Two Operating Modes:
– Philips SA7025 Emulation Mode
Pin-for-Pin and Programming
Compatible
– Extended Performance Mode (EPM)
D
Dual RF – IF Phase-Locked Loops
D
Fractional-N or Integer-N Operation
D
Programmable EPM Fractional
Modulus of 1–16
D
Normal, Speed-Up, and Fractional
CLOCK
DATA
STROBE
V
SS
RFIN
RFIN
V
CCP
REFIN
RA
AUXIN
Compensation Charge Pumps
D
2.9-V to 5.1-V Operation
D
Low-Power Consumption
description
The TRF2050 is a low-voltage, low-power consumption 1.2-GHz fractional-N/integer-N frequency synthesizer
component for wireless applications. Fractional-N division and an integral speed-up charge pump are used to
achieve rapid channel switching. Two operating modes are available: 1) SA7025 emulation mode in which the
part emulates the Philips SA7025 fractional-N synthesizer and 2) extended performance mode (EPM), which
provides additional features including fractional accumulator modulos from 1 to 16 (compared to only 5 or 8 for
the SA7025) and programmable control of the speed-up mode duration (compared to the SA7025 method of
holding the strobe line high).
PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
TRF2050
V
DD
TSETUP
LOCK/TEST
RF
RN
V
DDA
PHP
PHI
V
SSA
PHA
Along with external loop filters, the TRF2050 provides all functions necessary for voltage-controlled oscillator
(VCO) control in a dual phase-locked loop (PLL) frequency synthesizer system. A main channel is provided for
radio frequency (RF) channels and an auxiliary channel for intermediate frequency (IF) channels. The
current-output charge pumps directly drive passive resistance-capacitance (RC) filter networks to generate
VCO control voltages. Rapid main-channel frequency switching is achieved with a charge pump arrangement
that increases the current drive and alters the loop-filter frequency response during the speed-up mode portion
of the switching interval.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Terminals 4, 7, 12, 15, and 20 are for supply voltage. Terminal 19 is for testing. These terminals are not shown.
‡
Conversion and selection block provides emulation of SA7025 64/65/72 triple-modulus prescaler operation using the TRF2050 32/33
dual-modulus prescaler .
IPrescaler positive RF input
IPrescaler negative RF input
IReference frequency input signal
IResistor to V
IResistor to V
IResistor to V
ISerial interface strobe signal
IT est setup for pin 18. For lock detect output, pin 19 connects to VCC through a pullup resistor; for test mode output,
pin 19 terminates to ground.
Prescaler positive supply voltage
Digital supply voltage
Analog supply voltage
Digital ground
Analog ground
sets auxiliary charge pump reference current
SSA
sets proportional and integral charge pump reference current
SSA
sets compensation charge pump reference current
SSA
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Operating ambient temperature range, T
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: Voltage values are with respect to V
CCP,
VDD, V
stg
SSA
(see Note 1)–0.6 V to 5.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
High-level input voltage, VIH (CLOCK, DATA STROBE)0.7 × V
Low-level input voltage, VIL (CLOCK, DATA STROBE)–0.30.3 × V
Operating free-air temperature, T
, V
DDA
A
2.9
DD
4.8
VDD +0.3V
–402585°C
5.1
DD
V
V
dc electrical characteristics VDD = V
DDA
= V
=3.6 V, over recommended operating free-air
CCP
temperature range. internal registers: CN = 128, CL = 1, CK = 3, N = 3969, NF = 1, FMOD = 8,
SM = 0, NA = 296, SA = 0, P A = 1. external components: RN = 18 kΩ , RF = 24 kΩ, RA = 100 kΩ (unless
otherwise noted)
supply current: I = IDD + I
PARAMETERTEST CONDITIONS
I
STANDBY
I
MAIN
I
AUX
I
TOTAL
Total standby supply currentsEM = EA = 0 (see Notes 2 and 3)
Operational supply currentsEM = 1, EA = 0 (see Note 3)
Operational supply currentsEM = 0, EA = 1 (see Note 3)
Operational supply currents
NOTES: 2. VRN = VRA = VRF = V
3. For optimum standby and operational current consumption, the following condition should be be maintained:
VDD ≤ V
DDA
digital interface
V
OH
V
OL
I
IH
I
IL
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
+ I
CCP
DDA
EM = EA = 1 (see Note 3)
DDA
< VDD + 1.
