TEXAS INSTRUMENTS TRS3237E Technical data

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C2+

GND

C2−

V−
DOUT1
DOUT2
DOUT3

RIN1
RIN2

DOUT4

RIN3

DOUT5

EN

SHDN

C1+
V+
V

CC

C1−
DIN1
DIN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
DIN5
ROUT1B
MBAUD

DB, DW, OR PW PACKAGE

(TOP VIEW)

RHB PACKAGE

(TOP VIEW)

C1–
DIN1
IN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3

DOUT1
DOUT2
DOUT3

RIN1
RIN2

DOUT4

RIN3

N.C.

V−

C2–

GND

C2+

C1+V+VCCN.C.

DOUT5

EN

SHDN

MBAUD

N.C.

ROUT1B

DIN5

N.C.

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3132 30 29 28 27 26 25

109 111213 14 15 16

N.C.– Not internally connected

3-V TO 5.5-V MULTICHANNEL RS-232

1-MBit/s LINE DRIVER/RECEIVER

SLLS796 – JUNE 2007

FEATURES

• Meets or Exceeds the Requirements of • ESD Protection for RS-232 I/O Pins and Logic

TIA/EIA-232-F and ITU v.28 Standards Input pins

• Operates With 3-V to 5.5-V V

• Operates From 250 kbits/s to 1 Mbit/s – ± 8 kV – IEC61000-4-2, Contact Discharge

• Low Standby Current . . . 1 μ A Typical – ± 15 kV – IEC61000-4-2, Air-Gap Discharge

• External Capacitors . . . 4 × 0.1 μ F

• Accepts 5-V Logic Input With 3.3-V Supply

• Designed to Be Interchangeable With Industry

Standard '3237E Devices

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

Supply – ± 15 kV – Human-Body Model (HBM)

CC

APPLICATIONS

• Battery-Powered, Hand-Held, and Portable

Equipment

• PDAs and Palmtop PCs

• Notebooks, Sub-Notebooks, and Laptops

• Digital Cameras

• Mobile Phones and Wireless Devices

TRS3237E

DESCRIPTION/ORDERING INFORMATION

The TRS3237E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ± 15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to

5.5-V supply. This device operates at data signaling rates of 250 kbit/s in normal operating mode
(MBAUD = GND) and 1Mbit/s when MBAUD = V

The TRS3237E transmitters are disabled and the outputs are forced into high-impedance state when the device
is in shutdown mode ( SHDN = GND) and the supply current falls to less than 1 μ A. Also, during shutdown, the
onboard charge pump is disabled; V+ is lowered to V
can be placed in the high-impedance state by setting enable ( EN) high. ROUT1B remains active all the time,
regardless of the EN and SHDN condition.

UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

CC

. The driver output slew rate is a maximum of 30 V/ μ s.

, and V– is raised toward GND. Receiver outputs also

CC

Copyright © 2007, Texas Instruments Incorporated

www.ti.com

TRS3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER

SLLS796 – JUNE 2007

DESCRIPTION/ORDERING INFORMATION (CONTINUED)

The TRS3237EC is characterized for operation from 0 ° C to 70 ° C. The TRS3237EI is characterized for operation
from –40 ° C to 85 ° C.

ORDERING INFORMATION

T

A

SSOP – DB Reel of 2000 TRS3237ECDBR TRS3237EC

0 ° C to 70 ° C

–40 ° C to 85 ° C

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package .

(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com .

SOIC – DW Reel of 2000 TRS3237ECDWR TRS3237EC
TSSOP – PW Reel of 2000 TRS3237ECPWR RS37EC
QFN – RHB Reel of 2000 TRS3237ECRHBR PREVIEW
SSOP – DB Reel of 2000 TRS3237EIDBR TRS3237EI
SOIC – DW Reel of 2000 TRS3237EIDWR TRS3237EI
TSSOP – PW Reel of 2000 TRS3237EIPWR RS37EI
QFN – RHB Reel of 2000 TRS3237EIRHBR PREVIEW

