TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
D
High-Fidelity Line-Out/HP Driver
D
75-mW Stereo Output
D
PC Power Supply Compatible
D
Pop Reduction Circuitry
D
Internal Mid-Rail Generation
D
Thermal and Short-Circuit Protection
D
Surface-Mount Packaging
D
Pin Compatible With TPA302
VO1
MUTE
BYPASS
IN2–
D PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
IN1–
GND
V
DD
VO2
description
The TPA152 is a stereo audio power amplifier capable of less than 0.1% THD+N at 1 kHz when delivering
75 mW per channel into a 32-Ω load. THD+N is less than 0.2% across the audio band of 20 to 20 kHz. For
10 kΩ loads, the THD+N performance is better than 0.005% at 1 kHz, and less than 0.01% across the audio
band of 20 to 20 kHz.
The TP A152 is ideal for use as an output buffer for the audio CODEC in PC systems. It is also excellent for use
where a high-performance head phone/line-out amplifier is needed. Depop circuitry is integrated to reduce
transients during power up, power down, and mute mode.
Amplifier gain is externally configured by means of two resistors per input channel and does not require external
compensation for settings of 1 to 10. The TP A152 is packaged in the 8-pin SOIC (D) package that reduces board
space and facilitates automated assembly.
typical application circuit
Stereo Audio
Input
R
C
I
From System
Control
L
C
I
R
F
6
R
I
C
B
R
I
IN1–
8
3
BYPASS
2
IN2–
4
Mute
Control
–
+
Depop
Circuitry
–
+
R
F
VO1
VO2
C
1
5
C
C
C
R
C
V
DD
C
B
R
C
RLR
Stereo
L
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2000, Texas Instruments Incorporated
1
TPA152
T
I/O
DESCRIPTION
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
AVAILABLE OPTIONS
A
–40°C to 85°C TPA152D
†
The D packages are available taped and reeled. T o
order a taped and reeled part, add the suffix R
(e.g., TPA152DR)
Terminal Functions
TERMINAL
NAME NO.
BYPASS 3 BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to a 0.1-µF
GND 7 GND is the ground connection.
IN1– 8 I IN1– is the inverting input for channel 1.
IN2– 4 I IN2– is the inverting input for channel 2.
MUTE 2 I A logic high puts the device into MUTE mode.
V
DD
VO1 1 O VO1 is the audio output for channel 1.
VO2 5 O VO2 is the audio output for channel 1.
6 I VDD is the supply voltage terminal.
to 1-µF capacitor.
PACKAGED DEVICE
SMALL OUTLINE
†
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VDD 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage , VI –0.3 V to VDD + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation internally limited (See Dissipation Rating Table). . . . . . . . . . . . . . . . . . . . .
Operating junction temperature range, T
–40°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
J
Operating case temperature range, TC –40°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
D 724 mW 5.8 mW/°C 464 mW 376 mW
TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C
recommended operating conditions
MIN MAX UNIT
Supply voltage, V
Operating free-air temperature, T
DD
A
4.5 5.5 V
–40 85 °C
dc electrical characteristics at TA = 25°C, VDD = 5 V
‡
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
OO
I
DD
I
DD(MUTE)
Z
I
Output offset voltage 10 mV
Supply ripple rejection ratio VDD = 4.9 V to 5.1 V 81 dB
Supply current See Figure 13 5.5 14 mA
Supply current in MUTE 5.5 14 mA
Input impedance >1 MΩ
ac operating characteristics VDD = 5 V, TA = 25°C, RL = 32 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
P
O
THD+N Total harmonic distortion plus noise
B
OM
V
n
†
Measured at 1 kHz.
NOTES: 1. The dc output voltage is approximately VDD/2.
Output power (each channel) THD ≤ 0.03%, Gain = 1, See Figure 1 75
PO = 75 mW, 20 Hz–20 kHz, Gain = 1,
See Figure 2
Maximum output power bandwidth AV = 5, THD <0.6%, See Figure 2 >20 kHz
Phase margin Open loop, See Figure 16 80°
Supply ripple rejection ratio 1 kHz, CB = 1 µF, See Figure 12 65 dB
Mute attenuation See Figure 15 110 dB
Ch/Ch output separation See Figure 13 102 dB
Signal-to-Noise ratio VO = 1 V
Noise output voltage See Figure 10 6 µV(rms)
2. Output power is measured at the output pins of the IC at 1 kHz.
, Gain = 1 See Figure 11 104 dB
(rms)
†
0.2%
mW
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
TPA152
THD+N
Total harmonic distortion plus noise
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
ac operating characteristics VDD = 5 V, TA = 25°C, RL = 10 kΩ
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
B
OM
k
SVR
V
n
†
Measured at 1 kHz.
