1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
IN2
EN3
†
NC
OC3
OUT3
NC
NC
1
2
3
4
8
7
6
5
GND
IN
IN
EN
†
OUT
OUT
OUT
OC
TPS2041B/TPS2051B
D AND DGN PACKAGES
(TOP VIEW)
1
2
3
4
8
7
6
5
GND
IN
EN1
†
EN2
†
OC1
OUT1
OUT2
OC2
TPS2042B/TPS2052B
D AND DGN PACKAGES
(TOP VIEW)
OC1
OUT1
OUT2
OC2
GND
IN1
EN1
†
EN2
†
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
IN2
EN3
†
EN4
†
OC3
OUT3
OUT4
OC4
OC1
OUT1
OUT2
OC2
GND
IN1
EN1
†
EN2
†
NC − No connect
†
All enable inputs are active high for the TPS205xB series.
TPS2044B/TPS2054B
D PACKAGE
(TOP VIEW)
TPS2043B/TPS2053B
D PACKAGE
(TOP VIEW)
TPS201xA
TPS202x
TPS203x
33 mΩ , single
0.2 A − 2 A
0.2 A − 2 A
0.2 A − 2 A
TPS2014
TPS2015
TPS2041B
TPS2051B
TPS2045
TPS2055
TPS2061
TPS2065
80 mΩ , single
600 mA
1 A
500 mA
500 mA
250 mA
250 mA
1 A
1 A
GENERAL SWITCH CA TALOG
TPS2042B
TPS2052B
TPS2046
TPS2056
TPS2062
TPS2066
80 mΩ , dual
500 mA
500 mA
250 mA
250 mA
1 A
1 A
TPS2100/1
260 mΩ
IN1 500 mA
IN2 10 mA
OUT
IN1
IN2
TPS2102/3/4/5
IN1 500 mA
IN2 100 mA
1.3 Ω
TPS2043B
TPS2053B
TPS2047
TPS2057
80 mΩ , triple
500 mA
500 mA
250 mA
250 mA
TPS2044B
TPS2054B
TPS2048
TPS2058
80 mΩ , quad
500 mA
500 mA
250 mA
250 mA
80 mΩ , dual
TPS2080
TPS2081
TPS2082
TPS2090
500 mA
500 mA
500 mA
250 mA
TPS2091
TPS2092
250 mA
250 mA
80 mΩ , quad
TPS2085
TPS2086
TPS2087
TPS2095
500 mA
500 mA
500 mA
250 mA
TPS2096
TPS2097
250 mA
250 mA
查询TPS2041B供应商
CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES
FEATURES APPLICATIONS
• 70-m Ω High-Side MOSFET
• 500-mA Continuous Current
• Thermal and Short-Circuit Protection
• Accurate Current Limit
(0.75 A min, 1.25 A max)
• Operating Range: 2.7 V to 5.5 V
• 0.6-ms Typical Rise Time
• Undervoltage Lockout
• Deglitched Fault Report ( OC)
• No OC Glitch During Power Up
• Maximum Standby Supply Current:
1-µA (Single, Dual) or 2-µA (Triple, Quad)
• Bidirectional Switch
• Ambient Temperature Range: -40°C to 85°C
• ESD Protection
• UL Recognized, File Number E169910
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
• Heavy Capacitive Loads
• Short-Circuit Protections
DESCRIPTION
The TPS204xB/TPS205xB power-distribution switches are intended for applications where heavy capacitive
loads and short circuits are likely to be encountered. These devices incorporates 70-m Ω N-channel MOSFET
power switches for power-distribution systems that require multiple power switches in a single package. Each
switch is controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to
control the power-switch rise times and fall times to minimize current surges during switching. The charge pump
requires no external components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode, pulling the overcurrent ( OCx) logic output low. When
continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction
temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal
shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains
off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1 A
typically.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2004–2006, Texas Instruments Incorporated
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTION AND ORDERING INFORMATION
RECOMMENDED TYPICAL PACKAGED DEVICES
T
A
ENABLE
Active low Single TPS2041BDGN TPS2041BD
Active high Single TPS2051BDGN TPS2051BD
Active low Dual TPS2042BDGN TPS2042BD
-40°C to 85°C 0.5 A 1 A
Active high Dual TPS2052BDGN TPS2052BD
Active low Triple -- TPS2043BD
Active high Triple -- TPS2053BD
Active low Quad -- TPS2044BD
Active high Quad -- TPS2054BD
(1) The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2042BDR)
MAXIMUM SHORT-CIRCUIT NUMBER OF
CONTINUOUS CURRENT LIMIT SWITCHES
LOAD CURRENT AT 25°c
(1)
MSOP (DGN) SOIC (D)
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
Input voltage range, V
Output voltage range, V
Input voltage range, V
Voltage range, V
I(IN)
O(OUT)
I( EN)
, V
I(/OC)
Continuous output current, I
Continuous total power dissipation See Dissipation Rating Table
Operating virtual junction temperature range, T
Storage temperature range, T
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds 260°C
Electrostatic discharge (ESD) protection
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND.
, V
I( OCx)
(2)
I(INx)
, V
, V
I( ENx)
O(OUT)
stg
(2)
O(OUTx)
, V
, V
I(EN)
I(ENx)
, I
O(OUTx)
J
Human body model MIL-STD-883C 2 kV
Charge device model (CDM) 500 V
(1)
UNIT
-0.3 V to 6 V
-0.3 V to 6 V
-0.3 V to 6 V
-0.3 V to 6 V
Internally limited
-40°C to 125°C
-65°C to 150°C
DISSIPATING RATING TABLE
PACKAGE
DGN-8 1712.3 mW 17.123 mW/°C 941.78 mW 684.93 mW
D-8 585.82 mW 5.8582 mW/°C 322.20 mW 234.32 mW
D-16 898.47 mW 8.9847 mW 494.15 mW 359.38 mW
TA≤ 25°C DERATING FACTOR TA= 70°C TA= 85°C
POWER RATING ABOVE TA= 25°C POWER RATING POWER RATING
2
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
Input voltage, V
Input voltage, V
Continuous output current, I
Operating virtual junction temperature, T
ELECTRICAL CHARACTERISTICS
over recommended operating junction temperature range, V
POWER SWITCH
Static drain-source on-state
resistance, 5-V operation V
and 3.3-V operation
r
DS(on)
Static drain-source on-state
resistance, 2.7-V V
operation
(2)
t
Rise time, output
r
(2)
t
Fall time, output
f
ENABLE INPUT EN AND ENx
V
High-level input voltage 2.7 V ≤ V
IH
V
Low-level input voltage 2.7 V ≤ V
IL
I
Input current V
I
(2)
t
Turnon time CL= 100 µF, RL= 10 Ω 3
on
(2)
t
Turnoff time CL= 100 µF, RL= 10 Ω 10
off
CURRENT LIMIT
I
Short-circuit output current A
OS
SUPPLY CURRENT (TPS2041B, TPS2051B)
Supply current, low-level output µA
Supply current, high-level output µA
Leakage current -40°C ≤ TJ≤ 125°C 1 µA
Reverse leakage current V
SUPPLY CURRENT (TPS2042B, TPS2052B)
Supply current, low-level output No load on OUT, V
Supply current, high-level output No load on OUT, V
Leakage current OUT connected to ground, V
Reverse leakage current V
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account
separately.
