following steps
(Note: this example illustrates a 32-byte sequential read):
1. Device Address
•The MCU sets I2CSTA[SRD] = 0. This prevents the I
the I2CDAI register is received.
•The MCU writes the device address (R/W bit = 1) to the I2CADR register (read operation).
•The MCU writes a dummy byte to the I2CDAO register, starting the transfer on the SDA line.
•The RXF bit in I2CSTA is cleared.
•The content of the I2CADR register is transmitted to the device (preceded by a start condition on SDA).
2
C controller from generating a stop condition after
2−26
2. N-Byte Read (31 bytes)
•Data from the device is latched into the I2CDAI register (stop condition is not transmitted).
•The RXF bit in I2CSTA is set, and interrupts the MCU, indicating that data is available.
•The MCU reads the I2CDAI register, clearing the RXF bit (I2CSTA[RXF] = 0).
•This operation repeats 31 times.
3. Last-Byte Read (byte 32)
2
•The MCU sets I2CST A[SRD] = 1. This forces the I
C controller to generate a stop condition after the
I2CDAI register is received.
•Data from the device is latched into the I2CDAI register (stop condition is transmitted).
•The RXF bit in I2CSTA is set, and interrupts the MCU, indicating that data is available.
•The MCU reads the I2CDAI register, clearing the RXF bit (I2CSTA[RXF] = 0).
2.11.4 Write Operation (Serial EEPROM)
The byte write operation involves three phases: 1) device address + EEPROM [high byte] phase, 2) EEPROM [low
byte] phase, and 3) EEPROM [DATA]. The following describes the sequence of events to accomplish the byte write
transaction:
Device Address + EEPROM [high byte]
2
•The MCU sets I2CSTA[SWR] = 0. This prevents the I
the content of the I2CDAO register is transmitted.
•The MCU writes the device address (R/W bit = 0) to the I2CADR register (write operation).
C controller from generating a stop condition after
•The MCU writes the high byte of the EEPROM address into the I2CDAO register, starting the transfer on
the SDA line.
•The TXE bit in I2CSTA is cleared, indicating busy.
•The content of the I2CADR register is transmitted to the device (preceded by a start condition on SDA).
•The content of the I2CDAO register is transmitted to the device (EEPROM high-address).
•The TXE bit in I2CSTA is set, and interrupts the MCU, indicating that the I2CDAO register has been
transmitted.
EEPROM [low byte]
•The MCU writes the low byte of the EEPROM address into the I2CDAO register.
•The TXE bit in I2CSTA is cleared, indicating busy.
•The content of the I2CDAO register is transmitted to the device (EEPROM address).
•The TXE bit in I2CSTA is set, and interrupts the MCU, indicating that the I2CDAO register has been
transmitted.
2−27
EEPROM [DATA]
2
•The MCU sets I2CST A[SWR] = 1. This forces the I
C controller to generate a stop condition after the content
of the I2CDAO register is transmitted.
•The MCU writes the DATA to be written to the EEPROM into the I2CDAO register.
•The TXE bit in I2CSTA is cleared, indicating busy.
•The content of the I2CDAO register is transmitted to the device (EEPROM data).
•The TXE bit in I2CSTA is set, and interrupts the MCU, indicating that the I2CDAO register has been
transmitted.
2
•The I
C controller generates a stop condition after the content of the I2CDAO register is transmitted.
2.11.5 Page Write Operation
The page write operation is initiated the same way as byte write, with the exception that a stop condition is not
generated after the first EEPROM [DATA] is transmitted. The following describes the sequence of writing 32 bytes
in page mode:
Device Address + EEPROM [high byte]
2
•The MCU sets I2CSTA[SWR] = 0. This prevents the I
the content of the I2CDAO register is transmitted.
•The MCU writes the device address (R/W bit = 0) to the I2CADR register (write operation).
•The MCU writes the high byte of the EEPROM address into the I2CDAO register.
C controller from generating a stop condition after
•The TXE bit in I2CSTA is cleared, indicating busy.
•The content of the I2CADR register is transmitted to the device (preceded by a start condition on SDA).
•The content of the I2CDAO register is transmitted to the device (EEPROM address).
•The TXE bit in I2CSTA is set, and interrupts the MCU, indicating that the I2CDAO register has been sent.
EEPROM [low byte]
•The MCU writes the low byte of the EEPROM address into the I2CDAO register.
•The TXE bit in I2CSTA is cleared, indicating busy.
•The content of the I2CDAO register is transmitted to the device (EEPROM address).
•The TXE bit in I2CSTA is set, and interrupts the MCU, indicating that the I2CDAO register has been sent.
31 Bytes EEPROM [DATA]
•The MCU writes the DATA to be written to the EEPROM into the I2CDAO register.
•The TXE bit in I2CSTA is cleared, indicating busy.
•The content of the I2CDAO register is transmitted to the device (EEPROM data).
•The TXE bit in I2CSTA is set, and interrupts the MCU, indicating that the I2CDAO register has been sent.
•This operation repeats 31 times.
2−28
Last Byte EEPROM [DATA]
2
•The MCU sets I2CST A[SWR] = 1. This forces the I
C controller to generate a stop condition after the content
of the I2CDAO register is transmitted.
•The MCU writes the last DATA byte to be written to the EEPROM into the I2CDAO register.
•The TXE bit in I2CSTA is cleared, indicating busy.
•The content of the I2CDAO register is transmitted to the EEPROM (EEPROM data).
•The TXE bit in I2CSTA is set, and interrupts the MCU, indicating that the I2CDAO register has been sent.