Maximum output power bandwidth G = 5, THD <0.02%, See Figure 6 >20 kHz
Phase margin Open loop, See Figure 16 80°
Supply voltage rejection ratio 1 kHz, CB = 1 µF, See Figure 12 65 dB
Mute attenuation See Figure 15 110 dB
Ch/Ch output separation See Figure 13 102 dB
Signal-to-Noise ratio VO = 1 V
Noise output voltage See Figure 10 6 µV(rms)
VI = 1 V
p
See Figure 6
V
O(PP)
See Figure 8
TYPICAL CHARACTERISTICS
, 20 Hz–20 kHz,Gain = 1,
(rms)
= 4 V, 20 Hz–20 kHz, Gain = 1,
, Gain = 1, See Figure 11 104 dB
(rms)
0.005%
0.005%
Table of Graphs
FIGURE
THD+N Total harmonic distortion plus noise vs Output power 1, 4
THD+N Total harmonic distortion plus noise vs Frequency 2, 3, 6, 8, 9
THD+N Total harmonic distortion plus noise vs Output voltage 5, 7
V
n
SNR Signal-to-noise ratio vs Gain 11
I
DD
P
O
P
D
Output noise voltage vs Frequency 10
Supply ripple rejection ratio vs Frequency 12
Crosstalk vs Frequency 13, 14
Mute Attenuation vs Frequency 15
Open-loop gain and phase vs Frequency 16, 17
Closed-loop gain and phase vs Frequency 18
Supply current vs Supply voltage 19
Output power vs Load resistance 20
Power dissipation vs Output power 21
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
2
f = 1 kHz
1
AV = –1 V/V
0.1
0.01
THD+N –Total Harmonic Distortion + Noise – %
0.001
1102030 60705040
PO – Output Power – mW
Figure 1
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
0.3
AV = –1 V/V
RL = 32 Ω
0.1
PO = 75 mW
80
TOTAL HARMONIC DISTORTION PLUS NOISE
2
PO = 75 mW
1
RL = 32 Ω
0.1
0.01
THD+N –Total Harmonic Distortion + Noise – %
90
0.001
20 100 1k 10k 20k
TOTAL HARMONIC DISTORTION PLUS NOISE
2
RL = 32 Ω
1
vs
FREQUENCY
AV = –5 V/V
AV =– 2 V/V
AV = –1 V/V
f – Frequency – Hz
Figure 2
vs
OUTPUT POWER
PO = 25 mW
0.01
PO = 50 mW
THD+N –Total Harmonic Distortion + Noise – %
0.001
20 100 1k 10k 20k
f – Frequency – Hz
Figure 3
0.1
0.01
THD+N –Total Harmonic Distortion + Noise – %
0.001
0.1 1 10 100
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
20 kHz
1 kHz
20 Hz
PO – Output Power – mW
Figure 4
5
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT VOLTAGE
2
f = 1 kHz
1
AV = –1 V/V
RL = 10 kΩ
0.1
0.01
THD+N –Total Harmonic Distortion + Noise – %
0.001
0 0.2 0.4 0.6 1.2 1.410.8
VO – Output Voltage – V
Figure 5
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT VOLTAGE
2
AV = –1 V/V
1
RL = 10 kΩ
(rms)
1.6
1.8
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
0.1
VO = 1 V
RL = 10 kΩ
0.01
THD+N –Total Harmonic Distortion + Noise – %
0.001
20 100 1k 10k 20k
(rms)
AV = –5 V/V
AV = –2 V/V
AV = –1 V/V
f – Frequency – Hz
Figure 6
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
0.1
V
= 4 V
O(PP)
AV = –1 V/V
RL = 10 kΩ
0.1
0.01
THD+N –Total Harmonic Distortion + Noise – %
0.001
0.1 0.2 0.4 1
VO – Output Voltage – V
Figure 7
6
f = 20 kHz
f = 20 Hz
f = 1 kHz
2
(rms)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.01
THD+N –Total Harmonic Distortion + Noise – %
0.001
20 100 1k 10k 20k
f – Frequency – Hz
Figure 8
