TEXAS INSTRUMENTS TPS65140, TPS65141, TPS65145 Technical data

Download

www.ti.com

Vin

V 1 Uop to 15 V / 400 mA

V 3 Uop to 30 V / 20 mA

V 2 Uop to 12 V / 20 mA

V 4

3.3oV

Vcom

Boost

Converter

Positive Charge

Pump

Negative

Charge Pump

Vcom Buffer

Linear Regulator

Controller

TPS6514x

2.7 V to 5.8 V

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

TRIPLE OUTPUT LCD SUPPLY WITH LINEAR REGULATOR AND POWER GOOD

FEATURES DESCRIPTION

• 2.7-V to 5.8-V Input Voltage Range

• 1.6-MHz Fixed Switching Frequency

• 3 Independent Adjustable Outputs

• Main Output up to 15 V With <1% Typical

Output Voltage Accuracy

• Virtual Synchronous Converter Technology

• Negative Regulated Charge Pump Driver VO2

• Positive Charge Pump Converter VO3

• Auxiliary 3.3-V Linear Regulator Controller

• Internal Soft Start

• Internal Power-On Sequencing

• Fault Detection of all Outputs (TPS65140/45)

• No Fault Detection (TPS65141)

• Thermal Shutdown

• System Power Good

• Available in TSSOP-24 and QFN-24

PowerPAD™ Packages

APPLICATIONS

• TFT LCD Displays for Notebooks

• TFT LCD Displays for Monitors

• Portable DVD Players

• Tablet PCs

• Car Navigation Systems

• Industrial Displays

The TPS6514x series offers a compact and small power supply solution to provide all three voltages required by thin film transistor (TFT) LCD displays. The auxiliary linear regulator controller can be used to generate a 3.3-V logic power rail for systems powered by a 5-V supply rail only.

The main output VO1 is a 1.6-MHz fixed frequency PWM boost converter providing the source drive voltage for the LCD display. The device is available in two versions with different internal switch current limits to allow the use of a smaller external inductor when lower output power is required. The TPS65140/41 has a typical switch current limit of 2.3 A and the TPS65145 has a typical switch current limit of 1.37 A. A fully integrated adjustable charge pump doubler/tripler provides the positive LCD gate drive voltage. An externally adjustable negative charge pump provides the negative gate drive voltage. Due to the high 1.6-MHz switching frequency of the charge pumps, inexpensive and small 220-nF capacitors can be used.

Additionally, the TPS6514x series has a system power good output to indicate when all supply rails are acceptable. For LCD panels powered by 5 V the device has a linear regulator controller using an external transistor to provide a regulated 3.3 V output for the digital circuits. For maximum safety, the TPS65140/45 goes into shutdown as soon as one of the outputs is out of regulation. The device can be enabled again by toggling the input or the enable (EN) pin to GND. The TPS65141 does not enter shutdown when one of its outputs is below its power good threshold.

TPS65140 , TPS65141

TPS65145

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com

VIN COMP

GND EN

ENR C1+

C1− DRV

FB2 REF

FB4 BASE

SW SW

FB1

SUP

C2+

C2−/MODE

OUT3

FB3

PG PGND PGND

GND

TPS65140

System Power

Good

BCP68

2.7 V to 5.8 V

C3 22 µF

C13

10 nF

4.2 µH

C1 0.22 µF

C12

0.22 µF

C11

100 nF

1 µF

VO4

3.3 V

4.7 µF

0.22 µF

C4 22 µF

0.22 µF

R7 33 kΩ

VO3

Up to 30 V/20 mA

VO1

Up to 15 V/350 mA

VO2

Up to 12 V/20 mA

TPS65140 , TPS65141 TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

TYPICAL APPLICATION CIRCUIT

ORDERING INFORMATION

(1) (2)

PACKAGE

MARKING

Submit Documentation Feedback

-40 °C to 85 °C

(1) The PWP and RGE packages are available taped and reeled. Add an R suffix to the device type (TPS65100PWPR) to order the device

taped and reeled. The PWPR package has quantities of 2000 devices per reel, and the the RGER package has 3000 devices per reel. Without the suffix, the PWP package only, is shipped in tubes with 60 devices per tube.

(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com .

LINEAR REGULATOR MINIMUM SWITCH

OUTPUT VOLTAGE CURRENT LIMIT

3.3 V 1.6 A TPS65140PWP TPS65140RGE TPS65140

3.3 V 1.6 A TPS65141PWP TPS65141RGE TPS65141

3.3 V 0.96 A TPS65145PWP TPS65145RGE TPS65145

PACKAGE

TSSOP QFN

www.ti.com

TPS65140 , TPS65141

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

Voltages on pin VIN Voltages on pin VO1, SUP, PG Voltages on pin EN, MODE, ENR Voltage on pin SW Power good maximum sink current (PG) 1 mA Continuous power dissipation See Dissipation Rating Table Operating junction temperature range -40 ° C to 150 ° C Storage temperature range -65 ° C to 150 ° C Lead temperature (soldering, 10 sec) 260 ° C

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground terminal.

(2)

DISSIPATION RATINGS

PACKAGE R Θ

24-Pin TSSOP 30.13 C °/W (PWP soldered) 3.3 W 1.83 W 1.32 W

24-Pin QFN 30 C ° /W 3.3 W 1.8 W 1.3 W

(1)

UNIT

-0.3 V to 6 V

-0.3 V to 15.5 V

-0.3 V to VI+ 0.3 V 20 V

TA≤ 25 ° C TA= 70 °C TA= 85 °C

POWER RATING POWER RATING POWER RATING

TPS65145

RECOMMENDED OPERATING CONDITIONS

MIN TYP MAX UNIT

VIN Input voltage range 2.7 5.8 V L Inductor T

(1)

4.7 µH Operating ambient temperature -40 85 °C Operating junction temperature -40 125 °C

(1) See the application information section for further information.

