Texas Instruments TMS370C732AFNT Datasheet

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

1

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

D

CMOS/EEPROM/EPROM Technologies on a Single Device – Mask-ROM Devices for High-Volume

Production

– One-Time-Programmable (OTP) EPROM

Devices for Low-Volume Production

– Reprogrammable-EPROM Devices for

Prototyping Purposes

D

Internal System Memory Configurations – On-Chip Program Memory Versions

– ROM: 8K Bytes

– EPROM: 8K Bytes – Data EEPROM: 256 Bytes – Static RAM: 256 Bytes Usable as

Registers

D

Flexible Operating Features – Low-Power Modes: STANDBY and HAL T – Commercial, Industrial, and Automotive

T emperature Ranges – Clock Options

– Divide-by-1 (2 MHz–5 MHz SYSCLK)

Phase-Locked Loop (PLL)

– Divide-by-4 (0.5 MHz–5 MHz SYSCLK) – Supply Voltage (V

CC

) 5 V ±10%

D

Programmable Acquisition and Control Timer (PACT) Module – Input Capture on up to Six Pins, Four of

Which Can Have a Programmable

Prescaler – One Input Capture Pin Can Drive an 8-Bit

Event Counter – Up to Eight Timer-Driven Outputs – Interaction Between Event Counter and

Timer Activity – 18 Independent Interrupt Vectors – Watchdog With Selectable Time-Out

Period – Asynchronous Mini Serial

Communication Interface (Mini SCI)

D

Flexible Interrupt Handling – Two Software-Programmable Interrupt

Levels – Global- and Individual-Interrupt Masking – Programmable Rising- or Falling-Edge

Detect – Individual-Interrupt Vectors

D

Eight-Channel 8-Bit Analog-to-Digital Converter 1 (ADC1)

D

TMS370 Series Compatibility – Register-to-Register Architecture – 256 General-Purpose Registers – 14 Powerful Addressing Modes – Instructions Upwardly Compatible With

All TMS370 Devices

D

CMOS/TTL Compatible I/O Pins/Packages – All Peripheral Function Pins Software

Configurable for Digital I/O – 14 Bidirectional Pins, Nine Input Pins – 44-Pin Plastic and Ceramic Leaded Chip

Carrier (LCC) Packages

D

Workstation/PC-Based Development System – C Compiler and C Source Debugger – Real-Time In-Circuit Emulation – Multi-Window User Interface – Microcontroller Programmer – Extensive breakpoint/Trace Capability

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright  1997, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

OP2

MC XTAL2/CLKIN XTAL1 CP2 SCIRXD CP6 AN7 AN6 AN5 AN4 V

SS3

39 38 37 36 35 34 33 32 31 30 29

18 19

7 8 9 10 11 12 13 14 15 16 17

INT1 INT2 INT3

V

CC1

V

CC3

A7

A6

V

SS1

A5

A4

A3

20 21 22 23

FZ AND FN PACKAGES

(TOP VIEW)

OP5

OP1

SCITXD

CP1

54321644

RESET

OP8

OP7

OP6

OP4

OP3

AN0

AN1

AN2

AN3

A1

A0

D7/CP5

D4/CP3D3D6/CP4

42 41 4043

24 25 26 27 28

A2

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

2

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

Pin Descriptions

44 PINS

NAME

NO.

I/O

†

DESCRIPTION

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

A0 A1 A2 A3 A4 A5 A6 A7

ÁÁ

Á

ÁÁ

Á

ÁÁ

Á

ÁÁ

Á

ÁÁ

Á

20 19 18 17 16 15 13 12

Á

I/O

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

Port A is a general-purpose bidirectional I/O port.

ÁÁÁ

Á

ÁÁÁ

Á

D3 D4/CP3 D6/CP4 D7/CP5

ÁÁ

Á

ÁÁ

Á

23 22 24 21

Á

I/O

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

Port D is a general-purpose bidirectional port. Also configurable as SYSCLK (see Note 1) PACT input capture 3 (see Note 2) PACT input capture 4 (see Note 2) PACT input capture 5 (see Note 2)

ÁÁÁ

Á

ÁÁÁ

Á

CP1 CP2 CP6

ÁÁ

Á

ÁÁ

Á

40 36 34

Á

I

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

PACT Input capture pin 1 PACT Input capture pin 2 PACT Input capture pin 3

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

AN0/E0 AN1/E1 AN2/E2 AN3/E3 AN4/E4 AN5/E5 AN6/E6 AN7/E7

ÁÁ

Á

ÁÁ

Á

ÁÁ

Á

ÁÁ

Á

25 26 27 28 30 31 32 33

Á

I

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

ADC1 analog input pins (AN0–AN7)/port E digital input pins (E0–E7)

Port E can be programmed individually as a general-purpose digital input pin if it is not used as ADC1 analog input or positive reference input.

ÁÁÁ

Á

INT1 INT2 INT3

ÁÁ

Á

7 8 9

Á

I I/O I/O

ББББББББББББББББББББББББ

Á

External interrupt (non-maskable or maskable)/general-purpose input pin External maskable interrupt input/general purpose bidirectional pin External maskable interrupt input/general purpose bidirectional pin

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

OP1 OP2 OP3 OP4 OP5 OP6 OP7 OP8

ÁÁ

Á

ÁÁ

Á

ÁÁ

Á

ÁÁ

Á

ÁÁ

Á

42 43 44

1 2 3 4 5

Á

O

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

PACT output pin 1 PACT output pin 2 PACT output pin 3 PACT output pin 4 PACT output pin 5 PACT output pin 6 PACT output pin 7 PACT output pin 8

SCIRXD SCITXD

35 41

I

O

PACT mini SCI data receive input pin PACT mini SCI data transmit output pin

ÁÁÁ

Á

RESET

ÁÁ

Á

6

Á

I/O

ББББББББББББББББББББББББ

Á

System reset bidirectional pin; as input pin, RESET initializes the microcontroller; as open-drain output, RESET

indicates that an internal failure was detected by watchdog or oscillator fault circuit.

MC

39

I

Mode control input pin; enables EEPROM write protection override (WPO) mode, also EPROM V

PP

XTAL2/CLKIN XTAL1

38 37

I

O

Internal oscillator crystal input/External clock source input Internal oscillator output for crystal

ÁÁÁ

Á

ÁÁÁ

Á

V

CC1

V

SS1

V

CC3

V

SS3

ÁÁ

Á

ÁÁ

Á

10 14 11 29

Á

ББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББ

Á

Positive supply voltage for digital logic and digital I/O pins Ground reference for digital logic and digital I/O pins ADC1 positive supply voltage and optional positive reference input ADC1 ground supply and low reference input pin

†

I = input, O = output

NOTES: 1. D3 can be configured as SYSCLK by appropriately programming the DPORT1 and DPORT2 registers.

2. These digital I/O buffers are connected internally to some of the PACT module’s input capture pins. This allows the microcontroller to read the level on the input capture pin, or if the port D pin is configured as an output, to generate a capture. Be careful to leave the port D pin configured as an input if the corresponding input capture pin is being driven by external circuitry.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

3

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

functional block diagram

Interrupts

CP1

SCITXD SCIRXD

V

System Control

Clock Options:

Divide-By-4 or

Divide-By-1 (PLL)

Port A Port D

PACT

Watchdog

INT1

E0-E7

or

AN0-AN7

XTAL1

XTAL2/

CLKIN

MC RESET

SS1

V

CC1

Program Memory

ROM: 8K Bytes

EPROM: 8K Bytes

Data EEPROM

256 Bytes

48

A-to-D

Converter 1

V

CC3

V

SS3

Mini SCI

CPU

RAM

Register File

256 Bytes

CP6 OP1

OP8

. .

INT2 INT3

description

The TMS370C032A, TMS370C332A, TMS370C732A, and SE370C732A devices are members of the TMS370 family of single-chip 8-bit microcontrollers. Unless otherwise noted, the term TMS370Cx32 refers to these devices. The TMS370 family provides cost-effective real-time system control through integration of advanced peripheral-function modules and various on-chip memory configurations.

The TMS370Cx32 family of devices is implemented using high-performance silicon-gate CMOS EPROM and EEPROM technologies. Low-operating power, wide-operating temperature range, and noise immunity of CMOS technology coupled with the high performance and extensive on-chip peripheral functions make the TMS370Cx32 devices attractive for system designs for automotive electronics, industrial motors, computer peripheral controls, telecommunications, and consumer applications.

All TMS370Cx32 devices contain the following on-chip peripheral modules:

D

Programmable acquisition and control timer (PACT) – Asynchronous mini SCI – PACT watchdog timer

D

Eight channel, 8-bit analog-to-digital converter 1 (ADC1)

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

4

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

description (continued)

Table 1 provides a memory configuration overview of the TMS370Cx32 devices.

Table 1. Memory Configurations

DEVICE

PROGRAM MEMORY

(BYTES)

DATA MEMORY

(BYTES)

44 PIN PACKAGES

ROM

EPROM

RAM

EEPROM

TMS370C032A

8K

—

256

FN – PLCC

TMS370C332A

8k

—

256

—

FN – PLCC

TMS370C732A

—

8K

256

FN – PLCC

SE370C732A

†

—

8K

256

FZ – CLCC

†

System evaluators and development are for use only in prototype environment, and their reliability has not been characterized.

The suffix letter (A) appended to the device names shown in the device column of Table 1 indicates the configuration of the device. ROM or EPROM devices have different configurations as indicated in T able 2. ROM devices with the suffix letter A are configured through a programmable contact during manufacture.

Table 2. Suffix Letter Configuration

DEVICE

‡

CLOCK LOW-POWER MODE

EPROM A Divide-by-4 (Standard oscillator) Enabled

ROM A

Divide-by-4 or Divide-by-1 (PLL)

Enabled or disabled

‡

Refer to the “device numbering conventions” section for device nomenclature and to the “device part numbers” section for ordering.

The 8K bytes of mask-programmable ROM in the associated TMS370Cx32 devices are replaced in the TMS370C732A with 8K bytes of EPROM. All other available memory and on-chip peripherals are identical except for the TMS370C332A which does not have EEPROM memory. The OTP (TMS370C732A) and reprogrammable (SE370C732A) devices are available.

The TMS370C732A OTP device is available in a plastic package. This microcontroller is effective to use for immediate production updates for other members of the TMS370Cx32 family or for low-volume production runs when the mask charge or cycle time for the low-cost mask ROM devices is not practical.

The SE370C732A has a windowed ceramic package to allow reprogramming of the program EPROM memory during the development/prototyping phase of design. The SE370C732A device allows quick updates to breadboards and prototype systems while iterating initial designs.

The TMS370Cx32 family provides two low-power modes (STANDBY and HALT) for applications where low-power consumption is critical. Both modes stop all CPU activity (that is, no instructions are executed). In the STANDBY mode, the internal oscillator, the PACT counter, and PACT’s first command / definition entry remain active. This allows the P ACT module to bring the device out of ST ANDBY mode. In the HALT mode, all device activity is stopped. The device retains all RAM data and peripheral configuration bits throughout both low-power modes.

The TMS370Cx32 features advanced register-to-register architecture that allows direct arithmetic and logical operations without requiring an accumulator (for example, ADD R24, R47; add the contents of register 24 to the contents of register 47 and store the result in register 47). The TMS370Cx32 family is fully instruction-set-compatible, providing easy transition between members of the TMS370 8-bit microcontroller family.

The TMS370Cx32 has a P ACT module that acts as a timer coprocessor by gathering timing information on input signals and controlling output signals with little or no intervention by the CPU. The coprocessor nature of this module allows for levels of flexibility and power not found in traditional microcontroller timers.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

5

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

description (continued)

The TMS370Cx32 family provides the system designer with an economical, efficient solution to real-time control applications. The PACT compact development tool (CDT) solves the challenge of efficiently developing the software and hardware required to design the TMS370Cx32 into an ever-increasing number of complex applications. The application source code can be written in assembly and C language, and the output code can be generated by the linker. Precise real-time, in-circuit emulation and extensive symbolic debug and analysis tools ensure efficient software and hardware implementation as well as a reduced time-to-market cycle.

The TMS370Cx32 family together with the TMS370 P ACT CDT370, BP programmer, starter kit, software tools, the SE370C732A reprogrammable devices, comprehensive product documentation, and customer support provide a complete solution to the needs of the system designer.

central processing unit (CPU)

The CPU on the TMS370Cx32 device is the high-performance 8-bit TMS370 CPU module. The ’x32 implements an efficient register-to-register architecture that eliminates the conventional accumulator bottleneck. The complete ’x32 instruction map is shown in Table 15.

The ’370Cx32 CPU architecture provides the following components: CPU registers:

D

A stack pointer (SP) that points to the last entry in the memory stack

D

A status register (ST) that monitors the operation of the instructions and contains the global interrupt-enable bits

D

A program counter (PC) that points to the memory location of the next instruction to be executed

A memory map that includes:

D

256-byte general-purpose RAM that can be used for data memory storage, program instructions, general purpose register, dual-port RAM, or the stack

D

The upper 128-bytes of the register file is called dual-port RAM that contains the capture registers, the circular buffer, and a command/definition area.

