TEXAS INSTRUMENTS TPD4F003 Technical data

Ch1_In

Ch2_In

Ch3_In

Ch4_In

Ch5_In

Ch6_In

Ch1_Out

Ch2_Out

Ch3_Out

Ch4_Out

Ch5_Out

Ch6_Out

Ch7_In

Ch8_In

GND

Ch7_Out

Ch8_Out

TPD8F003

3.3 mm x 1.35 mm x 0.75 mm (0.4-mm pitch)

Ch1_In

Ch2_In

Ch3_In

Ch4_In

Ch5_In

Ch6_In

Ch1_Out

Ch2_Out

Ch3_Out

Ch4_Out

Ch5_Out

Ch6_Out

GND

TPD6F003

2.5 mm x 1.35 mm x 0.75 mm (0.4-mm pitch)

Ch1_In

Ch2_In

Ch3_In

Ch4_In

Ch1_Out

Ch2_Out

Ch3_Out

Ch4_Out

GND

TPD4F003

1.7 mm x 1.35 mm x 0.75 mm (0.4-mm pitch)

TPD4F003, TPD6F003, TPD8F003

www.ti.com

SLLS907D –AUGUST 2008–REVISED JANUARY 2010

FOUR-, SIX-, AND EIGHT-CHANNEL EMI FILTERS WITH INTEGRATED ESD PROTECTION

Check for Samples: TPD4F003, TPD6F003, TPD8F003

FEATURES

• Four-, Six-, and Eight-Channel EMI Filtering for • Space-Saving DQD Packages and Data Ports Flow-Through Pin Mapping Provide Optimum

• –3 dB Bandwidth 200 MHz

• Greater than 25dB attenuation at 1 GHz

• Robust ESD Protection Exceeds IEC61000-4-2 (Level 4)

– ±15-kV Human-Body Model (HBM) – ±12-kV IEC 61000-4-2 Contact Discharge – ±20-kV IEC 61000-4-2 Air-Gap Discharge

• Pi-Style (C-R-C) Filter Configuration (R = 100 Ω, C

TOTAL

= 17 pF)

• Low 10-nA Leakage Current

DQD PACKAGE

(TOP VIEW)

Filter Performance

APPLICATIONS

• LCD Display Interfaces

• Cell Phones

• SVGA Video Connections

• Personal Digital Assistants (PDAs)

DESCRIPTION/ORDERING INFORMATION

The TPD4F003, TPD6F003, and TPD8F003 are 4-, 6-, and 8-channel EMI filters in space-saving 0.4-mm pitch DQD packages. The low-pass filter arrays reduce EMI emissions and provide system level ESD protection.

Because of its small package and easy-to-use pin assignments, the TPDxF003 filters ar suitable for a wide array of applications such as mobile handsets, PDAs, video consoles, notebook computers, etc. In particular, these filters are ideal for EMI filtering and protecting data lines from ESD at the LCD display, keypad, and memory interfaces.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

100 Ω

GND

Ch_In

Ch_Out

8.5 pF

TPD4F003, TPD6F003, TPD8F003

SLLS907D –AUGUST 2008–REVISED JANUARY 2010

www.ti.com

The TPDxF003 are highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. These filter series include an ESD protection circuitry which prevents damage to the application when subjected to ESD stress far exceeding IEC 61000-4-2 (Level 4).

The TPDxF003 is specified for –40°C to 85°C operation.

ORDERING INFORMATION

–40°C to 85°C 0.4-mm pitch SON TPD6F003DQDR 47S

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

PACKAGE

(1) (2)

PACKAGE DIMENSION TOP-SIDE MARKING

Length = 1.7 mm, Width = 1.35 mm, Pitch = 0.4 mm, Height = 0.75 mm

Length = 2.5 mm, Width = 1.35 mm, Pitch = 0.4 mm, Height = 0.75 mm

Length = 3.3 mm, Width = 1.35 mm, Pitch = 0.4 mm, Height = 0.75 mm

ORDERABLE

PART NUMBER

TPD4F003DQDR 5RS

TPD8F003DQDR 5US

EQUIVALENT SCHEMATIC REPRESENTATION

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

V T T

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

IO to GND 6 V

Storage temperature range –65 150 °C

stg

Junction temperature 150 °C

only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

TA= –40°C to 85°C (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP

V R Resistance 85 100 115 Ω C Capacitance (C1 or C2) VIO= 2.5 V 8.5 pF I f

(1) Typical values are at TA= 25°C.