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
0.1
VI = 1 V
(rms)
AV = –1 V/V
RL = 32 Ω
0.01
RL = 10,47, and 100 kΩ
THD+N –Total Harmonic Distortion + Noise – %
0.001
20 100 1k 10k 20k
f – Frequency – Hz
Figure 9
SIGNAL-TO-NOISE RATIO
vs
GAIN
110
RI = 20 kΩ
105
100
OUTPUT NOISE VOLTAGE
vs
FREQUENCY
20
VDD = 5 V
BW = 10 Hz to 22 kHz
RL = 32 Ω to 10 kΩ
AV = –1 V/V
10
– Output Noise Voltage – VµV
n
1
20 100 1k 10k 20k
f – Frequency – Hz
Figure 10
SUPPLY RIPPLE REJECTION RATIO
vs
FREQUENCY
–10
–20
–30
–40
0
CB = 0.1 µF
VDD = 5 V
RL = 32 Ω to 10 kΩ
95
90
RL = 32 Ω
85
SNR – Signal-to-Noise Ratio – dB
80
1234 7865
Gain – V/V
Figure 11
RL = 10 kΩ
–50
–60
–70
–80
Supply Ripple Rejection Ratio – dB
–90
9
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
–100
CB = 1 µF
20 100 1k 10k 20k
CB = 2.5 V
f – Frequency – Hz
Figure 12
7
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
CROSSTALK
vs
FREQUENCY
–60
–70
–80
–90
Crosstalk – dB
–100
–110
–120
20 100 1k 10k 20k
f – Frequency – Hz
PO = 75 mW
VDD = 5 V
RL = 32 Ω
CB = 1 µF
AV = –1 V/V
Right to Left
Left to Right
Figure 13
–70
VDD = 5 V
RL = 32Ω
–80
CB = 1 µF
–60
–70
–80
–90
–100
Crosstalk – dB
–110
–120
–130
20 100 1k 10k 20k
MUTE ATTENUATION
vs
FREQUENCY
CROSSTALK
vs
FREQUENCY
VO = 1 V
VDD = 5 V
RL = 10 kΩ
CB = 1 µF
AV = –1 V/V
Right to Left
Left to Right
f – Frequency – Hz
Figure 14
90
–100
–110
–120
Mute Attenuation – dB
–130
–140
20 100 1k 10k 20k
f – Frequency – Hz
Figure 15
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
OPEN-LOOP GAIN AND PHASE
vs
FREQUENCY
100
No Load
160
80
60
40
20
Open-Loop Gain – dB
0
–20
100
CLOSED-LOOP GAIN AND PHASE
1
0.8
0.6
100k 10M 100M1k
10k 1M
f – Frequency – Hz
Figure 16
vs
FREQUENCY
140
120
100
80
60
40
20
0
185
180
°
Phase –
0.4
0.2
0
–0.2
–0.4
Closed-Loop Gain – dB
–0.6
–0.8
–1
10
100
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
RI = 20 kΩ
Rf = 20 kΩ
RL = 32 Ω
CI = 1 µF
AV = –1 V/V
10k 1M
f – Frequency – Hz
Figure 17
175
°
170
Phase –
165
160
155
100k1k
9
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
CLOSED-LOOP GAIN AND PHASE
FREQUENCY
1
0.8
0.6
vs
185
180
10
0.4
0.2
0
–0.2
–0.4
Closed-Loop Gain – dB
–0.6
–0.8
–1
10
100
RI = 20 kΩ
Rf = 20 kΩ
RL = 10 kΩ
CI = 1 µF
AV = –1 V/V
10k 1M
f – Frequency – Hz
100k1k
175
°
170
Phase –
165
160
155
Figure 18
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
90
9
8
80
70
OUTPUT POWER
vs
LOAD RESISTANCE
THD+N = 0.1%
AV = –1 V/V
7
6
– Supply Current – mA
5
DD
I
4
3
4.5
10
5
VDD – Supply Voltage – V
Figure 19
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5.5
60
50
40
– Output Power – mWP
O
30
20
10
30 50 70 90 150 170130110 190
RL – Load Resistance – Ω
Figure 20
210
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
POWER DISSIPATION
vs
OUTPUT POWER
100
RL = 32 Ω
80
60
40
– Power Dissipation – mW
D
P
20
0
0 5 10 15
PO – Output Power – mW
Figure 21
APPLICATION INFORMATION
selection of components
Figure 22 is a schematic diagram of a typical application circuit.