D

A peripheral file that provides access to all internal peripheral modules, system-wide control functions, and EEPROM/EPROM programming control

D

256-byte EEPROM module that provides in-circuit programmability and data retention in power-off conditions

D

8K-byte ROM or 8K-byte EPROM

CDT is a trademark of Texas Instruments Incorporated.

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

6

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

central processing unit (CPU) (continued)

Figure 1 Illustrates the CPU registers and memory blocks.

Reserved

†

Peripheral File

01FFh 0200h

1000h 10BFh 10C0h 1EFFh

1F00h

5FFFh 6000h

Interrupts and Reset Vectors;

Trap Vectors

0FFFh

Reserved

†

7FFFh

0

RAM (Includes up to 256-Byte Registers File)

015

Program Counter

7

Legend:

Z=Zero

IE1 = Level 1 interrupts Enable

C=Carry

V=Overflow

N=Negative

IE2 = Level 2 interrupts Enable

IE1IE2ZNC

01234567

V

Status Register (ST)

Stack Pointer (SP)

R0(A) R1(B)

R3

R127

0000h 0001h

0002h

007Fh

R255

0003h

R2

00FFh

1FFFh 2000h

7F9Ch

7F9Bh

256-Byte RAM

00FFh 0100h

017Fh 0180h

128-Byte PACT Dual-Port RAM

0000h

Reserved

†

256-Byte Data EEPROM

Reserved

†

8K-Byte ROM/EPROM

Reserved

†

FFFFh

8000h

†

Reserved means the address space is reserved for future expansion.

Figure 1. Programmer’s Model

stack pointer (SP)

The SP is an 8-bit CPU register. Stack operates as a last-in, first-out, read/write memory. T ypically, the stack is used to store the return address on subroutine calls as well as the ST contents during interrupt sequences.

The SP points to the last entry or top of the stack. The SP is incremented automatically before data is pushed onto the stack and decremented after data is popped from the stack. The stack can be placed anywhere in the on-chip RAM.

status register (ST)

The ST monitors the operation of the instructions and contains the global interrupt-enable bits. The ST includes four status bits (condition flags) and two interrupt-enable bits.

D

The four status bits indicate the outcome of the previous instruction; conditional instructions (for example, the conditional-jump instructions) use the status bits to determine program flow.

D

The two interrupt-enable bits control the two interrupt levels.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

7

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

central processing unit (CPU) (continued)

The ST, status-bit notation, and status-bit definitions are shown in Table 3.

Table 3. Status Registers

7

6

5

4

3

ÁÁÁÁ

2

1

0

C

N

Z

V

IE2

ÁÁÁÁ

IE1 Reserved Reserved

RW-0

ÁÁÁÁ

RW-0

R = read, W = write, 0 = value after reset

program counter (PC)

The contents of the PC point to the memory location of the next instruction to be executed. The PC consists of two 8-bit registers in the CPU: the program counter high (PCH) and program counter low (PCL). These registers contain the most significant byte (MSbyte) and least significant byte (LSbyte) of a 16-bit address.

During reset, the contents of the reset vector (7FFEh, 7FFFh) are loaded into the PC. The PCH (MSbyte of the PC) is loaded with the contents of memory location 7FFEh, and the PCL (LSbyte of the PC) is loaded with the contents of memory location 7FFFh. Figure 2 shows this operation using an example value of 6000h as the contents of the reset vector.

Memory

Program Counter (PC)

60 00

PCH PCL

60 00

0000h

7FFEh 7FFFh

Figure 2. Program Counter After Reset

memory map

The TMS370Cx32 architecture is based on the Von Neuman architecture, where the program memory and data memory share a common address space. All peripheral input/output is memory mapped in this same common address space. As shown in Figure 3, the TMS370Cx32 provides memory-mapped RAM, ROM, EPROM, data EEPROM, I/O pins, peripheral functions, and system-interrupt vectors.

The peripheral file contains all I/O port control, peripheral status and control, EEPROM, EPROM, and system-wide control functions. The peripheral file is located between 1000h to 107Fh and is divided logically into eight peripheral file frames of 16 bytes each. The eight PF frames consist of five control frames and three reserved frames.Each on-chip peripheral is assigned to a separate frame through which peripheral control and data information is passed.

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

8

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

central processing unit (CPU) (continued)

256-Byte RAM (0000h–00FFh)

Peripheral File

Reserved

†

7FC0h–7FDFh

PACT Interrupt 1-18

7FEEh–7FF7h

Reserved

†

7FECh–7FEDh

Interrupt 1

Reset

1020h–102Fh

Digital Port Control

Vectors

ADC1

7FFCh–7FFDh 7FFEh–7FFFh

0000h

0100h

0080h

0FFFh

1000h

10BFh 10C0h

1EFFh

1F00h

1FFFh

2000h

5FFFh

6000h

FFFFh

00FFh

Interrupts and Reset Vectors;

Trap and PACT Vectors

7F9Bh 7F9Ch

7FFFh

8000h

7FF8h–7FF9h 7FFAh–7FFBh

Peripheral File Control Registers

1010h–101Fh

1050h–105Fh

System Control

1030h–103Fh 1040h–104Fh

ADC1 Peripheral Control

Trap 15–0

Reserved

†

Reserved

†

256-Byte Data EEPROM

Reserved

†

8K-Byte ROM/EPROM

Reserved

†

7F9Ch–7FBFh

7FE0h–7FEBh

1000h–100Fh

1060h–106Fh 1070h–107Fh

Reserved

†

PACT Peripheral Control

Reserved

†

Reserved

†

Reserved

†

Interrupt 2

Interrupt 3

Dual–Port RAM (0080h–00FFh)

†

Reserved means that the address space is reserved for future expansion.

Figure 3. TMS370Cx32 Memory Map

RAM/register file (RF)

Locations within the RAM address space can serve as the RF, general-purpose read/write memory, program memory, or the stack instructions. The TMS370Cx32 devices contain 256 bytes of internal RAM, memory-mapped beginning at location 0000h (R0) and continuing through location 00FFh (R255) which is shown in Figure 1.

The first two registers, R0 and R1, are also called register A and B, respectively. Some instructions implicitly use register A or B; for example, the instruction LDSP (load SP) assumes that the value to be loaded into the stack pointer is contained in register B. Registers A and B are the only registers cleared on reset.

dual-port RAM

The upper 128 bytes of the register files (0080h – 00FFh) can be used by the PACT module to contain commands and definitions as well as timer values. Any RAM not used by P ACT can be used as additional CPU register or as general-purpose memory.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

9

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

peripheral file (PF)

The TMS370Cx32 control registers contain all the registers necessary to operate the system and peripheral modules on the device. The instruction set includes some instructions that access the PF directly. These instructions designate the register by the number of the PF relative to 1000h, preceded by P0 for a hexadecimal designator or P for a decimal designator. For example, the system-control register 0 (SCCR0) is located at address 1010h; its peripheral file hexadecimal designator is P010, and its decimal designator is P16. Table 4 shows the TMS370Cx32 PF address map.

Table 4. TMS370Cx32 Peripheral File Address Map

БББББ

Á

ADDRESS RANGE

БББББББ

Á

БББББ

Á

PERIPHERAL FILE

DESIGNAT OR

БББББББББББББББББББ

Á

DESCRIPTION

1000h–100Fh

БББББББ

P000–P00F Reserved

1010h–101Fh

БББББББ

P010–P01F

System and EPROM/EEPROM control registers

1020h–102Fh

P020–P02F

Digital I/O port control registers

1030h–103Fh

БББББББ

P030–P03F

Reserved

1040h–104Fh

БББББББ

P040–P04F

PACT registers

1050h–106Fh

БББББББ

P050–P06F Reserved

1070h–107Fh

БББББББ

P070–P07F

Analog-to-digital converter 1 registers

1080h–10FFh

БББББББ

P080–P0FF

Reserved

data EEPROM

The TMS370Cx32 devices, containing 256 bytes of data EEPROM, have a memory that is mapped beginning at location 1F00h and continuing through location 1FFFh. Writing to the data EEPROM module is controlled by the data EEPROM control register (DEECTL) and the write-protection register (WPR). Programming algorithm examples are available in the

TMS370 Family User’s Guide

(literature number SPNU127) or the

TMS370 Family Data Manual

(literature number SPNS014B). The data EEPROM features include the following:

D

Programming: – Bit-, byte-, and block-write/erase modes – Internal charge pump circuitry. No external EEPROM programming voltage supply is needed. – Control register: Data EEPROM programming is controlled by the DEECTL located in the PF frame

beginning at location P01A. See Table 5.

– In-circuit programming capability. There is no need to remove the device to program it.

D

Write protection. Writes to the data EEPROM are disabled during the following conditions. – Reset. All programming of the data EEPROM module is halted. – Write protection active. There is one write-protect bit per 32-byte EEPROM block. – Low-power mode operation

D

Write protection can be overridden by applying 12 V to MC.

T able 5. Data EEPROM and PROGRAM EPROM Control Registers Memory Map

ADDRESS

SYMBOL

NAME

P01A

DEECTL

Data EEPROM Control Register

P01B

— Reserved

P01C

EPCTLL

Program EPROM Control Register – Low Array

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

10

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

program EPROM

†

The TMS370C732 device contains 8K bytes of EPROM mapped, beginning at location 6000h and continuing through location 7FFFh as shown in Figure 3. Reading the program EPROM modules is identical to reading other internal memory. During programming, the EPROM is controlled by the EPROM control register (EPCTLL). The program EPROM module features include:

D

Programming – In-circuit programming capability if V

PP

is applied to MC

– Control register: EPROM programming is controlled by the EPROM control register (EPCTLL) located

in the peripheral file (PF) frame at location P01C as shown in Table 5.

D

Write protection: Writes to the program EPROM are disabled under the following conditions: – Reset: All programming to the EPROM module is halted – Low-power modes – 13 V not applied to MC

program ROM

†

The program ROM consists of 8K bytes of mask programmable read-only memory . The program ROM is used for permanent storage of data or instructions. Programming of the mask ROM is performed at the time of device fabrication. Refer to Figure 3 for ROM memory map.

system reset

The system-reset operation ensures an orderly start-up sequence for the TMS370Cx32 CPU-based device. There are up to three different actions that can cause a system reset to the device. Two of these actions are generated internally , while one (RESET pin) is controlled externally. These actions are as follows:

D

P ACT watchdog (WD) timer . A watchdog-generated reset occurs if an improper value is written to the WD key register, or if the re-initialization does not occur before the watchdog timer timeout . See the

TMS370

Family User’s Guide

(literature number SPNU127) for more information.

D

Oscillator reset. Reset occurs when the oscillator operates outside of the recommended operating range. See the

TMS370 Family User’s Guide

(literature number SPNU127) for more information.

D

External RESET pin. A low level signal can trigger an external reset. To ensure a reset, the external signal should be held low for one SYSCLK cycle. Signals of less than one SYSCLK can generate a reset. See the

TMS370 Family User’s Guide

(literature number SPNU127) for more information.

Once a reset source is activated, the external RESET pin is driven (active) low for a minimum of eight SYSCLK cycles. This allows the ’x32 device to reset external system components. Additionally, if a cold start condition (V

CC

is off for several hundred milliseconds) or oscillator failure occurs or the RESET pin is held low , then the

reset logic holds the device in a reset state for as long as these actions are active. After a reset, the program can check the oscillator-fault flag (OSC FL T FLAG, SCCR0.4) and the cold-start flag

(COLD START, SCCR0.7) to determine the source of the reset. A reset does not clear these flags. Table 6 depicts the reset sources. If none of the sources indicated in T able 1 caused the reset, then the RESET pin was pulled low by the external hardware or the PACT module’s watchdog.

†

Memory addresses 7FE0h through 7FEBh are reserved for Texas Instruments, and 7FECh through 7FFFh are reserved for interrupt and reset vectors. Trap vectors, used with TRAP0 through TRAP15 instructions are located between addresses 7FC0h and 7FDFh. PACT interrupts are located between addresses 7F9Ch and 7FBFh.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

11

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

system reset (continued)

Table 6. Reset Sources

REGISTER

ADDRESS

PF

BIT NO.

CONTROL BIT

SOURCE OF RESET

SCCR0

1010h

P010

7

COLD START

Cold (power-up)

SCCR0

1010h

P010

4

OSC FLT FLAG

Oscillator out of range

Once a reset is activated, the following sequence of events occurs:

1. The CPU registers are initialized: ST = 00h, SP = 01h (reset state).

2. Registers A and B are initialized to 00h (no other RAM is changed).

3. The contents of the LSbyte of the reset vector (07FFh) are read and stored in the PCL.

4. The contents of the MSbyte of the reset vector (07FEh) are read and stored in the PCH.

5. Program execution begins with an opcode fetch from the address pointed to the PC. The reset sequence takes 20 SYSCLK cycles from the time the reset pulse is released until the first opcode

fetch. During a reset, RAM contents (except for registers A and B) remain unchanged, and the module control register bits are initialized to their reset state.

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

12

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

interrupts

The TMS370 family software-programmable interrupt structure permits flexible on-chip and external interrupt configurations to meet real-time interrupt-driven application requirements. The hardware interrupt structure incorporates two priority levels as shown in Figure 4. Interrupt level 1 has a higher priority than interrupt level 2. The two priority levels can be masked independently by the global interrupt mask bits (IE1 and IE2) of the ST.