ELECTRICAL CHARACTERISTICS

Vin= 3.3 V, EN = VIN, VO1 = 10 V, TA= -40 °C to 85 °C, typical values are at TA= 25 ° C (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SUPPLY CURRENT

QCharge

QEN

UVLO

LOGIC SIGNALS EN, ENR

Input voltage range 2.7 5.5 V Quiescent current into VIN

Charge pump quiescent current into SUP

LDO controller quiescent current into Vin

ENR = GND, VO3 = 2 x VO1, 0.7 0.9 mA Boost converter not switching

VO1 = SUP = 10 V, VO3 = 2 x VO1 1.7 2.7 VO1 = SUP = 10 V, VO3 = 3 x VO1 3.9 6

ENR = VIN, EN = GND 300 800 µA

Shutdown current into VIN EN = ENR = GND 1 10 µA Undervoltage lockout VIfalling 2.2 2.4 V

threshold Thermal shutdown Temperature rising 160 ° C

High level input voltage 1.5 V Low level input voltage 0.4 V Input leakage current EN = GND or VIN 0.01 0.1 µA

Submit Documentation Feedback

www.ti.com

TPS65140 , TPS65141 TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

ELECTRICAL CHARACTERISTICS (continued)

Vin= 3.3 V, EN = VIN, VO1 = 10 V, TA= -40 °C to 85 °C, typical values are at TA= 25 ° C (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

MAIN BOOST CONVERTER

VO1 Output voltage range 5 15 V VO1-Vin 1 V V

REF

DS(on)

LIM

DS(on)

MAX

leak

NEGATIVE CHARGE PUMP VO2

VO2 Output voltage range -2 V V

ref

DS(on)

POSITIVE CHARGE PUMP VO3

VO3 Output voltage range 30 V V

ref

Minimum input to output voltage difference

Reference voltage 1.205 1.13 1.219 V Feedback regulation

voltage Feedback input bias

current N-MOSFET on-resistance

(Q1) N-MOSFET switch current

limit (Q1) P-MOSFET on-resistance

(Q2)

VO1 = 10 V, Isw= 500 mA 195 290 VO1 = 5 V, Isw= 500 mA 285 420 TPS65140, TPS65141 1.6 2.3 2.6 A TPS65145 0.96 1.37 1.56 A VO1 = 10 V, Isw= 100 mA 9 15 VO1 = 5 V, Isw= 100 mA 14 22

Maximum P-MOSFET peak switch current

Switch leakage current V

Oscillator frequency MHz

Line regulation 2.7 V ≤ VI≤ 5.7 V; I

= 15 V 1 10 µA

0 °C ≤ TA≤ 85 °C 1.295 1.6 2.1

-40 °C ≤ TA≤ 85 °C 1.191 1.6 2.1 = 100 mA 0.012 %/V

load

1.136 1.146 1.154 V

10 100 nA

1 A

Load regulation 0 mA ≤ IO≤ 300 mA 0.2 %/A

Reference voltage 1.205 1.213 1.219 V Feedback regulation

voltage Feedback input bias

current Q8 P-Channel switch

DS(on)

Q9 N-Channel switch r

DS(on)

IO= 20 mA Ω

-36 0 36 mV

10 100 nA

4.3 8

2.9 4.4 Maximum output current 20 mA Line regulation 0.09 %/V

7 V ≤ VO1 ≤ 15 V, I VO2 = -5 V

=10 mA,

load

Load regulation 1 mA ≤ IO≤ 20 mA, VO2 = -5 V 0.126 %/mA

Reference voltage 1.205 1.213 1.219 V Feedback regulation

voltage Feedback input bias

current

1.187 1.214 1.238 V

10 100 nA

m Ω

Ω

Submit Documentation Feedback

www.ti.com

1 2 3 4 5 6 7 8

9 10 11 12

24 23 22 21 20 19 18 17 16 15 14 13

FB1 FB4

BASE

VIN SW

SW PGND PGND

SUP

GND

FB3

EN ENR COMP FB2 REF GND DRV C1− C1+ C2−/MODE C2+ OUT3

Thermal PAD*

FB2

REF

GND

DRV

C1−

C1+

1 2 3 4 5 6

18 17 16

15 14 13

7 8

11 12

20212223

Exposed

Thermal Die*

COMP

ENR

FB1 FB4

BASE

VINSWSW

PGND

SUP

C2−/MODE C2+ OUT3 FB3 GND PG

PWP PACKAGE

TOP VIEW

RGE PACKAGE

TOP VIEW

TPS65140 , TPS65141

TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

ELECTRICAL CHARACTERISTICS (continued)

Vin= 3.3 V, EN = VIN, VO1 = 10 V, TA= -40 °C to 85 °C, typical values are at TA= 25 ° C (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Q3 P-Channel switch r

DS(on)

Q4 N-Channel switch r

DS(on)

Q5 P-Channel switch r

DS(on)

IO= 20 mA Ω

Q6 N-Channel switch r

DS(on)

D1 – D4 Shottky diode forward voltage

= 40 mA 610 720 mV

D1-D4

Maximum output current 20 mA Line regulation 0.56 %/V

10 V ≤ VO1 ≤ 15 V, I VO3 = 27 V

= 10 mA,

load

Load regulation 1 mA ≤ IO≤ 20 mA, VO3 = 27 V 0.05 %/mA

LINEAR REGULATOR CONTROLLER VO4

VO4 Output voltage 4.5 V ≤VI≤ 5.5 V; 10 mA ≤ IO≤ 500 mA 3.2 3.3 3.4 V

Vin-V

4-V

BASE

Maximum base drive current

Vin-V

4-V

Line regulation 4.75 V ≤ VI≤ 5.5 V, I

≥ 0.5 V ≥ 0.75 V

(1)

= 500 mA 0.186 %/V

load

13.5 19 20 27

Load regulation 1 mA ≤ IO≤ 500 mA, VI= 5 V 0.064 %/A Start up current VO4 ≤ 0.8 V 11 20 25 mA

SYSTEM POWER GOOD (PG)

(PG, Vo1)

(PG, Vo2)

(PG, Vo3)

Power good threshold

(2)

VOL PG output low voltage I

= 500 µ A 0.3 V

(sink)

-12 -8.75% VO1 -6 V

-13 -9.5% VO2 -5 V

-11 -8% VO3 -5 V

IL PG output leakage current VPG = 5 V 0.001 1 uA

9.9 15.5

1.1 1.8

4.6 8.5

1.2 2.2

(1) With VI= supply voltage of the TPS6514x, VO4 = output voltage of the regulator, V (2) The power good goes high when all 3 outputs (V

the outputs is below their threshold.