PACKAGE

(1) (2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

FUNCTION TABLE

INPUTS OUTPUTS

SHDN EN DOUT ROUT ROUT1B

0 0 Z
0 1 Z
1 0 Active Active Active
1 1 Active Z

(1) Z = high impedance (off)

(1)
(1)

Active Active

(1)

Z

(1)

Active

Active

2

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DIN3

DIN2

DIN1

DOUT3

DOUT2

DOUT1

RIN1

RIN2

RIN3

ROUT1

ROUT1B

ROUT2

ROUT3

24

23

22

21

16

20

18

5

6

7

8

9

11

DIN4

DOUT4

19 10

DIN5

DOUT5

17 12

13

EN

SHDN

14

MBAUD

15

LOGIC DIAGRAM (POSITIVE LOGIC)

TRS3237E

3-V TO 5.5-V MULTICHANNEL RS-232

1-MBit/s LINE DRIVER/RECEIVER

SLLS796 – JUNE 2007

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TRS3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER

SLLS796 – JUNE 2007

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

V

CC

V+ Positive-output supply voltage range
V– Negative-output supply voltage range
V+ – V– Supply voltage difference

V

I

V

O

θ

JA

T

stg

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

(2) All voltages are with respect to network GND.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.

Supply voltage range

Input voltage range V

Output voltage range V

Short-circuit duration DOUT to GND Unlimited
Package thermal impedance
Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 ° C
Storage temperature range –65 150 ° C

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(1)

MIN MAX UNIT

(2)

(2)

(2)

(2)

–0.3 6 V
–0.3 7 V

0.3 –7 V

Driver ( SHDN, MBAUD, EN) –0.3 6
Receiver –25 25
Driver –13.2 13.2
Receiver –0.3 V

(3)

CC

13 V

+ 0.3

62 ° C/W

Recommended Operating Conditions

(1)

See Figure 5

MIN NOM MAX UNIT

V

= 3.3 V 3 3.3 3.6

Supply voltage V

V

Driver and control high-level input voltage DIN, SHDN, MBAUD, EN V

IH

V

Driver and control low-level input voltage DIN, SHDN, MBAUD, EN 0 0.8 V

IL

V

Receiver input voltage –25 25 V

I

T

Operating free-air temperature ° C

A

(1) Test conditions are C1–C4 = 0.1 μ F at V

Electrical Characteristics

(1)

= 3 V to 5 V.

CC

CC

V

= 5 V 4.5 5 5.5

CC

V

= 3.3 V 2 5.5

CC

V

= 5 V 2.4 5.5

CC

TRS3237EC 0 70
TRS3237EI –40 85

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )

PARAMETER TEST CONDITIONS MIN TYP

I

I

I

CC

Input leakage current DIN, SHDN, MBAUD, EN 9 18 μ A

Supply current SHDN = GND 1 10 μ A
(T

= 25 ° C)

A

(1) Test conditions are C1–C4 = 0.1 μ F at V
(2) All typical values are at V

= 3.3 V or V

CC

Shutdown supply current

= 3 V to 5 V.

CC

= 5 V, and TA= 25 ° C.

CC

No load, SHDN = V

SHDN = RIN = GND,
DIN = GND or V

CC

CC

(2)

MAX UNIT

0.5 2 mA

10 300 nA

4

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TRS3237E

3-V TO 5.5-V MULTICHANNEL RS-232

1-MBit/s LINE DRIVER/RECEIVER

SLLS796 – JUNE 2007

DRIVER SECTION

xxx

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )

PARAMETER TEST CONDITIONS MIN TYP

V
V
I
I
I
r

(1) Test conditions are C1–C4 = 0.1 μ F at V
(2) All typical values are at V
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one

High-level output voltage DOUT at RL= 3 k Ω to GND, DIN = GND 5 5.4 V

OH

Low-level output voltage DOUT at RL= 3 k Ω to GND, DIN = V

OL

High-level input current VI= V

IH

Low-level input current VIat GND ± 0.01 ± 1 μ A

IL

Short-circuit output current

OS

Output resistance VCC, V+, and V– = 0 V, VO= ± 2 V 300 50k Ω

o

output should be shorted at a time.