GROUP 2

CPU

NMI

Logic

Enable

IE1

IE2

Level 1 INT Level 2 INT

PACT 3 PRI

Priority

Cmd/Def Entry 7 Cmd/Def Entry 6 Cmd/Def Entry 5 Cmd/Def Entry 4

Cmd/Def Entry 3 Cmd/Def Entry 2

AD INT

AD PRI

ADC1

STATUS REG

EXT INT1

INT1 PRI

INT1

Cmd/Def Entry 1 Cmd/Def Entry 0

GROUP 3

PACT 1 PRI

Overflow CP1 Edge CP2 Edge CP3 Edge

CP4 Edge CP5 Edge CP6 Edge

Circular Buffer

GROUP 1

PACT 2 PRI

SCI TXINT SCI RXINT

PACT

Default Timer

EXT INT3

INT3

EXT INT2

INT2

INT3 PRI

INT2 PRI

Figure 4. Interrupt Control

Each system interrupt is configured independently to either the high- or low-priority chain by the application program during system initialization. Within each interrupt chain, the interrupt priority is fixed by the position of the system interrupt. However, since each system interrupt is selectively configured on either the high- or low-priority-interrupt chain, the application program can elevate any system interrupt to the highest priority. Arbitration between the two priority levels is performed within the CPU. Arbitration within each of the priority

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

13

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

interrupts (continued)

chains is performed within the peripheral modules to support interrupt expansion for future modules. Pending interrupts are serviced upon completion of current instruction execution, depending on their interrupt mask and priority conditions.

The TMS370Cx32 has 22 hardware system interrupts (plus RESET

) as shown in T able 7. Each system interrupt has a dedicated vector located in program memory through which control is passed to the interrupt service routines. A system interrupt may have multiple interrupt sources. All the interrupt sources are individually maskable by local interrupt enable control bits in the associated peripheral file. Each interrupt source FLAG bit is individually readable for software polling or for determining which interrupt source generated the associated system interrupt.

Nineteen of the system interrupts are generated by on-chip peripheral functions, and three external interrupts are supported. Software configuration of the external interrupts is performed through the INT1, INT2, and INT3 control registers in peripheral file frame 1. Each external interrupt is individually software configurable for input polarity (rising or falling edge) for ease of system interface. External interrupt INT1 is software configurable as either a maskable or non-maskable interrupt. When INT1 is configured as non-maskable, it cannot be masked by the individual- or global-enable mask bits. The INT1 NMI bit is protected during non-privileged operation and, therefore, should be configured during the initialization sequence following reset. To maximize pin flexibility, external interrupts INT2 and INT3 can be software configured as general-purpose input/output pins if the interrupt function is not required (INT1 can be similarly configured as an input pin).

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

14

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

interrupts (continued)

T able 7. Hardware System Interrupts

ÁÁÁÁ

Á

ÁÁÁÁ

Á

INTERRUPT

SOURCE

БББББББ

Á

БББББББ

Á

INTERRUPT

FLAG

ББББББ

Á

ÁÁÁÁ

Á

ÁÁÁÁ

Á

OSC FLT FLG

ÁÁÁ

Á

ÁÁÁ

Á

SYSTEM

INTERRUPT

ÁÁÁÁ

Á

ÁÁÁÁ

Á

VECTOR

ADDRESS

ÁÁ

Á

ÁÁ

Á

MODULE

PRIORITY

†

ÁÁ

Á

ÁÁ

Á

PRIORITY

IN

GROUP

ÁÁÁÁ

Á

RESET

БББББББ

Á

External RESET Watchdog Overflow Oscillator Fault

ÁÁÁÁ

Á

COLD START (No Flag) OSC FLT FLAG

ÁÁÁ

Á

RESET

‡

ÁÁÁÁ

Á

7FFEh, 7FFFh

ÁÁ

Á

1

ÁÁ

Á

1

INT1

External Interrupt 1

INT1 FLAG

INT1

‡

7FFCh, 7FFDh

2

1

INT2

External Interrupt 2

INT2 FLAG

INT2

‡

7FFAh, 7FFBh

3

1

INT3

External Interrupt 3

INT3 FLAG

INT3

‡

7FF8h, 7FF9h

4

1

ÁÁÁÁÁБББББББ

Á

PACT Circular Buf fer

ÁÁÁÁ

Á

Buffer Half/Full Interrupt Flag

ÁÁÁ

Á

BUFINT

ÁÁÁÁ

Á

7FB0h, 7FB1h

ÁÁÁÁÁ

Á

1

PACT CP6 Event

CP6 INT FLAG

CP6INT

7FB2h, 7FB3h

2

PACT CP5 Event

CP5 INT FLAG

CP5INT

7FB4h, 7FB5h

3

p

PACT CP4 Event

CP4 INT FLAG

CP4INT

7FB6h, 7FB7h

4

PACT (Group 1)

PACT CP3 Event

CP3 INT FLAG

CP3INT

7FB8h, 7FB9h

5

PACT CP2 Event

CP2 INT FLAG

CP2INT

7FBAh, 7FBBh

6

PACT CP1 Event

CP1 INT FLAG

CP1INT

7FBCh, 7FBDh

7

ÁÁÁÁÁБББББББ

Á

Default Timer Overflow

ÁÁÁÁ

Á

DEFTIM OVRFL INT FLAG

ÁÁÁ

Á

POVRL

INT

ÁÁÁÁ

Á

7FBEh, 7FBFh

ÁÁÁÁÁ

Á

8

p

PACT SCI Rx Int

PACT RX RDY

PRXINT

7F9Eh, 7F9Fh

1

PACT (Group 2)

PACT SCI Tx Int

PACT TX RDY

PTXINT

7F9Ch, 7F9Dh

6

2

PACT Cmd/Def Entry 0

CMD/DEF INT 0 FLAG

CDINT 0

7FA0h, 7FA1h

1

PACT Cmd/Def Entry 1

CMD/DEF INT 1 FLAG

CDINT 1

7FA2h, 7FA3h

2

PACT Cmd/Def Entry 2

CMD/DEF INT 2 FLAG

CDINT 2

7FA4h, 7FA5h

3

p

PACT Cmd/Def Entry 3

CMD/DEF INT 3 FLAG

CDINT 3

7FA6h, 7FA7h

4

PACT (Group 3)

PACT Cmd/Def Entry 4

CMD/DEF INT 4 FLAG

CDINT 4

7FA8h, 7FA9h

7

5

PACT Cmd/Def Entry 5

CMD/DEF INT 5 FLAG

CDINT 5

7FAAh, 7FABh

6

PACT Cmd/Def Entry 6

CMD/DEF INT 6 FLAG

CDINT 6

7FACh, 7FADh

7

PACT Cmd/Def Entry 7

CMD/DEF INT 7 FLAG

CDINT 7

7FAEh, 7FAFh

8

ADC1

ADC1 Conversion Complete

AD INT FLAG

ADINT

7FECh, 7FEDh

8

1

†

Relative priority within an interrupt level

‡

Release microcontroller from STANDBY and HALT low-power modes

privileged operation and EEPROM write protection override

The TMS370Cx32 family is designed with significant flexibility to enable the designer to software-configure the system and peripherals to meet the requirements of a variety of applications. The nonprivileged mode of operation ensures the integrity of the system configuration, once it is defined for an application. Following a hardware reset, the TMS370Cx32 operates in the privileged mode, where all peripheral file registers have unrestricted read / write access, and the application program configures the system during the initialization sequence following reset. As the last step of system initialization, the PRIVILEGE DISABLE bit (SCCR2.0) is set to 1 to enter the nonprivileged mode, disabling write operations to specific configuration-control bits within the PF . Table 8 displays the system-configuration bits which are write-protected during the nonprivileged mode and must be configured by software prior to exiting the privileged mode.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

15

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

privileged operation and EEPROM write protection override (continued)

Table 8. Privilege Bits

REGISTER

†

NAME

LOCATION

CONTROL BIT

ÁÁÁ

Á

SCCRO

ÁÁÁ

Á

P010.5 P010.6

ББББББББ

Á

PF AUTO WAIT OSC POWER

SCCR1

P011.2 P011.4

MEMORY DISABLE AUTOWAIT DISABLE

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

SCCR2

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

P012.0 P012.1 P012.3 P012.4 P012.6 P012.7

ББББББББ

Á

ББББББББ

Á

ББББББББ

Á

PRIVILEGE DISABLE INT1 NMI CPU STEST BUS STEST PWRDWN/IDLE HALT/STANDBY

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

PACTSCR

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

P040.0 P040.1 P040.2 P040.3 P040.4

ББББББББ

Á

ББББББББ

Á

ББББББББ

Á

PACT PRESCALE SELECT 0 PACT PRESCALE SELECT 1 PACT PRESCALE SELECT 2 PACT PRESCALE SELECT 3 FAST MODE SELECT

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

PACTPRI

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

ÁÁÁ

Á

P04F.0 P04F.1 P04F.2 P04F.3 P04F.4 P04F.5 P04F.7

ББББББББ

Á

ББББББББ

Á

ББББББББ

Á

ББББББББ

Á

PACT WD PRESCALE SELECT 0 PACT WD PRESCALE SELECT 1 PACT MODE SELECT PACT GROUP 3 PRIORITY PACT GROUP 2 PRIORITY PACT GROUP 1 PRIORITY PACT STEST

ÁÁÁ

Á

ADPRI

ÁÁÁ

Á

P07F.5 P07F.6 P07F.7

ББББББББ

Á

AD ESPEN AD PRIORITY AD STEST

†

The privilege bits are shown in a bold typeface in the peripheral file frame 1 section.

low-power and IDLE modes

The TMS370Cx32 devices have two low-power modes (STANDBY and HALT) and an IDLE mode. For mask-ROM devices, low-power modes can be disabled permanently through a programmable contact at the time when the mask is manufactured.

The ST ANDBY and HALT low-power modes significantly reduce power consumption by reducing or stopping the activity of the various on-chip peripherals when processing is not required. Each of the low-power modes is entered by executing the IDLE instruction when the PWRDWN/IDLE bit in SCCR2 has been set to 1. The HALT/STANDBY bit in SCCR2 controls the low-power mode selection.

In the ST ANDBY mode (HAL T/ST ANDBY = 0), all CPU activity and most peripheral module activity is stopped; however, the oscillator, internal clocks, the PACT counter, and the first PACT command entry remain active in all modules. System processing is suspended until a qualified interrupt (hardware RESET or external interrupt on INT1, INT2, or INT3) is detected.

In the HAL T mode (HALT/STANDBY = 1), the TMS370Cx32 is placed in its lowest power consumption mode. The oscillator and internal clocks are stopped, causing all internal activity to be halted. System activity is suspended until a qualified interrupt (hardware RESET

or external interrupt on the INT1, INT2, or INT3) is

detected. The power-down mode-selection bits are summarized in Table 9.

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

16

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

low-power and IDLE modes (continued)

Table 9. Low-Power/Idle Control Bits

POWER-DOWN CONTROL BITS

ÁÁÁÁ

Á

PWRDWN/IDLE

(SCCR2.6)

БББББ

Á

HALT/STANDBY

(SCCR2.7)

ÁÁÁÁ

Á

MODE SELECTED

1

0

STANDBY

1

HALT

0

X

†

IDLE

†

X = don’t care

When low-power modes are disabled through a programmable contact in the mask-ROM devices, writing to the SCCR2.6-7 bits is ignored. In addition, if an IDLE instruction is executed when low-power modes are disabled through a programmable contact, the device always enters the IDLE mode.

T o provide a method for always exiting low-power modes for mask-ROM devices, INT1 is enabled automatically as a nonmaskable interrupt (NMI) during low-power modes when the hard watchdog mode is selected. This means that the NMI is generated always, regardless of the interrupt enable flags.

The following information is preserved throughout both the STANDBY and HALT modes: RAM (register file), CPU registers (SP , PC, and ST), I/O pin direction and output data, and status registers of all on-chip peripheral functions. Since all CPU instruction processing is stopped during the ST ANDBY and HAL T modes, the clocking of the WD timer is inhibited.

clock modules

The ’x32 family provides two clock options that are referred to as divide-by-1 (phase-locked loop) and divide-by-4 (standard oscillator). Both the divide-by-1 and divide-by-4 options are configurable during the manufacturing process of a TMS370 microcontroller. The ’x32 masked-ROM devices of fer both options to meet system engineering requirements. Only one of the two clock options is allowed on each ROM device. The ’732A EPROM has only the divide-by-4.

The divide-by-1 clock module option provides the capability for reduced electromagnetic interference (EMI) with no added cost.

The divide-by-1 provides a one-to-one match of the external resonator frequency (CLKIN) to the internal system clock (SYSCLK) frequency , whereas the divide-by-4 produces a SYSCLK which is one-fourth the frequency of the external resonator. Inside the divide-by-1 module, the frequency of the external resonator is multiplied by four, and the clock module then divides the resulting signal by four to provide the four-phased internal system clock signals. The resulting SYSCLK is equal to the resonator frequency. These are formulated as follows:

Divide-by-4 option : SYSCLK

+

external resonator frequency

4

+

CLKIN

4

Divide-by-1 option : SYSCLK

+

external resonator frequency 4

4

+

CLKIN

The main advantage of choosing a divide-by-1 oscillator is the reduced EMI. The harmonics of low-speed resonators extend through fewer of the emissions spectrum than the harmonics of faster resonators. The divide-by-1 provides the capability of reducing the resonator speed by four times, and this results in a steeper decay of emissions produced by the oscillator.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

17

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

system configuration registers

Table 10, contains system-configuration and control functions and registers for controlling EEPROM programming. The privileged bits are shown in a bold typeface and shaded areas.

