FAST-TRANSIENT-RESPONSE 1-A LOW-DROPOUT VOLTAGE REGULATORS
SLVS208C – MAY 1999 – REVISED SEPTEMBER 1999
D
1 A Low-Dropout Voltage Regulator
D
Available in 1.5-V, 1.8-V, 2.5-V , 2.7-V, 2.8-V,
3.0-V, 3.3-V, 5.0-V Fixed Output and
Adjustable Versions
D
Dropout Voltage Down to 230 mV at 1 A
(TPS76750)
D
Ultra Low 85 µA Typical Quiescent Current
D
Fast Transient Response
D
2% Tolerance Over Specified Conditions for
Fixed-Output Versions
D
Open Drain Power-On Reset With 200-ms
Delay (See TPS768xx for PG Option)
D
8-Pin SOIC and 20-Pin TSSOP PowerPAD
(PWP) Package
D
Thermal Shutdown Protection
description
This device is designed to have a fast transient
response and be stable with 10-µF low ESR
capacitors. This combination provides high
performance at a reasonable cost.
TPS76733
DROPOUT VOLTAGE
vs
FREE-AIR TEMPERATURE
3
10
IO = 1 A
2
10
1
10
0
10
– Dropout Voltage – mV
DO
V
–1
10
CO = 10 µF
–2
10
–40020120
–6040 6080 100
–20140
TA – Free-Air Temperature – °C
IO = 10 mA
IO = 0
100
50
0
– Change in∆
O
V
–50
Output Voltage – mV
–100
0.5
O
I – Output Current – A
GND/HSINK
GND/HSINK
GND/HSINK
GND/HSINK
1
0
0
PWP PACKAGE
(TOP VIEW)
1
20
GND/HSINK
2
19
GND/HSINK
3
18
GND
4
NC
5
EN
6
IN
7
IN
8
NC
9
10
NC – No internal connection
D PACKAGE
(TOP VIEW)
GND
EN
IN
IN
1
2
3
4
NC
17
NC
16
RESET
15
FB/NC
14
OUT
13
OUT
12
GND/HSINK
11
GND/HSINK
RESET
8
FB/NC
7
OUT
6
5
OUT
TPS76733
LOAD TRANSIENT RESPONSE
CL = 100 µF
TA = 25°C
60402080 100140120160 180 200
t – Time – µs
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1999, Texas Instruments Incorporated
1
TPS76715Q, TPS76718Q, TPS76725Q, TPS76727Q
J
–40 C to 125 C
TPS76728Q, TPS76730Q TPS76733Q, TPS76750Q, TPS76701Q
FAST-TRANSIENT-RESPONSE 1-A LOW-DROPOUT VOLTAGE REGULATORS
SLVS208C – MAY 1999 – REVISED SEPTEMBER 1999
description (continued)
Because the PMOS device behaves as a low-value resistor, the dropout voltage is very low (typically 230 mV
at an output current of 1 A for the TPS76750) and is directly proportional to the output current. Additionally , since
the PMOS pass element is a voltage-driven device, the quiescent current is very low and independent of output
loading (typically 85 µA over the full range of output current, 0 mA to 1 A). These two key specifications yield
a significant improvement in operating life for battery-powered systems. This LDO family also features a sleep
mode; applying a TTL high signal to EN
1 µA at TJ = 25°C.
The RESET output of the TPS767xx initiates a reset in microcomputer and microprocessor systems in the event
of an undervoltage condition. An internal comparator in the TPS767xx monitors the output voltage of the
regulator to detect an undervoltage condition on the regulated output voltage.
The TPS767xx is offered in 1.5-V, 1.8-V , 2.5-V, 2.7-V , 2.8-V, 3.0-V, 3.3-V and 5.0-V fixed-voltage versions and
in an adjustable version (programmable over the range of 1.5 V to 5.5 V). Output voltage tolerance is specified
as a maximum of 2% over line, load, and temperature ranges. The TPS767xx family is available in 8 pin SOIC
and 20 pin PWP packages.
T
–
°
The TPS76701 is programmable using an external resistor divider (see application
information). The D and PWP packages are available taped and reeled. Add an R
suffix to the device type (e.g., TPS76701QDR).
V
I
0.1 µF
°
(enable) shuts down the regulator, reducing the quiescent current to
AVAILABLE OPTIONS
OUTPUT
VOLTAGE
(V)
TYP
5.0TPS76750QTPS76750Q
3.3TPS76733QTPS76733Q
3.0TPS76730QTPS76730Q
2.8TPS76728QTPS76728Q
2.7TPS76727QTPS76727Q
2.5TPS76725QTPS76725Q
1.8TPS76718QTPS76718Q
1.5TPS76715QTPS76715Q
Adjustable
1.5 V to 5.5 V
TPS767xx
6
IN
7
IN
5
EN
GND
3
PACKAGED DEVICES
TSSOP
(PWP)
TPS76701QTPS76701Q
OUT
OUT
16
14
13
RESET
+
SOIC
(D)
RESET
C
10 µF
V
O
†
O
2
†
See application information section for capacitor selection details.
FAST-TRANSIENT-RESPONSE 1-A LOW-DROPOUT VOLTAGE REGULATORS
functional block diagram—adjustable version
IN
EN
_
TPS76715Q, TPS76718Q, TPS76725Q, TPS76727Q
SLVS208C – MAY 1999 – REVISED SEPTEMBER 1999
RESET
+
V
= 1.1834 V
ref
+
_
GND
200 ms Delay
functional block diagram—fixed-voltage version
IN
EN
_
+
OUT
R1
FB/NC
R2
External to the device
RESET
OUT
V
= 1.1834 V
ref
+
_
GND
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
200 ms Delay
R1
R2
3
TPS76715Q, TPS76718Q, TPS76725Q, TPS76727Q
I/O
DESCRIPTION
I/O
DESCRIPTION
TPS76728Q, TPS76730Q TPS76733Q, TPS76750Q, TPS76701Q
FAST-TRANSIENT-RESPONSE 1-A LOW-DROPOUT VOLTAGE REGULATORS
SLVS208C – MAY 1999 – REVISED SEPTEMBER 1999
Terminal Functions – SOIC Package
TERMINAL
NAMENO.
EN2IEnable input
FB/NC7IFeedback input voltage for adjustable device (no connect for fixed options)
GND1Regulator ground
IN3, 4IInput voltage
OUT5, 6ORegulated output voltage
RESET8ORESET output
Terminal Functions – PWP Package
TERMINAL
NAMENO.
EN5IEnable input
FB/NC15IFeedback input voltage for adjustable device (no connect for fixed options)
GND3Regulator ground
GND/HSINK1, 2, 9, 10, 11,
12, 19, 20
IN6, 7IInput voltage
NC4, 8, 17, 18No connect
OUT13, 14ORegulated output voltage
RESET16ORESET output
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡
All voltage values are with respect to network terminal ground.
PACKAGE
PACKAGE
#
This parameter is measured with the recommended copper heat sink pattern on a 1-layer PCB, 5-in × 5-in PCB, 1 oz. copper,
2-in × 2-in coverage (4 in2).
||
This parameter is measured with the recommended copper heat sink pattern on a 8-layer PCB, 1.5-in × 2-in PCB, 1 oz. copper
with layers 1, 2, 4, 5, 7, and 8 at 5% coverage (0.9 in2) and layers 3 and 6 at 100% coverage (6 in2). For more information, refer
to TI technical brief SLMA002.