1, VO2, VO3) are above their threshold. The power good goes low as soon as one of

DEVICE INFORMATION

Submit Documentation Feedback

= basis emitter voltage of external transistor.

www.ti.com

TPS65140 , TPS65141 TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

DEVICE INFORMATION (continued)

Terminal Functions

TERMINAL

NAME

VIN 4 7 I Input voltage pin of the device. EN 24 3 I COMP 22 1 Compensation pin for the main boost converter. A small capacitor is connected to this

PG 10 13 O nominal output voltage. The output goes low when one of the outputs falls below 10%

ENR 23 2 I left floating. Logic high enables the regulator and a logic low puts the regulator in

C1+ 16 19 Positive terminal of the charge pump flying capacitor C1- 17 20 Negative terminal of the charge pump flying capacitor DRV 18 21 O External charge pump driver FB2 21 24 I Feedback pin of negative charge pump REF 20 23 O Internal reference output typically 1.23 V

FB4 2 5 I BASE 3 6 O Base drive output for the external transistor

GND 11, 19 14, 22 Ground PGND 7, 8 10, 11 Power ground FB3 12 15 I Feedback pin of positive charge pump OUT3 13 16 O Positive charge pump output

C2-/MODE 15 18

C2+ 14 17

SUP 9 12 I

FB1 1 4 I Feedback pin of the boost converter SW 5, 6 8, 9 I Switch pin of the boost converter PowerPAD The PowerPAD or exposed thermal die needs to be connected to power ground pins

™ /Thermal (PGND) Die

NO. NO.

(PWP) (RGE)

I/O DESCRIPTION

Enable pin of the device. This pin should be terminated and not be left floating. A logic high enables the device and a logic low shuts down the device.

pin. Open drain output indicating when all outputs VO1, VO2, VO3 are within 10% of their

of their nominal output voltage. Enable pin of the linear regulator controller. This pin should be terminated and not be

shutdown.

Feedback pin of the linear regulator controller. The linear regulator controller is set to a fixed output voltage of 3.3 V or 3 V depending on the version.

Negative terminal of the charge pump flying capacitor and charge pump MODE pin. If the flying capacitor is connected to this pin, the converter operates in a voltage tripler mode. If the charge pump needs to operate in a voltage doubler mode, the flying capacitor is removed and the C2-/MODE pin needs to be connected to GND.

Positive terminal for the charge pump flying capacitor. If the device runs in voltage doubler mode, this pin needs to be left open.

Supply pin of the positive, negative charge pump, boost converter, and gate drive circuit. This pin needs to be connected to the output of the main boost converter and cannot be connected to any other voltage source. For performance reasons, it is not recommended for a bypass capacitor to be connected directly to this pin.

Submit Documentation Feedback

www.ti.com

1.6-MHz

Oscillator

VFB

1.146 V

Comparator

VFB

1.146 V

D S

Vref

1.213 V

Vin

~1 V

D S

SUP

D S

SUP

C1−

C1+

Vo3

C2+

C2−

D S

Vref

1.214 V

Soft Start

Vref

1.213 V

SUP

ENR BASE

FB4

REF

FB2

DRV

COMP

FB1

VIN

SW SW

FB3

GND GND PGND PGND

D S

Q10

SUP

Linear Regulator Controller

Reference

Output

Negative

Charge Pump

Positive

Charge Pump

Main boost

converter

Vref

0 V

Current Control

FB1 FB2 FB3

SUP

Vref

1.213 V

FB1

FB2

FB3

System Power

Good

Bias V

ref

= 1.213 V

Thermal Shutdown

Start−Up Sequencing

Undervoltage Detection

Overvoltage Detection

Short Circuit Protection

Current Limit

and

Soft Start

Control Logic

Gate Drive Circuit

Gain Select (Doubler or

Tripler Mode)

Current

Control

Soft Start

Logic and

1-µs Glitch

Filter

Short Circuit

Detect

Soft Start

Iref = 20 mA

GM Amplifier

Low Gain

SUP (VO)

Sawtooth

Generator

FUNCTIONAL BLOCK DIAGRAM

TPS65140 , TPS65141

TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

Submit Documentation Feedback

www.ti.com

100

1 10 100 1 k

Vo1 = 6 V

IL − Load Current − mA

Efficiency − %

Vo1 = 15 V

Vo1 = 10 V

VI = 3.3 V Vo2, Vo3 = No Load, Switching

100

1 10 100 1 k

− Load Current − mA

Efficiency − %

Vo1 = 15 V

Vo1 = 10 V

VI = 5 V Vo2, Vo3 = No Load, Switching

100

2.5 3 3.5 4 4.5 5 5.5 6

Vo1 = 6 V

Vo1 = 15 V

Vo1 = 10 V

ILoad at Vo1 = 100 mA

Vo2, Vo3 = No Load, Switching

- Input Voltage - V

Efficiency - %

TPS65140 , TPS65141 TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

TYPICAL CHARACTERISTICS

Table of Graphs

Main Boost Converter

Efficiency, main boost converter VO1 vs Load current 1

η Efficiency, main boost converter VO1 vs Load current 2

Efficiency vs Input voltage 3

DS(on)

Negative Charge Pump

max

Positive Charge Pump

max

Switching frequency vs Free-air temperature 4 r

N-Channel main switch Q1 vs Free-air temperature 5

DS(on)

PWM operation continuous mode 6 PWM operation, discontinuous (light load) 7 Load transient response, CO= 22 µ F 8 Load transient response, CO= 2 x 22 µ F 9 Power-up sequencing 10 Soft start VO1 11

VO2 maximum load current vs Output voltage VO1 12

VO3 maximum load current vs Output voltage VO1 (doubler mode) 13 VO3 Maximum load current vs Output voltage VO1 (tripler mode) 14

FIGURE

EFFICIENCY EFFICIENCY EFFICIENCY

vs vs vs

LOAD CURRENT LOAD CURRENT INPUT VOLTAGE

Figure 1. Figure 2. Figure 3.

