Texas Instruments TPIC1310KTS, TPIC1310KTR Datasheet

TPIC1310
3-HALF H-BRIDGE GATE PROTECTED
POWER DMOS ARRAY
SLIS071 – DECEMBER 1997
D
D
Low r
DS(on)
D
High Voltage Output...30 V
D
Pulsed Current...12 A Per Channel
D
Input Transient and ESD Protection
D
Compatible With High-Side and Low-Side Current Sense Resistors
. . . 0.25 Typ
description
The TPIC1310 is a monolithic gate-protected power DMOS array that consists of six electrically isolated N-channel enhancement-mode DMOS transistors configured as a three-half H-bridge.
When suitably heat sunk, the TPIC1310 can drive motors requiring 2.5 A of phase current. The DMOS transistors are immune to second break­down effects and current crowding, problems often associated with bipolar transistors.
The TPIC1310 is offered in 15-pin through-hole (KTS) and surface-mount (KTR) PowerFLEX packages and is characterized for operation over the case temperature range of –40°C to 125°C.
KTR or KTS PACKAGE
(TOP VIEW)
V
DD
OUTA
UGA
LGA
UGB
SUB/GND
SOURCE
OUTB
SOURCE
SUB/GND
LGB
LGC
UGC
OUTC
V
DD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Tab is SUB/GND
schematic
V
DD
1, 15
Q1
UGA
3
2
OUTA
Q4
NOTES: A. Terminals 1 and 15 must be externally connected.
B. Terminals 6 and 10 must be connected to GND. C. Terminals 7 and 9 must be connected to the sense resistor or GND. D. No terminal may be taken greater than 0.5 V below GND.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LGA
4
13 k 13 k 13 k
8
7, 9
SOURCE
Q2
Q5
OUTB
UGB
LGB
KTR PACKAGE KTS PACKAGE
Q3
OUTC
UG
13
C
LGC
12
SUB/TAB/GND
6, 10
5
14
Q6
11
PowerFLEX is a trademark of Texas Instruments Inc.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1997, Texas Instruments Incorporated
1
TPIC1310 3-HALF H-BRIDGE GATE PROTECTED POWER DMOS ARRAY
SLIS071 – DECEMBER 1997
absolute maximum ratings over operating case temperature range (unless otherwise noted)
Drain-to-source voltage, V
30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DS
Output-to-GND voltage 30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SOURCE-to-SUB/GND voltage –0.3 V to 20 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Gate-to-source voltage range, V Continuous output current, each output, all outputs on, T Continuous source-to-drain diode current, T Pulsed output current, each output, I Continuous V Pulsed V
DD
and SOURCE current, TC = 25°C 3 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DD
and SOURCE current, TC = 25°C (see Note 1) 12 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total dissipation, T Operating virtual junction temperature range, T Operating case temperature range, T
–0.3 V to 20 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GS
= 25°C 3 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C
, TC = 25°C (see Note 1 and Figure 14) 12 A. . . . . . . . . . . . . . . . . . .
max
= 25°C (see Note 2 and Figure 14) 13.9 W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
C
–40°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C
–40°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
J
= 25°C 3 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C
Storage temperature range –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Pulse duration = 10 µs, duty cycle ≤ 2%
2. Package is mounted in intimate contact with an infinite heat sink.
2
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V
Source-to-gate breakdown voltage
V
I
Drain current-gate shorted to source
DS
,
A
GSSF
circuited to source
I
g, g
V
V
A
D
,
r
Static drain-to-source on-state resistance
D
,
V
V
f = 1 MHz
See Figure 10
High-side
V
0
di/dt
100 A/
Low-side
GS
µ
3-HALF H-BRIDGE GATE PROTECTED
electrical characteristics, TC = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
(BR)DSX
V
GS(th)
V
(BR)GS
(BR)SG
V
DS(on)
V
F(SD)
DSS
I
I
GSSR
lkg
DS(on)
g
fs
C
iss
C
oss
C
rss
Engineering estimate
NOTES: 3. Technique should limit TJ – TC to 10°C maximum.