Table 10. Peripheral File Frame 1: System-Configuration Registers

PF

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

REG

Á

P010

ÁÁ

Á

COLD

START

OSC

POWER

PF AUTO

WAIT

ÁÁÁ

Á

OSC FLT

FLAG

ÁÁ

Á

MC PIN

WPO

ÁÁ

Á

MC PIN

DATA

ÁÁÁ

Á

—

ÁÁÁ

Á

µP/µC MODE

Á

SCCR0

Á

P011

ÁÁ

Á

—

ÁÁÁ

Á

—

ÁÁ

Á

—

AUTO WAIT

DISABLE

ÁÁ

Á

—

MEMORY DISABLE

ÁÁÁ

Á

—

ÁÁÁ

Á

—

Á

SCCR1

Á

P012

HALT/

STANDBY

PWRDWN/

IDLE

—

BUS

STEST

CPU

STEST

ÁÁ

Á

—

INT1

NMI

PRIVILEGE

DISABLE

Á

SCCR2

Á

P013

to

P016

Reserved

Á

P017

ÁÁ

Á

INT1

FLAG

ÁÁÁ

Á

INT1

PIN DATA

ÁÁ

Á

—

ÁÁÁ

Á

—

ÁÁ

Á

—

ÁÁ

Á

INT1

POLARITY

ÁÁÁ

Á

INT1

PRIORITY

ÁÁÁ

Á

INT1

ENABLE

Á

INT1

P018

INT2

FLAG

INT2

PIN DATA

—

INT2

DATA DIR

INT2

DATA OUT

INT2

POLARITY

INT2

PRIORITY

INT2

ENABLE

INT2

Á

P019

ÁÁ

Á

INT3

FLAG

ÁÁÁ

Á

INT3

PIN DATA

ÁÁ

Á

—

ÁÁÁ

Á

INT3

DATA DIR

ÁÁ

Á

INT3

DATA OUT

ÁÁ

Á

INT3

POLARITY

ÁÁÁ

Á

INT3

PRIORITY

ÁÁÁ

Á

INT3

ENABLE

Á

INT3

P01A

BUSY

—

AP

W1W0

EXE

DEECTL P01B Reserved P01C

BUSY

VPPS

—

W0

EXE

EPCTLL

Á

P01D P01E

P01F

Reserved

Á

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

18

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

digital port control registers

Peripheral file frame 2 contains the digital I/O pin configuration and control registers. T able 11 shows the specific addresses, registers, and control bits within this peripheral file frame. Table 12 shows the port configuration register setup.

Table 11. Peripheral File Frame 2: Digital Port-Control Registers

PF

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

P020 Reserved

APORT1

P021

Port A Control Register 2 (must be 0)

APORT2

P022

Port A Data

ADATA

P023

Port A Direction

ADIR

ÁÁ

Á

P024

to

P02B

Reserved

ÁÁ

Á

P02C

Port D Control Register 1

(must be 0)

—

Port D Control Register 1

(must be 0)

—

DPORT1

ÁÁ

Á

P02D

БББББ

Á

Port D Control Register 2

(must be 0)

†

ÁÁÁ

Á

—

ББББББ

Á

Port D Control Register 2

(must be 0)

†

ÁÁ

Á

—

ÁÁ

Á

—

ÁÁÁ

Á

—

ÁÁ

Á

DPORT2

P02E

Port D Data

—

Port D Data

—

DDATA

P02F

Port D Direction

—

Port D Direction

—

DDIR

†

To configure pin D3 as SYSCLK, set port D control register 2 = 08h.

Table 12. Port Configuration Register Setup

PORT

abcd 00q1

abcd 00y0

A

0 – 7

Data out q

Data In y

D

3, 4, 6, 7

Data out q

Data In y

ББББББББББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББББББББББ

Á

a = Port x Control Register 1 b = Port x Control Register 2

c = Data

d = Direction

programmable acquisition and control timer (PACT) module

Traditionally, timers in microcontrollers provide limited capture and compare functions consuming significant CPU processing power, leading to inaccurate timings due to interrupt latencies. The programmable acquisition and control timer (P ACT8) acts as a coprocessor combining configurable capture and compare features, within a flexible dual-port RAM, able to run real-time tasks with little or no CPU intervention. The P ACT structure allows concatenation of tasks, thus enabling the CPU to perform data manipulation while the PACT module both captures and outputs real-time-related information. Since all the PACT control information is held within the dual-port RAM, the CPU can access these parameters quickly.

To use the PACT, the user must set up three distinct areas of memory. The first is the dual-port RAM, which contains the capture area, the commands, and the timer definitions. The second is the peripheral frame. The third is an area near the end of the program memory which holds the interrupt vectors of PACT.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

19

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

programmable acquisition and control timer (PACT) module (continued)

The PACT module features include the following:

D

Input-capture functions on up to six input pins (CP1 to CP6), depending on the mode selected: – Mode A: CP1–2 are dedicated capture, CP3–6 are circular-buffer capture, and CP6 is an event pin. – Mode B: CP1–4 are dedicated capture, CP5–6 are circular-buffer capture, and CP6 is an event pin.

D

Multiple timer-driven outputs on eight pins (OP1 to OP8) – Standard compare command: sets or clears an output pin whenever the timer/counter is equal to a

certain value – Virtual timers: Enable variations of the PWM’s period and provides periodic interrupts to the processor . – Double event-compare command: Comparisons of the 8-bit event counter with two event-compare

values and the actions that can be performed are based on each value.

– Event-compare 1 matching the event counter: sets or resets the selected output pin (OP1–OP8),

generates interrupt, and generates a 32-bit capture into the circular buffer.

– Event-compare 2 matching the event counter: sets or resets the selected output pin (OP1–OP8),

generates interrupt, generates a 32-bit capture into the circular buffer , and resets the 20-bit default timer.

– Offset timer definition-time from last event:

– Generates an interrupt when the maximum event count is reached

– Stores the 16-bit virtual timer in the circular buffer on each event

– Stores the 20-bit default timer and 8-bit event counter in the circular buffer when the maximum

event count is reached

– Resets the 20-bit hardware default timer when the maximum event count is reached – Conditional-compare command has a timer-compare value and an event-compare value.

– Generates an interrupt when the event-compare value equals the event counter and the

timer-compare value equals the last defined timer

– Sets or clears one of the seven output pins (OP1–OP7) when the event compare value equals the

event counter and the timer-compare value equals the last defined timer

– Baud rate timer definition: runs the mini-serial communications port built into the PACT module.

D

Configurable timer overflow rates

D

One 8-bit event counter driven by CP6

D

Up to 20-bit timer capability

D

Interaction between event counter and timer activity

D

Register-based organization allowing direct access to timer parameters by the CPU

D

18 independent interrupt vectors with two priority levels

D

Integrated, configurable watchdog with selectable time-out period

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

20

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

programmable acquisition and control timer (PACT) module (continued)

D

Mini-serial communications interface works as a simplified full duplex universal asychronous receiver/transmitter (UART) with independent setup of baud rate for receive and transmit lines.

– Asynchronous communications mode

Asynchronous Baud

+

1

(Max Virtual Timer Value) (4) (PACT Resolution)

–2

where P ACT Resolution = SYSCLK × Prescale Value

PACT block diagram

The PACT module block diagram is illustrated in Figure 5.

8-Bit Event Counter

20-Bit Timer/Counter

Prescale

Reset

Watchdog Timer

Dedicated Capture Register 1

Dedicated Capture Register 2

Dedicated Capture Register 3

Dedicated Capture Register 4

Circular Buffer

(32–Bit Captures)

Command Analyzer

and

Output Controller

Command/Definition Area

Mini SCI

PACT PRESCALED CLOCK

3-Bit Prescaler

Outputs

Int Level 1 Int Level 2

OPT1

OPT3

OPT2

OPT4 OPT5 OPT6 OPT7 OPT8

SCITXDSCIRXD

MODE

EVENT ONLY

CP1

CP2

CP3 CP4 CP5 CP6

Figure 5. PACT Block diagram

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

21

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

PACT control registers

The P ACT module is controlled and accessed through registers in peripheral frame 4. These registers are listed in T able 13. The bits in shaded boxes are privileged mode bits; that is, they can be written to only in the privileged mode.

