TMS370Cx8x
8-BIT MICROCONTROLLER
SPNS035B –DECEMBER 1995 – REVISED FEBRUARY 1997
1
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
D
CMOS/EEPROM/EPROM Technologies on
a Single Device
– Mask-ROM Devices for High-Volume
Production
– One-Time-Programmable (OTP) EPROM
Devices for Low-Volume Production
– Reprogrammable EPROM Devices for
Prototyping Purposes
D
Internal System Memory Configurations
– On-Chip Program Memory Versions
– ROM: 4K Bytes
– EPROM: 16K Bytes
– Data EEPROM: 256 Bytes
– Static RAM: 128 or 256 Bytes Usable as
Registers
D
Flexible Operating Features
– Low-Power Modes: STANDBY and HAL T
– Commercial, Industrial, and Automotive
T emperature Ranges
– Clock Options
– Divide-by-1 (2 MHz–5 MHz SYSCLK) PLL
– Divide-by-4 (0.5 MHz–5 MHz SYSCLK)
– Supply Voltage (V
CC
) 5 V ±10%
D
16-Bit General Purpose Timer
– Software Configurable as
a 16-Bit Event Counter, or
a 16-Bit Pulse Accumulator, or
a 16-Bit Input Capture Functions, or
T wo Compare Registers, or a
Self-Contained Pulse Width Modulation
(PWM) Function
D
On-Chip 24-Bit Watchdog Timer
– EPROM/OTP Device: Standard
Watchdog
– Mask-ROM Devices: Hard Watchdog,
Simple Counter, or Standard Watchdog
D
Flexible Interrupt Handling
– Two S/W Programmable Interrupt Levels
– Global- and Individual-Interrupt Masking
– Programmable Rising- or Falling-Edge
Detect
– Individual Interrupt Vectors
D
TMS370 Series Compatibility
– Register-to-Register Architecture
– 256 General-Purpose Registers
– 14 Powerful Addressing Modes
– Instructions Upwardly Compatible With
all TMS370 Devices
D
CMOS/Package/TTL Compatible I/O Pins
– 40-Pin Plastic Dual-In-Line Packages/
32 Bidirectional Pins, 1 Input Pin
– 44-Pin Plastic Leaded Chip Carrier (LCC)
Packages/34 Bidirectional Pins,
1 Input Pin
D
Workstation/PC-Based Development
System
– C Compiler and C Source Debugger
– Real-Time In-Circuit Emulation
– Extensive Breakpoint/Trace Capability
– Multi-Window User Interface
– Microcontroller Programmer
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1997, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
N PACKAGE
(TOP VIEW)
FZ AND FN PACKAGES
(TOP VIEW)
MC
XTAL2/CLKIN
XTAL1
B7
B6
B5
NC
B4
C7
C6
NC
39
38
37
36
35
34
33
32
31
30
29
18 19
7
8
9
10
11
12
13
14
15
16
17
INT1
INT2
INT3
V
CC
NC
A7
A6
V
SS
A5
A4
A3
20 21 22 23
B0B1B2
B3
54 3216
44
RESETC5C4C3C2C1C0
D5
T1EVT
T1PWM
T1IC/CR
A2A1A0
D7D4D3
D6
42 41 4043
24 25 26 27 28
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
C2
C3
C4
C5
RESET
INT1
INT2
INT3
NC
V
CC
A7
A6
A5
A4
A3
A2
A1
A0
D7
D4
C1
C0
B0
B1
B2
B3
MC
XTAL2/CLKIN
XTAL1
B7
B6
B5
B4
V
SS
T1IC/CR
T1PWM
T1EVT
D5
D6
D3