R
F
20 kΩ
R
F
20 kΩ
IN1–
GND
V
DD
VO2
Audio Input 1
Audio Input 2
C
I
R
1 µF
(from System Control)
C
I
1 µF
I
20 kΩ
Shutdown
C
B
1 µF
R
I
20 kΩ
1
2
3
4
VO1
MUTE
IN2
IN2–
2520
C
C
330 µF
†
1 µF
R
O
20 kΩ
R
O
20 kΩ
V
DD
†
C
330 µF
8
7
6
5
†
R
C
100 Ω
Jack
C
HP
R
C
100 Ω
R
L
32 Ω
†
R
L
32 Ω
†
These resistors are optional. Adding these resistors improves the depop performance of the TPA152.
Figure 22. TPA152 Typical Application Circuit
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
APPLICATION INFORMATION
gain setting resistors, RF and R
The gain for the TPA152 is set by resistors RF and RI according to equation 1.
R
+*
+
ǒ
R
Gain
Given that the TPA152 is a MOS amplifier, the input impedance is very high, consequently input leakage
currents are not generally a concern although noise in the circuit increases as the value of RF increases. In
addition, a certain range of R
it is recommended that the effective impedance seen by the inverting node of the amplifier be set between 5
kΩ and 20 kΩ. The effective impedance is calculated in equation 2.
Effective Impedance
As an example, consider an input resistance of 20 kΩ and a feedback resistor of 20 kΩ. The gain of the amplifier
would be –1 and the effective impedance at the inverting terminal would be 10 kΩ, which is within the
recommended range.
For high performance applications, metal film resistors are recommended because they tend to have lower
noise levels than carbon resistors. For values of R
to a pole formed from RF and the inherent input capacitance of the MOS input structure. For this reason, a small
compensation capacitor of approximately 5 pF should be placed in parallel with RF. This, in effect, creates a
low-pass filter network with the cutoff frequency defined in equation 3.
f
c(lowpass)
F
Ǔ
I
1
2pRFC
I
values are required for proper start-up operation of the amplifier. Taken together
F
RFR
RF)
I
R
I
above 50 kΩ, the amplifier tends to become unstable due
F
+
F
(1)
(2)
(3)
For example if RF is 100 kΩ and CF is 5 pF then f
input capacitor, C
In the typical application, an input capacitor, CI, is required to allow the amplifier to bias the input signal to the
proper dc level for optimum operation. In this case, CI and RI form a high-pass filter with the corner frequency
determined in equation 4.
The value of CI is important to consider as it directly affects the bass (low frequency) performance of the circuit.
Consider the example where RI is 20 kΩ and the specification calls for a flat bass response down to 20 Hz.
Equation 4 is reconfigured as equation 5.
In this example, CI is 0.40 µF, so one would likely choose a value in the range of 0.47 µF to 1 µF. A further
consideration for this capacitor is the leakage path from the input source through the input network (R
the feedback resistor (RF) to the load. This leakage current creates a dc offset voltage at the input to the amplifier
that reduces useful headroom, especially in high-gain applications (> 10). For this reason a low-leakage
tantalum or ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the
capacitor should face the amplifier input in most applications, as the dc level there is held at V
likely higher that the source dc level. Please note that it is important to confirm the capacitor polarity in the
application.
I
f
c(highpass)
C
+
I
2pRIf
1
+
2pRIC
1
c(highpass)
I
co(lowpass)
is 318 kHz, which is well outside the audio range.
DD
(4)
(5)
, CI) and
I
/2, which is
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
APPLICATION INFORMATION
power supply decoupling, C
The TP A152 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to
ensure that the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also
prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is
achieved by using two capacitors of different types that target different types of noise on the power supply leads.
For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance
(ESR) ceramic capacitor, typically 0.1 µF , placed as close as possible to the device V
filtering lower-frequency noise signals, a larger aluminum electrolytic capacitor of 10 µF or greater placed near
the power amplifier is recommended.
midrail bypass capacitor, C
The midrail bypass capacitor, CB, serves several important functions. During startup or recovery from shutdown
mode, CB determines the rate at which the amplifier starts up. This helps to push the start-up pop noise into
the subaudible range (so slow it can not be heard). The second function is to reduce noise produced by the
power supply caused by coupling into the output drive signal. This noise is from the midrail generation circuit
internal to the amplifier. The capacitor is fed from a 160-kΩ source inside the amplifier . To keep the start-up pop
as low as possible, the relationship shown in equation 6 should be maintained.