(2) Not tested in production, specified by design.
, V
I(IN)
I(INx)
, V
, V
I( EN)
I( ENx)
, V
I(EN)
I(ENx)
, I
O(OUT)
O(OUTx)
J
PARAMETER TEST CONDITIONS
= 5 V or 3.3 V, IO= 0.5 A -40°C ≤ TJ≤ 125°C 70 135 m Ω
I(IN)
= 2.7 V, IO= 0.5 A -40°C ≤ TJ≤ 125°C 75 150 m Ω
(2)
I(IN)
V
= 5.5 V 0.6 1.5
I(IN)
V
= 2.7 V 0.4 1
I(IN)
V
= 5.5 V 0.05 0.5
I(IN)
V
= 2.7 V 0.05 0.5
I(IN)
≤ 5.5 V 2
I(IN)
≤ 5.5 V 0.8
I(IN)
= 0 V or 5.5 V -0.5 0.5 µA
I( ENx)
V
= 5 V, OUT connected to GND,
I(IN)
device enabled into short-circuit
No load on OUT, V
or V
= 0 V
I(ENx)
No load on OUT, V
or V
= 5.5 V
I(ENx)
OUT connected to ground, V
or V
= 0 V
I(ENx)
= 5.5 V, IN = ground
I(OUTx)
= 5.5 V, IN = ground
I(OUTx)
2.7 5.5 V
0 5.5 V
0 500 mA
-40 125 °C
= 5.5 V, IO= 0.5 A, V
I(IN)
CL= 1 µF,
RL= 10 Ω
(1)
TJ= 25°C ms
= 0 V (unless otherwise noted)
I(/ENx)
MIN TYP MAX UNIT
TJ= 25°C 0.75 1 1.25
-40°C ≤ TJ≤ 125°C 0.7 1 1.3
I( ENx)
= 5.5 V,
TJ= 25°C 0.5 1
-40°C ≤ TJ≤ 125°C 0.5 5
I( ENx)
= 0 V,
TJ= 25°C 43 60
-40°C ≤ TJ≤ 125°C 43 70
= 5.5 V,
I( ENx)
(2)
= 5.5 V µA
I( ENx)
= 0 V µA
I( ENx)
= 5.5 V -40°C ≤ TJ≤ 125°C 1 µA
I( ENx)
(2)
TJ= 25°C 0 µA
TJ= 25°C 0.5 1
-40°C ≤ TJ≤ 125°C 0.5 5
TJ= 25°C 50 70
-40°C ≤ TJ≤ 125°C 50 90
TJ= 25°C 0.2 µA
V
ms
3
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating junction temperature range, V
PARAMETER TEST CONDITIONS
SUPPLY CURRENT (TPS2043B, TPS2053B)
Supply current, low-level output No load on OUT, V
Supply current, high-level output No load on OUT, V
Leakage current OUT connected to ground, V
Reverse leakage current V
= 5.5 V, INx = ground
I(OUTx)
SUPPLY CURRENT (TPS2044B, TPS2054B)
Supply current, low-level output µA
Supply current, high-level output µA
Leakage current -40°C ≤ TJ≤ 125°C 1 µA
Reverse leakage current V
No load on OUT, V
or V
= 0 V
I(ENx)
No load on OUT, V
or V
= 5.5 V
I(ENx)
OUT connected to ground, V
or V
= 0 V
I(ENx)
= 5.5 V, INx = ground
I(OUTx)
UNDERVOLTAGE LOCKOUT
Low-level input voltage, IN, INx 2 2.5 V
Hysteresis, IN, INx TJ= 25°C 75 mV
OVERCURRENT OC and OCx
Output low voltage, V
Off-state current
OC deglitch
(3)
THERMAL SHUTDOWN
Thermal shutdown threshold
Recovery from thermal shutdown
Hysteresis
(3)
OL(/OCx)
(3)
(4)
(3)
I
= 5 mA 0.4 V
O( OCx)
V
= 5 V or 3.3 V 1 µA
O( OCx)
OCx assertion or deassertion 4 8 15 ms
(3)
I(ENx)
I(ENx)
I( ENx)
I( ENx)
= 5.5 V, IO= 0.5 A, V
I(IN)
(1)
= 0 V µA
= 5.5 V µA
= 0 V -40°C ≤ TJ≤ 125°C 1 µA
I(ENx)
(3)
= 5.5 V,
TJ= 25°C 0.5 2
-40°C ≤ TJ≤ 125°C 0.5 10
TJ= 25°C 65 90
-40°C ≤ TJ≤ 125°C 65 110
TJ= 25°C 0.2 µA
TJ= 25°C 0.5 2
= 0 V (unless otherwise noted)
I(/ENx)
MIN TYP MAX UNIT
-40°C ≤ TJ≤ 125°C 0.5 10
= 0 V,
TJ= 25°C 75 110
-40°C ≤ TJ≤ 125°C 75 140
= 5.5 V,
I( ENx)
(3)
TJ= 25°C 0.2 µA
135 °C
125 °C
10 °C
(3) Not tested in production, specified by design.
(4) The thermal shutdown only reacts under overcurrent conditions.