Submit Documentation Feedback

www.ti.com

10 V/div

50 mV/div

VI = 3.3 V VO = 10 V/300 mA

1 A/div

250 ns/div

100

150

200

250

300

350

−40 −20 0 20 40 60 80 100

− N−Channel Main Switch − mΩ

TA − Free-Air Temperature − °C

Vo1 = 5 V

Vo1 = 15 V

Vo1 = 10 V

DS(on)

1.3

1.4

1.5

1.6

1.7

1.8

1.9

−40 −20 0 20 40 60 80 100

− Free-Air Temperature − °C

Switching Frequency − MHz

VI = 2.7 V

VI = 3.3 V

VI = 5.8 V

Vo1

200 mV/div

VI = 3.3 V Vo1 = 10 V, CO= 22 µF

50 mA to 250 mA

100 µs/div

Vo1

100 mV/div

VI = 3.3 V Vo1 = 10 V, CO= 2*22 µF

50 mA to 250 mA

100 µs/div

10 V/div

50 mV/div

VI = 3.3 V VO = 10 V/10 mA

500 mA/div

250 ns/div

Vo1

5 V/div

VI = 3.3 V VO = 10 V, IO = 300 mA

500 µs/div

500

mA/div

Vo1

5 V/div

VI = 3.3 V VO = 10 V,

500 µs/div

Vo2

5 V/div

Vo3

10 V/div

0.02

0.04

0.06

0.08

0.10

0.12

0.14

0.16

0.18

0.20

8.8 9.8

10.8 11.8 12.8 13.8 14.8

Vo1 − Output Voltage − V

− Output Current − AI O

Vo2 = −8 V

TA = −40°C

TA = 25°C

TA = 85°C

TPS65140 , TPS65141

TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

SWITCHING FREQUENCY r

vs vs MODE

N-CHANNEL MAIN SWITCH PWM OPERATION CONTINUOUS

DS(on)

FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE

Figure 4. Figure 5. Figure 6.

PWM OPERATION AT LIGHT LOAD LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE

POWER-UP SEQUENCING SOFT START VO1 VO2 MAXIMUM LOAD CURRENT

Figure 7. Figure 8. Figure 9.

Figure 10. Figure 11. Figure 12.

Submit Documentation Feedback

www.ti.com

0.02

0.04

0.06

0.08

0.10

0.12

0.14

10 11 12 13 14 15

Vo1 − Output Voltage − V

− Output Current − AI O

Vo3 = 18 V (Doubler Mode)

TA = 25°C

TA = 85°C

TA = −40°C

0.02

0.04

0.06

0.08

0.10

0.12

10 11 12 13 14 15

Vo1 − Output Voltage − V

− Output Current − AI O

Vo3 = 28 V (Tripler Mode)

TA = 25°C

TA = 85°C

TA = −40°C

TPS65140 , TPS65141 TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

VO3 MAXIMUM LOAD CURRENT VO3 MAXIMUM LOAD CURRENT

Figure 13. Figure 14.

DETAILED DESCRIPTION

The TPS6514x series consists of a main boost converter operating with a fixed switching frequency of 1.6 MHz to allow for small external components. The boost converter output voltage VO1 is also the input voltage, connected via the pin SUP, for the positive and negative charge pump. The linear regulator controller is independent from this system with its own enable pin. This allows the linear regulator controller to continue to operate while the other supply rails are disabled or in shutdown due to a fault condition on one of their outputs. Refer to the functional block diagram for more information.

Main Boost Converter

The main boost converter operates with PWM and a fixed switching frequency of 1.6 MHz. The converter uses a unique fast response, voltage mode controller scheme with input voltage feedforward. This achieves excellent line and load regulation (0.2% A load regulation typical) and allows the use of small external components. To add higher flexibility to the selection of external component values, the device uses external loop compensation. Although the boost converter looks like a nonsynchronous boost converter topology operating in discontinuous mode at light load, the TPS6514x series maintains continuous conduction even at light load currents. This is accoplished using the Virtual Synchronous Converter Technology for improved load transient response. This architecture uses an external Schottky diode and an integrated MOSFET in parallel connected between SW and SUP (see the functional block diagram). The integrated MOSFET Q2 allows the inductor current to become negative at light load conditions. For this purpose, a small integrated P-channel MOSFET with typically 10 Ω r

is sufficient. When the inductor current is positive, the external Schottky diode with the lower forward

DS(on)

voltage conducts the current. This causes the converter to operate with a fixed frequency in continuous conduction mode over the entire load current range. This avoids the ringing on the switch pin as seen with a standard nonsynchronous boost converter and allows a simpler compensation for the boost converter.

Power-Good Output

The TPS6514x sereis has an open-drain power-good output with a maximum sink capability of 1 mA. The power-good output goes high as soon as the main boost converter VO1 and the negative and the positive charge pumps are within regulation. The power-good output goes low as soon as one of the outputs is out of regulation. In this case, the device goes into shutdown at the same time. See the electrical characteristics table for the power-good thresholds.

Enable and Power-On Sequencing (EN, ENR)

The device has two enable pins. These pins should be terminated and not left floating to prevent faulty operation. Pulling the enable pin (EN) high enables the device and starts the power-on sequencing with the main boost converter VO1 coming up first, then the negative and positive charge pump. The linear regulator has an independent enable pin (ENR). Pulling this pin low disables the regulator, and pulling this pin high enables this regulator.