Table 13. PACT Control Registers

PF

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

REG

Á

P040

ÁÁ

Á

ÁÁ

Á

DEFTIM

OVRFL

INT ENA

ÁÁÁ

Á

ÁÁÁ

Á

DEFTIM

OVRFL

INT FLAG

ÁÁ

Á

ÁÁ

Á

CMD/DEF

AREA ENA

FAST

MODE

SELECT

PACT

PRESCALE

SELECT3

PACT

PRESCALE

SELECT2

PACT

PRESCALE

SELECT1

PACT

PRESCALE

SELECT0

ÁÁ

Á

ÁÁ

Á

PACTSCR

Á

P041

ÁÁ

Á

CMD/DEF

AREA

INT ENA

ÁÁÁ

Á

—

ÁÁ

Á

CMD/DEF

AREA

START BIT 5

ÁÁÁ

Á

CMD/DEF

AREA

START BIT 4

ÁÁ

Á

CMD/DEF

AREA

START BIT 3

ÁÁ

Á

CMD/DEF

AREA

START BIT 2

ÁÁÁ

Á

—

ÁÁ

Á

—

ÁÁ

Á

CDSTART

Á

P042 —

CMD/DEF

AREA

END BIT 6

CMD/DEF

AREA

END BIT 5

CMD/DEF

AREA

END BIT 4

CMD/DEF

AREA

END BIT 3

CMD/DEF

AREA END

BIT 2

— —

ÁÁ

Á

CDEND

Á

P043

ÁÁ

Á

1

ÁÁÁ

Á

1

ÁÁ

Á

BUFFER

POINTER

BIT 5

ÁÁÁ

Á

BUFFER

POINTER

BIT 4

ÁÁ

Á

BUFFER

POINTER

BIT 3

ÁÁ

Á

BUFFER

POINTER

BIT 2

ÁÁÁ

Á

BUFFER

POINTER

BIT 1

ÁÁ

Á

—

ÁÁ

Á

BUFPTR

P044 Reserved P045

PACT

RXRDY

PACT

TXRDY

PACT

PARITY

PACT FE

PACT SCI

RX INT ENA

PACT SCI

TX INT ENA

—

PACT SCI

SW RESET

SCICTLP

Á

P046

PACT

RXDT7

PACT

RXDT6

PACT

RXDT5

PACT

RXDT4

PACT

RXDT3

PACT

RXDT2

PACT

RXDT1

PACT

RXDT0

ÁÁ

Á

RXBUFP

P047

PACT

TXDT7

PACT

TXDT6

PACT

TXDT5

PACT

TXDT4

PACT

TXDT3

PACT

TXDT2

PACT

TXDT1

PACT

TXDT0

TXBUFP

Á

P048

ÁÁ

Á

PACT OP8

STATE

ÁÁÁ

Á

PACT OP7

STATE

ÁÁ

Á

PACT OP6

STATE

ÁÁÁ

Á

PACT OP5

STATE

ÁÁ

Á

PACT OP4

STATE

ÁÁ

Á

PACT OP3

STATE

ÁÁÁ

Á

PACT OP2

STATE

ÁÁ

Á

PACT OP1

STATE

ÁÁ

Á

PSTATE

P049

CMD/DEF

INT 7 FLAG

CMD/DEF

INT 6 FLAG

CMD/DEF

INT 5 FLAG

CMD/DEF

INT 4 FLAG

CMD/DEF

INT 3 FLAG

CMD/DEF

INT 2 FLAG

CMD/DEF

INT 1 FLAG

CMD/DEF

INT 0 FLAG

CDFLAGS

Á

P04A

CP2 INT

ENA

CP2 INT

FLAG

ÁÁ

Á

CP2 CAPT

RISING

EDGE

ÁÁÁ

Á

CP2 CAPT

FALLING

EDGE

ÁÁ

Á

CP1 INT

ENA

ÁÁ

Á

CP1 INT

FLAG

ÁÁÁ

Á

CP1 CAPT

RISING

EDGE

ÁÁ

Á

CP1 CAPT

FALLING

EDGE

ÁÁ

Á

CPCTL1

Á

P04B

CP4 INT

ENA

CP4 INT

FLAG

ÁÁ

Á

ÁÁ

Á

CP4 CAPT

RISING

EDGE

ÁÁÁ

Á

ÁÁÁ

Á

CP4 CAPT

FALLING

EDGE

ÁÁ

Á

ÁÁ

Á

CP3 INT

ENA

ÁÁ

Á

ÁÁ

Á

CP3 INT

FLAG

ÁÁÁ

Á

ÁÁÁ

Á

CP3 CAPT

RISING

EDGE

ÁÁ

Á

ÁÁ

Á

CP3 CAPT

FALLING

EDGE

ÁÁ

Á

ÁÁ

Á

CPCTL2

Á

P04C

CP6 INT

ENA

CP6 INT

FLAG

ÁÁ

Á

CP6 CAPT

RISING

EDGE

ÁÁÁ

Á

CP6 CAPT

FALLING

EDGE

ÁÁ

Á

CP5 INT

ENA

ÁÁ

Á

CP5 INT

FLAG

ÁÁÁ

Á

CP5 CAPT

RISING

EDGE

ÁÁ

Á

CP5 CAPT

FALLING

EDGE

ÁÁ

Á

CPCTL3

Á

P04D

BUFFER

HALF/FULL

INT ENA

BUFFER

HALF/FULL

INT FLAG

ÁÁ

Á

INPUT

CAPT

PRESCALE

SELECT 3

ÁÁÁ

Á

INPUT

CAPT

PRESCALE

SELECT 2

ÁÁ

Á

INPUT

CAPT

PRESCALE

SELECT 1

ÁÁ

Á

CP6 EVENT

ONLY

ÁÁÁ

Á

EVENT

COUNTER

SW RESET

ÁÁ

Á

OP/ SET/CLR

SELECT

ÁÁ

Á

CPPRE

P04E WATCHDOG RESET KEY

WDRST

Á

P04F

PACT

STEST

PACT

SUSPEND

PACT

GROUP 1

PRIORITY

PACT GROUP 2 PRIORITY

PACT

GROUP 3

PRIORITY

PACT

MODE

SELECT

PACT WD

PRESCALE

SELECT 1

PACT WD

PRESCALE

SELECT 0

ÁÁ

Á

PACTPRI

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

22

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

analog-to-digital converter 1 module

The analog-to-digital converter 1 (ADC1) module is an 8-bit, successive approximation converter with internal sample-and-hold circuitry . The module has four multiplexed analog input channels that allow the processor to convert the voltage levels from up to eight different sources. The ADC1 module features include the following:

D

Minimum conversion time: 32.8 µs at 5 MHz SYSCLK

D

Ten external pins: – Eight analog-input channels (AN0 –AN7), any of which can be software-configured as digital inputs

(E0–E7) when not needed as analog channels – AN1–AN7 also can be configured as positive-input voltage reference. –V

CC3

: ADC1 module high-voltage reference input

–V

SS3

: ADC1 module low-voltage reference input

D

The ADDATA register, which contains the digital result of the last ADC1 conversion.

D

ADC1 operations can be accomplished through either interrupt-driven or polled algorithms.

D

Six ADC1 module control registers located in the control-register frame beginning at address 1070h

The ADC1 module control registers are listed in Table 14.

Table 14. ADC1 Module Control Register Memory Map

PF

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

REG

ÁÁ

Á

P070

ÁÁ

Á

CONVERT

START

ÁÁ

Á

SAMPLE

START

ÁÁÁ

Á

REF VOLT

SELECT2

ÁÁ

Á

REF VOLT

SELECT1

ÁÁÁ

Á

REF VOLT

SELECT0

ÁÁ

Á

AD INPUT

SELECT2

ÁÁÁ

Á

AD INPUT SELECT1

ÁÁ

Á

AD INPUT

SELECT0

ÁÁ

Á

ADCTL

ÁÁ

Á

P071

ÁÁ

Á

—

ÁÁ

Á

—

ÁÁÁ

Á

—

ÁÁ

Á

—

ÁÁÁ

Á

—

ÁÁ

Á

AD READY

ÁÁÁ

Á

AD INT

FLAG

ÁÁ

Á

AD INT

ENA

ÁÁ

Á

ADSTAT

P072

A/D Conversion Data Register

ADDATA

ÁÁ

Á

ÁÁ

Á

P073

to

P07C

ББББББББББББББББББББББББББ

Á

ББББББББББББББББББББББББББ

Á

Reserved

ÁÁ

Á

ÁÁ

Á

P07D

Port E Data Input Register

ADIN

P07E

Port E Input Enable Register

ADENA

ÁÁ

Á

P07F AD STEST

AD

PRIORITY

AD ESPEN

ÁÁ

Á

—

ÁÁÁ

Á

—

ÁÁ

Á

—

ÁÁÁ

Á

—

ÁÁ

Á

—

ÁÁ

Á

ADPRI

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

23

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

analog-to-digital converter 1 module (continued)

The ADC1 module block diagram is illustrated in Figure 6.

ADCTL.5–3

5 4 3

ADENA.0

REF VOLTS SELECT

ADCTL.2–0

2 1 0

AD INPUT SELECT

ADIN.0

Port E Input

ENA 0

Port E Data

AN 0

AN0

ADENA.1

ADIN.1

Port E Input

ENA 1

Port E Data

AN 1

AN1

ADENA.2

ADIN.2

Port E Input

ENA 2

Port E Data

AN 2

AN2

ADENA.3

ADIN.3

Port E Input

ENA 3

Port E Data

AN 3

AN3

ADENA.4

ADIN.4

Port E Input

ENA 4

Port E Data

AN 4

AN4

ADENA.5

ADIN.5

Port E Input

ENA 5

Port E Data

AN 5

AN5

ADENA.6

ADIN.6

Port E Input

ENA 6

Port E Data

AN 6

AN6

ADENA.7

ADIN.7

Port E Input

ENA 7

Port E Data

AN 7

AN7

V

CC3

V

SS3

ADCTL.6

SAMPLE

START

ADCTL.7

CONVERT

START

ADDATA.7–0

A-to-D

Conversion

Data Register

ADSTAT.2

AD READY

AD PRIORITY

ADPRI.6

0

1

Level 1 INT

Level 2 INT

AD INT FLAG

ADSTAT.1

AD INT ENA

ADSTAT.0

A/D

Figure 6. ADC1 Block Diagram

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

24

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

instruction set overview

Table 15 provides an opcode to instruction cross reference of all 73 instructions and 274 opcodes of the ‘370Cx32 instruction set. The numbers at the top of this table represent the most significant nibble (MSN) of the opcode while the numbers at the left side of the table represent the least significant nibble (LSN). The instruction of these two opcode nibbles contains the mnemonic, operands, and byte /cycle particular to that opcode.

For example, the opcode B5h points to the CLR A instruction. This instruction contains one byte and executes in eight SYSCLK cycles.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443

• 25

Table 15. TMS370 Family Opcode/Instruction Map

†

MSN

01 2 3 4 5 6 7 8 9 A B C D E F

0

JMP

#ra 2/7

INCW

#ra,Rd

3/11

MOV Ps,A

2/8

CLRC /

TST A

1/9

MOV

A,B 1/9

MOV A,Rd

2/7

TRAP

15

1/14

LDST

n

2/6

1JNra

2/5

MOV

A,Pd

2/8

MOV

B,Pd

2/8

MOV

Rs,Pd

3/10

MOV Ps,B

2/7

MOV B,Rd

2/7

TRAP

14

1/14

MOV

#ra[SP],A

2/7

2JZra

2/5

MOV Rs,A

2/7

MOV

#n,A

2/6

MOV Rs,B

2/7

MOV

Rs,Rd

3/9

MOV

#n,B

2/6

MOV

B,A 1/8

MOV

#n,Rd

3/8

MOV

Ps,Rd

3/10

DEC

A

1/8

DEC

B

1/8

DEC

Rd 2/6

TRAP

13

1/14

MOV

A,*ra[SP]

2/7

3JCra

2/5

AND Rs,A

2/7

AND #n,A

2/6

AND Rs,B

2/7

AND

Rs,Rd

3/9

AND #n,B

2/6

AND

B,A 1/8

AND

#n,Rd

3/8

AND A,Pd

2/9

AND B,Pd

2/9

AND

#n,Pd

3/10

INC

A

1/8

INC

B

1/8

INC

Rd 2/6

TRAP

12

1/14

CMP

*n[SP],A

2/8

4JPra

2/5

OR

Rs,A

2/7

OR

#n,A

2/6

OR

Rs,B

2/7

OR

Rs,Rd

3/9

OR

#n,B

2/6

OR B,A 1/8

OR

#n,Rd

3/8

OR

A,Pd

2/9

OR

B,Pd

2/9

OR

#n,Pd

3/10

INV

A

1/8

INV

B

1/8

INV

Rd 2/6

TRAP

11

1/14

extend

inst,2

opcodes

L S

5

JPZ

ra

2/5

XOR Rs,A

2/7

XOR #n,A

2/6

XOR Rs,B

2/7

XOR

Rs,Rd

3/9

XOR #n,B

2/6

XOR

B,A 1/8

XOR

#n,Rd

3/8

XOR A,Pd

2/9

XOR B,Pd

2/9

XOR

#n,Pd

3/10

CLR

A

1/8

CLR

B

1/8

CLR

Rn 2/6

TRAP

10

1/14

N

6

JNZ

ra

2/5

BTJO

Rs,A,ra

3/9

BTJO

#n,A,ra

3/8

BTJO

Rs,B,ra

3/9

BTJO

Rs,Rd,ra

4/11

BTJO

#n,B,ra

3/8

BTJO

B,A,ra

2/10

BTJO

#n,Rd,ra

4/10

BTJO

A,Pd,ra

3/11

BTJO

B,Pd,ra

3/10

BTJO

#n,Pd,ra

4/11

XCHB

A

1/10

XCHB A /

TST B

1/10

XCHB

Rn 2/8

TRAP

9

1/14

IDLE

1/6

7

JNC

ra

2/5

BTJZ

Rs.,A,ra

3/9

BTJZ

#n,A,ra

3/8

BTJZ

Rs,B,ra

3/9

BTJZ

Rs,Rd,ra

4/11

BTJZ

#n,B,ra

3/8

BTJZ

B,A,ra

2/10

BTJZ

#n,Rd,ra

4/10

BTJZ

A,Pd,ra

3/10

BTJZ

B,Pd,ra

3/10

BTJZ

#n,Pd,ra

4/11

SWAP

A

1/11

SWAP

B

1/11

SWAP

Rn 2/9

TRAP

8

1/14

MOV

#n,Pd

3/10

8JVra

2/5

ADD Rs,A

2/7

ADD #n,A

2/6

ADD Rs,B

2/7

ADD

Rs,Rd

3/9

ADD #n,B

2/6

ADD

B,A 1/8

ADD

#n,Rd

3/8

MOVW #16,Rd

4/13

MOVW

Rs,Rd

3/12

MOVW

#16[B],Rpd

4/15

PUSH

A

1/9

PUSH

B

1/9

PUSH

Rd 2/7

TRAP

7

1/14

SETC

1/7

9JLra

2/5

ADC Rs,A

2/7

ADC #n,A

2/6

ADC Rs,B

2/7

ADC

Rs,Rd

3/9

ADC #n,B

2/6

ADC

B,A 1/8

ADC

#n,Rd

3/8

JMPL

lab 3/9

JMPL

*Rp

2/8

JMPL

*lab[B]

3/11

POP

A

1/9

POP

B

1/9

POP

Rd 2/7

TRAP

6

1/14

RTS

1/9

A

JLE

ra

2/5

SUB

Rs,A

2/7

SUB #n,A

2/6

SUB

Rs,B

2/7

SUB

Rs,Rd

3/9

SUB #n,B

2/6

SUB

B,A 1/8

SUB

#n,Rd

3/8

MOV

& lab,A

3/10

MOV

*Rp,A

2/9

MOV

*lab[B],A

3/12

DJNZ

A,#ra

2/10

DJNZ

B,#ra

2/10

DJNZ

Rd,#ra

3/8

TRAP

5

1/14

RTI

1/12

B

JHS

ra

2/5

SBB

Rs,A

2/7

SBB #n,A

2/6

SBB

Rs,B

2/7

SBB

Rs,Rd

3/9

SBB #n,B

2/6

SBB

B,A 1/8

SBB

#n,Rd

3/8

MOV

A, & lab

3/10

MOV

A, *Rp

2/9

MOV

A,*lab[B]

3/12

COMPL

A

1/8

COMPL

B

1/8

COMPL

Rd 2/6

TRAP

4

1/14

PUSH

ST 1/8

†

All conditional jumps (opcodes 01– 0F), BTJO, BTJZ, and DJNZ instructions use two additional cycles if the branch is taken. The BTJO, BTJZ, and DJNZ instructions have a relative address as the last operand.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

Template Release Date: 7–11–94

26

POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443

•

Table 15. TMS370 Family Opcode/Instruction Map† (Continued)

MSN

01 2 3 4 5 6 7 8 9 A B C D E F

C

JNV

ra

2/5

MPY Rs,A

2/46

MPY

#n,A 2/45

MPY Rs,B 2/46

MPY

Rs,Rd

3/48

MPY #n,B 2/45

MPY

B,A

1/47

MPY

#n,Rs

3/47

BR lab 3/9

BR

*Rp

2/8

BR

*lab[B]