4
DEVICE INFORMATION
OUT
OC
IN
EN
GND
Current
Limit
Driver
UVLO
Charge
Pump
CS
Thermal
Sense
Deglitch
Note A: Current sense
Note B: Active low (EN
) for TPS2041B; Active high (EN) for TPS2051B
(See Note A)
(See Note B)
Terminal Functions (TPS2041B and TPS2051B)
TERMINAL
NAME TPS2041B TPS2051B
EN 4 - I Enable input, logic low turns on power switch
EN - 4 I Enable input, logic high turns on power switch
GND 1 1 Ground
IN 2, 3 2, 3 I Input voltage
OC 5 5 O Overcurrent open-drain output, active-low
OUT 6, 7, 8 6, 7, 8 O Power-switch output
Functional Block Diagram (TPS2041B and TPS2051B)
I/O DESCRIPTION
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
5
Thermal
Sense
Driver
Current
Limit
Charge
Pump
UVLO
CS
Driver
Current
Limit
CS
Thermal
Sense
Charge
Pump
GND
EN1
IN
EN2
OC1
OUT1
OUT2
OC2
Deglitch
Deglitch
(See Note A)
(See Note B)
Note A: Current sense
Note B: Active low (ENx
) for TPS2042B; Active high (ENx) for TPS2052B
(See Note B)
(See Note A)
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
Terminal Functions (TPS2042B and TPS2052B)
TERMINAL
NAME TPS2042B TPS2052B
EN1 3 - I Enable input, logic low turns on power switch IN-OUT1
EN2 4 - I Enable input, logic low turns on power switch IN-OUT2
EN1 - 3 I Enable input, logic high turns on power switch IN-OUT1
EN2 - 4 I Enable input, logic high turns on power switch IN-OUT2
GND 1 1 Ground
IN 2 2 I Input voltage
OC1 8 8 O Overcurrent, open-drain output, active low, IN-OUT1
OC2 5 5 O Overcurrent, open-drain output, active low, IN-OUT2
OUT1 7 7 O Power-switch output, IN-OUT1
OUT2 6 6 O Power-switch output, IN-OUT2
Functional Block Diagram (TPS2042B and TPS2052B)
I/O DESCRIPTION
6
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
Terminal Functions (TPS2043B and TPS2053B)
TERMINAL
NAME TPS2043B TPS2053B
EN1 3 -- I Enable input, logic low turns on power switch IN1-OUT1
EN2 4 -- I Enable input, logic low turns on power switch IN1-OUT2
EN3 7 -- I Enable input, logic low turns on power switch IN2-OUT3
EN1 -- 3 I Enable input, logic high turns on power switch IN1-OUT1
EN2 -- 4 I Enable input, logic high turns on power switch IN1-OUT2
EN3 -- 7 I Enable input, logic high turns on power switch IN2-OUT3
GND 1, 5 1, 5 Ground
IN1 2 2 I Input voltage for OUT1 and OUT2
IN2 6 6 I Input voltage for OUT3
NC 8, 9, 10 8, 9, 10 No connection
OC1 16 16 O Overcurrent, open-drain output, active low, IN1-OUT1
OC2 13 13 O Overcurrent, open-drain output, active low, IN1-OUT2
OC3 12 12 O Overcurrent, open-drain output, active low, IN2-OUT3
OUT1 15 15 O Power-switch output, IN1-OUT1
OUT2 14 14 O Power-switch output, IN1-OUT2
OUT3 11 11 O Power-switch output, IN2-OUT3
I/O DESCRIPTION
TPS2041B , , TPS2042B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
7
Thermal
Sense
Driver
Current
Limit
UVLO
CS
Driver
Current
Limit
CS
Thermal
Sense
GND
EN1
IN1
EN2
OC1
OUT1
OUT2
OC2
Deglitch
Deglitch
Driver
Current
Limit
CS
Thermal
Sense
Charge
Pump
GND
IN2
EN3
OUT3
OC3
Deglitch
VCC
Selector
UVLO
(See Note A)
Note A: Current sense
Note B: Active low (ENx
) for TPS2043B; Active high (ENx) for TPS2053B
(See Note A)
(See Note A)
(See Note B)
(See Note B)
(See Note B)
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
Functional Block Diagram (TPS2043B and TPS2053B)
8
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
Terminal Functions (TPS2044B and TPS2054B)
TERMINAL
NAME TPS2044B TPS2054B
EN1 3 - I Enable input, logic low turns on power switch IN1-OUT1
EN2 4 - I Enable input, logic low turns on power switch IN1-OUT2
EN3 7 - I Enable input, logic low turns on power switch IN2-OUT3
EN4 8 - I Enable input, logic low turns on power switch IN2-OUT4
EN1 - 3 I Enable input, logic high turns on power switch IN1-OUT1
EN2 - 4 I Enable input, logic high turns on power switch IN1-OUT2
EN3 - 7 I Enable input, logic high turns on power switch IN2-OUT3
EN4 - 8 I Enable input, logic high turns on power switch IN2-OUT4
GND 1, 5 1, 5 Ground
IN1 2 2 I Input voltage for OUT1 and OUT2
IN2 6 6 I Input voltage for OUT3 and OUT4
OC1 16 16 O Overcurrent, open-drain output, active low, IN1-OUT1
OC2 13 13 O Overcurrent, open-drain output, active low, IN1-OUT2
OC3 12 12 O Overcurrent, open-drain output, active low, IN2-OUT3
OC4 9 9 O Overcurrent, open-drain output, active low, IN2-OUT4
OUT1 15 15 O Power-switch output, IN1-OUT1
OUT2 14 14 O Power-switch output, IN1-OUT2
OUT3 11 11 O Power-switch output, IN2-OUT3
OUT4 10 10 O Power-switch output, IN2-OUT4
I/O DESCRIPTION
TPS2041B , , TPS2042B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
9
Thermal
Sense
Driver
Current
Limit
UVLO
CS
Driver
Current
Limit
CS
Thermal
Sense
Power Switch
GND
EN1
IN1
EN2
OC1
OUT1
OUT2
OC2
Deglitch
Deglitch
Thermal
Sense
Driver
Current
Limit
UVLO
CS
Driver
Current
Limit
CS
Thermal
Sense
Charge
Pump
Power Switch
GND
EN3
IN2
EN4
OC3
OUT3
OUT4
OC4
Deglitch
Deglitch
VCC
Selector
Note A: Current sense
Note B: Active low (ENx
) for TPS2044B; Active high (ENx) for TPS2054B
(See Note A)
(See Note A)
(See Note A)
(See Note A)
(See Note B)
(See Note B)
(See Note B)
(See Note B)