If the enable pin (EN) is pulled high, the device starts its power-on sequencing. The main boost converter starts

Submit Documentation Feedback

www.ti.com

TPS65140 , TPS65141

TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

up first with its soft start. If the output voltage has reached 91.25% of its output voltage, the negative charge pump comes up next. The negative charge pump starts with a soft start and when the output voltage has reached 91% of the nominal value, the positive charge pump comes up with the soft start. Pulling the enable pin low shuts down the device. Dependent on load current and output capacitance, each of the outputs comes down.

Positive Charge Pump

The TPS6514x series has a fully regulated integrated positive charge pump generating VO3. The input voltage for the charge pump is applied to the SUP pin that is equal to the output of the main boost converter VO1. The charge pump is capable of supplying a minimum load current of 20 mA. Higher load currents are possible depending on the voltage difference between VO1 and VO3. See Figure 13 and Figure 14 .

Negative Charge Pump

The TPS6514x sereis has a regulated negative charge pump using two external Schottky diodes. The input voltage for the charge pump is applied to the SUP pin that is connected to the output of the main boost converter VO1. The charge pump inverts the main boost converter output voltage and is capable of supplying a minimum load current of 20 mA. Higher load currents are possible depending on the voltage difference between VO1 and VO2. See Figure 12 .

Linear Regulator Controller

The TPS6514x series includes a linear regulator controller to generate a 3.3-V rail which is useful when the system is powered from a 5-V supply. The regulator is independent from the other voltage rails of the device and has its own enable (ENR). Since most of the systems require this voltage rail to come up first it is recommended to use a R-C delay on EN. This delays the start-up of the main boost converter which reduces the inrush current as well.

Soft Start

The main boost converter as well as the charge pumps and linear regulator have an internal soft start. This avoids heavy voltage drops at the input voltage rail or at the output of the main boost converter VO1 during start-up. See Figure 10 and Figure 11. During softstart of the main boost converter VO1 the internal current limit threshold is increased in three steps. The device starts with the first step where the current limit is set to 2/5 of the typical current limit (2/5 of 2.3A) for 1024 clock cycles then increased to 3/5 of the current limit for 1024 clock cycles and the 3rd step is the full current limit. The TPS65141 has an extended softstart time where each step is 2048 clock cycles.

Fault Protection

All of the outputs of the TPS65140/45 have short-circuit detection and cause the device to go into shutdown. The TPS65141, as an exception, does not enter shutdown in case one of the outputs falls below its power good threshold. The main boost converter has overvoltage and undervoltage protection. If the output voltage VO1 rises above the overvoltage protection threshold of typically 5% of VO1, then the device stops switching, but remains operational. When the output voltage falls below this threshold, the converter continues operation. When the output voltage falls below the undervoltage protection threshold of typically 8.75% of VO1, because of a short-circuit condition, the TPS65140/45 goes into shutdown. Because there is a direct pass from the input to the output through the diode, the short-circuit condition remains. If this condition needs to be avoided, a fuse at the input or an output disconnect using a single transistor and resistor is required. The negative and positive charge pumps have an undervoltage lockout (UVLO) to protect the LCD panel of possible latch-up conditions due to a short-circuit condition or faulty operation. When the negative output voltage is typically above 9.5% of its output voltage (closer to ground), then the device enters shutdown. When the positive charge pump output voltage, VO3, is below 8% typical of its output voltage, the device goes into shutdown. See the fault protection thresholds in the electrical characteristics table. The device is enabled by toggling the enable pin (EN) below 0.4 V or by cycling the input voltage below the UVLO of 1.7 V. The linear regulator reduces the output current to 20 mA typical under a short-circuit condition when the output voltage is typically < 1 V. See the functional block diagram. The linear regulator does not go into shutdown under a short-circuit condition.

Submit Documentation Feedback

www.ti.com

TPS65140 , TPS65141 TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

Thermal Shutdown

A thermal shutdown is implemented to prevent damage due to excessive heat and power dissipation. Typically, the thermal shutdown threshold is 160 °C. If this temperature is reached, the device goes into shutdown. The device can be enabled by toggling the enable pin to low and back to high or by cycling the input voltage to GND and back to VIagain.

Submit Documentation Feedback

www.ti.com

D 

out

 VD V

out

 VD V



10 V  0.8 V  3.3 V 10 V  0.8 V  0.5 V

 0.73



out

1  D



300 mA

1  0.73

 1.11 A

i





Vin V



 D

fs L



(3.3 V  0.5 V)  0.73

1.6 MHz  4.2 H

 304 mA

swpeak

 I



i

 1.11 A 

304 mA

 1.26 A

TPS65140 , TPS65141

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

APPLICATION INFORMATION

BOOST CONVERTER DESIGN PROCEDURE

The first step in the design procedure is to calculate the maximum possible output current of the main boost converter under certain input and output voltage conditions. Below is an example for a 3.3-V to 10-V conversion:

= 3.3 V, V

1. Duty cycle:

2. Average inductor current:

3. Inductor peak-to-peak ripple current:

4. Peak switch current:

= 10 V, Switch voltage drop V

out

= 0.5 V, Schottky diode forward voltage V

= 0.8 V

TPS65145

The integrated switch, the inductor, and the external Schottky diode must be able to handle the peak switch current. The calculated peak switch current has to be equal or lower than the minimum N-MOSFET switch current limit as specified in the electrical characteristics table (1.6 A for the TPS65140/41 and 0.96 A for the TPS65145). If the peak switch current is higher, then the converter cannot support the required load current. This calculation must be done for the minimum input voltage where the peak switch current is highest. The calculation includes conduction losses like switch r

(0.5 V) and diode forward drop voltage losses (0.8 V).

DS(on)

Additional switching losses, inductor core and winding losses, etc., require a slightly higher peak switch current in the actual application. The above calculation still allows for a good design and component selection.