3/11

RR

A

1/8

RR

B

1/8

RR

Rd

2/6

TRAP

3

1/14

POP

ST

1/8

L

D

JGE

ra

2/5

CMP Rs,A

2/7

CMP

#n,A

2/6

CMP Rs,B

2/7

CMP

Rs,Rd

3/9

CMP

#n,B

2/6

CMP

B,A 1/8

CMP

#n,Rd

3/8

CMP

& lab,A

3/11

CMP *Rp,A

2/10

CMP

*lab[B],A

3/13

RRC

A

1/8

RRC

B

1/8

RRC

Rd

2/6

TRAP

2

1/14

LDSP

1/7

S

N

EJGra

2/5

DAC Rs,A

2/9

DAC

#n,A

2/8

DAC Rs,B

2/9

DAC

Rs,Rd

3/11

DAC #n,B

2/8

DAC

B,A

1/10

DAC

#n,Rd

3/10

CALL

lab

3/13

CALL

*Rp 2/12

CALL

*lab[B]

3/15

RL

A

1/8

RL

B

1/8

RL Rd

2/6

TRAP

1

1/14

STSP

1/8

F

JLO

ra

2/5

DSB Rs,A

2/9

DSB

#n,A

2/8

DSB Rs,B

2/9

DSB

Rs,Rd

3/11

DSB #n,B

2/8

DSB

B,A

1/10

DSB

#n,Rd

3/10

CALLR

lab

3/15

CALLR

*Rp 2/14

CALLR

*lab[B]

3/17

RLC

A

1/8

RLC

B

1/8

RLC

Rd

2/6

TRAP

0

1/14

NOP

1/7

Second byte of two-byte instructions (F4xx): F4 8

MOVW

*n[Rn]

4/15

DIV

Rn.A

3/14-63

F4 9

JMPL

*n[Rn]

4/16

Legend: * = Indirect addressing operand prefix & = Direct addressing operand prefix

F4 A

MOV

*n[Rn],A

4/17

# = immediate operand #16 = immediate 16-bit number lab = 16-label

F4 B

MOV

A,*n[Rn]

4/16 n = immediate 8-bit number Pd = Peripheral register containing destination type Pn = Peripheral register

p

F4 C

BR

*n[Rn]

4/16

Ps=Peri heral register containing source byte

ra = Relative address Rd = Register containing destination type Rn = Re

g

ister file

F4 D

CMP

*n[Rn],A

4/18

Rn Register file

Rp = Register pair Rpd= Destination register pair Rps = Source Register pair

F4 E

CALL

*n[Rn]

4/20 Rs = Register containing source byte

F4 F

CALLR

*n[Rn]

4/22

†

All conditional jumps (opcodes 01– 0F), BTJO, BTJZ, and DJNZ instructions use two additional cycles if the branch is taken. The BTJO, BTJZ, and DJNZ instructions have a relative address as the last operand.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

27

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

development system support

The TMS370 family development support tools include an assembler, a C-compiler, a linker, a starter kit, CDT and an EEPROM/UVEPROM programmer.

D

Assembler/linker (Part No. TMDS3740850–02 for PC) – Includes extensive macro capability – Provides high-speed operation – Includes format conversion utilities for popular formats

D

ANSI C Compiler (Part No. TMDS3740855–02 for PC, Part No. TMDS3740555–09 for HP700, Sun-3 or Sun-4)

– Generate assembly code for the TMS370 that can be inspected easily – Improves code execution speed and reduces code size with optional optimizer pass – Enables direct reference to the TMS370’s port registers by using a naming convention – Provides flexibility in specifying the storage for data objects – Interfaces C functions and assembly functions easily – Includes assembler and linker

D

CDT370 (Compact Development Tool) PACT real-time in-circuit emulation – Base (Part Number EDSCDT37P – for PC, requires cable)

– Cable for 44-pin PLCC (Part No. EDSTRG44PLCC32) – EEPROM and EPROM programming support – Allows inspection and modification of memory locations – Includes compatibility to upload/download program and data memory – Execute programs and software routines – Includes 1024-sample trace buffer – Includes single-step executable instructions – Uses software breakpoints to halt program execution at selected address

D

Microcontroller programmer – Base (Part No. TMDS3760500A – for PC, requires programmer head)

– Single unit head for 44-pin PLCC (Part No. TMDS3780510A) – PC-based, window/function-key-oriented user interface for ease of use and rapid learning environment

D

Starter Kit (Part No. TMDS37000 – For PC) – Includes TMS370 Assembler diskette and documentation – Includes TMS370 Simulator – Includes programming adapter board and programming software – Does not include – (to be supplied by the user):

– + 5 V power supply

– ZIF sockets

– 9-pin RS-232 cable

HP700 is a trademark of Hewlett-Packard Company. Sun-3 and Sun-4 are trademarks of Sun Microsystems, Incorporated.

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

28

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

device numbering conventions

Figure 7 illustrates the numbering and symbol nomenclature for the TMS370Cx32 family.

7370 32C

Prefix: TMS = Standard prefix for fully qualified devices

SE = System evaluator (window EPROM) that is used for

prototyping purpose.

Family: 370 = TMS370 8-Bit Microcontroller Family

Technology: C = CMOS

Program Memory Types: 0 = Mask ROM

3 = Mask ROM, No Data EEPROM 7 = EPROM

Device Type: 32 = x32 device containing the following modules:

– Analog-to-Digital Converter 1 – Programmable Acquisition and Control Timer (PACT)

Memory Size: 2 = 8K bytes

Temperature Ranges: A = –40°C to 85°C

L = 0°C to 70°C T = –40°C to 105°C

Packages: FN = Plastic Leaded Chip Carrier

FZ = Ceramic Leaded Chip Carrier

ROM and EPROM Option: A = For ROM device, the watchdog timer can be configured

as one of the three different mask options:

– A standard watchdog or – A hard watchdog or – A simple watchdog

The clock can be either:

– Divide-by-4 clock or – Divide-by-1 (PLL) clock

The low-power modes can be either:

– Enabled or – Disabled

A = For EPROM device, a standard watchdog, a divide-by-

4 clock, and low-power modes are enabled

TMS

AFNT

Figure 7. TMS370Cx32 Family Nomenclature

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

29

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

device part numbers

T able 16 lists all the ’x32 devices available. The device part number nomenclature is designed to assist ordering. Upon ordering, the customer must specify not only the device part number, but also the clock and watchdog timer options desired. Each device can have only one of the three possible watchdog timer options and one of the two clock options. The options to be specified pertain solely to orders involving ROM devices.

T able 16. Device Part Numbers

DEVICE PART NUMBERS

FOR 44 PINS (LCC)

TMS370C032AFNA

TMS370C032AFNL

TMS370C032AFNT TMS370C332AFNA

TMS370C332AFNL

TMS370C332AFNT TMS370C732AFNT

SE370C732AFZT

†

System evaluators are for use in prototype environment, and their reliability has not been characterized.

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

30

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

new code release form

Figure 8 shows a sample of the new code release form.

NEW CODE RELEASE FORM

TEXAS INSTRUMENTS

TMS370 MICROCONTROLLER PRODUCTS

DATE:

T o release a new customer algorithm to TI incorporated into a TMS370 family microcontroller, complete this form and submit with the following information:

1. A ROM description in object form on Floppy Disk, Modem XFR, or EPROM (Verification file will be returned via same media)

2. An attached specification if not using TI standard specification as incorporated in TI’s applicable device data book.

Company Name: Street Address: Street Address: City: State Zip

Contact Mr./Ms.: Phone: ( ) Ext.:

Customer Purchase Order Number:

Customer Part Number: Customer Application:

Customer Print Number *Yes: #

No: (Std. spec to be followed) *If Yes: Customer must provide ”print” to TI w/NCRF for approval before ROM code processing starts.

TMS370 Device: TI Customer ROM Number:

(provided by T exas Instruments)

CONTACT OPTIONS FOR THE ’A’ VERSION TMS370 MICROCONTROLLERS

OSCILLAT OR FREQUENCY

MIN TYP MAX [] External Drive (CLKIN) [] Crystal [] Ceramic Resonator

Low Power Modes [] Enabled [] Disabled

Watchdog counter [] Standard [] Hard Enabled [] Simple Counter

Clock Type [] Standard (/4) [] PLL (/1)

[] Supply Voltage MIN: MAX: (std range: 4.5V to 5.5V)

NOTE: Non ’A’ version ROM devices of the TMS370 microcontrollers will have the “Low-power modes Enabled”, “Divide-by-4” Clock, and “Standard” Watchdog options. See the

TMS370 Family User’s Guide

(literature number SPNU127)

or the

TMS370 Family Data Manual

(literature number SPNS014B).

TEMPERATURE RANGE

[] ’L’: 0° to 70°C (standard) [] ’A’: –40° to 85°C [] ’T’: –40° to 105°C

PACKAGE TYPE

[] ’N’ 28-pin PDIP [] “FN” 44-pin PLCC [] “FN” 28-pin PLCC [] “FN” 68-pin PLCC [] “N” 40-pin PDIP [] “NM” 64-pin PSDIP [] “NJ” 40-pin PSDIP (formerly known as N2)

SYMBOLIZA TION BUS EXPANSION

[] TI standard symbolization [] TI standard w/customer part number [] Customer symbolization

(per attached spec, subject to approval)

[] YES [] NO

NON-STANDARD SPECIFICATIONS: ALL NON-STANDARDS SPECIFICA TIONS MUST BE APPROVED BY THE TI ENGINEERING ST AFF: If the customer requires expedited production material

(i.e., product which must be started in process prior to prototype approval and full production release) and non-standard spec issues are not resolved to the satisfaction of both the customer and TI in time for a scheduled shipment, the specification parameters in question will be processed/tested to the standard TI spec. Any such devices which are shipped without conformance to a mutually approved spec, will be identified by a ’P’ in the symbolization preceding the TI part number.

RELEASE AUTHORIZATION: This document, including any referenced attachments, is and will be the controlling document for all orders placed for this TI custom device. Any changes must

be in writing and mutually agreed to by both the customer and TI. The prototype cycletime commences when this document is signed off and the verification code is approved by the customer.

1. Customer: Date: 2. TI: Field Sales: Marketing: Prod. Eng.: Proto. Release:

Figure 8. Sample New Code Release Form

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

31

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

Table 17 is a collection of all the peripheral file frames used in the ’Cx32 (provided for a quick reference).

Table 17. Peripheral File Frame Compilation

System Configuration Registers

PF

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

REG

Á

P010

ÁÁ

Á

COLD

START

OSC

POWER

PF AUTO

WAIT

ÁÁ

Á

OSC FLT

FLAG

ÁÁ

Á

MC PIN

WPO

ÁÁÁ

Á

MC PIN

DATA

ÁÁ

Á

—

ÁÁÁ

Á

µP/µC MODE

Á

SCCR0

Á

P011

ÁÁ

Á

—

ÁÁÁ

Á

—

ÁÁ

Á

—

AUTO

WAIT

DISABLE

ÁÁ

Á

—

MEMORY DISABLE

ÁÁ

Á

—

ÁÁÁ

Á

—

Á

SCCR1

Á

P012

HALT/

STANDBY

PWRDWN/

IDLE

—

BUS

STEST

CPU

STEST

ÁÁÁ

Á

—

INT1

NMI

PRIVILEGE

DISABLE

Á

SCCR2

Á

P013

to

P016

Reserved

Á

P017

INT1

FLAG

INT1

PIN DATA

—

INT1

POLARITY

INT1

PRIORITY

INT1

ENABLE

INT1

Á

P018

ÁÁ

Á

INT2

FLAG

ÁÁÁ

Á

INT2

PIN DATA

ÁÁ

Á

—

ÁÁ

Á

INT2

DATA DIR

ÁÁ

Á

INT2

DATA OUT

ÁÁÁ

Á

INT2

POLARITY

ÁÁ

Á

INT2

PRIORITY

ÁÁÁ

Á

INT2

ENABLE

Á

INT2

P019

INT3

FLAG

INT3

PIN DATA

—

INT3

DATA DIR

INT3

DATA OUT

INT3

POLARITY

INT3

PRIORITY

INT3

ENABLE

INT3

P01A

BUSY

—

AP

W1W0

EXE

DEECTL P01B Reserved P01C

BUSY

VPPS

—

W0

EXE

EPCTLL

Á

P01D P01E

P01F

Reserved

Á

Digital Port Control Registers

P020

Reserved

APORT1

P021

Port A Control Register 2 (must be 0)

APORT2

P022

Port A Data

ADATA

P023

Port A Direction

ADIR

Á

P024

to

P02B

Reserved

Á

P02C

ББББББ

Á

Port D Control Register 1

(must be 0)

ÁÁ

Á

—

БББББ

Á

Port D Control Register 1

(must be 0)

ÁÁÁ

Á

—

ÁÁ

Á

—

ÁÁÁ

Á

—

Á

DPORT1

Á

P02D

ББББББ

Á

Port D Control Register 2

(must be 0)

†

ÁÁ

Á

—

БББББ

Á

Port D Control Register 2

(must be 0)

†

ÁÁÁ

Á

—

ÁÁ

Á

—

ÁÁÁ

Á

—

Á

DPORT2 P02E

Port D Data

—

Port D Data

—

DDATA

P02F

Port D Direction

—

Port D Direction

—

DDIR

PACT Module Register Memory Map

Á

P040

ÁÁ

Á

DEFTIM

OVRFL

INT ENA

ÁÁÁ

Á

DEFTIM

OVRFL

INT FLAG

ÁÁ

Á

CMD/DEF

AREA ENA

FAST

MODE

SELECT

PACT

PRESCALE

SELECT3

PACT

PRESCALE

SELECT2

PACT

PRESCALE

SELECT1

PACT

PRESCALE

SELECT0

Á

PACTSCR

Á

P041

ÁÁ

Á

ÁÁ

Á

CMD/DEF

AREA

INT ENA

ÁÁÁ

Á

ÁÁÁ

Á

—

ÁÁ

Á

ÁÁ

Á

CMD/DEF

AREA

START BIT

5

ÁÁ

Á

ÁÁ

Á

CMD/DEF

AREA

START BIT

4

ÁÁ

Á

ÁÁ

Á

CMD/DEF

AREA

START BIT

3

ÁÁÁ

Á

ÁÁÁ

Á

CMD/DEF

AREA

START BIT

2

ÁÁ

Á

ÁÁ

Á

—

ÁÁÁ

Á

ÁÁÁ

Á

—

Á

CDSTART

†

To configure D3 as SYSCLK, set port D register 2 = 08h.