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
Functional Block Diagram (TPS2044B and TPS2054B)
10
PARAMETER MEASUREMENT INFORMATION
R
L
C
L
OUT
t
r
t
f
90%
90%
10%
10%
50%
50%
90%
10%
V
O(OUT)
V
I(EN)
V
O(OUT)
VOLTAGE WAVEFORMS
TEST CIRCUIT
t
on
t
off
50%
50%
90%
10%
V
I(EN)
V
O(OUT)
t
on
t
off
V
I(EN)
V
I(EN)
5 V/div
V
O(OUT)
2 V/div
RL = 10 ,
CL = 1 F
TA = 25 C
t − Time − 500 s/div
V
I(EN)
V
I(EN)
5 V/div
V
O(OUT)
2 V/div
RL = 10 ,
CL = 1 F
TA = 25 C
t − Time − 500 s/div
Figure 1. Test Circuit and Voltage Waveforms
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
Figure 2. Turnon Delay and Rise Time With 1-µF Load Figure 3. Turnoff Delay and Fall Time With 1-µF Load
11
V
I(EN)
V
I(EN)
5 V/div
V
O(OUT)
2 V/div
RL = 10 ,
CL = 100 F
TA = 25 C
t − Time − 500 s/div
V
O(OUT)
2 V/div
V
I(EN)
V
I(EN)
5 V/div
RL = 10 ,
CL = 100 F
TA = 25 C
t − Time − 500 s/div
220 F
470 F
100 F
VI = 5 V ,
RL = 10 ,
TA = 25 C
V
I(EN)
V
I(EN)
5 V/div
I
O(OUT)
500 mA/div
t − Time − 500 s/div
V
I(EN)
V
I(EN)
5 V/div
I
O(OUT)
500 mA/div
t − Time − 500 s/div
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 4. Turnon Delay and Rise Time With 100-µF Load Figure 5. Turnoff Delay and Fall Time With 100-µF Load
Figure 6. Short-Circuit Current, Figure 7. Inrush Current With Different
Device Enabled Into Short Load Capacitance
12
V
O(OC)
2 V/div
I
O(OUT)
500 mA/div
t − Time − 2 ms/div
V
O(OC)
2 V/div
I
O(OUT)
500 mA/div
t − Time − 2 ms/div
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
2 3 4 5 6
Turnon Time − ms
VI − Input Voltage − V
CL = 100 F,
RL = 10 ,
TA = 25 C
2.8
2.9
3
3.1
3.2
3.3
2 3 4 5 6
Turnoff Time − ms
VI − Input Voltage − V
CL = 100 F,
RL = 10 ,
TA = 25 C
PARAMETER MEASUREMENT INFORMATION (continued)
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
Figure 8. 3- Ω Load Connected to Enabled Device Figure 9. 2- Ω Load Connected to Enabled Device
TYPICAL CHARACTERISTICS
TURNON TIME TURNOFF TIME
vs vs
INPUT VOLTAGE INPUT VOLTAGE
Figure 10. Figure 11.
13
0
0.1
0.2
0.3
0.4
0.5
0.6
2 3 4 5 6
Rise Time − ms
VI − Input Voltage − V
CL = 1 F,
RL = 10 ,
TA = 25 C
0
0.05
0.1
0.15
0.2
0.25
2 3 4 5 6
CL = 1 F,
RL = 10 ,
TA = 25 C
Fall Time − ms
VI − Input Voltage − V
0
10
20
30
40
50
60
−50 0 50 100 150
VI = 5.5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − C
− Supply Current, Output Enabled −
I
I (IN)
Aµ
VI = 5 V
0
10
20
30
40
50
60
70
−50 0 50 100 150
VI = 5.5 V
VI = 5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − C
− Supply Current, Output Enabled −
I
I (IN)
Aµ
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
RISE TIME FALL TIME
INPUT VOLTAGE INPUT VOLTAGE
TYPICAL CHARACTERISTICS (continued)
vs vs
Figure 12. Figure 13.
SUPPLY CURRENT, OUTPUT ENABLED SUPPLY CURRENT, OUTPUT ENABLED
14
TPS2041B/2051B TPS2042B/TPS2052B
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 14. Figure 15.
vs vs
0
10
20
30
40
50
60
70
80
90
−50 0 50 100 150
VI = 5.5 V
VI = 5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − C
− Supply Current, Output Enabled −
I
I (IN)
Aµ
0
20
40
60
80
100
120
−50 0 50 100 150
VI = 5.5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − C
− Supply Current, Output Enabled −
I
I (IN)
Aµ
VI = 5 V
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
−50 0 50 100 150
VI = 5.5 V
VI = 5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − C
− Supply Current, Output Disabled −
I
I (IN)
Aµ
TJ − Junction Temperature − C
− Supply Current, Output Disabled − I
I (IN)
Aµ
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
−50 0 50 100 150
VI = 2.7 V
VI = 3.3 V
VI = 5.5 V
VI = 5 V
TYPICAL CHARACTERISTICS (continued)
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
SUPPLY CURRENT, OUTPUT ENABLED SUPPLY CURRENT, OUTPUT ENABLED
SUPPLY CURRENT, OUTPUT DISABLED SUPPLY CURRENT, OUTPUT DISABLED
TPS2043B/TPS2053B TPS2044B/2054B
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 16. Figure 17.
TPS2041B/2051B TPS2042B/TPS2052B
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 18. Figure 19.
15
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
−50 0 50 100 150
VI = 5.5 V
VI = 5 V
VI = 2.7 V
TJ − Junction Temperature − C
− Supply Current, Output Disabled −
I
I (IN)
Aµ
VI = 3.3 V
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
−50 0 50 100 150
VI = 5.5 V
VI = 5 V
VI = 2.7 V
TJ − Junction Temperature − C
− Supply Current, Output Disabled − I
I (IN)
Aµ
VI = 3.3 V
0.9
0.92
0.94
0.96
0.98
1.0
1.02
1.04
1.06
1.08
−50 0 50 100 150
VI = 5 V
VI = 3.3 V
VI = 5.5 V
TJ − Junction Temperature − C
VI = 2.7 V
− Short-Circuit Output Current − A
I
OS
0
20
40
60
80
100
120
−50 0 50 100 150
VI = 5 V
VI = 3.3 V
TJ − Junction Temperature − C
r
DS(on) − Static Drain-Source On-State Resistance − m
Ω
VI = 2.7 V
IO = 0.5 A
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
TYPICAL CHARACTERISTICS (continued)
SUPPLY CURRENT, OUTPUT DISABLED SUPPLY CURRENT, OUTPUT DISABLED
STATIC DRAIN-SOURCE ON-STATE RESISTANCE SHORT-CIRCUIT OUTPUT CURRENT
TPS2043B/TPS2053B TPS2044B/2054B
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 20. Figure 21.