PARAMETERTEST CONDITIONS
IOH = 2 mAVDD –0.5V
IOL = – 2 mA0.5V
MIN
TYP
MAX
7.0
1.5
7.5
200
UNIT
µA
mA
mA
mA
MINTYPMAXUNIT
10µA
10µA
charge pump currents (see Figure 1)
auxiliary charge pump
|I
|Output current PHA
PHA
∆I
PHA
|I
|
ÁÁÁ
PHA
∆I
PHA
proportional charge pump, normal mode, VRF = V
|I
PHP-NM
∆I
|I
PHP-NM
ÁÁÁ
∆I
4
PHP-NM
PHP-NM
|
|
PARAMETER
Relative output current variation PHA (see Figure 1)
Output current matching PHA (see Figure 1)
DDA
PARAMETER
Output current PHP
Relative output current variation PHP (see Figure 1)
ac electrical characteristics, VDD = V
(continued)
auxiliary divider
PARAMETERTEST CONDITIONS
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
f
AUXIN
ÁÁÁ
ÁÁÁ
reference divider
f
REFIN
V
I_REFIN
Auxiliary input frequency (ac-coupled)
p
p
PARAMETERTEST CONDITIONS
Reference input frequency
Reference input voltageac-coupled
p
p
CCP
= V
= 3.6 V, TA = 25°C (unless otherwise noted)
DDA
PA = 0:
V
= VDD = 3.6 V
DDA
V
I_AUXIN
V
I_AUXIN
PA = 0:
V
= VDD = 4.8 V
DDA
V
I_AUXIN
PA = 1:
V
= VDD = 3.6 V
DDA
V
I_AUXIN
PA = 1:
V
= VDD = 4.8 V
DDA
ББББББББ
V
I_AUXIN
= 560 mVpp
= 200 mVpp
= 200 mVpp
= 200 mVpp
= 200 mVpp
MIN
TYP
MAX
Á
Á
Á
Á
Á
125
Á
70
Á
Á
ÁÁÁÁÁ
ÁÁÁÁÁ
Á
Á
Á
110
Á
40
72
5
100
3
MIN
TYP
MAX
40
200
100
3
UNIT
Á
MHz
Á
MHz
Á
MHz
Á
Á
MHz
Á
MHz
kΩ
pF
UNIT
MHz
mVpp
kΩ
pF
timing requirements, serial data interface (see Figure 2)
f
CLOCK
t
w_CLKHI
t
w_CLKLO
t
su_Data
t
h_Data
t
h_Strobe
t
su_Strobe
t
w_STRBHI
Clock frequency10MHz
Clock high time pulse width, CLOCK high30ns
Clock low time pulse width, CLOCK low30ns
Setup time, data valid before CLOCK↑30ns
Hold time, data valid after CLOCK↑30ns
Hold time, STROBE high before CLOCK↑30ns
Setup time, STROBE lowafter CLOCK↑30ns
STROBE high time pulse width, STROBE high
The relative output current variation is defined as the percent difference between charge-pump current output
at two charge-pump output voltages and the mean charge-pump current output (see Figure 1):
D
I
OUT REL
Ť
I
OUT MEAN
+2
Ť
ǒ
I2–I
ǒ
Ť
I2)
Ǔ
1
×100%; with V1+
Ǔ
Ť
I
1
0.7 V, V2+
V
DDA
–0.8 V.
Output current matching is defined as the difference between charge-pump sinking current output and
charge-pump sourcing current output at a given charge-pump output (see Figure 1).