Inductor Selection

Several inductors work with the TPS6514x. Especially with the external compensation, the performance can be adjusted to the specific application requirements. The main parameter for the inductor selection is the saturation current of the inductor which should be higher than the peak switch current as calculated above with additional margin to cover for heavy load transients and extreme start-up conditions. Another method is to choose the inductor with a saturation current at least as high as the minimum switch current limit of 1.6 A for the TPS65140/41 and 0.96 A for the TPS65145. The different switch current limits allow selection of a physically smaller inductor when less output current is required. The second important parameter is the inductor DC resistance. Usually, the lower the DC resistance, the higher the efficiency. However, the inductor DC resistance is not the only parameter determining the efficiency. Especially for a boost converter where the inductor is the energy storage element, the type and material of the inductor influences the efficiency as well. Especially at high switching frequencies of 1.6 MHz, inductor core losses, proximity effects, and skin effects become more important. Usually, an inductor with a larger form factor yields higher efficiency. The efficiency difference between different inductors can vary between 2% to 10%. For the TPS6514x, inductor values between 3.3 µ H and 6.8 µ H are a good choice but other values can be used as well. Possible inductors are shown in Table 1 .

Submit Documentation Feedback

www.ti.com

V

out



out







Ip L

out

 Vd V



 Ip ESR

TPS65140 , TPS65141 TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

APPLICATION INFORMATION (continued)

Table 1. Inductor Selection

DEVICE INDUCTOR VALUE COMPONENT SUPPLIER DIMENSIONS / mm ISAT/DCR

4.7 µ H Coilcraft DO1813P-472HC 8,89 x 6,1 x 5 2.6 A/54 m Ω

4.2 µ H Sumida CDRH5D28 4R2 5,7 x 5,7 x 3 2.2 A/23 m Ω

TPS65140

TPS65145 3.3 µ H Sumida CDRH2D18/HP 3R3 3,2 x 3,2 x 2 1.45 A/69 m Ω

Output Capacitor Selection

For best output voltage filtering, a low ESR output capacitor is recommended. Ceramic capacitors have a low ESR value but depending on the application, tantalum capacitors can be used as well. A 22- µ F ceramic output capacitor works for most of the applications. Higher capacitor values can be used to improve load transient regulation. See Table 2 for the selection of the output capacitor. The output voltage ripple can be calculated as:

4.7 µ H Sumida CDC5D23 4R7 6 x 6 x 2,5 1.6 A/48 m Ω

3.3 µ H Wuerth Elektronik 744042003 4,8 x 4,8 x 2 1.8 A/65 m Ω

4.2 µ H Sumida CDRH6D12 4R2 6,5 x 6, 5 x 1,5 1.8 A/60 m Ω

3.3 µ H Sumida CDRH6D12 3R3 6,5 x 6,5 x 1,5 1.9 A/50 m Ω

3.3 µ H Sumida CDPH4D19 3R3 5,1 x 5,1 x 2 1.5 A/26 m Ω

3.3 µ H Coilcraft DO1606T-332 6,5 x 5,2 x 2 1.4 A/120 m Ω

4.7 µ H Wuerth Elektronik 744010004 5,5 x 3,5 x 1 1 A/260 m Ω

3.3 µ H Coilcraft LPO6610-332M 6,6 x 5,5 x 1 1.3 A/160 m Ω

with:

IP = Peak switch current as calculated in the previous section with I

SW(peak)

. L = Selected inductor value I

= Normal load current

OUT

fs= Switching frequency Vd= Rectifier diode forward voltage (typical 0.3 V) C

= Selected output capacitor

OUT

ESR = Output capacitor ESR value

Input Capacitor Selection

For good input voltage filtering, low ESR ceramic capacitors are recommended. A 22- µ F ceramic input capacitor is sufficient for most of applications. For better input voltage filtering, this value can be increased. See Table 2 and the typical applications for input capacitor recommendations.

Table 2. Input and Output Capacitors Selection

CAPACITOR VOLTAGE RATING COMPONENT SUPPLIER COMMENTS

22 µ F/1210 16 V Taiyo Yuden EMK325BY226MM C 22 µ F/1206 6.3 V Taiyo Yuden JMK316BJ226 C

O I

Rectifier Diode Selection

To achieve high efficiency, a Schottky diode should be used. The voltage rating should be higher than the maximum output voltage of the converter. The average forward current should be equal to the average inductor current of the converter. The main parameter influencing the efficiency of the converter is the forward voltage and the reverse leakage current of the diode; both should be as low as possible. Possible diodes are: On Semiconductor MBRM120L, Microsemi UPS120E, and Fairchild Semiconductor MBRS130L.

Submit Documentation Feedback

www.ti.com

out

 1.146 V 1 

R1 R2



SW SW

FB1

SUP

C2+

C2−/MODE

6.8 pF

430 kΩ

56 kΩ

C4 22 µF

VO1

Up to 10 V/150 mA

C2 0.22 µF

C8 

2    fz R1



2    50 kHz  R1

TPS65140 , TPS65141

TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

Converter Loop Design and Stability

The TPS6514x converter loop can be externally compensated and allows access to the internal transconductance error amplifier output at the COMP pin. A small feedforward capacitor across the upper feedback resistor divider speeds up the circuit as well. To test the converter stability and load transient performance of the converter, a load step from 50 mA to 250 mA is applied and the output voltage of the converter is monitored. Applying load steps to the converter output is a good tool to judge the stability of such a boost converter.

Design Procedure Quick Steps

1. Select the feedback resistor divider to set the output voltage.

2. Select the feedforward capacitor to place a zero at 50 kHz.

3. Select the compensation capacitor on pin COMP. The smaller the value, the higher the low frequency gain.

4. Use a 50-k Ω potentiometer in series to C transient by adjusting the potentiometer. Select a resistor value that comes closest to the potentiometer resistor value. This needs to be done at the highest V critical at these conditions.

Setting the Output Voltage and Selecting the Feedforward Capacitor

The output voltage is set by the external resistor divider and is calculated as:

and monitor V

during load transients. Fine tune the load

out

and highest load current because stability is most

Across the upper resistor, a bypass capacitor is required to speed up the circuit during load transients as shown in Figure 15 .

Figure 15. Feedforward Capacitor

Together with R1 the bypass capacitor C8 sets a zero in the control loop at approximately 50 kHz:

A value closest to the calculated value should be used. Larger feedforward capacitor values reduce the load regulation of the converter and cause load steps as shown in Figure 16 .