DC breakdown voltage IIO= 10 mA 6 V

Channel leakage current VIO= 3.3 V 10 nA

Cut-off frequency Z

SOURCE

= 50 Ω, Z

= 50 Ω 200 MHz

LOAD

(1)

MAX UNIT

Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003

-40

-20

100

120

140

0 25 50 75 100 125 150 175 200

Time (ns)

Amplitude (V)

Ch_In Ch_Out

-40

-20

100

120

140

0 25 50 75 100 125 150 175 2 00

Time (ns)

Amplitude (V)

Ch_In Ch_Out

-140

-120

-100

-80

-60

-40

-20

0 25 50 75 100 125 150 1 75 200

Time (ns)

Amplitude (V)

Ch_In Ch_Out

-140

-120

-100

-80

-60

-40

-20

0 25 50 75 100 1 25 150 175 200

Time (ns)

Amplitude (V)

Ch_In Ch_Out

TPD4F003, TPD6F003, TPD8F003

www.ti.com

SLLS907D –AUGUST 2008–REVISED JANUARY 2010

ESD PROTECTION

TYP UNIT

Human-Body Model (HBM) ±15 kV IEC 61000-4-2 Contact Discharge ±12 kV IEC 61000-4-2 Air-Gap Discharge ±20 kV

TYPICAL CHARACTERISTCS

IEC Clamping Waveforms (clamp voltage measured both at Ch_Out and Ch_In)

Figure 1. With 8 kV Contact ESD Stress at Ch_Out Figure 2. With 12 kV Contact ESD Stress at Ch_Out

Figure 3. With -8 kV Contact ESD Stress at Ch_Out Figure 4. With -12 kV Contact ESD Stress at Ch_Out

Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

1.00E+06 1.00E+07 1.00E+08 1. 00E+09 1. 00E+10

Frequency (Hz)

Insertion Loss (dB)

TPD8F003 TPD6 F003 TPD4F003

TPD8F003 3dB drop/Bias of 0.0V

-3dB = 198M Hz Peak/Freq/Db = 2.57/45 GHz/dB

TPD6F003 3dB drop/Bias of 0.0V

-3dB = 197M Hz Peak/Freq/Db = 2.30/47 GHz/dB

TPD4F003 3dB drop/Bias of 0.0V

-3dB = 197M Hz Peak/Freq/Db = 2.25/45 GHz/dB

-0.001

-0.0008

-0.0006

-0.0004

-0.0002

0.0002

0.0004

0.0006

0.0008

0.001

-4 -2 0 2 4 6 8

Voltage (V)

Current (mA)

-110

-105

-100

-95

-90

-85

-80

-75

-70

-65

-60

-55

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10

Frequency (Hz)

Crosstalk (dB)

Adjacent Signal Pair Farthest Signal Pair

-110

-105

-100

-95

-90

-85

-80

-75

-70

-65

-60

-55

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10

Frequency (Hz)

Crosstalk (dB)

Adjacent Signal Pair Farthest Signal Pair

-110

-105

-100

-95

-90

-85

-80

-75

-70

-65

-60

-55

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10

Frequency (Hz)

Crosstalk (dB)

Adjacent Signal pair Farthest Signal Pair

TPD4F003, TPD6F003, TPD8F003

SLLS907D –AUGUST 2008–REVISED JANUARY 2010

Figure 5. Frequency Response Figure 6. DC Voltage-Current Sweep Across Input/Output Pins

Channel-to-Channel Crosstalk

www.ti.com

Figure 7. TPD4F003 Figure 8. TPD6F003

Figure 9. TPD8F003

Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003

PACKAGE OPTION ADDENDUM

www.ti.com 12-Mar-2010

PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

TPD4F003DQDR ACTIVE WSON DQD 8 3000 Green (RoHS &

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

(3)

no Sb/Br)

TPD6F003DQDR ACTIVE WSON DQD 12 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TPD8F003DQDR ACTIVE WSON DQD 16 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 20-Jul-2010

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

TPD4F003DQDR WSON DQD 8 3000 180.0 8.4 1.65 2.0 0.95 4.0 8.0 Q1 TPD6F003DQDR WSON DQD 12 3000 180.0 8.4 1.68 2.79 0.91 4.0 8.0 Q1 TPD8F003DQDR WSON DQD 16 3000 330.0 12.4 1.65 3.6 0.95 4.0 12.0 Q1

Type

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

+ 12 hidden pages

TEXAS INSTRUMENTS TPD4F003 Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

APPLICATIONS

DESCRIPTION/ORDERING INFORMATION

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

ESD PROTECTION

TYPICAL CHARACTERISTCS

IEC Clamping Waveforms (clamp voltage measured both at Ch_Out and Ch_In)

Channel-to-Channel Crosstalk