1
ǒ
CB
160 kΩ
As an example, consider a circuit where CB is 1 µF, CI is 1 µF and RI is 20 kΩ. Inserting these values into the
equation 9 results in:
6.25v50
S
lead, works best. For
DD
B
1
v
Ǔ
ǒ
Ǔ
CIR
I
(6)
which satisfies the rule. Bypass capacitor, CB, values of 0.1 µF to 1 µF ceramic or tantalum low-ESR capacitors
are recommended for the best THD and noise performance.
output coupling capacitor, C
In the typical single-supply single-ended (SE) configuration, an output coupling capacitor (CC) is required to
block the dc bias at the output of the amplifier thus preventing dc currents in the load. As with the input coupling
capacitor, the output coupling capacitor and impedance of the load form a high-pass filter governed by
equation 7.
f
c(high)
The main disadvantage, from a performance standpoint, is that the load impedances are typically small, which
drive the low-frequency corner higher. Large values of C
Consider the example where a CC of 68 µF is chosen and loads vary from 32 Ω to 47 kΩ. Table 1 summarizes
the frequency response characteristics of each configuration.
+
2pR
C
1
C
C
L
are required to pass low frequencies into the load.
C
(7)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
13
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
APPLICATION INFORMATION
Table 1. Common Load Impedances vs Low Frequency Output Characteristics in SE Mode
R
L
32 Ω 68 µF
10,000 Ω 68 µF 0.23 Hz
47,000 Ω 68 µF 0.05 Hz
As Table 1 indicates, headphone response is adequate and drive into line level inputs (a home stereo for
example) is very good.
The output coupling capacitor required in single-supply SE mode also places additional constraints on the
selection of other components in the amplifier circuit. With the rules described earlier still valid, add the following
relationship:
1
ǒ
CB
160 kΩ
Ǔ
output pull-down resistor, RC + R
Placing a 100-Ω resistor, RC, from the output side of the coupling capacitor to ground insures the coupling
capacitor, CC, is charged before a plug is inserted into the jack. Without this resistor, the coupling capacitor
would charge rapidly upon insertion of a plug, leading to an audible pop in the headphones.
Placing a 20-kΩ resistor, RO, from the output of the IC to ground insures that the coupling capacitor fully
discharges at power down. If the supply is rapidly cycled without this capacitor, a small pop may be audible in
10-kΩ loads.
v
ǒ
CIR
1
Ơ
RLC
Ǔ
I
O
C
C
1
C
LOWEST FREQUENCY
73 Hz
using low-ESR capacitors
(8)
Low-ESR capacitors are recommended throughout this applications section. A real capacitor can be modeled
simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor minimizes the
beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance, the more the
real capacitor behaves like an ideal capacitor.
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA152
75-mW STEREO AUDIO POWER AMPLIFIER
SLOS210A – JUNE 1998 – REVISED MARCH 2000
MECHANICAL DATA
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0.050 (1,27)
14
1
0.069 (1,75) MAX
0.020 (0,51)
0.014 (0,35)
8
7
A
0.010 (0,25)
0.004 (0,10)
DIM
0.157 (4,00)
0.150 (3,81)
PINS **
0.010 (0,25)
0.244 (6,20)
0.228 (5,80)
8
M
Seating Plane
0.004 (0,10)
14
0.008 (0,20) NOM
0°–8°
16
Gage Plane
0.010 (0,25)
0.044 (1,12)
0.016 (0,40)
A MAX
A MIN
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.197
(5,00)
0.189
(4,80)
0.344
(8,75)
0.337
(8,55)
0.394
(10,00)
0.386
(9,80)
4040047/D 10/96
15
PACKAGE OPTION ADDENDUM
www.ti.com
20-Apr-2006
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
TPA152D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
TPA152DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
TPA152DR ACTIVE SOIC D 8 2500 Green(RoHS &
no Sb/Br)
TPA152DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
Type
TPA152DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPA152DR SOIC D 8 2500 346.0 346.0 29.0
Pack Materials-Page 2
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