2
•The I
C controller generates a stop condition after the content of the I2CDAO register is transmitted.
2−29
2−30
3 Electrical Specifications
3.1Absolute Maximum Ratings Over Operating Free-Air Temperature Range
(unless otherwise noted)
Supply voltage, V
Input voltage, V
Output voltage, V
Input clamp current, I
Output clamp current, I
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , a nd
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
3.3Electrical Characteristics, TA = 25°C, VCC = 3.3 V ± 0.3 V, GND = 0 V
PARAMETERTEST CONDITIONSMINNOMMAXUNIT
V
OH
V
OL
V
IT+
V
IT−
V
hys
I
IH
I
IL
I
OZ
C
I
C
O
I
CC
I
CCx
I
CCx
High-level output voltageI
Low-level output voltageI
Positive input threshold voltageVI = V
Negative input threshold voltageVI = V
Hysteresis (V
High-level input currentVI = V
Low-level input currentVI = V
Output leakage current (Hi-Z)VI = VCC or V
Input capacitance5pF
Output capacitance7pF
Quiescent2545mA
Suspend45µA
1.8 Suspend 1.8 VDD1µA
IT+
− V
)VI = V
IT−
= –4 mAV
OH
= 4 mA0.5V
OL
IH
IL
IH
IH
IL
SS
–0.5V
CC
0.8V
1V
±1µA
±1µA
10µA
2V
3−1
3−2
4 Application
V
4.1Keyboard Section
Table 4−1 outlines the GPIO assignment for the switch-matrix scanning and for keyboard LED drive. Figure 4−1
illustrates the port-3 pins that are assigned to drive the four keyboard LEDs. As shown, P3[5:2] can sink up to 12 mA
(open-drain output) on each pin. Figure 4−2 illustrates the 18 outputs (open-drain) and the 8 inputs (internal pullups)
that are used for the switch-matrix scanning. Figure 4−3 illustrates the partial connection bus power mode. Figure
4−4 shows the USB upstream connection, and Figure 4−5 illustrates the downstream connection (only one port
shown).
Table 4−1. GPIO Assignment for Matrix Scan and LED Drive
GPIOI/O
P0[7:0]O8-bit matrix-scan outputs
P1[7:0]O8-bit matrix-scan outputs
P3.6O1-bit matrix-scan output
P3.7O1-bit matrix-scan output
P2[7:0]I8-bit matrix-scan inputs
P3.2OKeyboard LED-1
P3.3OKeyboard LED-2
P3.4OKeyboard LED-3
P3.5OKeyboard LED-4
P3.0I/OGPIO (Not used for keyboard)
P3.1I/OGPIO (Not used for keyboard)
TUSB2136
P3.2
P3.3
P3.4
P3.5
Figure 4−1. Keyboard LED Connection
CC
4−1
TUSB2136
PUR
8
P0[7:0]
8
P1[7:0]
1
P3.6
1
P3.7
8
P2[7:0]
18 × 8 Matrix
Figure 4−2. Keyboard Matrix Scan Connection
5 V
C1
TPS76333
VR
C2
PS
C5
SCL
SDA
V
CC
V
CC
R1
R2
C3
R3
V
CC
V
CC
V
reg
VREN
SUSP
C4
X1X2
TUSB2136
PWR OVCR
TPS2042
Figure 4−3. Partial Connection Bus Power Mode
3.3 V
Bus PWR
(5 V)
R4
I2C
EEPROM
R5
4−2
1.5 kΩ
DP0
DM0
D+
D−
1.5 kΩ
DP0
DM0
(a)(b)
D+
D−
Figure 4−4. Upstream Connection (a) Non-Switching Power Mode (b) Switching Power Mode
D+
5 V
To Power Switch
D−
R1
R2
DP1
DM1
15 kΩ
GND
15 kΩ
Figure 4−5. Downstream Connection − Only One Port Shown
4.2Reset Timing
There are two requirements for the reset signal timing. First, the reset window should be between 100 ms and 10 ms.
At power up, this time is measured from the time the power ramps up to 90% of the nominal V
goes high (above 1.2 V). The second requirement is that the clock has to be valid during the last 60 ms of the reset
window. These two requirements are depicted in Figure 4−6. Notice that when using a 12-MHz crystal or the 48-MHz
oscillator, the clock signal may take several milliseconds to ramp up and become valid after power up. Therefore, the
reset window may need to be elongated up to 10 ms to ensure that there is a 60-ms overlap with a valid clock.
V
3.3 V
90%
1.2 V
CC
CLK
RESET
until the reset signal
CC
0 V
>60 µs
100 µs < RESET TIME < 10 ms
Figure 4−6. Reset Timing
t
4−3
4−4
PACKAGE OPTION ADDENDUM
www.ti.com
20-Mar-2008
PACKAGING INFORMATION
Orderable DeviceStatus
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
TUSB2136PMACTIVELQFPPM64160 Green (RoHS &
no Sb/Br)
TUSB2136PMG4ACTIVELQFPPM64160Green(RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-3-260C-168 HR
CU NIPDAULevel-3-260C-168 HR
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
PM (S-PQFP-G64) PLASTIC QUAD FLATPACK
49
64
0,50
48
0,27
0,17
33
1
7,50 TYP
10,20
SQ
9,80
12,20
SQ
11,80
16
0,08
32
17
M
0,05 MIN
0,13 NOM
Gage Plane
0,25
0°–7°
1,45
1,35
1,60 MAX
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
D. May also be thermally enhanced plastic with leads connected to the die pads.
0,75
0,45
Seating Plane
0,08
4040152/C 11/96
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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