Submit Documentation Feedback

www.ti.com

Load Step

VIN COMP

15 kΩ

1 nF



2    Cc  Rc

CC = 4.7 nF

TPS65140 , TPS65141 TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

Figure 16. Load Step Caused By A Too Large Feedforward Capacitor Value

Compensation

The regulator loop can be compensated by adjusting the external components connected to the COMP pin. The COMP pin is connected to the output of the internal transconductance error amplifier. A typical compensation scheme is shown in Figure 17 .

Figure 17. Compensation Network

The compensation capacitor C

adjusts the low frequency gain, and the resistor value adjusts the high frequency

gain. The following formula calculates at what frequency the resistor increases the high frequency gain.

Lower input voltages require a higher gain and a lower compensation capacitor value. A good start is C for a 3.3-V input and C

= 2.2 nF for a 5-V input. If the device operates over the entire input voltage range from

2.7 V to 5.8 V, a larger compensation capacitor up to 10 nF is recommended. Figure 18 shows the load transient with a larger compensation capacitor, and Figure 19 shows a smaller compensation capacitor.

Figure 18. C

= 4. 7 nF

= 1 nF

Submit Documentation Feedback

www.ti.com

CC = 1 nF

TPS65140 , TPS65141

TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

Figure 19. C

Lastly, R

needs to be selected. A good practice is to use a 50-k Ω potentiometer and adjust the potentiometer

for the best load transient where no oscillations should occur. These tests have to be done at the highest V

= 1 nF

and

highest load current because the converter stability is most critical under these conditions. Figure 20 , Figure 21 , and Figure 22 show the fine tuning of the loop with Rc.

Figure 20. Overcompensated (Damped Oscillation), R

Is Too Large

Figure 21. Undercompensated (Loop Is Too Slow), R

Submit Documentation Feedback

Is Too Small

www.ti.com

V = -V x

OUT REF

= -1.213 V x

RR3

RR4

R3 = R4 x

= R4 x

OUT

REF

1.213

TPS65140 , TPS65141 TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

Figure 22. Optimum, R

Is Ideal

Negative Charge Pump

The negative charge pump provides a regulated output voltage by inverting the main output voltage, VO1. The negative charge pump output voltage is set with external feedback resistors.

The maximum load current of the negative charge pump depends on the voltage drop across the external Schottky diodes, the internal on resistance of the charge pump MOSFETS Q8 and Q9, and the impedance of the flying capacitor, C12. When the voltage drop across these components is larger than the voltage difference from VO1 to VO2, the charge pump is in drop out, providing the maximum possible output current. Therefore, the higher the voltage difference between VO1 and VO2, the higher the possible load current. See Figure 12 for the possible output current versus boost converter voltage VO1 and the calculations below.

Vout

= -(V

min

1 - 2 V

- IO(2 x r

DS(on)Q8

+ 2 x r

DS(on)Q9

+ X

))

cfly

Setting the output voltage:

The lower feedback resistor value, R4, should be in a range between 40 k Ω to 120 k Ω or the overall feedback resistance should be within 500 k Ω to 1 M Ω . Smaller values load the reference too heavy and larger values may cause stability problems. The negative charge pump requires two external Schottky diodes. The peak current rating of the Schottky diode has to be twice the load current of the output. For a 20 mA output current, the dual Schottky diode BAT54 or similar is a good choice.

Positive Charge Pump

The positive charge pump can be operated in a voltage doubler mode or a voltage tripler mode depending on the configuration of the C2+ and C2-/MODE pins. Leaving the C2+ pin open and connecting C2-/MODE to GND forces the positive charge pump to operate in a voltage doubler mode. If higher output voltages are required the positive charge pump can be operated as a voltage tripler. To operate the charge pump in the voltage tripler mode, a flying capacitor needs to be connected to C2+ and C2-/MODE.

The maximum load current of the positive charge pump depends on the voltage drop across the internal Schottky diodes, the internal on-resistance of the charge pump MOSFETS, and the impedance of the flying capacitor. When the voltage drop across these components is larger than the voltage difference VO1 x 2 to VO3 (doubler mode) or VO1 x 3 to VO3 (tripler mode), then the charge pump is in dropout, providing the maximum possible output current. Therefore, the higher the voltage difference between VO1 x 2 (doubler) or VO1 x 3 (tripler) to VO3, the higher the possible load current. See Figure 13 and Figure 14 for output current versus boost converter voltage, VO1, and the following calculations.

Voltage doubler:

Voltage tripler:

VO3

= 2 x VO1 - (2 V

max

= 3 x V

max

- (3 x V

+ 2 x IOx (2 x r

+ 2 x IOx (3 x r

DS(on)Q5

Submit Documentation Feedback

+ r

DS(on)Q3

+ r

DS(on)Q3

+ r

DS(on)Q4

+ r

DS(on)Q4

+ X

))

+ X

))

www.ti.com

out

 1.214 1 

R5 R6



R5  R6 



out

 1



 R6  

out

1.214

 1

TPS65140 , TPS65141

TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

The output voltage is set by the external resistor divider and is calculated as:

Linear Regulator Controller

The TPS6514x includes a linear regulator controller to generate a 3.3-V rail when the system is powered from a 5-V supply. Because an external npn transistor is required, the input voltage of the TPS6514x applied to VIN needs to be higher than the output voltage of the regulator. To provide a minimum base drive current of 13.5 mA, a minimum internal voltage drop of 500 mV from V minimum input voltage on VIN for a certain output voltage as the following calculation shows:

= VO4 + V

I(min)

The base drive current together with the h Using a standard npn transistor like the BCP68 allows an output current of 1 A and using the BCP54 allows a load current of 337 mA for an input voltage of 5 V. Other transistors can be used as well, depending on the required output current, power dissipation, and PCB space. The device is stable with a 4.7- µ F ceramic output capacitor. Larger output capacitor values can be used to improve the load transient response when higher load currents are required.