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
16
Figure 22. Figure 23.
1
1.2
1.4
1.6
1.8
2
2.5 3 3.5 4 4.5 5 5.5 6
TA = 25 C
Load Ramp = 1A/10 ms
Threshold Trip Current − A
VI − Input Voltage − V
TPS2043B,
TPS2044B,
TPS2053B,
TPS2054B
Threshold Trip Current − A
VI − Input Voltage − V
1
1.2
1.4
1.6
1.8
2
2.5 3 3.5 4 4.5 5 5.5 6
TA = 25 C
Load Ramp = 1A/10 ms
TPS2041B,
TPS2042B,
TPS2051B,
TPS2052B
0
20
40
60
80
100
0 2.5 5 7.5 10 12.5
Peak Current − A
VI = 5 V ,
TA = 25 C
Current-Limit Response − sµ
2.1
2.14
2.18
2.22
2.26
2.3
−50 0 50 100 150
UVLO Rising
UVLO Falling
UVLO − Undervoltage Lockout − V
TJ − Junction Temperature − C
TYPICAL CHARACTERISTICS (continued)
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
THRESHOLD TRIP CURRENT THRESHOLD TRIP CURRENT
UNDERVOLTAGE LOCKOUT CURRENT-LIMIT RESPONSE
JUNCTION TEMPERATURE PEAK CURRENT
vs vs
INPUT VOLTAGE INPUT VOLTAGE
Figure 24. Figure 25.
vs vs
Figure 26. Figure 27.
17
IN
OC1
EN1
OC2
2
8
5
7
0.1 µ F 22 µ F
0.1 µ F 22 µ F
Load
Load
OUT1
OUT2
Power Supply
2.7 V to 5.5 V
6
EN2
3
4
GND
0.1 µ F
TPS2042B
1
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
APPLICATION INFORMATION
POWER-SUPPLY CONSIDERATIONS
Figure 28. Typical Application (Example, TPS2042B)
A 0.01-µF to 0.1-µF ceramic bypass capacitor between IN and GND, close to the device, is recommended.
Placing a high-value electrolytic capacitor on the output pin(s) is recommended when the output load is heavy.
This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the
output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients.
OVERCURRENT
A sense FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not
increase the series resistance of the current path. When an overcurrent condition is detected, the device
maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only
if the fault is present long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted before the
device is enabled or before V
has been applied (see Figure 14 through Figure 17 ). The TPS204xB/TPS205xB
I(IN)
senses the short and immediately switches into a constant-current output.
In the second condition, a short or an overload occurs while the device is enabled. At the instant the overload
occurs, high currents may flow for a short period of time before the current-limit circuit can react. After the
current-limit circuit has tripped (reached the overcurrent trip threshold), the device switches into constant-current
mode.
In the third condition, the load has been gradually increased beyond the recommended operating current. The
current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is
exceeded (see Figure 18 through Figure 21 ). The TPS204xB/TPS205xB is capable of delivering current up to the
current-limit threshold without damaging the device. Once the threshold has been reached, the device switches
into its constant-current mode.
OC RESPONSE
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature shutdown condition
is encountered after a 10-ms deglitch timeout. The output remains asserted until the overcurrent or
overtemperature condition is removed. Connecting a heavy capacitive load to an enabled device can cause a
momentary overcurrent condition; however, no false reporting on OCx occurs due to the 10-ms deglitch circuit.
The TPS204xB/TPS205xB is designed to eliminate false overcurrent reporting. The internal overcurrent deglitch
eliminates the need for external components to remove unwanted pulses. OCx is not deglitched when the switch
is turned off due to an overtemperature shutdown.
18
GND
IN
EN1
EN2
OC1
OC2
OUT1
OUT2
TPS2042B
R
pullup
V+
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
APPLICATION INFORMATION (continued)
Figure 29. Typical Circuit for the OC Pin (Example, TPS2042B)
POWER DISSIPATION AND JUNCTION TEMPERATURE
The low on-resistance on the N-channel MOSFET allows the small surface-mount packages to pass large
currents. The thermal resistances of these packages are high compared to those of power packages; it is good
design practice to check power dissipation and junction temperature. Begin by determining the r
N-channel MOSFET relative to the input voltage and operating temperature. As an initial estimate, use the
highest operating ambient temperature of interest and read r
from Figure 22 . Using this value, the power
DS(on)
dissipation per switch can be calculated by:
• P
= r
D
DS(on)
2
× I
Multiply this number by the number of switches being used. This step renders the total power dissipation from
the N-channel MOSFETs.
Finally, calculate the junction temperature:
• TJ= P
x R
D
+ T
Θ JA
A
Where:
• T A= Ambient temperature °C
• R
• P
= Thermal resistance
Θ JA
= Total power dissipation based on number of switches being used.
D
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally
sufficient to get a reasonable answer.
DS(on)
of the
THERMAL PROTECTION
Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for
extended periods of time. The TPS204xB/TPS205xB implements a thermal sensing to monitor the operating
junction temperature of the power distribution switch. In an overcurrent or short-circuit condition, the junction
temperature rises due to excessive power dissipation. Once the die temperature rises to approximately 140°C
due to overcurrent conditions, the internal thermal sense circuitry turns the power switch off, thus preventing the
power switch from damage. Hysteresis is built into the thermal sense circuit, and after the device has cooled
approximately 10°C, the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The OCx open-drain output is asserted (active low) when an overtemperature shutdown
or overcurrent occurs.
UNDERVOLTAGE LOCKOUT (UVLO)
An undervoltage lockout ensures that the power switch is in the off state at power up. Whenever the input
voltage falls below approximately 2 V, the power switch is quickly turned off. This facilitates the design of
hot-insertion systems where it is not possible to turn off the power switch before input power is removed. The
UVLO also keeps the switch from being turned on until the power supply has reached at least 2 V, even if the
switch is enabled. On reinsertion, the power switch is turned on, with a controlled rise time to reduce EMI and
voltage overshoots.