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

32

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

Table 17. Peripheral File Frame Compilation (Continued)

PF

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

REG

PACT Module Register Memory Map (Continued)

ÁÁ

Á

P042 —

CMD/DEF

AREA

END BIT 6

CMD/DEF

AREA

END BIT 5

CMD/DEF

AREA

END BIT 4

CMD/DEF

AREA

END BIT 3

CMD/DEF

AREA END

BIT 2

— —

ÁÁ

Á

CDEND

ÁÁ

Á

P043

ÁÁ

Á

1

ÁÁ

Á

1

ÁÁ

Á

BUFFER

POINTER

BIT 5

ÁÁÁ

Á

BUFFER

POINTER

BIT 4

ÁÁ

Á

BUFFER

POINTER

BIT 3

ÁÁ

Á

BUFFER

POINTER

BIT 2

ÁÁ

Á

BUFFER

POINTER

BIT 1

ÁÁÁ

Á

—

ÁÁ

Á

BUFPTR

P044 Reserved

ÁÁ

Á

P045

ÁÁ

Á

PACT

RXRDY

ÁÁ

Á

PACT

TXRDY

ÁÁ

Á

PACT

PARITY

ÁÁÁ

Á

PACT FE

ÁÁ

Á

PACT SCI

RX INT

ENA

ÁÁ

Á

PACT SCI

TX INT ENA

ÁÁ

Á

—

ÁÁÁ

Á

PACT SCI SW

RESET

ÁÁ

Á

SCICTLP

ÁÁ

Á

P046

PACT

RXDT7

PACT

RXDT6

PACT

RXDT5

PACT

RXDT4

PACT

RXDT3

PACT

RXDT2

PACT

RXDT1

PACT RXDT0

ÁÁ

Á

RXBUFP

P047

PACT

TXDT7

PACT

TXDT6

PACT

TXDT5

PACT

TXDT4

PACT

TXDT3

PACT

TXDT2

PACT

TXDT1

PACT TXDT0

TXBUFP

ÁÁ

Á

P048

ÁÁ

Á

PACT OP8

STATE

ÁÁ

Á

PACT OP7

STATE

ÁÁ

Á

PACT OP6

STATE

ÁÁÁ

Á

PACT OP5

STATE

ÁÁ

Á

PACT OP4

STATE

ÁÁ

Á

PACT OP3

STATE

ÁÁ

Á

PACT OP2

STATE

ÁÁÁ

Á

PACT OP1

STATE

ÁÁ

Á

PSTATE

P049

CMD/DEF

INT 7 FLAG

CMD/DEF

INT 6 FLAG

CMD/DEF

INT 5 FLAG

CMD/DEF

INT 4 FLAG

CMD/DEF

INT 3 FLAG

CMD/DEF

INT 2 FLAG

CMD/DEF

INT 1 FLAG

CMD/DEF INT

0 FLAG

CDFLAGS

ÁÁ

Á

P04A

CP2 INT

ENA

CP2 INT

FLAG

ÁÁ

Á

CP2 CAPT

RISING

EDGE

ÁÁÁ

Á

CP2 CAPT

FALLING

EDGE

ÁÁ

Á

CP1 INT

ENA

ÁÁ

Á

CP1 INT

FLAG

ÁÁ

Á

CP1 CAPT

RISING

EDGE

ÁÁÁ

Á

CP1 CAPT

FALLING

EDGE

ÁÁ

Á

CPCTL1

ÁÁ

Á

P04B

CP4 INT

ENA

CP4 INT

FLAG

ÁÁ

Á

CP4 CAPT

RISING

EDGE

ÁÁÁ

Á

CP4 CAPT

FALLING

EDGE

ÁÁ

Á

CP3 INT

ENA

ÁÁ

Á

CP3 INT

FLAG

ÁÁ

Á

CP3 CAPT

RISING

EDGE

ÁÁÁ

Á

CP3 CAPT

FALLING

EDGE

ÁÁ

Á

CPCTL2

ÁÁ

Á

ÁÁ

Á

P04C

CP6 INT

ENA

CP6 INT

FLAG

ÁÁ

Á

ÁÁ

Á

CP6 CAPT

RISING

EDGE

ÁÁÁ

Á

ÁÁÁ

Á

CP6 CAPT

FALLING

EDGE

ÁÁ

Á

ÁÁ

Á

CP5 INT

ENA

ÁÁ

Á

ÁÁ

Á

CP5 INT

FLAG

ÁÁ

Á

ÁÁ

Á

CP5 CAPT

RISING

EDGE

ÁÁÁ

Á

ÁÁÁ

Á

CP5 CAPT

FALLING

EDGE

ÁÁ

Á

ÁÁ

Á

CPCTL3

ÁÁ

Á

P04D

BUFFER

HALF/FULL

INT ENA

BUFFER

HALF/FULL

INT FLAG

ÁÁ

Á

INPUT

CAPT

PRESCALE

SELECT 3

ÁÁÁ

Á

INPUT

CAPT

PRESCALE

SELECT 2

ÁÁ

Á

INPUT

CAPT

PRESCALE

SELECT 1

ÁÁ

Á

CP6

EVENT

ONLY

ÁÁ

Á

EVENT

COUNTER

SW RESET

ÁÁÁ

Á

OP/ SET/CLR

SELECT

ÁÁ

Á

CPPRE

P04E WATCHDOG RESET KEY

WDRST

ÁÁ

Á

P04F

PACT

STEST

PACT

SUSPEND

PACT

GROUP 1

PRIORITY

PACT

GROUP 2

PRIORITY

PACT

GROUP 3

PRIORITY

PACT

MODE

SELECT

PACT WD

PRESCALE

SELECT 1

PACT WD

PRESCALE

SELECT 0

ÁÁ

Á

PACTPRI

ÁÁ

Á

P070

ÁÁ

Á

CONVERT

STAR T

ÁÁ

Á

SAMPLE

STAR T

ÁÁ

Á

REF VOLT

SELECT2

ÁÁÁ

Á

REF VOLT

SELECT1

ÁÁ

Á

REF VOLT

SELECT0

ÁÁ

Á

AD INPUT SELECT2

ÁÁ

Á

AD INPUT SELECT1

ÁÁÁ

Á

AD INPUT SE-

LECT0

ÁÁ

Á

ADCTL

P071

—

AD READY

AD INT

FLAG

AD INT ENA

ADSTAT

P072

A/D Conversion Data Register

ADDATA

ÁÁ

Á

P073

to

P07C

БББББББББББББББББББББББББ

Á

Reserved

ÁÁ

Á

P07D

Port E Data Input Register

ADIN

P07E

Port E Input Enable Register

ADENA

ÁÁ

Á

P07F AD STEST

AD

PRIORITY

AD ESPEN

ÁÁÁ

Á

—

ÁÁ

Á

—

ÁÁ

Á

—

ÁÁ

Á

—

ÁÁÁ

Á

—

ÁÁ

Á

ADPRI

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

33

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

†

Supply voltage range,V

CC1

(see Note 3) –0.6 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, All pins except MC –0.6 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MC –0.6 V to 14 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input clamp current, IIK (V

I

< 0 or V

I

> V

CC1

) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output clamp current, I

OK

(VO < 0 or VO > V

CC1

) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous output current per buffer, IO (VO = 0 to V

CC1

) (see Note 4) ±10 mA. . . . . . . . . . . . . . . . . . . . . . . .

Maximum I

CC

current 170 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum I

SS

current – 170 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous power dissipation 800 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating free-air temperature, TA: L version 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

A version –40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

T version –40°C to 105°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, T

stg

–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 3. Unless otherwise noted, all voltage values are with respect to V

SS1

.

4. Electrical characteristics are specified with all output buffers loaded with specified IO current. Exceeding the specified IO current in any buffer can affect the levels on other buffers.

recommended operating conditions

MIN NOM MAX UNIT

Supply voltage (see Note 3) 4.5 5 5.5 V

V

CC1

RAM data retention supply voltage (see Note 5) 3 5.5 V

V

CC3

Analog supply voltage (see Note 3) 4.5 5 5.5 V

V

SS3

Analog supply ground – 0.3 0 0.3 V

p

All pins except MC V

SS1

0.8 V

VILLow-level input voltage

MC, normal operation V

SS1

0.3 V

All pins except MC, XTAL2/CLKIN, and RESET

2 V

CC1

V

IH

High-level input voltage

XTAL2/CLKIN

0.8 V

CC1

V

CC1

V

RESET 0.7 V

CC1

V

CC1

EEPROM write protect override (WPO) 11.7 12 13

V

MC

MC (mode control) voltage

EPROM programming voltage (VPP)

13 13.2 13.5

V

Microcomputer V

SS1

0.3

L version 0 70

T

A

Operating free-air temperature

A version

– 40 85

°C

T version – 40 105

NOTES: 3. Unless otherwise noted, all voltage values are with respect to V

SS1

.

5. RESET

must be externally activated when V

CC1

or SYSCLK is not within the recommended operating range.

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

34

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

V

OL

Low-level output voltage IOL = 1.4 mA 0.4 V

p

IOH = –50 µA 0.9 V

CC1

VOHHigh-level output voltage

IOH = –2 mA 2.4

V

0 V ≤ VI ≤ 0.3 V 10 µA

p

MC

0.3 V < VI ≤ 13 V 650 µA

IIInput current

12 V ≤ VI ≤ 13 V

†

50 mA

I/O pins 0 V ≤ VI ≤ V

CC1

± 10 µA

I

OL

Low-level output current VOL = 0.4 V 1.4 mA

p

VOH = 0.9 V

CC1

– 50 µA

IOHHigh-level output current

VOH = 2.4 V – 2 mA

See Notes 6 and 7

35 45

SYSCLK = 5 MHz

Supply current (operating mode) See Notes 6 and 7

25 35

y(g)

OSC POWER bit = 0 SYSCLK = 3 MHz

mA

See Notes 6 and 7

10 14

SYSCLK = 0.5 MHz

See Notes 6 and 7

12 17

SYSCLK = 5 MHz

Supply current (STANDBY mode) See Notes 6 and 7

8 13

I

CC1

y( )

OSC POWER bit = 0 SYSCLK = 3 MHz

mA

See Notes 6 and 7

3 4

SYSCLK = 0.5 MHz

Supply current (STANDBY mode)

See Notes 6 and 7

SYSCLK = 3 MHz

6 8.6

y( )

OSC POWER bit = 1

See Notes 6 and 7

SYSCLK = 0.5 MHz

2 3.0

mA

pp

See Note 6

15 40

Supply current (HALT mode)

XTAL2/CLKIN < 0.2 V

µ

A

†

Input current IPP will be a maximum of 50 mA only when programming EPROM.

NOTES: 6. Single chip mode, ports configured as inputs or outputs with no load. All inputs ≤ 0.2 V or ≥ VCC – 0.2V .

7. XTAL2/CLKIN is driven with an external square-wave signal with 50% duty cycle and rise and fall times less than 10 ns. Current can be higher with a crystal oscillator. At 5-MHz SYSCLK, this extra current = 0.01 mA x (total load capacitance + crystal capacitance in pF).

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

35

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

External

Clock Signal

XTAL1XTAL2/CLKIN

C2 (see Note A)

C1

(see Note A)

Crystal/Ceramic

Resonator

(see Note B)

XTAL1XTAL2/CLKIN

C3 (see Note A)

NOTES: A. The values of C1 and C2 are typically 15 pF and C3 value is typically 50 pF. See the manufacturer’s recommendations for ceramic

resonators.

B. The crystal/ceramic resonator frequency is four times the reciprocal of the system clock period.

Figure 9. Recommended Crystal/Clock Connections

1.2 kΩ

20 pF

V

O

Load Voltage

Case 1: VO = VOH = 2.4 V; Load Voltage = 0 V Case 2: VO = VOL = 0.4 V; Load Voltage = 2.1 V

NOTE A: All measurements are made with the pin loading as shown unless otherwise noted. All measurements are made with XTAL2/CLKIN

driven by an external square wave signal with a 50% duty cycle and rise and fall times less than 10 ns unless otherwise stated.