Drain-to-source breakdown voltage ID = 250 µA, VGS = 0 30 V Gate-to-source threshold voltage Gate-to-source breakdown voltage Low-side IGS = 250 µA 20 V
Low-side ISG = 250 µA 0.3 High-side ISG = 250 µA 20
Drain-to-source on-state voltage
Forward on-state voltage, source-to-drain
Forward-gate current, drain short
Reverse-gate current, drain short circuited to source VSG = 0.3 V, VDS = 0 20 200 nA Leakage current, drain-to-GND gate shorted to
source
Forward transconductance Short-circuit input capacitance, low-side
Short-circuit output capacitance, low-side Short-circuit reverse transfer capacitance, low-side
4. These parameters are measured with voltage-sensing contacts separate from the current-carrying contacts.
Low-side High-side VSG = 16 V, VDS = 0 20 200 nA
ID = 1 mA, See Figure 4
ID = 3 A, See Notes 3 and 4
IS = 3 A, VGS = 0, See Notes 3 and 4 and Figure 11
V
= 28 V,
VGS = 0 VSG = 16 V, VDS = 0,
Internal 13 kfrom gate to source
= 28
DGND
VGS = 10 V, I
= 3 A, See Notes 3 and 4 and Figures 5 and 6
VGS = 14 V, I
= 3 A, See Notes 3 and 4 and Figures 5 and 6
VDS = 10 V, ID = 3 A, See Notes 3 and 4 and Figure 8
= 25 V,
DS
,
=
TPIC1310
POWER DMOS ARRAY
SLIS071 – DECEMBER 1997
VDS = V
VGS = 14 V,
TC = 25°C 0.05 1 TC = 125°C 0.5 10
TC = 25°C 0.05 1 TC = 125°C 0.5 10
TC = 25°C 0.27 0.37
TC = 125°C 0.45 0.55
TC = 25°C 0.22 0.32
TC = 125°C 0.32 0.47
GS
= 0,
GS,
0.9 1.2 1.7 V
0.66 0.9 V
1.1 1.4 V
2 4 mA
0.5 0.85 S 110
120
60
µ
µ
pF
source-to-drain and GND-to-drain diode characteristics, TC = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
Reverse-recovery time
rr
Q
Total diode charge
RR
t
Reverse-recovery time
rr
Q
Total diode charge
RR
IS = 3 A,
See Figures 1 and 13 IS = 3 A,
VGS = 0, See Figure 13,
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GS
=
,
VDS = 28 V,
=
VDS = 28 V, di/dt = 100 A/µs, SUB/GND connected to SOURCE
µs,
30 ns 30 nC
70 ns
350 nC
3
TPIC1310
t
10
See
t
10
ns
See Figure 2
,
V
GS
nH
3-HALF H-BRIDGE GATE PROTECTED POWER DMOS ARRAY
SLIS071 – DECEMBER 1997
resistive-load switching characteristics, TC = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
d(on)
t
d(off)
t
r
t
f
Q Q Q L
D
L
S
R
thermal resistance
R R
NOTES: 5. Package mounted in intimate contact with infinite heatsink.
Turn-on delay time 70 Turn-off delay time Rise time Fall time Total gate charge
g
Threshold gate-to-source charge
gs(th)
Gate-to-drain charge
gd
Internal drain inductance 5 Internal source inductance 5 Internal gate resistance 500
g
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Junction-to-case thermal resistance, one output on See Note 5 7.5 9 °C/W
θJC
Junction-to-case thermal resistance, two outputs on See Notes 5 and 6 4.5 5.5 °C/W
θJC
6. Two outputs with equal power
VDD = 28 V,
=
en
Figure 2
VDS = 12 V, ID = 3 A, V
= 10 V
= 10 V,
See Figure 3 and Figure 12
ns,
RL = 9.3 ,
dis
=
ns,
200 140
55
1.6 2
0.5 0.62
0.25 0.31
nC
4
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