19
IN
OC
EN
GND
0.1 µ F
2, 3
5
4
6, 7, 8
0.1 µ F 120 µ F
GND
OUT
TPS2041B
Power Supply
D+
D−
V
BUS
Downstream
USB Ports
USB
Control
3.3 V 5 V
1
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
APPLICATION INFORMATION (continued)
UNIVERSAL SERIAL BUS (USB) APPLICATIONS
The universal serial bus (USB) interface is a 12-Mb/s, or 1.5-Mb/s, multiplexed serial bus designed for
low-to-medium bandwidth PC peripherals (e.g., keyboards, printers, scanners, and mice). The four-wire USB
interface is conceived for dynamic attach-detach (hot plug-unplug) of peripherals. Two lines are provided for
differential data, and two lines are provided for 5-V power distribution.
USB data is a 3.3-V level signal, but power is distributed at 5 V to allow for voltage drops in cases where power
is distributed through more than one hub across long cables. Each function must provide its own regulated 3.3 V
from the 5-V input or its own internal power supply.
The USB specification defines the following five classes of devices, each differentiated by power-consumption
requirements:
• Hosts/self-powered hubs (SPH)
• Bus-powered hubs (BPH)
• Low-power, bus-powered functions
• High-power, bus-powered functions
• Self-powered functions
Self-powered and bus-powered hubs distribute data and power to downstream functions. The
TPS204xB/TPS205xB can provide-power distribution solutions to many of these classes of devices.
HOST/SELF-POWERED AND BUS-POWERED HUBS
Hosts and self-powered hubs have a local power supply that powers the embedded functions and the
downstream ports (see Figure 30 and Figure 31 ). This power supply must provide from 5.25 V to 4.75 V to the
board side of the downstream connection under full-load and no-load conditions. Hosts and SPHs are required to
have current-limit protection and must report overcurrent conditions to the USB controller. Typical SPHs are
desktop PCs, monitors, printers, and stand-alone hubs.
Figure 30. Typical One-Port USB Host / Self-Powered Hub
20
IN1
OC1
EN1
OC2
EN2
GND
0.1 µ F
2
16
3
13
4
15
14
33 µ F
33 µ F
GND
1
OUT1
OUT2
TPS2044B
Power Supply
D+
D−
V
BUS
GND
D+
D−
V
BUS
Downstream
USB Ports
USB
Controller
3.3 V 5 V
OC3
EN3
OC4
EN4
12
7
9
8
6
IN2
+
+
5
GND
11
10
33 µ F
33 µ F
GND
OUT3
OUT4
D+
D−
V
BUS
GND
D+
D−
V
BUS
+
+
APPLICATION INFORMATION (continued)
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
Figure 31. Typical Four-Port USB Host / Self-Powered Hub
Bus-powered hubs obtain all power from upstream ports and often contain an embedded function. The hubs are
required to power up with less than one unit load. The BPH usually has one embedded function, and power is
always available to the controller of the hub. If the embedded function and hub require more than 100 mA on
power up, the power to the embedded function may need to be kept off until enumeration is completed. This can
be accomplished by removing power or by shutting off the clock to the embedded function. Power switching the
embedded function is not necessary if the aggregate power draw for the function and controller is less than one
unit load. The total current drawn by the bus-powered device is the sum of the current to the controller, the
embedded function, and the downstream ports, and it is limited to 500 mA from an upstream port.
LOW-POWER BUS-POWERED AND HIGH-POWER BUS-POWERED FUNCTIONS
Both low-power and high-power bus-powered functions obtain all power from upstream ports; low-power
functions always draw less than 100 mA; high-power functions must draw less than 100 mA at power up and can
draw up to 500 mA after enumeration. If the load of the function is more than the parallel combination of 44 Ω
and 10 µF at power up, the device must implement inrush current limiting (see Figure 32 ).
21
IN
OC1
OC2
2
8
3
5
4
7
0.1 µ F 10 µ F
Internal
Function
OUT1
Power Supply
3.3 V
EN1
6
0.1 µ F 10 µ F
OUT2
Internal
Function
0.1 µ F
10 µ F
USB
Control
GND
V
BUS
D−
D+
EN2
GND
1
TPS2042B
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
APPLICATION INFORMATION (continued)
Figure 32. High-Power Bus-Powered Function (Example, TPS2042B)
USB POWER-DISTRIBUTION REQUIREMENTS
USB can be implemented in several ways, and, regardless of the type of USB device being developed, several
power-distribution features must be implemented.
• Hosts/self-powered hubs must:
– Current-limit downstream ports
– Report overcurrent conditions on USB V
• Bus-powered hubs must:
– Enable/disable power to downstream ports
– Power up at <100 mA
– Limit inrush current (<44 Ω and 10 µF)
• Functions must:
– Limit inrush currents
– Power up at <100 mA
The feature set of the TPS204xB/TPS205xB allows them to meet each of these requirements. The integrated
current-limiting and overcurrent reporting is required by hosts and self-powered hubs. The logic-level enable and
controlled rise times meet the need of both input and output ports on bus-powered hubs, as well as the input
ports for bus-powered functions (see Figure 33 through Figure 36 ).
BUS
22
†
USB rev 1.1 requires 120 µ F per hub.