+ 0.5 V

of the external transistor determines the possible output current.

to V

is required. This can be translated into a

base

Thermal Information

An influential component of the thermal performance of a package is board design. To take full advantage of the heat dissipation abilities of the PowerPAD or QFN package with exposed thermal die, a board that acts similar to a heatsink and allows for the use of an exposed (and solderable) deep downset pad should be used. For further information. see Texas Instrumens application notes (SLMA002) PowerPAD Thermally Enhanced Package, and (SLMA004) Power Pad Made Easy. For the QFN package, see the application report (SLUA271) QFN/SON PCB Attachement. Especially for the QFN package it is required to solder down the Thermal Pad to achieve the required thermal resistance.

Layout Considerations

For all switching power supplies, the layout is an important step in the design, especially at high-peak currents and switching frequencies. If the layout is not carefully designed, the regulator might show stability and EMI problems. Therefore, the traces carrying high-switching currents should be routed first using wide and short traces. The input filter capacitor should be placed as close as possible to the input pin VIN of the IC. See the evaluation module (EVM) for a layout example.

Submit Documentation Feedback

www.ti.com

VIN COMP GND EN ENR C1+

C1− DRV

FB2 REF

FB4 BASE

SW SW

FB1

SUP

C2+

C2−/MODE

OUT3

FB3

PG PGND PGND

GND

TPS65140

3.3uH

22uF

Vin

3.3V

Vo1

10V / 150 mA

Vo3

up to 23V/20mA

System Power

Good

0.22u

33k

0.22u

620k

150k

C11

220nF

0.22u

R5 1M

56k

22uF

0.22u

6.8pF

56k

430

C12 0.22u

C13

Vin

15k

Vo2

−5 V / 20 mA

VIN COMP GND EN ENR C1+

C1− DRV

FB2 REF

FB4 BASE

SW SW

FB1

SUP C2+

C2−/MODE

OUT3

FB3

PG PGND PGND

GND

TPS65140

4.7uH

22uF

Vin

5.0 V

Vo1

13.5V / 400 mA

Vo3

up to 23V/20mA

System Power

Good

0.22u

33k

C10

4.7uF

BCP68

Vo4

3.3V/500mA

Vin

0.22u

750k

130k

C11

220nF

0.22u

1uF

R5 1M

56k

22uF

3.3pF

75k

820

C12 0.22u

C13

2.2n

Vin

4.3k

Vo2

−7 V / 20 mA

TPS65140 , TPS65141 TPS65145

SLVS497C – SEPTEMBER 2003 – REVISED APRIL 2006

Figure 23. Typical Application, Notebook Supply

Figure 24. Typical Application, Monitor Supply

Submit Documentation Feedback

PACKAGE OPTION ADDENDUM

www.ti.com

14-Aug-2006

PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

TPS65140PWP ACTIVE HTSSOP PWP 24 60 Green (RoHS &

no Sb/Br)

TPS65140PWPG4 ACTIVE HTSSOP PWP 24 60 Green (RoHS &

no Sb/Br)

TPS65140PWPR ACTIVE HTSSOP PWP 24 2000 Green (RoHS &

no Sb/Br)

TPS65140PWPRG4 ACTIVE HTSSOP PWP 24 2000 Green (RoHS &

no Sb/Br)

TPS65140RGER ACTIVE QFN RGE 24 3000 Green (RoHS &

no Sb/Br)

TPS65140RGERG4 ACTIVE QFN RGE 24 3000 Green (RoHS &

no Sb/Br)

TPS65141PWP ACTIVE HTSSOP PWP 24 60 Green (RoHS &

no Sb/Br)

TPS65141PWPG4 ACTIVE HTSSOP PWP 24 60 Green (RoHS &

no Sb/Br)

TPS65141PWPR ACTIVE HTSSOP PWP 24 2000 Green (RoHS &

no Sb/Br)

TPS65141PWPRG4 ACTIVE HTSSOP PWP 24 2000 Green (RoHS &

no Sb/Br)

TPS65141RGER ACTIVE QFN RGE 24 3000 Green (RoHS &

no Sb/Br)

TPS65141RGERG4 ACTIVE QFN RGE 24 3000 Green (RoHS &

no Sb/Br)

TPS65145PWP ACTIVE HTSSOP PWP 24 60 Green (RoHS &

no Sb/Br)

TPS65145PWPG4 ACTIVE HTSSOP PWP 24 60 Green (RoHS &

no Sb/Br)

TPS65145PWPR ACTIVE HTSSOP PWP 24 2000 Green (RoHS &

no Sb/Br)

TPS65145PWPRG4 ACTIVE HTSSOP PWP 24 2000 Green (RoHS &

no Sb/Br)

TPS65145RGER ACTIVE QFN RGE 24 3000 Green (RoHS &

no Sb/Br)

TPS65145RGERG4 ACTIVE QFN RGE 24 3000 Green (RoHS &

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-2-260C-1 YEAR

Call TI Level-2-260C-1 YEAR

CU NIPDAU Level-2-260C-1 YEAR

Call TI Level-2-260C-1 YEAR

(3)

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

14-Aug-2006

Addendum-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty . Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive

DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony

Video & Imaging www.ti.com/video Wireless www.ti.com/wireless

Mailing Address: Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

TEXAS INSTRUMENTS TPS65140, TPS65141, TPS65145 Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES DESCRIPTION

APPLICATIONS

ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

RECOMMENDED OPERATING CONDITIONS

ELECTRICAL CHARACTERISTICS

DEVICE INFORMATION

TYPICAL CHARACTERISTICS

Table of Graphs

DETAILED DESCRIPTION

Main Boost Converter

Power-Good Output

Enable and Power-On Sequencing (EN, ENR)

Positive Charge Pump

Negative Charge Pump

Linear Regulator Controller

Soft Start

Fault Protection

Thermal Shutdown

APPLICATION INFORMATION

BOOST CONVERTER DESIGN PROCEDURE

Inductor Selection

Output Capacitor Selection

Input Capacitor Selection

Rectifier Diode Selection

Converter Loop Design and Stability

Design Procedure Quick Steps

Setting the Output Voltage and Selecting the Feedforward Capacitor

Compensation