= 3.3 V or V

CC

(1)

(2)

MAX UNIT

CC

CC

(3)

V

= 3.6 V or 3.3 V, VO= 0 V ± 60 mA

CC

= 3 V to 5 V.

CC

= 5 V, and TA= 25 ° C.

CC

–5 –5.4 V

± 0.01 ± 1 μ A

Switching Characteristics

(1)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )

PARAMETER TEST CONDITIONS MIN TYP

CL= 1000 pF,
MBAUD = GND

250

CL= 1000 pF,
V

= 4.5 V to 5.5 V, RL= 3 k Ω , 1 DIN switching, 1000

Maximum data rate kbit/s

CC

MBAUD = V

CC

See Figure 1

CL= 250 pF,
V

= 3 V to 4.5 V, 1000

CC

MBAUD = V

t

Pulse skew

sk(p)

(3)

Slew rate, V

SR(tr) transition region RL= 3 k Ω to 7 k Ω , V/ μ s

CL= 150 pF to 2500 pF, RL= 3 k Ω to 7 k Ω ,
MBAUD = V

CC

(see Figure 1 ) TA= 25 ° C

(1) Test conditions are C1–C4 = 0.1 μ F at V
(2) All typical values are at V
(3) Pulse skew is defined as |t

= 3.3 V or V

CC

PLH

CC

or GND, See Figure 2

CC

= 3.3 V,

= 3 V to 5 V.

CC

= 5 V, and TA= 25 ° C.

– t

CC

| of each channel of the same device.

PHL

CL= 150 pF to 1000
pF

CL= 150 pF to 2500
pF,

MBAUD = GND 6 30
MBAUD = V

CC

24 150

MBAUD = GND 4 30

(2)

MAX UNIT

100 ns

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TRS3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER

SLLS796 – JUNE 2007

RECEIVER SECTION

xxx

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5 )

PARAMETER TEST CONDITIONS MIN TYP

V
V

V

V

V
I

oz

r

i

(1) Test conditions are C1–C4 = 0.1 mF at V
(2) All typical values are at V

High-level output voltage IOH= –1 mA V

OH

Low-level output voltage IOL= 1 mA 0.4 V

OL

Positive-going input threshold voltage V

IT+

Negative-going input threshold voltage V

IT–

Input hysteresis (V

hys

Output leakage current EN = V
Input resistance VI= ± 3 V to ± 25 V 3 5 7 k Ω

Switching Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER TEST CONDITIONS TYP

t

Propagation delay time, low- to high-level output CL= 150 pF, See Figure 3 150 ns

PLH

t

Propagation delay time, high- to low-level output CL= 150 pF, See Figure 3 150 ns

PHL

t

Output enable time CL= 150 pF, RL= 3 k Ω , See Figure 4 2.6 μ s

en

t

Output disable time CL= 150 pF, RL= 3 k Ω , See Figure 4 2.4 μ s

dis

t

Pulse skew

sk(p)

(1) Test conditions are C1–C4 = 0.1 μ F at V
(2) All typical values are at V
(3) Pulse skew is defined as |t

(3)

IT+

CC

CC

PLH

(1)

(2)

– 0.6 V

CC

V

= 3.3 V 1.5 2.4

CC

V

= 5 V 2 2.4

CC

V

= 3.3 V 0.6 1.1

CC

V

= 5 V 0.8 1.5

CC

– V

) 0.5 V

IT–

CC

= 3 V to.5 V.

= 3.3 V or V

CC

= 5 V, and TA= 25 ° C.

CC

(1)

– 0.1 V

CC

± 0.05 ± 10 μ A

See Figure 3 50 ns

= 3 V to 5 V.

= 3.3 V or V

– t

CC

= 5 V, and TA= 25 ° C.

CC

| of each channel of the same device.

PHL

MAX UNIT

(2)

UNIT

ESD Protection

PIN TEST CONDITIONS TYP UNIT

HBM ± 15

DIN, RIN, ROUT IEC61000-4-2, Contact Discharge ± 8 kV

IEC61000-4-2, Air-Gap Discharge ± 15

6

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