DP1
DM1
DP2
DM2
DP3
DM3
DP4
PWRON1
OVRCUR1
PWRON2
OVRCUR2
PWRON3
OVRCUR3
PWRON4
OVRCUR4
DM4
DP0
DM0
V
CC
XTAL1
XTAL2
OCSOFF
SN75240
D +
D −
5 V
GND
D +
D −
5 V
D +
D −
5 V
D +
D −
5 V
48-MHz
Crystal
Downstream
Ports
TUSB2041B
Hub Controller
Tuning
Circuit
ABC
D
33 µ F
†
SN75240
ABC
D
GND
GND
GND
33 µ F
†
33 µ F
†
33 µ F
†
D +
D −
Upstream
Port
TPS2041B
SN75240
A
B
5 V
GND
C
D
1 µ F
IN
GND
Ferrite Beads
Ferrite Beads
Ferrite Beads
Ferrite Beads
BUSPWR
GANGED
Tie to TPS2041B EN Input
OC EN
OUT
5-V Power
Supply
IN
GND
3.3 V
4.7 µ F
0.1 µ F
4.7 µ F
GND
EN
OC
IN
TPS2041B
OUT
EN
OC
IN
TPS2041B
OUT
EN
OC
IN
TPS2041B
OUT
EN
OC
IN
TPS2041B
OUT
TPS76333
0.1 µ F
0.1 µ F
0.1 µ F
0.1 µ F
APPLICATION INFORMATION (continued)
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
Figure 33. Hybrid Self / Bus-Powered Hub Implementation, TPS2041B/TPS2051B
23
DP1
DM1
DP2
DM2
DP3
DM3
DP4
PWRON1
OVRCUR1
PWRON2
OVRCUR2
DM4
DP0
DM0
V
CC
XTAL1
XTAL2
OCSOFF
SN75240
D +
D −
5 V
GND
D +
D −
5 V
D +
D −
5 V
D +
D −
5 V
48-MHz
Crystal
Downstream
Ports
TUSB2040
Hub Controller
Tuning
Circuit
ABC
D
33 µ F
†
SN75240
ABC
D
GND
GND
GND
33 µ F
†
33 µ F
†
33 µ F
†
D +
D −
Upstream
Port
TPS2041B
SN75240
A
B
5 V
GND
C
D
1 µ F
IN
GND
Ferrite Beads
Ferrite Beads
Ferrite Beads
Ferrite Beads
BUSPWR
GANGED
Tie to TPS2041B EN Input
OC EN
OUT
5-V Power
Supply
IN
GND
3.3 V
4.7 µ F
0.1 µ F
4.7 µ F
EN1
IN
OC1
OUT1
TPS2042B
EN2
OC2
OUT2
0.1 µ F
GND
†
USB rev 1.1 requires 120 µ F per hub.
TPS76333
PWRON3
PWRON4
OVRCUR3
OVRCUR4
EN1
IN
OC1
OUT1
TPS2042B
EN2
OC2
OUT2
0.1 µ F
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
APPLICATION INFORMATION (continued)
24
Figure 34. Hybrid Self / Bus-Powered Hub Implementation, TPS2042B/TPS2052B
DP1
DM1
DP2
DM2
DP3
DM3
PWRON1
OVRCUR1
PWRON2
OVRCUR2
PWRON3
OVRCUR3
DP0
DM0
V
CC
XTAL1
XTAL2
OCSOFF
SN75240
D +
D −
5 V
GND
D +
D −
5 V
D +
D −
5 V
48-MHz
Crystal
Downstream
Ports
TUSB2040
Hub Controller
Tuning
Circuit
ABC
D
47 µ F
†
1/2 SN75240
ABC
D
GND
GND
47 µ F
†
47 µ F
†
D +
D −
Upstream
Port
TPS2041B
1/2 SN75240
A
B
5 V
GND
C
D
1 µ F
IN
GND
Ferrite Beads
Ferrite Beads
Ferrite Beads
BUSPWR
GANGED
Tie to TPS2041B EN Input
OC EN
OUT
5-V Power
Supply
IN
GND
3.3 V
4.7 µ F
0.1 µ F
4.7 µ F
EN1
IN1
OC1
OUT1
TPS2053B
EN2
OC2
OUT2
0.1 µ F
0.1 µ F
GND
†
USB rev 1.1 requires 120 µ F per hub.
OUT3
EN3
OC3
IN2
GND
GND
TPS76333
APPLICATION INFORMATION (continued)
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
Figure 35. Hybrid Self / Bus-Powered Hub Implementation, TPS2043B/TPS2053B
25
DP1
DM1
DP2
DM2
DP3
DM3
DP4
PWRON1
OVRCUR1
PWRON2
OVRCUR2
PWRON3
OVRCUR3
PWRON4
OVRCUR4
DM4
DP0
DM0
V
CC
XTAL1
XTAL2
OCSOFF
SN75240
D +
D −
5 V
GND
D +
D −
5 V
D +
D −
5 V
D +
D −
5 V
48-MHz
Crystal
Downstream
Ports
TUSB2040
Hub Controller
Tuning
Circuit
ABC
D
33 µ F
†
SN75240
ABC
D
GND
GND
GND
33 µ F
†
33 µ F
†
33 µ F
†
D +
D −
Upstream
Port
TPS2041B
SN75240
A
B
5 V
GND
C
D
1 µ F
IN
GND
Ferrite Beads
Ferrite Beads
Ferrite Beads
Ferrite Beads
BUSPWR
GANGED
Tie to TPS2041B EN Input
OC EN
OUT
5-V Power
Supply
IN
GND
3.3 V
4.7 µ F
0.1 µ F
4.7 µ F
EN1
IN1
OC1
OUT1
TPS2044B
EN2
OC2
OUT2
0.1 µ F
0.1 µ F
GND
†
USB rev 1.1 requires 120 µ F per hub.
EN3
OC3
OUT3
EN4
OC4
OUT4
IN2
GND1
GND2
TPS76333
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
APPLICATION INFORMATION (continued)
Figure 36. Hybrid Self / Bus-Powered Hub Implementation, TPS2044B/TPS2054B
26
Power
Supply
0.1 µ F
1000 µ F
Optimum
2.7 V to 5.5 V
PC Board
Overcurrent Response
TPS2042B
OC1
GND
EN1
IN
EN2
OUT1
OUT2
OC2
Block of
Circuitry
Block of
Circuitry
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
APPLICATION INFORMATION (continued)
GENERIC HOT-PLUG APPLICATIONS
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating.
These are considered hot-plug applications. Such implementations require the control of current surges seen by
the main power supply and the card being inserted. The most effective way to control these surges is to limit and
slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply
normally turns on. Due to the controlled rise times and fall times of the TPS204xB/TPS205xB, these devices can
be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of
the TPS204xB/TPS205xB also ensures that the switch is off after the card has been removed, and that the
switch is off during the next insertion. The UVLO feature insures a soft start with a controlled rise time for every
insertion of the card or module.
Figure 37. Typical Hot-Plug Implementation (Example, TPS2042B)
By placing the TPS204xB/TPS205xB between the V
input and the rest of the circuitry, the input power reaches
CC
these devices first after insertion. The typical rise time of the switch is approximately 1 ms, providing a slow
voltage ramp at the output of the device. This implementation controls system surge currents and provides a
hot-plugging mechanism for any device.
DETAILED DESCRIPTION
Power Switch
The power switch is an N-channel MOSFET with a low on-state resistance. Configured as a high-side switch, the
power switch prevents current flow from OUT to IN and IN to OUT when disabled. The power switch supplies a
minimum current of 500 mA.
Charge Pump
An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate
of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires
little supply current.
Driver
The driver controls the gate voltage of the power switch. To limit large current surges and reduce the associated
electromagnetic interference (EMI) produced, the driver incorporates circuitry that controls the rise times and fall
times of the output voltage.
Enable ( ENx)
The logic enable pin disables the power switch and the bias for the charge pump, driver, and other circuitry to
reduce the supply current. The supply current is reduced to less than 1 µA or 2 µA when a logic high is present
on EN. A logic zero input on EN restores bias to the drive and control circuits and turns the switch on. The
enable input is compatible with both TTL and CMOS logic levels.
27
TPS2041B , , TPS2042B
TPS2043B , TPS2044B , TPS2051B
TPS2052B , TPS2053B , TPS2054B
SLVS514E – APRIL 2004 – REVISED JANUARY 2006
DETAILED DESCRIPTION (continued)
Enable (ENx)
The logic enable disables the power switch and the bias for the charge pump, driver, and other circuitry to reduce
the supply current. The supply current is reduced to less than 1 µA or 2 µA when a logic low is present on ENx.
A logic high input on ENx restores bias to the drive and control circuits and turns the switch on. The enable input
is compatible with both TTL and CMOS logic levels.
Overcurrent ( OCx)
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature condition is
encountered. The output remains asserted until the overcurrent or overtemperature condition is removed. A
10-ms deglitch circuit prevents the OCx signal from oscillation or false triggering. If an overtemperature shutdown
occurs, the OCx is asserted instantaneously.
Current Sense
A sense FET monitors the current supplied to the load. The sense FET measures current more efficiently than
conventional resistance methods. When an overload or short circuit is encountered, the current-sense circuitry
sends a control signal to the driver. The driver in turn reduces the gate voltage and drives the power FET into its
saturation region, which switches the output into a constant-current mode and holds the current constant while
varying the voltage on the load.
Thermal Sense
The TPS204xB/TPS205xB implements a thermal sensing to monitor the operating temperature of the power
distribution switch. In an overcurrent or short-circuit condition, the junction temperature rises. When the die
temperature rises to approximately 140°C due to overcurrent conditions, the internal thermal sense circuitry turns
off the switch, thus preventing the device from damage. Hysteresis is built into the thermal sense, and after the
device has cooled approximately 10 degrees, the switch turns back on. The switch continues to cycle off and on
until the fault is removed. The open-drain false reporting output ( OCx) is asserted (active low) when an
overtemperature shutdown or overcurrent occurs.
Undervoltage Lockout
A voltage sense circuit monitors the input voltage. When the input voltage is below approximately 2 V, a control
signal turns off the power switch.
28
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
TPS2041BD ACTIVE SOIC D 8 75 Green (RoHS &
TPS2041BDG4 ACTIVE SOIC D 8 75 Green (RoHS &
TPS2041BDGN ACTIVE MSOP-
TPS2041BDGN-ASY OBSOLETE MSOP-
TPS2041BDGNG4 ACTIVE MSOP-
TPS2041BDGNR ACTIVE MSOP-
TPS2041BDGNRG4 ACTIVE MSOP-
TPS2041BDR ACTIVE SOIC D 8 2500 Green (RoHS &
TPS2041BDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
TPS2042BD ACTIVE SOIC D 8 75 Green (RoHS &
TPS2042BDG4 ACTIVE SOIC D 8 75 Green (RoHS &
TPS2042BDGN ACTIVE MSOP-
TPS2042BDGNG4 ACTIVE MSOP-
TPS2042BDGNR ACTIVE MSOP-
TPS2042BDGNRG4 ACTIVE MSOP-
TPS2042BDR ACTIVE SOIC D 8 2500 Green (RoHS &
TPS2042BDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
TPS2043BD ACTIVE SOIC D 16 40 Green (RoHS &
TPS2043BDG4 ACTIVE SOIC D 16 40 Green (RoHS &
TPS2043BDR ACTIVE SOIC D 16 2500 Green (RoHS &
TPS2043BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
(1)
Package
Type
Power
PAD
Power
PAD
Power
PAD
Power
PAD
Power
PAD
Power
PAD
Power
PAD
Power
PAD
Power
PAD
Package
Drawing
DGN 8 80 Green (RoHS &
DGN 8 TBD Call TI Call TI
DGN 8 80 Green (RoHS &
DGN 8 2500 Green (RoHS &
DGN 8 2500 Green (RoHS &
DGN 8 80 Green (RoHS &
DGN 8 80 Green (RoHS &
DGN 8 2500 Green (RoHS &
DGN 8 2500 Green (RoHS &
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
27-Feb-2006
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
TPS2044BD ACTIVE SOIC D 16 40 Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
27-Feb-2006
no Sb/Br)
TPS2044BDG4 ACTIVE SOIC D 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2044BDR ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2044BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2051BD ACTIVE SOIC D 8 75 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2051BDG4 ACTIVE SOIC D 8 75 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2051BDGN ACTIVE MSOP-
Power
DGN 8 80 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PAD
TPS2051BDGNG4 ACTIVE MSOP-
Power
DGN 8 80 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PAD
TPS2051BDGNR ACTIVE MSOP-
Power
DGN 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PAD
TPS2051BDGNRG4 ACTIVE MSOP-
Power
DGN 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PAD
TPS2051BDR ACTIVE SOIC D 8 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2051BDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2052BD ACTIVE SOIC D 8 75 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2052BDG4 ACTIVE SOIC D 8 75 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2052BDGN ACTIVE MSOP-
Power
DGN 8 80 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PAD
TPS2052BDGNG4 ACTIVE MSOP-
Power
DGN 8 80 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PAD
TPS2052BDGNR ACTIVE MSOP-
Power
DGN 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PAD
TPS2052BDGNRG4 ACTIVE MSOP-
Power
DGN 8 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PAD
TPS2052BDR ACTIVE SOIC D 8 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2052BDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2053BD ACTIVE SOIC D 16 75 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2053BDR ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2053BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
(3)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
27-Feb-2006
(3)
no Sb/Br)
TPS2054BD ACTIVE SOIC D 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2054BDR ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS2054BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
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reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
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information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
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