Figure 10. Typical Output Load Circuit (See Note A)

V

CC

GND

300 Ω

20 Ω

I/O

Pin Data Output

Enable

V

CC

GND

INT1

6 kΩ

20 Ω

30 Ω

Figure 11. Typical Buffer Circuitry

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

36

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

PARAMETER MEASUREMENT INFORMATION

timing parameter symbology

Timing parameter symbols have been created in accordance with JEDEC Standard 100. In order to shorten the symbols, some of the pin names and other related terminology have been abbreviated as follows:

AR Array PGM Program B Byte SC SYSCLK CI XTAL2/CLKIN

Lowercase subscripts and their meanings are: c cycle time (period) su setup time

d delay time v valid time f fall time w pulse duration (width) r rise time

The following additional letters are used with these meanings: H High

L Low V Valid

All timings are measured between high and low measurement points as indicated in Figure 12 and Figure 13.

0.8 V (Low)

2 V (High)

0.8 V (Low)

0.8 VCC V (High)

Figure 12. XTAL2/CLKIN Measurement Points Figure 13. General Measurement Points

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

37

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

external clocking requirements for clock divided by 4 (see Note 8 and Figure 14)

NO. PARAMETER MIN MAX UNIT

1 t

w(Cl)

Pulse duration, XTAL2/CLKIN (see Note 9) 20 ns

2 t

r(Cl)

Rise time, XTAL2/CLKIN 30 ns

3 t

f(CI)

Fall time, XTAL2/CLKIN 30 ns

4 t

d(CIH-SCL)

Delay time, XTAL2/CLKIN rise to SYSCLK fall 100 ns CLKIN Crystal operating frequency 2 20 MHz SYSCLK Internal system clock operating frequency

†

0.5 5 MHz

†

SYSCLK = CLKIN/4

NOTES: 8. For VIL and VIH, refer to recommended operating conditions.

9. This pulse may be either a high pulse, as illustrated below, which extends from the earliest valid high to the final valid high in an XTAL2/CLKIN cycle or a low pulse, which extends from the earliest valid low to the final valid low in an XTAL2/CLKIN cycle.

XTAL2/CLKIN

3

2

1

4

SYSCLK

Figure 14. External Clock Timing for Divide-by-4

external clocking requirements for clock divided by 1 (PLL) (see Note 8 and Figure 15)

NO. PARAMETER MIN MAX UNIT

1 t

w(Cl)

Pulse duration, XTAL2/CLKIN (see Note 9) 20 ns

2 t

r(Cl)

Rise time, XTAL2/CLKIN 30 ns

3 t

f(CI)

Fall time, XTAL2/CLKIN 30 ns

4 t

d(CIH-SCH)

Delay time, XTAL2/CLKIN rise to SYSCLK rise 100 ns CLKIN Crystal operating frequency 2 5 MHz SYSCLK Internal system clock operating frequency

‡

2 5 MHz

‡

SYSCLK = CLKIN/1

NOTES: 8. For VIL and VIH, refer to recommended operating conditions.

9. This pulse can be either a high pulse, as illustrated below, which extends from the earliest valid high to the final valid high in an XTAL2/CLKIN cycle or a low pulse, which extends from the earliest valid low to the final valid low in an XTAL2/CLKIN cycle.

4

32

1

XTAL2/CLKIN

SYSCLK

Figure 15. External Clock Timing for Divide-by-1

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

38

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

switching characteristics and timing requirements (see Note 10 and Figure 16)

NO. PARAMETER MIN MAX UNIT

Divide-by-4 200 2000

5

tcCycle time, SYSCLK (system clock)

Divide-by-1 200 500

ns

6 t

w(SCL)

Pulse duration, SYSCLK low 0.5 tc–20 0.5 t

c

ns

7 t

w(SCH)

Pulse duration, SYSCLK high 0.5 t

c

0.5 tc + 20 ns

NOTE 10: tc = system clock cycle time = 1/SYSCLK

SYSCLK

5

6

7

Figure 16. SYSCLK Timing

general purpose output signal switching time requirements (see Figure 17)

MIN NOM MAX UNIT

trRise time 30 ns tfFall time 30 ns

t

f

t

r

Figure 17. Signal Switching Timing

recommended EEPROM timing requirements for programming

MIN MAX UNIT

t

w(PGM)B

Pulse duration, programming signal to ensure valid data is stored (byte mode) 10 ms

t

w(PGM)AR

Pulse duration, programming signal to ensure valid data is stored (array mode) 20 ms

recommended EPROM operating conditions for programming

MIN NOM MAX UNIT

V

CC

Supply voltage 4.75 5.5 6 V

V

PP

Supply voltage at MC pin 13 13.2 13.5 V

I

PP

Supply current at MC pin during programming (VPP = 13 V) 30 50 mA

Divide-by-4 0.5 5

SYSCLK

System clock

Divide-by-1 2 5

MH

z

recommended EPROM timing requirements for programming

MIN NOM MAX UNIT

t

w(EPGM)

Pulse duration, programming signal (see Note 11) 0.40 0.50 3 ms

NOTE 11: Programming pulse is active when both EXE (EPCTL.0) and V

PPS

(EPCTL.6) are set.

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

39

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

ADC1 converter

The ADC1 converter has a separate power bus for its analog circuitry . These pins are referred to as V

CC3

and

V

SS3

. The purpose is to enhance ADC1 performance by preventing digital switching noise of the logic circuitry

that can be present on V

SS1

and V

CC1

from coupling into the ADC1 analog stage. All ADC1 specifications are

given with respect to V

SS3

unless otherwise noted.

Resolution 8-bits (256 values). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Monotonic Yes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output conversion mode 00h to FFh (00 for VI ≤ V

SS3

≤; FF for VI ≤ V

ref

). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Conversion time (excluding sample time) 164 t

c

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

recommended operating conditions

MIN NOM MAX UNIT

pp

4.5 5 5.5

V

CC3

Analog suppl

y v

oltage

V

CC1

–0.3 V

CC1

+0.3

V

SS3

Analog ground V

SS1

–0.3 V

SS1

+0.3 V

V

ref

Non-V

CC3

reference

†

2.5 V

CC3VCC3

+ 0.1 V

Analog input for conversion V

SS3

V

ref

V

†

V

ref

must be stable, within ± 1/2 LSB of the required resolution, during the entire conversion time.

operating characteristics over recommended ranges operating conditions

PARAMETER MIN MAX UNIT

Absolute accuracy

‡

V

CC3

= 5.5 V V

ref

= 5.1 V ±1.5 LSB

Differential/integral linearity error

‡§

V

CC3

= 5.5 V V

ref

= 5.1 V ±0.9 LSB

pp

Converting 2 mA

I

CC3

Analog supply current

Nonconverting 5 µA

I

Input current, AN0–AN7 0 V ≤ VI ≤ 5.5 V 2 µA

I

ref

Input charge current 1 mA

p

SYSCLK ≤ 3 MHz 24 kΩ

Z

ref

Source impedance of V

ref

3 MHz < SYSCLK ≤ 5 MHz 10 kΩ

‡

Absolute resolution = 20 mV. At V

ref

= 5 V, this is one LSB. As V

ref

decreases, LSB size decreases; therefore, the absolute accuracy and

differential/integral linearity errors in terms of LSBs increase.

§

Excluding quantization error of 1/2 LSB

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

40

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

ADC1 converter (continued)

The ADC1 module allows complete freedom in design of the sources for the analog inputs. The period of the sample time is user-defined so that the high-impedance can be accommodated without penalty to the low-impedance sources. The sample period begins when the SAMPLE ST ART bit of the ADC1 control register (ADCTL.6) is set to 1. The end of the signal sample period occurs when the conversion bit (CONVERT ST ART, ADCTL.7) is set to 1. After a hold time, the converter will reset the SAMPLE ST ART and CONVERT ST ART bits, signaling that a conversion has started and that the analog signal can be removed.

analog timing requirements (see Figure 18)

MIN MAX UNIT

t

su(S)

Setup time, analog to sample command 0 ns

t

h(AN)

Hold time, analog input from start of conversion 18t

c

ns

t

w(S)

Pulse duration, sample time per kilo-Ω of source impedance

†

1 µs/kΩ

†

The value given is valid for a signal with a source impedance > 1 kΩ. If the source impedance is < 1 kΩ, use a minimum sampling time of 1µs.

Analog In

Sample Start

Convert Start

Analog Stable

t

h(AN)

t

w(S)

t

su(S)

Figure 18. Analog Timing

Table 18 is designed to aid the user in referencing a device part number to a mechanical drawing. The table shows a cross-reference of the device part number to the TMS370 generic package name and the associated mechanical drawing by drawing number and name.

Table 18. TMS370Cx32 Family Package Type and Mechanical Cross-Reference

PKG TYPE

(mil pin spacing)

TMS370 GENERIC NAME

PKG TYPE NO. AND

MECHANICAL NAME

DEVICE PART NUMBERS

БББББ

Á

БББББ

Á

БББББ

Á

БББББ

Á

FN – 44 pin (50-mil pin spacing)

ББББББББ

Á

ББББББББ

Á

ББББББББ

Á

ББББББББ

Á

PLASTIC LEADED CHIP CARRIER (PLCC)

ББББББББББ

Á

ББББББББББ

Á

ББББББББББ

Á

ББББББББББ

Á

FN(S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER

ББББББ

Á

ББББББ

Á

ББББББ

Á

ББББББ

Á

TMS370C032AFNA TMS370C032AFNL TMS370C032AFNT TMS370C332AFNA TMS370C332AFNL TMS370C332AFNT TMS370C732AFNT

БББББ

Á

FZ – 44 pin (50-mil pin spacing)

ББББББББ

Á

CERAMIC LEADED CHIP CARRIER (CLCC)

ББББББББББ

Á

FZ(S-CQCC-J**) J-LEADED CERAMIC CHIP CARRIER

ББББББ

Á

SE370C732AFZT

TMS370Cx32

8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

41

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

MECHANICAL DATA

FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER

4040005/B 03/95

20 PIN SHOWN

0.026 (0,66)

0.032 (0,81)

D2/E2

0.020 (0,51) MIN

0.180 (4,57) MAX

0.120 (3,05)

0.090 (2,29)

D2/E2

0.013 (0,33)

0.021 (0,53)

Seating Plane

MAX

D2/E2

0.219 (5,56)

0.169 (4,29)

0.319 (8,10)

0.469 (11,91)

0.569 (14,45)

0.369 (9,37)

MAX

0.356 (9,04)

0.456 (11,58)

0.656 (16,66)

0.008 (0,20) NOM

1.158 (29,41)

0.958 (24,33)

0.756 (19,20)

0.191 (4,85)

0.141 (3,58)

MIN

0.441 (11,20)

0.541 (13,74)

0.291 (7,39)

0.341 (8,66)

18

19

14

13

D

D1

13

9

E1E

4

8

MINMAXMIN

PINS

**

20 28 44

0.385 (9,78)

0.485 (12,32)

0.685 (17,40) 52 68 84

1.185 (30,10)

0.985 (25,02)

0.785 (19,94)

D/E

0.395 (10,03)

0.495 (12,57)

1.195 (30,35)

0.995 (25,27)

0.695 (17,65)

0.795 (20,19)

NO. OF

D1/E1

0.350 (8,89)

0.450 (11,43)

1.150 (29,21)

0.950 (24,13)

0.650 (16,51)

0.750 (19,05)

0.004 (0,10)

M

0.007 (0,18)

0.050 (1,27)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice. C. Falls within JEDEC MS-018

TMS370Cx32 8-BIT MICROCONTROLLER

SPNS015C – FEBRUARY 1990 – REVISED FEBRUARY 1997

42

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

MECHANICAL DATA

FZ (S-CQCC-J**) J-LEADED CERAMIC CHIP CARRIER

4040219/B 03/95

0.180 (4,57)

0.140 (3,55)

C

0.020 (0,51)

0.032 (0,81)

A B

A

B

0.025 (0,64) R TYP

0.026 (0,66)

0.120 (3,05)

0.155 (3,94)

0.014 (0,36)

0.120 (3,05)

0.040 (1,02) MIN

0.090 (2,29)

0.040 (1,02)  45°

A

MIN MAX

0.485

(12,32) (12,57)

0.495

0.455

(11,56)(10,92)

0.430

MAXMIN

BC

MIN MAX

0.410

(10,41) (10,92)

0.430

0.6300.6100.630 0.6550.6950.685

(16,00)(15,49)(16,00) (16,64)(17,65)(17,40)

0.7400.6800.730 0.7650.7950.785

(18,79)(17,28)(18,54) (19,43)(20,19)(19,94)

PINS**

28

44

52

NO. OFJEDEC

MO-087AC

MO-087AB

MO-087AA

OUTLINE

28 LEAD SHOWN

Seating Plane

(at Seating

Plane)

1426

25

19

18

12

11

5

0.050 (1,27)

0.9300.9100.930 0.9550.9950.985

(23,62)(23,11)(23,62) (24,26)(25,27)(25,02)

68MO-087AD

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a ceramic lid using glass frit.

IMPORTANT NOTICE

T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.

CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERSTOOD T O BE FULLY AT THE CUSTOMER’S RISK.

In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.

TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.

Texas Instruments TMS370C732AFNT Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual