PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
This page intentionally left blank
Revision History
Revision History
This data manual revision history highlights the technical changes made to the SPRS247D device-specific data
manual to make it an SPRS247E revision.
Scope: Applicable updates to the C64x device family, specifically relating to the TMS320C6413 and
TMS320C6410 devices, have been incorporated.
PAGE(s)
NO.
63Terminal Functions table:
Host-port data [7:0] pins (I/O/Z) description:
Changed sentence from “Host-Port bus width user-configurable at device reset via a 10-kW resistor pullup/pulldown resistor
on the HD5 pin (I):“ to “Host-Port bus width user-configurable at device reset via a 1-kW pullup/pulldown resistor on the HD5
pin (I):“
78I2C section:
Updated/added “For more detailed information...”
90Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Case Temperature:
D0.13-µm/6-Level Cu Metal Process (CMOS)
D3.3-V I/Os, 1.2-V Internal
VelociTI.2, VelociTI, and TMS320C64x are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
†
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
April 2004 − Revised May 2005SPRS247E
11
Functional Overview
2Functional Overview
2.1GTS and ZTS BGA Packages (Bottom View)
GTS and ZTS 288-PIN BALL GRID ARRAY (BGA) PACKAGES
( BOTTOM VIEW )
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
21
19
17
15
13
11
5
31
4
2
9
10
876
14
12
18
16
22
20
Figure 2−1. GTS and ZTS BGA Packages (Bottom View)
12
April 2004 − Revised May 2005SPRS247E
2.2Description
The TMS320C64x™ DSPs (including the TMS320C6413, TMS320C6410 devices) are the
highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The TMS320C6413
and TMS320C6410 (C6413 and C6410) devices are based on the second-generation high-performance,
advanced VelociTI™ very-long-instruction-word (VLIW) architecture (VelociTI.2™) developed by Texas
Instruments (TI). The high-performance, lower-cost C6413/C6410 DSPs enable customers to reduce system
costs for telecom, medical, industrial, office, and photo lab equipment. The C64x™ is a code-compatible
member of the C6000™ DSP platform.
With performance of up to 4000 million instructions per second (MIPS) at a clock rate of 500 MHz, the C6413
device offers cost-effective solutions to high-performance DSP programming challenges.
With performance of up to 3200 million instructions per second (MIPS) at a clock rate of 400 MHz, the C6410
device offers cost-effective solutions to high-performance DSP programming challenges. The C6410 device
also provides excellent value for packet telephony and for other cost−sensitive applications demanding high
performance.
The C6413/C6410 DSP possesses the operational flexibility of high-speed controllers and the numerical
capability of array processors. The C64x™ DSP core processor has 64 general-purpose registers of 32-bit
word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic
logic units (ALUs)— with VelociTI.2™ extensions. The VelociTI.2™ extensions in the eight functional units
include new instructions to accelerate the performance in video and imaging applications and extend the
parallelism of the VelociTI™ architecture. The C6413 can produce four 16-bit multiply-accumulates (MACs)
per cycle for a total of 2000 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of
4000 MMACS. The C6410 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of
1600 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 3200 MMACS. The
C6413/C6410 DSP also has application-specific hardware logic, on-chip memory, and additional on-chip
peripherals similar to the other C6000™ DSP platform devices.
Description
The C6413/C6410 uses a two-level cache-based architecture and has a powerful and diverse set of
peripherals. The Level 1 program cache (L1P) is a 128-Kbit direct mapped cache and the Level 1 data cache
(L1D) is a 128-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 2-Mbit
memory space that is shared between program and data space [for C6413 device] and the Level 2
memory/cache (L2) consists of an 1-Mbit memory space that is shared between program and data space [for
C6410 device]. L2 memory can be configured as mapped memory, cache, or combinations of the two. The
peripheral set includes: two multichannel buffered audio serial ports (McASPs); two inter-integrated circuit bus
modules (I2Cs) ; two multichannel buffered serial ports (McBSPs); three 32-bit general-purpose timers; a
user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a 16-pin general-purpose input/output
port (GP0) with programmable interrupt/event generation modes; and a 32-bit glueless external memory
interface (EMIFA), which is capable of interfacing to synchronous and asynchronous memories and
peripherals.
Each McASP port supports one transmit and one receive clock zone, with six serial data pins which can be
individually allocated to any of the two zones. The serial port supports time-division multiplexing on each pin
from 2 to 32 time slots. The C6413/C6410 has sufficient bandwidth to support all six serial data pins
transmitting a 192-kHz stereo signal. Serial data in each zone may be transmitted and received on multiple
serial data pins simultaneously and formatted in a multitude of variations on the Philips Inter-IC Sound (I
2
S)
format.
In addition, the McASP transmitter may be programmed to output multiple S/PDIF, IEC60958, AES-3, CP-430
encoded data channels simultaneously, with a single RAM containing the full implementation of user data and
channel status fields.
McASP also provides extensive error-checking and recovery features, such as the bad clock detection circuit
for each high-frequency master clock which verifies that the master clock is within a programmed frequency
range.
TMS320C6000, and C6000 are trademarks of Texas Instruments.
April 2004 − Revised May 2005SPRS247E
13
Device Characteristics
Not all peripherals pins
Confi
The I2C ports on the TMS320C6413/C6410 allows the DSP to easily control peripheral devices and
communicate with a host processor. In addition, the standard multichannel buffered serial port (McBSP) may
be used to communicate with serial peripheral interface (SPI) mode peripheral devices.
The C6413/C6410 has a complete set of development tools which includes: a new C compiler, an assembly
optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into
source code execution.
2.3Device Characteristics
Table 2−1, provides an overview of the C6413 and C6410 DSPs. The tables show significant features of the
C6413 and C6410 devices, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and
the package type with pin count.
Table 2−1. Characteristics of the C6413 and C6410 Processors
HARDWARE FEATURESC6413 AND C6410
EMIFA (32-bit bus width)
(clock source = AECLKIN, CLKOUT4, or CLKOUT6)
Peripherals
Not all peripherals pins
are available at the
same time (For more
detail, see the Device
guration section).
On-Chip Memory
CPU ID + CPU Rev IDControl Status Register (CSR.[31:16])0x0C01
BGA Package23 x 23 mm288-Pin Flip-Chip Plastic BGA (GTS and ZTS)
Process Technologyµm0.13 µm
Product Status
†
On this C64x™ device, the rated EMIF speed affects only the SDRAM interface on the EMIF. For more detailed information, see the EMIF device
speed portion of this data sheet.
‡
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard
warranty. Production processing does not necessarily include testing of all parameters.
‡
EDMA (64 independent channels)1
McASPs (use Peripheral Clock and AUXCLK)2
I2Cs (use Peripheral Clock)2
HPI (32- or 16-bit user selectable)1 (HPI16 or HPI32)
GP0[15:8] pins are muxed with the HPI HD[15:8] pins and GP0[2:1] pins are muxed with CLKOUT6 and CLKOUT4,
respectively.
§
Note: the C6413 device has 256K-Bytes L2 Cache Memory; the C6410 device has only 128K-Bytes L2 Cache Memory.
GP0
GP0
‡
OSCILLATOR
and PLL
(x1, x5 − x12, x16,
x18, x19 − x22, x24)
Boot Configuration
Power-Down
Logic
Figure 2−2. Functional Block Diagram
April 2004 − Revised May 2005SPRS247E
15
CPU (DSP Core) Description
2.4CPU (DSP Core) Description
The CPU fetches VelociTI™ advanced very-long instruction words (VLIWs) (256 bits wide) to supply up to
eight 32-bit instructions to the eight functional units during every clock cycle. The VelociTI™ VLIW architecture
features controls by which all eight units do not have to be supplied with instructions if they are not ready to
execute. The first bit of every 32-bit instruction determines if the next instruction belongs to the same execute
packet as the previous instruction, or whether it should be executed in the following clock as a part of the next
execute packet. Fetch packets are always 256 bits wide; however, the execute packets can vary in size. The
variable-length execute packets are a key memory-saving feature, distinguishing the C64x CPUs from other
VLIW architectures. The C64x™ VelociTI.2™ extensions add enhancements to the TMS320C62x™ DSP
VelociTI™ architecture. These enhancements include:
•Register file enhancements
•Data path extensions
•Quad 8-bit and dual 16-bit extensions with data flow enhancements
•Additional functional unit hardware
•Increased orthogonality of the instruction set
•Additional instructions that reduce code size and increase register flexibility
The CPU features two sets of functional units. Each set contains four units and a register file. One set contains
functional units .L1, .S1, .M1, and .D1; the other set contains units .D2, .M2, .S2, and .L2. The two register
files each contain 32 32-bit registers for a total of 64 general-purpose registers. In addition to supporting the
packed 16-bit and 32-/40-bit fixed-point data types found in the C62x™ VelociTI™ VLIW architecture, the
C64x™ register files also support packed 8-bit data and 64-bit fixed-point data types. The two sets of functional
units, along with two register files, compose sides A and B of the CPU [see the functional block and CPU (DSP
core) diagram, and Figure 2−3]. The four functional units on each side of the CPU can freely share the 32
registers belonging to that side. Additionally, each side features a “data cross path”—a single data bus
connected to all the registers on the other side, by which the two sets of functional units can access data from
the register files on the opposite side. The C64x CPU pipelines data-cross-path accesses over multiple clock
cycles. This allows the same register to be used as a data-cross-path operand by multiple functional units in
the same execute packet. All functional units in the C64x CPU can access operands via the data cross path.
Register access by functional units on the same side of the CPU as the register file can service all the units
in a single clock cycle. On the C64x CPU, a delay clock is introduced whenever an instruction attempts to read
a register via a data cross path if that register was updated in the previous clock cycle.
In addition to the C62x™ DSP fixed-point instructions, the C64x™ DSP includes a comprehensive collection
of quad 8-bit and dual 16-bit instruction set extensions. These VelociTI.2™ extensions allow the C64x CPU
to operate directly on packed data to streamline data flow and increase instruction set efficiency.
Another key feature of the C64x CPU is the load/store architecture, where all instructions operate on registers
(as opposed to data in memory). Two sets of data-addressing units (.D1 and .D2) are responsible for all data
transfers between the register files and the memory. The data address driven by the .D units allows data
addresses generated from one register file to be used to load or store data to or from the other register file.
The C64x .D units can load and store bytes (8 bits), half-words (16 bits), and words (32 bits) with a single
instruction. And with the new data path extensions, the C64x .D unit can load and store doublewords (64 bits)
with a single instruction. Furthermore, the non-aligned load and store instructions allow the .D units to access
words and doublewords on any byte boundary. The C64x CPU supports a variety of indirect addressing modes
using either linear- or circular-addressing with 5- or 15-bit offsets. All instructions are conditional, and most
can access any one of the 64 registers. Some registers, however, are singled out to support specific
addressing modes or to hold the condition for conditional instructions (if the condition is not automatically
“true”).
TMS320C62x and C62x are trademarks of Texas Instruments.
16
April 2004 − Revised May 2005SPRS247E
CPU (DSP Core) Description
The two .M functional units perform all multiplication operations. Each of the C64x .M units can perform two
16 × 16-bit multiplies or four 8 × 8-bit multiplies per clock cycle. The .M unit can also perform 16 × 32-bit multiply
operations, dual 16 × 16-bit multiplies with add/subtract operations, and quad 8 × 8-bit multiplies with add
operations. In addition to standard multiplies, the C64x .M units include bit-count, rotate, Galois field multiplies,
and bidirectional variable shift hardware.
The two .S and .L functional units perform a general set of arithmetic, logical, and branch functions with results
available every clock cycle. The arithmetic and logical functions on the C64x CPU include single 32-bit, dual
16-bit, and quad 8-bit operations.
The processing flow begins when a 256-bit-wide instruction fetch packet is fetched from a program memory.
The 32-bit instructions destined for the individual functional units are “linked” together by “1” bits in the least
significant bit (LSB) position of the instructions. The instructions that are “chained” together for simultaneous
execution (up to eight in total) compose an execute packet. A “0” in the LSB of an instruction breaks the chain,
effectively placing the instructions that follow it in the next execute packet. A C64x™ DSP device enhancement
now allows execute packets to cross fetch-packet boundaries. In the TMS320C62x™/TMS320C67x™ DSP
devices, if an execute packet crosses the fetch-packet boundary (256 bits wide), the assembler places it in
the next fetch packet, while the remainder of the current fetch packet is padded with NOP instructions. In the
C64x™ DSP device, the execute boundary restrictions have been removed, thereby, eliminating all of the
NOPs added to pad the fetch packet, and thus, decreasing the overall code size. The number of execute
packets within a fetch packet can vary from one to eight. Execute packets are dispatched to their respective
functional units at the rate of one per clock cycle and the next 256-bit fetch packet is not fetched until all the
execute packets from the current fetch packet have been dispatched. After decoding, the instructions
simultaneously drive all active functional units for a maximum execution rate of eight instructions every clock
cycle. While most results are stored in 32-bit registers, they can be subsequently moved to memory as bytes,
half-words, or doublewords. All load and store instructions are byte-, half-word-, word-, or
doubleword-addressable.
For more details on the C64x CPU functional units enhancements, see the following documents:
•TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189)
•TMS320C64x Technical Overview (literature number SPRU395)
TMS320C67x is a trademark of Texas Instruments.
April 2004 − Revised May 2005SPRS247E
17
CPU (DSP Core) Description
ST1b (Store Data)
ST1a (Store Data)
Data Path A
LD1b (Load Data)
LD1a (Load Data)
DA1 (Address)
32 MSBs
32 LSBs
32 MSBs
32 LSBs
src1
.L1
src2
long dst
long src
long src
long dst
src1
.S1
src2
long dst
long dst
src1
.M1
src2
src2
src1
.D1
src2
dst
dst
dst
dst
dst
8
8
8
8
Register
File A
(A0−A31)
See Note A
See Note A
2X
Data Path B
DA2 (Address)
LD2a (Load Data)
LD2b (Load Data)
ST2a (Store Data)
ST2b (Store Data)
32 LSBs
32 MSBs
32 MSBs
32 LSBs
src2
.D2
src1
src2
src1
.M2
long dst
src2
.S2
src1
long dst
long src
long src
long dst
src2
.L2
src1
dst
dst
dst
dst
1X
See Note A
See Note A
Register
File B
(B0− B31)
8
8
8
8
Control Register
File
NOTE A: For the .M functional units, the long dst is 32 MSBs and the dst is 32 LSBs.
Figure 2−3. TMS320C64x™ CPU (DSP Core) Data Paths
18
April 2004 − Revised May 2005SPRS247E
2.5Memory Map Summary
Table 2−2 shows the memory map address ranges of the C6413 and C6410 devices. Internal memory is
always located at address 0 and can be used as both program and data memory. The external memory
address ranges in the C6413/C6410 device begin at the hex address location 0x8000 0000 for EMIFA.
Figure 2−4 and Figure 2−5 show the detail of the L2 architecture on the TMS320C6413 and TMS320C6410
devices, respectively . For more information on the L2MODE bits, see the cache configuration (CCFG) register
bit field descriptions in the TMS320C64x Two-Level Internal Memory Reference Guide (literature number
SPRU610).
Table 2−3 through Table 2−20 identify the peripheral registers for the C6413/C6410 device by their register
names, acronyms, and hex address or hex address range. For more detailed information on the register
contents, bit names and their descriptions, see the specific peripheral reference guide listed in the
TMS320C6000 DSP Peripherals Overview Reference Guide (literature number SPRU190).
Table 2−3. EMIFA Registers
HEX ADDRESS RANGEACRONYMREGISTER NAMECOMMENTS
0180 0000GBLCTLEMIFA global control
0180 0004CECTL1EMIFA CE1 space control
0180 0008CECTL0EMIFA CE0 space control
0180 000C−Reserved
0180 0010CECTL2EMIFA CE2 space control
0180 0014CECTL3EMIFA CE3 space control
0180 0018SDCTLEMIFA SDRAM control
0180 001CSDTIMEMIFA SDRAM refresh control
0180 0020SDEXTEMIFA SDRAM extension
0180 0024 − 0180 003C−Reserved
0180 0040PDTCTLPeripheral device transfer (PDT) control
0180 0044CESEC1EMIFA CE1 space secondary control
0180 0048CESEC0EMIFA CE0 space secondary control
0180 004C−Reserved
0180 0050CESEC2EMIFA CE2 space secondary control
0180 0054CESEC3EMIFA CE3 space secondary control
0180 0058 − 0183 FFFF–Reserved
Table 2−4. L2 Cache Registers (C64x)
HEX ADDRESS RANGEACRONYMREGISTER NAMECOMMENTS
0184 0000CCFGCache configuration register
0184 0004 − 0184 0FFC−Reserved
0184 1000EDMAWEIGHTL2 EDMA access control register
0184 1004 − 0184 1FFC−Reserved
0184 2000L2ALLOC0L2 allocation register 0
0184 2004L2ALLOC1L2 allocation register 1
0184 2008L2ALLOC2L2 allocation register 2
0184 200CL2ALLOC3L2 allocation register 3
0184 2010 − 0184 3FFC−Reserved
0184 4000L2WBARL2 writeback base address register
0184 4004L2WWCL2 writeback word count register
0184 4010L2WIBARL2 writeback invalidate base address register
0184 4014L2WIWCL2 writeback invalidate word count register
0184 4018L2IBARL2 invalidate base address register
0184 401CL2IWCL2 invalidate word count register
0184 4020L1PIBARL1P invalidate base address register
0184 4024L1PIWCL1P invalidate word count register
0184 4030L1DWIBARL1D writeback invalidate base address register
April 2004 − Revised May 2005SPRS247E
23
Peripheral Register Descriptions
Table 2−4. L2 Cache Registers (C64x) (Continued)
HEX ADDRESS RANGECOMMENTSREGISTER NAMEACRONYM
0184 4034L1DWIWCL1D writeback invalidate word count register
0184 4038 − 0184 4044−Reserved
0184 4048L1DIBARL1D invalidate base address register
0184 404CL1DIWCL1D invalidate word count register
0184 4050 − 0184 4FFC−Reserved
0184 5000L2WBL2 writeback all register
0184 5004L2WBINVL2 writeback invalidate all register
0184 5008 − 0184 7FFC−Reserved
0184 8000 − 0184 81FC
0184 8200MAR128Controls EMIFA CE0 range 8000 0000 − 80FF FFFF
0184 8204MAR129Controls EMIFA CE0 range 8100 0000 − 81FF FFFF
0184 8208MAR130Controls EMIFA CE0 range 8200 0000 − 82FF FFFF
0184 820CMAR131Controls EMIFA CE0 range 8300 0000 − 83FF FFFF
0184 8210MAR132Controls EMIFA CE0 range 8400 0000 − 84FF FFFF
0184 8214MAR133Controls EMIFA CE0 range 8500 0000 − 85FF FFFF
0184 8218MAR134Controls EMIFA CE0 range 8600 0000 − 86FF FFFF
0184 821CMAR135Controls EMIFA CE0 range 8700 0000 − 87FF FFFF
0184 8220MAR136Controls EMIFA CE0 range 8800 0000 − 88FF FFFF
0184 8224MAR137Controls EMIFA CE0 range 8900 0000 − 89FF FFFF
0184 8228MAR138Controls EMIFA CE0 range 8A00 0000 − 8AFF FFFF
0184 822CMAR139Controls EMIFA CE0 range 8B00 0000 − 8BFF FFFF
0184 8230MAR140Controls EMIFA CE0 range 8C00 0000 − 8CFF FFFF
0184 8234MAR141Controls EMIFA CE0 range 8D00 0000 − 8DFF FFFF
0184 8238MAR142Controls EMIFA CE0 range 8E00 0000 − 8EFF FFFF
0184 823CMAR143Controls EMIFA CE0 range 8F00 0000 − 8FFF FFFF
0184 8240MAR144Controls EMIFA CE1 range 9000 0000 − 90FF FFFF
0184 8244MAR145Controls EMIFA CE1 range 9100 0000 − 91FF FFFF
0184 8248MAR146Controls EMIFA CE1 range 9200 0000 − 92FF FFFF
0184 824CMAR147Controls EMIFA CE1 range 9300 0000 − 93FF FFFF
0184 8250MAR148Controls EMIFA CE1 range 9400 0000 − 94FF FFFF
0184 8254MAR149Controls EMIFA CE1 range 9500 0000 − 95FF FFFF
0184 8258MAR150Controls EMIFA CE1 range 9600 0000 − 96FF FFFF
0184 825CMAR151Controls EMIFA CE1 range 9700 0000 − 97FF FFFF
0184 8260MAR152Controls EMIFA CE1 range 9800 0000 − 98FF FFFF
0184 8264MAR153Controls EMIFA CE1 range 9900 0000 − 99FF FFFF
0184 8268MAR154Controls EMIFA CE1 range 9A00 0000 − 9AFF FFFF
0184 826CMAR155Controls EMIFA CE1 range 9B00 0000 − 9BFF FFFF
0184 8270MAR156Controls EMIFA CE1 range 9C00 0000 − 9CFF FFFF
0184 8274MAR157Controls EMIFA CE1 range 9D00 0000 − 9DFF FFFF
0184 8278MAR158Controls EMIFA CE1 range 9E00 0000 − 9EFF FFFF
0184 827CMAR159Controls EMIFA CE1 range 9F00 0000 − 9FFF FFFF
0184 8280MAR160Controls EMIFA CE2 range A000 0000 − A0FF FFFF
MAR0 to
MAR127
Reserved
24
April 2004 − Revised May 2005SPRS247E
Table 2−4. L2 Cache Registers (C64x) (Continued)
HEX ADDRESS RANGECOMMENTSREGISTER NAMEACRONYM
0184 8284MAR161Controls EMIFA CE2 range A100 0000 − A1FF FFFF
0184 8288MAR162Controls EMIFA CE2 range A200 0000 − A2FF FFFF
0184 828CMAR163Controls EMIFA CE2 range A300 0000 − A3FF FFFF
0184 8290MAR164Controls EMIFA CE2 range A400 0000 − A4FF FFFF
0184 8294MAR165Controls EMIFA CE2 range A500 0000 − A5FF FFFF
0184 8298MAR166Controls EMIFA CE2 range A600 0000 − A6FF FFFF
0184 829CMAR167Controls EMIFA CE2 range A700 0000 − A7FF FFFF
0184 82A0MAR168Controls EMIFA CE2 range A800 0000 − A8FF FFFF
0184 82A4MAR169Controls EMIFA CE2 range A900 0000 − A9FF FFFF
0184 82A8MAR170Controls EMIFA CE2 range AA00 0000 − AAFF FFFF
0184 82ACMAR171Controls EMIFA CE2 range AB00 0000 − ABFF FFFF
0184 82B0MAR172Controls EMIFA CE2 range AC00 0000 − ACFF FFFF
0184 82B4MAR173Controls EMIFA CE2 range AD00 0000 − ADFF FFFF
0184 82B8MAR174Controls EMIFA CE2 range AE00 0000 − AEFF FFFF
0184 82BCMAR175Controls EMIFA CE2 range AF00 0000 − AFFF FFFF
0184 82C0MAR176Controls EMIFA CE3 range B000 0000 − B0FF FFFF
0184 82C4MAR177Controls EMIFA CE3 range B100 0000 − B1FF FFFF
0184 82C8MAR178Controls EMIFA CE3 range B200 0000 − B2FF FFFF
0184 82CCMAR179Controls EMIFA CE3 range B300 0000 − B3FF FFFF
0184 82D0MAR180Controls EMIFA CE3 range B400 0000 − B4FF FFFF
0184 82D4MAR181Controls EMIFA CE3 range B500 0000 − B5FF FFFF
0184 82D8MAR182Controls EMIFA CE3 range B600 0000 − B6FF FFFF
0184 82DCMAR183Controls EMIFA CE3 range B700 0000 − B7FF FFFF
0184 82E0MAR184Controls EMIFA CE3 range B800 0000 − B8FF FFFF
0184 82E4MAR185Controls EMIFA CE3 range B900 0000 − B9FF FFFF
0184 82E8MAR186Controls EMIFA CE3 range BA00 0000 − BAFF FFFF
0184 82ECMAR187Controls EMIFA CE3 range BB00 0000 − BBFF FFFF
0184 82F0MAR188Controls EMIFA CE3 range BC00 0000 − BCFF FFFF
0184 82F4MAR189Controls EMIFA CE3 range BD00 0000 − BDFF FFFF
0184 82F8MAR190Controls EMIFA CE3 range BE00 0000 − BEFF FFFF
0184 82FCMAR191Controls EMIFA CE3 range BF00 0000 − BFFF FFFF
0184 8300 −0184 83FC
0184 8400 −0187 FFFF−Reserved
MAR192 to
MAR255
Reserved
Peripheral Register Descriptions
April 2004 − Revised May 2005SPRS247E
25
Peripheral Register Descriptions
Table 2−5. Quick DMA (QDMA) and Pseudo Registers
HEX ADDRESS RANGEACRONYMREGISTER NAME
0200 0000QOPTQDMA options parameter register
0200 0004QSRCQDMA source address register
0200 0008QCNTQDMA frame count register
0200 000CQDSTQDMA destination address register
0200 0010QIDXQDMA index register
0200 0014 − 0200 001CReserved
0200 0020QSOPTQDMA pseudo options register
0200 0024QSSRCQDMA psuedo source address register
0200 0028QSCNTQDMA psuedo frame count register
0200 002CQSDSTQDMA destination address register
0200 0030QSIDXQDMA psuedo index register
Table 2−6. EDMA Registers (C64x)
HEX ADDRESS RANGEACRONYMREGISTER NAME
01A0 0800 − 01A0 FF98−Reserved
01A0 FF9CEPRHEvent polarity high register
01A0 FFA4CIPRHChannel interrupt pending high register
01A0 FFA8CIERHChannel interrupt enable high register
The C6413/C6410 device has 213 EDMA parameters total: 64-Event/Reload channels and 149-Reload only parameter sets [six (6) words each]
that can be used to reload/link EDMA transfers.
†
Parameters for Event 0
(6 words) or Reload/Link
Parameters for other Event
Reload/Link Parameters for
other Event 0−15
April 2004 − Revised May 2005SPRS247E
27
Peripheral Register Descriptions
Table 2−8. Interrupt Selector Registers (C64x)
HEX ADDRESS RANGEACRONYMREGISTER NAMECOMMENTS
019C 0000MUXHInterrupt multiplexer high
019C 0004MUXLInterrupt multiplexer low
019C 0008EXTPOLExternal interrupt polarity
019C 000C − 019F FFFF−Reserved
Selects which interrupts drive CPU
interrupts 10−15 (INT10−INT15)
Selects which interrupts drive CPU
interrupts 4−9 (INT04−INT09)
Sets the polarity of the external
interrupts (EXT_INT4−EXT_INT7)
The C64x EDMA supports up to 64 EDMA channels which service peripheral devices and external memory.
Table 2−21 lists the source of C64x EDMA synchronization events associated with each of the programmable
EDMA channels. For the C6413/C6410 device, the association of an event to a channel is fixed; each of the
EDMA channels has one specific event associated with it. These specific events are captured in the EDMA
event registers (ERL, ERH) even if the events are disabled by the EDMA event enable registers (EERL,
EERH). The priority of each event can be specified independently in the transfer parameters stored in the
EDMA parameter RAM. For more detailed information on the EDMA module and how EDMA events are
enabled, captured, processed, linked, chained, and cleared, etc., see the TMS320C6000 DSP EnhancedDirect Memory Access (EDMA) Controller Reference Guide (literature number SPRU234).
In addition to the events shown in this table, each of the 64 channels can also be synchronized with the transfer completion or alternate transfer
completion events. For more detailed information on EDMA event-transfer chaining, see the TMS320C6000 DSP Enhanced Direct MemoryAccess (EDMA) Controller Reference Guide (literature number SPRU234).
In addition to the events shown in this table, each of the 64 channels can also be synchronized with the transfer completion or alternate transfer
completion events. For more detailed information on EDMA event-transfer chaining, see the TMS320C6000 DSP Enhanced Direct MemoryAccess (EDMA) Controller Reference Guide (literature number SPRU234).
EVENT DESCRIPTIONEVENT NAME
2.8Interrupt Sources and Interrupt Selector
The C64x DSP core supports 16 prioritized interrupts, which are listed in Table 2−22. The highest-priority
interrupt is INT_00 (dedicated to RESET) while the lowest-priority interrupt is INT_15. The first four interrupts
(INT_00−INT_03) are non-maskable and fixed. The remaining interrupts (INT_04−INT_15) are maskable and
default to the interrupt source specified in Table 2−22. The interrupt source for interrupts 4−15 can be
programmed by modifying the selector value (binary value) in the corresponding fields of the Interrupt Selector
Control registers: MUXH (address 0x019C0000) and MUXL (address 0x019C0004).
MUXL[25:21]01000EDMA_INTEDMA channel (0 through 63) interrupt
MUXL[30:26]01001EMU_DTDMAEMU DTDMA
MUXH[4:0]00011SD_INTAEMIFA SDRAM timer interrupt
MUXH[9:5]01010EMU_RTDXRXEMU real-time data exchange (RTDX) receive
MUXH[14:10]01011EMU_RTDXTXEMU RTDX transmit
MUXH[20:16]00000DSP_INTHPI-to-DSP interrupt
MUXH[25:21]00001TINT0Timer 0 interrupt
MUXH[30:26]00010TINT1Timer 1 interrupt
−−01100XINT0McBSP0 transmit interrupt
−−01101RINT0McBSP0 receive interrupt
−−01110XINT1McBSP1 transmit interrupt
−−01111RINT1McBSP1 receive interrupt
−−10000GPINT0GP0 interrupt 0
−−10001ReservedReserved. Do not use.
−−10010ReservedReserved. Do not use.
−−10011TINT2Timer 2 interrupt
−−10100ReservedReserved. Do not use.
−−10101ReservedReserved. Do not use.
−−10110ICINT0I2C0 interrupt
−−10111ICINT1I2C1 interrupt
−−11000AXINT1McASP1 transmit interrupt
−−11001ARINT1McASP1 receive interrupt
−−11010ReservedReserved. Do not use.
−−11011ReservedReserved. Do not use.
−−11100AXINT0McASP0 transmit interrupt
−−11101ARINT0McASP0 receive interrupt
−−11110ReservedReserved. Do not use.
−−11111ReservedReserved. Do not use.
†
Interrupts INT_00 through INT_03 are non-maskable and fixed.
‡
Interrupts INT_04 through INT_15 are programmable by modifying the binary selector values in the Interrupt Selector Control registers fields.
Table 2−22 shows the default interrupt sources for Interrupts INT_04 through INT_15. For more detailed information on interrupt sources and
selection, see the TMS320C6000 DSP Interrupt Selector Reference Guide (literature number SPRU646).
These pins are muxed with the GP0 pins and by default these signals function as clocks (CLKOUT4 or CLKOUT6). To use these muxed
pins as GPIO signals, the appropriate GPIO register bits (GPxEN and GPxDIR) must be properly enabled and configured. For more
details, see the Device Configurations section of this data sheet.
‡
These pins are GP0 pins that can also function as external interrupt sources (EXT_INT[7:4]). Default after reset is EXT_INTx or GPIO
as input-only.
§
These pins are muxed with the HPI peripheral pins and by default these signals function as HPI. For more details on these muxed pins,
see the Device Configurations section of this data sheet.
These HPI pins are muxed with the McASP1 or GP0 peripherals. By default, these signals function as HPI and no function,
respectively. For more details on these muxed pins, see the Device Configurations section of this data sheet.
Figure 2−7. Peripheral Signals
April 2004 − Revised May 2005SPRS247E
Signal Groups Description
CLKX1
FSX1
CLKR1
FSR1
CLKS1
TOUT1/LENDIAN
TINP1
DX1
DR1
McBSP1
Transmit
Receive
Timer 1
Timer 2
Clock
McBSP0
Transmit
Receive
Clock
McBSPs
(Multichannel Buffered
Serial Ports)
Timer 0
Timers
CLKX0
FSX0
DX0
CLKR0
FSR0
DR0
CLKS0
TOUT0
TINP0
SCL1
SDA1
I2C1
I2Cs
I2C0
Figure 2−7. Peripheral Signals (Continued)
SCL0
SDA0
April 2004 − Revised May 2005SPRS247E
41
Signal Groups Description
(Transmit/Receive Data Pins)(Transmit/Receive Data Pins)
AXR0[0]
AXR0[1]
AXR0[2]
AXR0[3]
(Receive Bit Clock)
ACLKR0
AHCLKR0
(Receive Master Clock)(Transmit Master Clock)
AFSR0
(Receive Frame Sync or
Left/Right Clock)
Receive Clock
Generator
Receive Clock
Check Circuit
Receive
Frame Sync
Error Detect
(see Note A)
6-Serial Ports
Flexible
Partitioning
Tx, Rx, OFF
Transmit
Clock
Generator
Transmit
Clock Check
Circuit
Transmit
Frame Sync
Auto Mute
Logic
AXR0[4]
AXR0[5]
(Transmit Bit Clock)
ACLKX0
AHCLKX0
AFSX0
(Transmit Frame Sync or
Left/Right Clock)
AMUTE0
AMUTEIN0
(Multichannel Audio Serial Port 0)
NOTES: A. The McASPs’ Error Detect function detects underruns, overruns, early/late frame syncs, DMA errors, and external mute input.
B. Bolded and italicized text within parentheses denotes the function of the pins in an audio system.
McASP0
Figure 2−7. Peripheral Signals (Continued)
42
April 2004 − Revised May 2005SPRS247E
Signal Groups Description
(Transmit/Receive Data Pins)(Transmit/Receive Data Pins)
NOTES: A. The McASPs’ Error Detect function detects underruns, overruns, early/late frame syncs, DMA errors, and external mute input.
B. Bolded and italicized text within parentheses denotes the function of the pins in an audio system.
Figure 2−7. Peripheral Signals (Continued)
April 2004 − Revised May 2005SPRS247E
43
Device Configurations
3Device Configurations
On the C6413/C6410 device, bootmode and certain device configurations/peripheral selections are
determined at device reset, while other device configurations/peripheral selections are software-configurable
via the peripheral configurations register (PERCFG) [address location 0x01B3F000] after device reset.
3.1Device Configuration at Device Reset
Table 3−1 describes the C6413/C6410 device configuration pins. The logic level of the AEA[22:19],
TOUT1/LENDIAN, TOUT0/HPI_EN
The logic level on the device configuration pins can be set by using external pullup/pulldown resistors or by
using some control device (e.g., FPGA/CPLD) to intelligently drive these pins. When using a control device,
care should be taken to ensure there is no contention on the lines when the device is out of reset. The
CLKINSEL and OSC_DIS configuration pins should remain driven to the correct levels during device operation
and must only be changed when RESET
are driven after the reset is removed. At this time, the control device should ensure it has stopped driving the
device configuration pins of the DSP to again avoid contention.
HPI, McASP1, GP0[15:8] select
Selects whether the HPI peripheral or McASP1 peripheral, and GP0[15:8] pins are
functionally enabled
0 – HPI is enabled and the McASP1 peripheral and GP0 [15:8] pins are disabled
(default mode);
[HPI32, if HD5 = 1; HPI16 if HD5 = 0]
1 − HPI I is disabled and the McASP1 peripheral and GP0 [15:8] pins are enabled
For more detail on the peripherals (McASP1 and GP0[15:8] pins) muxed with HPI, see the
Table 3−2.
HPI peripheral bus width (HPI_WIDTH) select
0 − HPI operates as an HPI16.
(HPI bus is 16 bits wide. HD[15:0] pins are used for HPI and the remaining
HD[31:16] muxed
pins function as McASP1 peripheral pins or are reserved pins in the Hi-Z state.)
1 − HPI operates as an HPI32.
(HPI bus is 32 bits wide. All HD[31:0] pins are used for host-port operations.)
For more detail on the peripherals (McASP1 and GP0[15:8] pins) muxed with HPI, see the
Table 3−2.
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
NO.
†
PLL input clock source select
Selects whether the PLL input clock is CLKIN [pin high] or directly from the crystal oscillator
(OSCIN and OSCOUT) [pin low]. For proper device operation, this pin must be used in
conjunction with the OSC_DIS pin.
0 − Oscillator pads (OSCIN, OSCOUT directly from the crystal oscillator)
For proper device operation, OSC_DIS must be 0
1 − CLKIN square wave (default)
For proper device operation, OSC_DIS must be 1
This pin must be pulled to the correct level even after reset.
Oscillator disable
Selects whether the Oscillator is enabled or disabled. For proper device operation, this pin
must follow the CLKINSEL pin operation.
0 − OSC enabled
1 − OSC disabled (default)
This pin must be pulled to the correct level even after reset.
FUNCTIONAL DESCRIPTIONIPD/IPU
3.2Peripheral Configuration at Device Reset
Some C6413/C6410 peripherals share the same pins (internally muxed) and are mutually exclusive (i.e., HPI,
general-purpose input/output 0 pins GP0[15:8], and McASP1).
•HPI, McASP1, and GP0 peripherals
The TOUT0/HPI_EN
(AA2 pin) is latched at reset. This pin selects whether the HPI peripheral or McASP1
peripheral, and GP0[15:8] pins are functionally enabled (see Table 3−2).
Table 3−2. TOUT0/HPI_EN
PERIPHERAL SELECTIONPERIPHERALS SELECTED
HPI_EN
(AA2)
0016-bit HPIAvailableN/A
0132-bit HPIN/A
1xN/A
†
The TOUT0/HPI_EN pin has an internal pulldown that enables the HPI by default. The TOUT0/HPI_EN pin can disable the HPI via an external
pullup resistor or be driven high during reset. The TOUT0/HPI_EN
‡
N/A = Not available
HD5
[HPI_WIDTH]
(Y13)
and HD5 Peripheral Selection (HPI or McASP1 and Select GP0 Pins)
HPIMcASP1GP0 [15:8]
‡
‡
‡
AvailableAvailable
‡
N/A
pin is not software-controllable.
HPI_EN = 0, HD5 = 0
HPI16 is enabled and McASP1 peripheral is enabled
and GP0 [15:8] pins are disabled. All multiplexed
HPI/McASP1 pins function as McASP1 pins. All
multiplexed HPI/GP0 are reserved pins in the Hi-Z state.
HPI_EN = 0, HD5 = 1
HPI32 is enabled and McASP1 peripheral and GP0
[15:8] pins are disabled. All multiplexed HPI/McASP1
and HPI/GP0 pins function as HPI pins.
HPI_EN = 1, HD5 = x (don’t care)
HPI is disabled and the McASP1 peripheral and GP0
[15:8] pins are enabled. All multiplexed HPI/McASP1
and HPI/GP0 pins function as McASP1 and GP0 pins,
respectively. To use the GP0 pins, the appropriate bits
in the GP0EN and GP0DIR registers need to be set. All
standalone HPI pins are reserved pins in the Hi-Z state
DESCRIPTION
†
April 2004 − Revised May 2005SPRS247E
45
Device Configurations
3.3Peripheral Selection After Device Reset
HPI, McBSP1, McBSP0, McASP1, McASP0, I2C1, and I2C0
The C6413/C6410 device has designated registers for peripheral configuration (PERCFG), device status
(DEVSTAT), and JTAG identification (JTAGID). These registers are part of the Device Configuration module
and are mapped to a 4K block memory starting at 0x01B3F000. The CPU accesses these registers via the
CFGBUS.
The peripheral configuration register (PERCFG), allows the user to control the peripheral selection of the
McASP1, McASP0, I2C1, and I2C0 peripherals. For more detailed information on the PERCFG register
control bits, see Figure 3−1 and Table 3−3.
31282724
Reserved
23
1511
†
R-0R-0
Reserved
Reserved
†
R-0R/W-0R/W-0
†
R-0
Reserved
1098
AFCMUX[1:0]MCASP1EN
†
16
76543
I2C1EN
R/W-0R-0R-0R-0R/W-0R-1R-1R/W-0
Legend: R = Read only; R/W = Read/Write; -n = value after reset
†
For proper device operation, all reserved bits have to be written with “0”.
[designed for multiple non-simultaneous I2S sources with different clock sources].
McASP1 select bit.
Selects whether the McASP1 peripheral is enabled or disabled (default).
(This feature allows power savings by disabling the peripheral when not in use.)
0 = McASP1 is disabled and the module is powered down [default].
1 = McASP1 is enabled.
Inter-integrated circuit 1 (I2C1) enable bit.
Selects whether I2C1 peripheral is enabled or disabled (default).
(This feature allows power savings by disabling the peripheral when not in use.)
0 = I2C1 is disabled, and the module is powered down (default).
1 = I2C1 is enabled.
Inter-integrated circuit 0 (I2C0) enable bit.
Selects whether I2C0 peripheral is enabled or disabled (default).
(This feature allows power savings by disabling the peripheral when not in use.)
0 = I2C0 is disabled, and the module is powered down (default).
1 = I2C0 is enabled.
McBSP1 enable bit.
This bit is read-only as a “1” (McBSP1 always enabled).
McBSP0 enable bit .
This bit is read-only as a “1” (McBSP0 always enabled).
McASP0 select bit.
Selects whether the McASP0 peripheral is enabled or disabled.
(This feature allows power savings by disabling the peripheral when not in use.)
0 = McASP0 is disabled.
1 = McASP0 is enabled.
April 2004 − Revised May 2005SPRS247E
47
Device Configurations
3.4Peripheral Configuration Lock
By default, the McASP1, McASP0, I2C1, and I2C0 peripherals are disabled on power up. In order to use these
peripherals on the C6413/C6410 device, the peripheral must first be enabled in the Peripheral Configuration
register (PERCFG). Software muxed pins should not be programmed to switch functionalities during
run-time. Care should also be taken to ensure that no accesses are being performed before disabling
the peripherals. To help minimize power consumption in the C6413/C6410 device, unused peripherals may
be disabled..
Figure 3−2 shows the flow needed to enable (or disable) a given peripheral on the C6413/C6410 device.
A 32-bit key (value = 0x10C0010C) must be written to the Peripheral Configuration Lock register
(PCFGLOCK) in order to unlock access to the PERCFG register. Reading the PCFGLOCK register
determines whether the PERCFG register is currently locked (LOCKSTAT bit = 1) or unlocked (LOCKSTAT
bit = 0), see Figure 3−3. A peripheral can only be enabled when the PERCFG register is “unlocked”
(LOCKSTAT bit = 0).
48
April 2004 − Revised May 2005SPRS247E
Device Configurations
Read Accesses
3110
Reserved
R-0R-1
LOCKSTAT
Write Accesses
310
LOCK
W-0
Legend: R = Read only; R/W = Read/Write; -n = value after reset
Table 3−4. PCFGLOCK Register Selection Bit Descriptions − Read Accesses
BITNAMEDESCRIPTION
31:1ReservedReserved. Read-only, writes have no effect.
Lock status bit.
Determines whether the PERCFG register is locked or unlocked.
0LOCKSTAT
0 = Unlocked, read accesses to the PERCFG register allowed.
1 = Locked, write accesses to the PERCFG register do not modify the register state [default].
Reads are unaffected by Lock Status.
Table 3−5. PCFGLOCK Register Selection Bit Descriptions − Write Accesses
BITNAMEDESCRIPTION
Lock bits.
31:0LOCK
0x10C0010C = Unlocks PERCFG register accesses.
Any write to the PERCFG register will automatically relock the register. In order to avoid the unnecessary
overhead of multiple unlock/enable sequences, all peripherals should be enabled with a single write to the
PERCFG register with the necessary enable bits set.
Prior to waiting 128 CPU cycles, the PERCFG register should be read. There is no direct correlation between
the CPU issuing a write to the PERCFG register and the write actually occurring. Reading the PERCFG
register after the write is issued forces the CPU to wait for the write to the PERCFG register to occur.
Once a peripheral is enabled, the DSP (or other peripherals such as the HPI) must wait a minimum of 128 CPU
cycles before accessing the enabled peripheral. The user must ensure that no accesses are performed to a
peripheral while it is disabled.
In addition to the normal usage, the PCFGLOCK register can be used to override the power saver settings
specified in the PERCFG register. When the power saver feature is disabled (PCFGLOCK written with
0xC0100C01), all peripherals controlled by PERCFG are enabled. If the power saver is returned to normal
operation (PCFGLOCK written with 0x0C01C010), then the peripherals return to the operating condition
specified by PERCFG. Turning off the power saver settings will add a worst-case 50 mW of power to the overall
DSP power consumption.
Note: overriding the settings of the PERCFG register will not cause a conflict on the multiplexed pins. For
example, with the HPI and McASP1 peripherals, the HPI will still have control over the multiplexed pins
provided the TOUT0/HPI_EN
April 2004 − Revised May 2005SPRS247E
pin was “0” at reset.
49
Device Configurations
3.5Device Status Register Description
The device status register depicts the status of the device peripheral selection. Once set, these bits will remain
set until a device reset; therefore, these bits should be masked when reading the DEVSTAT register since their
values can change. For the actual register bit names and their associated bit field descriptions, see Figure 3−4
and Table 3−6.
3124
Reserved
R-100x0111
2319
PLLM
R-xxxxxR-1R-xR-x
1514131211
Reserved
R-000R-xR-0R-xR-0R-x
CLKMODE3ReservedHPI-WIDTHReservedHPI_EN
181716
ReservedOSC EXT RESCLKINSEL
1098
76543
CLKMODE2
R-xR-xR-xR-xR-xR-xR-xR-x
Legend: R = Read only; R/W = Read/Write; -n = value after reset
Figure 3−4. Device Status Register (DEVSTAT) Description − 0x01B3 F004
Table 3−6. Device Status (DEVSTAT) Register Selection Bit Descriptions
BITNAMEDESCRIPTION
31:24ReservedReserved. Read-only, writes have no effect.
PLL multiply factor status bits.
Shows the status of the PLL multiply mode selected; whether the CPU clock frequency equals the input
23:19PLLM
18ReservedReserved. Read-only, writes have no effect.
17OSC EXT RES
16CLKINSEL
15:13ReservedReserved. Read-only, writes have no effect.
11ReservedReserved. Read-only, writes have no effect.
10HPI_WIDTH
9ReservedReserved. Read-only, writes have no effect.
8HPI_EN
clock frequency x1 (Bypass), x5, x6, x7, x8, x9, x10, x11, x12, x16, x18, x19, x20, x21, x22, or x24.
For more detailed information on the PLL multiply factors, see the Clock PLL and Oscillator section of this
data sheet.
Oscillator external resistor status bit.
Shows the status internal or external of the OSC bias resistor.
0 = Normal functional mode with internal bias resistor.
1 = Normal functional mode with external bias resistor [default; internally tied high].
PLL input clock select status bit.
Shows the status of whether the PLL input clock is CLKIN [pin high] or directly from the crystal oscillator
(OSCIN and OSCOUT) [pin low]
HPI bus width control bit.
Shows the status of whether the HPI bus operates in 32-bit mode or in 16-bit mode (default).
0 = HPI operates in 16-bit mode. (default).
1 = HPI operates in 32-bit mode.
HPI_EN pin status bit.
Shows the status at device reset of the HPI_EN
or disabled.
0 = HPI_EN pin is low, meaning the HPI peripheral is enabled (default).
1 = HPI_EN
pin is high, meaning the HPI peripheral is disabled.
pin, which controls the HPI peripheral as enabled [default]
50
April 2004 − Revised May 2005SPRS247E
Table 3−6. Device Status (DEVSTAT) Register Selection Bit Descriptions (Continued)
Sh
the status (”1 or 0”) of the CLKMODE[3:0] select bit
y
12CLKMODE3
7CLKMODE2
6CLKMODE1
5CLKMODE0
4LENDIAN
3BOOTMODE1
2BOOTMODE0
1AECLKINSEL1
0AECLKINSEL0
Device Configurations
DESCRIPTIONNAMEBIT
Clock mode select status bits
ows
Clock mode select for CPU clock frequency (CLKMODE[3:0]), for example:
0000– Bypass (x1) (default mode)
For more details on the CLKMODE pins and the PLL multiply factors, see the Clock PLL section of this
data sheet.
Device Endian mode (LENDIAN)
Shows the status of whether the system is operating in Big Endian mode or Little Endian mode (default).
0 – System is operating in Big Endian mode
1 − System is operating in Little Endian mode (default)
Bootmode configuration bits (AEA[22:21] pins)
Shows the status of what device bootmode configuration is operational.
Bootmode [1:0]
00 – No boot (default mode)
01 − HPI boot (based on HPI_EN
10 − Reserved
11 − EMIFA 8-bit ROM boot
EMIFA input clock select (AEA[20:19] pins)
Shows the status of what clock mode is enabled or disabled for the EMIF.
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. For the
C6413/C6410 device, the JTAG ID register resides at address location 0x01B3 F008. The register hex value
for the C6413/C6410 device is: 0x0007 902F. For the actual register bit names and their associated bit field
descriptions, see Figure 3−5 and Table 3−7.
31−2827−1211−10
VARIANT (4-Bit)
R-0000R-0000 0000 1000 0100R-0000 0010 111R-1
Legend: R = Read only; -n = value after reset
Figure 3−5. JTAG ID Register Description − TMS320C6413/C6410 Register Value − 0x0007 902F
0LSBLSB. This bit is read as a “1” for C6413/C6410.
PART NUMBER (16-Bit)MANUFACTURER (11-Bit)LSB
Table 3−7. JTAG ID Register Selection Bit Descriptions
April 2004 − Revised May 2005SPRS247E
51
Device Configurations
DEFAULT
DEFAULT
g
y
the GPIO Direction Register must be properly
(McASP1 is disabled).
To enable the McASP1 peripheral, the
dri
l device (disabling the HPI)
HPI pin
TOUT0/HPI_EN0,
HHWIL pin
HD5 = 0]
(HPI16 only)
McASP1 pins disabled.
determine which of the clock and frame sync
pasaepuocSooedeaed
(McASP1 is disabled).
HPI pin
p
McASP1 pins disabled
McASP1 pin direction is controlled by the
3.7Multiplexed Pins
Multiplexed pins are pins that are shared by more than one peripheral and are internally multiplexed. Some
of these pins are configured by software, and the others are configured by external pullup/pulldown resistors
only at reset. Those muxed pins that are configured by software should not be programmed to switch
functionalities during run-time. Those muxed pins that are configured by external pullup/pulldown resistors
are mutually exclusive; only one peripheral has primary control of the function of these pins after reset.
Table 3−8 identifies the multiplexed pins on the C6413/C6410 device; shows the default (primary) function and
the default settings after reset; and describes the pins, registers, etc. necessary to configure specific
multiplexed functions.
Table 3−8. C6413/C6410 Device Multiplexed Pins
MULTIPLEXED PINS
NAMENO.
CLKOUT4/GP0[1]A2IPUCLKOUT4GP1EN = 0 (disabled)
CLKOUT6/GP0[2]B3IPUCLKOUT6GP2EN = 0 (disabled)
HCNTL0/AFSR1[1]Y6
HHWIL/AFSR1[2]Y7
HR/W/AFSR1[3]AA5
HAS/ACLKR1[1]Y5
HCS/ACLKR1[2]AA11
HDS1/ACLKR1[3]AB11
HD29/AMUTEIN1W11
HD28/AMUTE1W10
HD27/AHCLKX1Y4
HD26/AHCLKR1AB4
HD25/ACLKR1AA9
HD24/ACLKX1AA4
HD23/AFSR1AB9
HD22/AFSX1AB5
HD21/AXR1[5]Y9
HD20/AXR1[4]AB8
HD19/AXR1[3]AA6
HD18/AXR1[2]AB7
HD17/AXR1[1]AA7
IPD/IPU
IPU
IPU
DEFAULTDEFAULT
†
FUNCTION
HPI pin TOUT0/HPI_EN = 0,
function
SETTING
HD5 = 1
(32-Bit HPI enabled)
(HPI16 only)McASP1 pins disabled.
TOUT0/HPI_EN = 0,
HPI pin
function
HD5 = 1
(32-Bit HPI enabled)
McASP1
ins disabled.
DESCRIPTION
These pins are software-configurable. To use
these pins as GPIO pins, the GPxEN bits in the
GPIO Enable Register and the GPxDIR bits in
the GPIO Direction Re
configured.
GPxEN = 1:GPx pin enabled
GPxDIR = 0:GPx pin is an input
GPxDIR = 1:GPx pin is an output
By default, HPI32 is enabled upon reset
To enable the McASP1 peripheral, the
TOUT0/HPI_EN pin must be high at reset either
via an external pullup (PU) resistor (1 kΩ) or
ven by a contro
or the McASP1 peripheral pins can be used if the
HPI is used as a 16-bit width [HPI_EN = 0,
=
.
The clocks and frame syncs select bits
(AFCMUX[1:0]) located in the PERCFG register
pairs are input to McASP1. For more detailed
information, see the Device Configuration
section of this data sheet.
By default, HPI32 is enabled upon reset
(McASP1 is disabled).
To enable the McASP1 peripheral, the
TOUT0/HPI_EN
via an external pullup (PU) resistor (1 kΩ) or
driven by a control device (disabling the HPI).
or the McASP1 peripheral pins can be used if the
HPI is used as a 16-bit width [HPI_EN
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
]
AB13
IPD/IPU
IPD/IPU
NO.NAME
IPU
†
†
DEFAULT
DEFAULT
FUNCTION
FUNCTION
HPI pin
function
DEFAULT
DEFAULT
SETTING
SETTING
,
32-Bit HPI enabled
GPIO pins disabled.
=
DESCRIPTION
DESCRIPTION
By default, HPI is enabled upon reset (GP0[15:9
pins are disabled).
To use GP0[15:9] as GPIO pins, the HPI needs
to be
the GPxEN bits in the GPIO Enable Re
the GPxDIR bits in the GPIO Direction Register
must be properly configured.
:
GPxDIR = 0:GPx pin is an input
GPxDIR = 1:GPx pin is an output
1,
enable
’
= x (don’t care
ister and
3.8Debugging Considerations
It is recommended that external connections be provided to device configuration pins, including
TOUT1/LENDIAN, AEA[22:19], TOUT0/HPI_EN
pullup/pulldown resistors exist on these pins, providing external connectivity adds convenience to the user
in debugging and flexibility in switching operating modes.
Internal pullup/pulldown resistors also exist on the non-configuration pins on the AEA bus (AEA[18:3]). Do not
oppose the internal pullup/pulldown resistors on these non-configuration pins with external pullup/pulldown
resistors. If an external controller provides signals to these non-configuration pins, these signals must be
driven to the default state of the pins at reset, or not be driven at all.
, CLKINSEL, and OSC_DIS. Although internal
,
For the internal pullup/pulldown resistors for all device pins, see the terminal functions table.
3.9Configuration Examples
Figure 3−6 illustrates an example of peripheral selections/options that are configurable on the C6413/C610
device.
The terminal functions table (Table 3−9) identifies the external signal names, the associated pin (ball) numbers
along with the mechanical package designator, the pin type (I, O/Z, or I/O/Z), whether the pin has any internal
pullup/pulldown resistors and a functional pin description. For more detailed information on device
configuration, peripheral selection, multiplexed/shared pins, and debugging considerations, see the Device
Configurations section of this data sheet.
Terminal Functions
April 2004 − Revised May 2005SPRS247E
55
Terminal Functions
†
IPD/
DESCRIPTION
Clock mode selects
For more details on the CLKMODE pins and the PLL multiply factors, see the Clock
Table 3−9. Terminal Functions
SIGNAL
NAMENO.
TYPE
IPD/
IPU
‡
CLOCK/PLL CONFIGURATION
CLKINA12IIPDClock Input. This clock is the input to the on-chip PLL.
CLKOUT4/GP0[1]
CLKOUT6/GP0[2]
§
§
A2I/O/ZIPU
B3I/O/ZIPU
Clock output at 1/4 of the device speed (O/Z) [default] or this pin can be programmed as
a GP0 1 pin (I/O/Z).
Clock output at 1/6 of the device speed (O/Z) [default] or this pin can be programmed as
a GP0 2 pin (I/O/Z).
CLKIN select. Selects whether the PLL input clock is CLKIN [pin high] or directly from
CLKINSELA11IIPU
the crystal oscillator (OSCIN and OSCOUT) [pin low].
For proper device operation, this pin must be used in conjunction with the OSC_DIS
pin.
CLKMODE3C11IIPD
CLKMODE2B10IIPD
CLKMODE1A13IIPD
CLKMODE0C13IIPD
¶
PLLV
C12APLL voltage supply
Clock mode selects
• Selects whether the CPU clock frequency = input clock frequency x1 (Bypass), x5,
x6, x7, x8, x9, x10, x11, x12, x16, x18, x19, x20, x21, x22, or x24.
PLL section of this data sheet.
OSCINA6I—Crystal oscillator Input (XI)
OSCOUTA7O—Crystal oscillator output (XO)
Power for crystal oscillator (1.2 V), Do not connect to board power 1.4 V; for optimum
OSCV
DD
B6S—
performance, connected internally. If CLKIN is used instead of the oscillator, then this
pin can be left open or connected to CV
DD
.
Ground for crystal oscillator, Do not connect to board ground; for optimum
OSCV
SS
C6GND—
performance, connected internally. If CLKIN is used instead of the oscillator, then this
pin can be left open or connected to VSS.
Oscillator disable select.
OSC_DISB7IIPU
For proper device operation, this pin must follow the CLKINSEL pin operation.
0 − OSC enabled; CLKINSEL must be 0
1 − OSC disabled (default); CLKINSEL must be 1
JTAG EMULATION
TMSU3IIPUJTAG test-port mode select
TDOT4O/ZIPUJTAG test-port data out
TDIT1IIPUJTAG test-port data in
TCKT2IIPUJTAG test-port clock
TRSTU1IIPD
EMU0R1I/O/ZIPUEmulation pin 0
EMU1T3I/O/ZIPUEmulation pin 1
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
¶
PLLV is not part of external voltage supply. See the Clock PLL and Oscillator section for information on how to connect this pin.
#
The EMU0 and EMU1 pins are internally pulled up with 30-kΩ resistors; therefore, for emulation and normal operation, no external
JTAG test-port reset. For IEEE 1149.1 JTAG compatibility, see the IEEE 1149.1 JTAG
compatibility statement portion of this data sheet.
#
#
pullup/pulldown resistors are necessary. However, for boundary scan operation, pull down the EMU1 and EMU0 pins with a dedicated 1-kΩ
resistor.
56
April 2004 − Revised May 2005SPRS247E
Terminal Functions
pppp()p()p(py)
p
• When these pins function as External Interrupts [by selecting the corresponding
pp()[]pppp()[]p
GP0 [3:0] pins (I/O/Z)
g
Clock output at 1/4 of the device
d (O/Z) [default] or this pin
a GP0 1 pin (I/O/Z)
Table 3−9. Terminal Functions (Continued)
IPD/
NAMENO.
EMU2R2I/O/ZIPUEmulation pin 2. Reserved for future use, leave unconnected.
EMU3U2I/O/ZIPUEmulation pin 3. Reserved for future use, leave unconnected.
EMU4R3I/O/ZIPUEmulation pin 4. Reserved for future use, leave unconnected.
EMU5P2I/O/ZIPUEmulation pin 5. Reserved for future use, leave unconnected.
EMU6R4I/O/ZIPUEmulation pin 6. Reserved for future use, leave unconnected.
EMU7V2I/O/ZIPUEmulation pin 7. Reserved for future use, leave unconnected.
EMU8V1I/O/ZIPUEmulation pin 8. Reserved for future use, leave unconnected.
EMU9V3I/O/ZIPUEmulation pin 9. Reserved for future use, leave unconnected.
EMU10W3I/O/ZIPUEmulation pin 10. Reserved for future use, leave unconnected.
EMU11W2I/O/ZIPUEmulation pin 11. Reserved for future use, leave unconnected.
RESETS, INTERRUPTS, AND GENERAL-PURPOSE INPUT/OUTPUTS
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
†
TYPE
IPU
I/O/ZIPU
‡
DESCRIPTION
JTAG EMULATION (CONTINUED)
General-purpose input/output (GPIO) pins (I/O/Z) or external interrupts (input only).
The default after reset setting is GPIO enabled as input-only.
• When these
ins function as External Interrupts [by selecting the corresponding
interrupt enable register bit (IER.[7:4])], they are edge-driven and the polarity can be
independently selected via the External Interrupt Polarity Register bits
(EXTPOL.[3:0]).
Host-port data pins (I/O/Z) [default] or General-purpose input/output (GP0) [15:8] pins
(I/O/Z)
GP0 [3:0] pins (I/O/Z)
Clock output at 1/6 of the device speed (O/Z) [default] or this pin can be programmed as
a GP0 2 pin (I/O/Z).
a GP0 1 pin (I/O/Z).
.
spee
can be programmed as
April 2004 − Revised May 2005SPRS247E
57
Terminal Functions
Only one p
asserted d
access
• Only one pin is asserted during any external data access
EMIFA byteenable control
• Byte-write enables for most types of memory
Table 3−9. Terminal Functions (Continued)
IPD/
NAMEDESCRIPTION
NO.
EMIFA (32-BIT) − CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY
ACE3H19O/ZIPU
ACE2N20O/ZIPU
ACE1R20O/ZIPU
ACE0F20O/ZIPU
ABE3AB21O/ZIPU
ABE2P21O/ZIPU
ABE1A22O/ZIPU
ABE0D16O/ZIPU
APDTT19O/ZIPUEMIFA peripheral data transfer, allows direct transfer between external peripherals
AHOLDAJ21OIPUEMIFA hold-request-acknowledge to the host
AHOLDJ22IIPUEMIFA hold request from the host
ABUSREQR19OIPUEMIFA bus request output
EMIFA (32-BIT) − ASYNCHRONOUS/SYNCHRONOUS MEMORY CONTROL
AECLKIN K22IIPD
AECLKOUT2U22O/ZIPD
AECLKOUT1F22O/ZIPD
AARE/
ASDCAS
ASADS
/
/ASRE
D20O/ZIPU
AAOE/
ASDRAS
/
E20O/ZIPU
ASOE
AAWE/
ASDWE
/
C20O/ZIPU
ASWE
ASDCKEK21O/ZIPU
ASOE3P19O/ZIPUEMIFA synchronous memory output-enable for ACE3 (for glueless FIFO interface)
AARDYL21IIPUAsynchronous memory ready input
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
TYPE
†
IPU
‡
EMIFA memory space enables
• Enabled by bits 28 through 31 of the word address
•
in is
EMIFA byte-enable control
• Decoded from the low-order address bits. The number of address bits or byte
enables used depends on the width of external memory.
•
-
• Can be directly connected to SDRAM read and write mask signal (SDQM)
EMIFA (32-BIT) − BUS ARBITRATION
EMIFA external input clock. The EMIFA input clock (AECLKIN, CPU/4 clock, or CPU/6
clock) is selected at reset via the pullup/pulldown resistors on the AEA[20:19] pins.
AECLKIN is the default for the EMIFA input clock.
EMIFA output clock 2. Programmable to be EMIFA input clock (AECLKIN, CPU/4 clock,
or CPU/6 clock) frequency divided-by-1, -2, or -4.
• For programmable synchronous interface, the RENEN field in the CE Space
Secondary Control Register (CExSEC) selects between ASADS
If RENEN = 0, then the ASADS
If RENEN = 1, then the ASADS
EMIFA SDRAM clock-enable (used for self-refresh mode).
• If SDRAM is not in system, ASDCKE can be used as a general-purpose output.
uring any external data
and ASRE:
/ASRE signal functions as the ASADS signal.
/ASRE signal functions as the ASRE signal.
58
April 2004 − Revised May 2005SPRS247E
Terminal Functions
a
ces (e.g., C6
,
maintain signal name compatibility with other C64x™ devices (e.g., C6411, C6414
,)[g
p/p
• Also controls initialization of DSP modes at reset (I) via pullup/pulldown resistors
([])
10−Reserved
EMIF clock sel
[](_[])
01−CPU/4 Clock Rat
10CPU/6 Clock Rate
For
the Device Confi
f this data sheet
Table 3−9. Terminal Functions (Continued)
IPD/
NAMEDESCRIPTION
NO.
AEA22M21
AEA21N21
AEA20P22
AEA19N22
AEA18H22
AEA17H21
AEA16J20
AEA15H20
AEA14G20
AEA13K20
AEA12B21
AEA11B22
AEA10D21
AEA9D22
AEA8E21
AEA7E22
AEA6F21
AEA5M20
AEA4J19
AEA3L20
AED31W21
AED30W22
AED29V20
AED28W20
AED27AA22
AED26Y20
AED25AA21
AED24AB22
AED23P20
AED22R22
AED21R21
AED20U21
AED19V21
AED18T20
AED17V22
AED16U20
AED15A18
AED14D17
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
†
TYPE
IPU
‡
EMIFA (32-BIT) − ADDRESS
I/O/ZIPD
EMIFA external address (word address)
Note: EMIF address numbering for the C6413/C6410 devices starts with AEA3 to
intain signal name compatibility with other C64x™ devi
m
C6415, and C6416) [see the 64-bit EMIF adressing scheme in the TMS320C6000 DSPExternal Memory Interface (EMIF) Reference Guide (literature number SPRU266)].
• Also controls initialization of DSP modes at reset (I) via pullu
− Boot mode (AEA[22:21]):
00 – No boot (default mode)
01 − HPI boot (based on HPI_EN pin)
10 − Reserved
11 − EMIFA 8-bit ROM boot
O/ZIPD
−
− AEA[20:19]: Clock mode select for EMIFA (AECLKIN_SEL[1:0])
00 – AECLKIN (default mode)
−
10 − CPU/6 Clock Rate
11 − Reserved
more details, see
EMIFA (32-BIT) − DATA
I/O/ZIPUEMIFA external data
ect
e
gurations section o
411, C6414
ulldown resistors
.
,
April 2004 − Revised May 2005SPRS247E
59
Terminal Functions
Table 3−9. Terminal Functions (Continued)
IPD/
NAMEDESCRIPTION
NO.
AED13B18
AED12C18
AED11A19
AED10C19
AED9B19
AED8A21
AED7D15
AED6A15
AED5B15
AED4C15
AED3A16
AED2C16
AED1B16
AED0C17
−No external pins. The timer 2 peripheral pins are not pinned out as external pins.
TOUT1/LENDIANAA1I/O/ZIPU
TINP1AB1IIPDTimer 1 or general-purpose input
TOUT0/HPI_ENAA2I/O/ZIPD
TINP0AB2IIPDTimer 0 or general-purpose input
SCL1AA18I/O/Z—I2C1 clock. When the I2C module is used, use an external pullup resistor on this pin.
SDA1AA19I/O/Z—I2C1 data. When I2C is used, ensure there is an external pullup resistors on this pin.
SCL0AB18I/O/Z—I2C0 clock. When I2C is used, ensure there is an external pullup resistors on this pin.
SDA0AB19I/O/Z—I2C0 data. When I2C is used, ensure there is an external pullup resistors on this pin.
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
†
TYPE
IPU
‡
EMIFA (32-BIT) − DATA (CONTINUED)
I/O/ZIPUEMIFA external data
TIMER 2
TIMER 1
Timer 1 output (O/Z) or device endian mode (I).
Also controls initialization of DSP modes at reset via pullup/pulldown resistors
− Device Endian mode
0 – Big Endian
1 − Little Endian (default)
For more details on LENDIAN, see the Device Configurations section of this data sheet.
TIMER 0
Timer 0 output pin and HPI enable HPI_EN pin function
The HPI_EN
pin function selects whether the HPI peripheral or McASP1 peripheral,
and GP0[15:8] pins are functionally enabled
0 – HPI is enabled and the McASP1 peripheral and GP0 [15:8] pins are disabled
(default mode); [HPI32, if HD5 = 1; HPI16 if HD5 = 0]
1 − HPI I is disabled and the McASP1 peripheral and GP0 [15:8] pins are
enabled
For more details, see the Device Configurations section of this data sheet.
INTER-INTEGRATED CIRCUIT 1 (I2C1)
INTER-INTEGRATED CIRCUIT 0 (I2C0)
60
April 2004 − Revised May 2005SPRS247E
Terminal Functions
Table 3−9. Terminal Functions (Continued)
IPD/
NAMEDESCRIPTION
NO.
CLKR1G3I/O/ZIPDMcBSP1 receive clock
FSR1G2I/O/ZIPDMcBSP1 receive frame sync
DR1F1IIPDMcBSP1 receive data
CLKS1G1IIPDMcBSP1 external clock source (as opposed to internal)
DX1H2O/ZIPDMcBSP1 transmit data
FSX1H3I/O/ZIPDMcBSP1 transmit frame sync
CLKX1H1I/O/ZIPDMcBSP1 transmit clock
CLKR0C2I/O/ZIPDMcBSP0 receive clock
FSR0D1I/O/ZIPDMcBSP0 receive frame sync
DR0D2IIPDMcBSP0 receive data
CLKS0D3IIPDMcBSP0 external clock source (as opposed to internal)
AFSR0K2I/O/ZIPDMcASP0 receive frame sync or left/right clock (LRCLK).
ACLKR0K1I/O/ZIPDMcASP0 receive bit clock.
AXR0[5]P3McASP0 TX/RX data pin [5].
AXR0[4]N3McASP0 TX/RX data pin [4].
AXR0[3]M3
AXR0[2]L3
AXR0[1]K3McASP0 TX/RX data pin [1].
AXR0[0]L2McASP0 TX/RX data pins[0].
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
HDS1/ACLKR1[3]AB11Host data strobe 1 (I) [default] or McASP1 receive clock input 3 (I).
HDS2AB12IIPUHost data strobe 2 (I)
HRDYY10O/ZIPUHost ready from DSP to host (O)
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
†
TYPE
IPU
‡
MCASP1
Host control − selects between control, address, or data registers (I) [default] or
McASP1 receive frame sync input 1 (I).
Host half-word select − first or second half-word (not necessarily high or low order)
[For HPI16 bus width selection only] (I) [default] oror McASP1 receive frame sync
input 2 (I) .
Host read or write select (I) [default] or McASP1 receive frame sync input 3 (I).
Host-port data pin 27 (I/O/Z) [default] or McASP1 transmit high-frequency master clock
(I/O/Z).
Host-port data pin 22 (I/O/Z) [default] or McASP1 transmit frame sync or left/right clock
(LRCLK) (I/O/Z) .
Host-port data pin 26 (I/O/Z) [default] or McASP1 receive high-frequency master clock
(I/O/Z).
Host-port data pin 23 (I/O/Z) [default] or McASP1 receive frame sync or left/right clock
(LRCLK) (I/O/Z).
I/O/ZIPUHost-port data pins [21:16] (I/O/Z) [default] or McASP1 TX/RX data pins [5:0] (I/O/Z).
HOST-PORT INTERFACE (HPI)
Host control − selects between control, address, or data registers (I) [default] or
McASP1 receive frame sync input 1 (I).
Host half-word select − first or second half-word (not necessarily high or low order)
[For HPI16 bus width selection only] (I) [default] or McASP1 receive frame sync
input 2 (I).
Host read or write select (I) [default] or McASP1 receive frame sync input 3 (I).
62
April 2004 − Revised May 2005SPRS247E
Terminal Functions
Host port data [15:8] pins (I/O/Z) [default] or General purpose input/output (GP0) [15:8]
Hostport data [7:0] pins (I/O/Z)
p
pulldown resistor on the HD5 pin (I):
(
(HPI bus is 16 bits wide. HD[15:0] pins are used and the remaining HD[31:16] pins
pgp)
HD5 pin = 1: HPI operates as an HPI32
Table 3−9. Terminal Functions (Continued)
IPD/
NAMEDESCRIPTION
NO.
HD31Y8I/O/ZIPUHost-port data pin 31 (I/O/Z)
HD30Y11I/O/ZIPUHost-port data pin 30 (I/O/Z)
HD29/AMUTEIN1W11IIPUHost-port data pin 29 (I/O/Z) [default] or McASP1 mute input (I).
HD28/AMUTE1W10I/O/ZIPUHost-port data pin 28 (I/O/Z) [default] or McASP1 mute output (I/O/Z).
HD27/AHCLKX1Y4I/O/ZIPU
HD26/AHCLKR1AB4I/O/ZIPU
HD25/ACLKR1AA9I/O/ZIPUHost-port data pin 25 (I/O/Z) [default] or McASP1 receive bit clock (I/O/Z).
HD24/ACLKX1AA4I/O/ZIPUHost-port data pin 24 (I/O/Z) [default] or McASP1 transmit bit clock (I/O/Z).
HD23/AFSR1AB9I/O/ZIPU
HD22/AFSX1AB5I/O/ZIPU
HD21/AXR1[5]Y9
HD20/AXR1[4]AB8
HD19/AXR1[3]AA6
HD18/AXR1[2]AB7
HD17/AXR1[1]AA7
HD16/AXR1[0]AB6
HD15/GP0[15]Y12
HD14/GP0[14]AA12
HD13/GP0[13
]
AB13
HD12/GP0[12]Y14
HD11/GP0[11]AB14
HD10/GP0[10]AA15
HD9/GP0[9]Y16
HD8/GP0[8]AB16
HD7W12
HD6AA13
HD5Y13
HD4AA14
HD3AB15
HD2AA16
HD1Y15
HD0W15
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
§
These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
†
TYPE
IPU
‡
HOST-PORT INTERFACE (HPI) (CONTINUED)
Host-port data pin 27 (I/O/Z) [default] or McASP1 transmit high-frequency master clock
(I/O/Z).
Host-port data pin 26 (I/O/Z) [default] or McASP1 receive high-frequency master clock
(I/O/Z).
Host-port data pin 23 (I/O/Z) [default] or McASP1 receive frame sync or left/right clock
(LRCLK) (I/O/Z).
Host-port data pin 22 (I/O/Z) [default] or McASP1 transmit frame sync or left/right clock
(LRCLK) (I/O/Z).
I/O/ZIPUHost-port data [21:16] pin (I/O/Z) [default] or McASP1 TX/RX data pins [5:0] (I/O/Z).
I/O/ZIPU
Host-port data [15:8] pins (I/O/Z) [default] or General-purpose input/output (GP0) [15:8]
pins (I/O/Z).
Host-port data [7:0] pins (I/O/Z)
Host-Port bus width user-configurable at device reset via a 1-kΩ pullup/
ulldown resistor on the HD5 pin (I):
I/O/ZIPU
HD5 pin = 0: HPI operates as an HPI16.
HPI bus is 16 bits wide. HD[15:0] pins are used and the remaining HD[31:16] pins
are reserved pins in the high-impedance state.)
=
.
(HPI bus is 32 bits wide. All HD[31:0] pins are used for host-port operations.)
April 2004 − Revised May 2005SPRS247E
63
Terminal Functions
†
IPD/
DESCRIPTION
RSV
Reserved (leave unconnected, do not connect to power or ground)
DV
DD
S
3.3V supply voltage
Table 3−9. Terminal Functions (Continued)
SIGNAL
NAMENO.
TYPE
IPD/
IPU
‡
RESERVED FOR TEST
RSVU4A—Reserved. This pin must be connected directly to CVDD for proper device operation.
RSVF3A—Reserved. This pin must be connected directly to DVDD for proper device operation.
RSVC8IIPDReserved. This pin must be connected directly to VSS for proper device operation.
B11A—
B12I—
RSV
C10OIPU
Reserved (leave unconnected, do not connect to power or ground)
D7O/Z—
D8O/Z—
SUPPLY VOLTAGE PINS
A3
A5
A8
A9
A14
A17
A20
B1
C22
E1
G22
DV
DD
J1
S3.3-V supply voltage
M22
P1
T22
W1
Y2
Y17
Y19
Y22
AB3
AB10
AB17
AB20
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
64
April 2004 − Revised May 2005SPRS247E
Table 3−9. Terminal Functions (Continued)
Terminal Functions
SIGNAL
NAME
NO.
TYPE
TYPE
IPD/
IPD/
†
†
IPU
IPU
‡
‡
DESCRIPTION
DESCRIPTION
SUPPLY VOLTAGE PINS (CONTINUED)
D5
D6
D9
D11
D12
D14
D18
E19
F19
G4
H4
CV
DD
L19
S1.2-V supply voltage (-400, -500 devices)
M4
M19
N4
V4
V19
W5
W9
W13
W16
W18
GROUND PINS
A1
A10
B2
B5
B8
B14
V
SS
B17
GNDGround pins
B20
C1
C3
C5
C7
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
April 2004 − Revised May 2005SPRS247E
65
Terminal Functions
Table 3−9. Terminal Functions (Continued)
SIGNAL
NAME
NO.
TYPE
TYPE
IPD/
IPD/
†
†
IPU
IPU
‡
‡
DESCRIPTION
DESCRIPTION
GROUND PINS (CONTINUED)
C14
C21
D4
D10
D19
F2
F4
G19
G21
J2
J3
K19
L4
L22
N2
N19
V
SS
P4
GNDGround pins
T21
U19
W4
W6
W8
W14
W17
W19
Y3
Y18
Y21
AA3
AA10
AA17
AA20
†
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog Signal
‡
IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the opposite
supply rail, a 1-kΩ resistor should be used.)
66
April 2004 − Revised May 2005SPRS247E
3.11Development Support
In case the customer would like to develop their own features and software on the TMS320C6413/C6410
device, TI offers an extensive line of development tools for the TMS320C6000™ DSP platform, including tools
to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules. The tool’s support documentation is electronically
available within the Code Composer Studio™ Integrated Development Environment (IDE).
The following products support development of C6000™ DSP-based applications:
Software Development Tools:
Code Composer Studio™ Integrated Development Environment (IDE): including Editor
C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software
needed to support any DSP application.
Hardware Development Tools:
Extended Development System (XDS™) Emulator (supports C6000™ DSP multiprocessor system debug)
EVM (Evaluation Module)
For a complete listing of development-support tools for the TMS320C6000™ DSP platform, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL). For
information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
Development Support
Code Composer Studio, DSP/BIOS, and XDS are trademarks of Texas Instruments.
April 2004 − Revised May 2005SPRS247E
67
Device Support
3.12Device Support
3.12.1Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP
devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS
(e.g., TMS320C6412GDK600). Texas Instruments recommends two of three possible prefix designators for
its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development
from engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS / TMDS).
Device development evolutionary flow:
TMXExperimental device that is not necessarily representative of the final device’s electrical
specifications.
TMPFinal silicon die that conforms to the device’s electrical specifications but has not completed quality
and reliability verification.
TMSFully qualified production device.
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification
testing.
TMDS Fully qualified development-support product.
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package
type (for example, GTS), the temperature range (for example, “A” is the extended temperature range), and
the device speed range in megahertz (for example, -500 is 500 MHz). Figure 3−7 provides a legend for
reading the complete device name for any TMS320C6000™ DSP platform member.
The ZTS package, like the GTS package, is a 288-ball plastic BGA only with PB-free balls. For device part
numbers and further ordering information for TMS320C6413/C6410 in the GTS and ZTS package types, see
the TI website (http://www.ti.com) or contact your TI sales representative.
68
April 2004 − Revised May 2005SPRS247E
Device Support
TMS 320 C6413 GTS500
( A )
PREFIXDEVICE SPEED RANGE
TMX = Experimental device
TMP = Prototype device
TMS = Qualified device
SMX= Experimental device, MIL
SMJ = MIL-PRF-38535, QML
SM = High Rel (non-38535)
Blank = 0°C to 90°C, commercial temperature
A=−40°C to 105°C, extended temperature
†
DEVICE FAMILY
320 = TMS320t DSP family
†
The extended temperature “A version” devices may have different operating conditions than the commercial temperature devices.
For more details, see the recommended operating conditions portion of this data sheet.
‡
BGA =Ball Grid Array
§
The ZTS mechanical package designator represents the version of the GTS package with Pb-free balls. For more detailed
information, see the Mechanical Data section of this document.
¶
For actual device part numbers (P/Ns) and ordering information, see the TI website (www.ti.com).
For additional information, see the TMS320C6413, TMS320C6410 Digital Signal Processors Silicon Errata
(literature number SPRZ219)
April 2004 − Revised May 2005SPRS247E
69
Device Support
3.12.2Documentation Support
Extensive documentation supports all TMS320™ DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data
sheets, such as this document, with design specifications; complete user’s reference guides for all devices
and tools; technical briefs; development-support tools; on-line help; and hardware and software applications.
The following is a brief, descriptive list of support documentation specific to the C6000™ DSP devices:
The TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189) describes the
C6000™ DSP CPU (core) architecture, instruction set, pipeline, and associated interrupts.
The TMS320C6000 DSP Peripherals Overview Reference Guide (literature number SPRU190) provides an
overview and briefly describes the functionality of the peripherals available on the C6000™ DSP platform of
devices. This document also includes a table listing the peripherals available on the C6000 devices along with
literature numbers and hyperlinks to the associated peripheral documents.
The TMS320C64x Technical Overview (literature number SPRU395) gives an introduction to the C64x™
digital signal processor, and discusses the application areas that are enhanced by the C64x™ DSP
VelociTI.2™ VLIW architecture.
The TMS320C6000 DSP Multichannel Audio Serial Port (McASP) Reference Guide (literature number
SPRU041) describes the functionality of the McASP peripheral.
TMS320C6000 DSP Inter-Integrated Circuit (I2C) Module Reference Guide (literature number SPRU175)
describes the functionality of the I2C peripherals available on the C6413/C6410 device except for the
additional interrupt and new GPIO capability. For more detailed information on the additional interrupt and
GPIO capability, see the I2C section of this data manual and the TMS320C6410/C6413 DSP Inter-IntegratedCircuit (I2C) Module Reference Guide (literature number SPRZ221).
The TMS320C6413, TMS320C6410 Digital Signal Processors Silicon Errata (literature number SPRZ219)
describes the known exceptions to the functional specifications for particular silicon revisions of the
TMS320C6413 and TMS320C6410 devices.
The Using IBIS Models for Timing Analysis application report (literature number SPRA839) describes how to
properly use IBIS models to attain accurate timing analysis for a given system.
The tools support documentation is electronically available within the Code Composer Studio™ Integrated
Development Environment (IDE). For a complete listing of C6000™ DSP latest documentation, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL).
Most of the internal C64x™ DSP clocks are generated from a single source through the CLKIN pin. This source
clock either drives the PLL, which multiplies the source clock frequency to generate the internal CPU clock,
or bypasses the PLL to become the internal CPU clock.
To use the PLL to generate the CPU clock, the external PLL filter circuit must be properly designed. Figure 4−1
shows the external PLL circuitry for either x1 (PLL bypass) or other PLL multiply modes.
To minimize the clock jitter, a single clean power supply should power both the C64x™ DSP device and the
external clock oscillator circuit. The minimum CLKIN rise and fall times should also be observed. For the input
clock timing requirements, see the input and output clocks electricals section.
Rise/fall times, duty cycles (high/low pulse durations), and the load capacitance of the external clock source
must meet the DSP requirements in this data sheet (see the electrical characteristics over recommendedranges of supply voltage and operating case temperature table and the input and output clocks electricals
section).
April 2004 − Revised May 2005SPRS247E
71
Clock PLL and Oscillator
‡
CLKMODE0
CLKMODE1
CLKMODE2
CLKMODE3
C5
470 pF
†
C7
†
C8
3.3 V
†
R
C6
470 pF
CPU Clock
EMI
Filter
C2C1
10 µF 0.1 µF
PLLV
PLLMULT
/2
/8
/4
/6
Peripheral Bus, EDMA
Clock
Timer Internal Clock
CLKOUT4, Peripheral Clock
CLKOUT6
PLL
x5, x6−x12, x16,
x18−x22, x24
PLLCLK
1
0
00 01 10
/4
/2
CLKINSEL
CLKIN
OSCV
OSCIN
DD
‡
1
EMIF00 01 10
0
†
†
S
OSCOUT
R
B
SS
‡
OSCV
Osc.
EK2RATE
(GBLCTL.[19,18])
AUXCLK
for McASPs
OSC_DIS
AECLKIN
AEA[20:19]
Internal to C6413/10
(For the PLL options, CLKMODE pins setup, and PLL clock frequency ranges,
see Table 4−1 and Table 4−2.)
†
Exact values for these components depend on choice of crystal. For recommended crystal and component values, see Table 4−3.
‡
Do not connect any of these nodes to board power or ground if the oscillator is used. They are internally connected for proper operation.
If CLKIN is being used instead of the oscillator, then OSCV
OSCV
may be tied to ground.
SS
and OSCVSS may either be left open, or OSCVDD may be tied to CVDD and
DD
ECLKOUT2ECLKOUT1
NOTES: A. Place all PLL external components (C1, C2, and the EMI Filter) as close to the C6000™ DSP device as possible. For the best
performance, TI recommends that all the PLL external components be on a single side of the board without jumpers, switches, or
components other than the ones shown.
B. For reduced PLL jitter, maximize the spacing between switching signals and the PLL external components (C1, C2, and the EMI
Filter).
C. The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, DV
DD
.
D. EMI filter manufacturer TDK part number ACF451832-333, -223, -153, -103. Panasonic part number EXCCET103U.
E. If CLKIN is used instead of OSCIN, tie OSCIN to Ground to minimize noise and current. (Do not leave OSCIN floating.)
Figure 4−1. External PLL Circuitry for Either PLL Multiply Modes or x1 (Bypass) Mode
72
April 2004 − Revised May 2005SPRS247E
Clock PLL and Oscillator
75
For proper C6413/C6410 device operation, the CLKINSEL pin must be used in conjunction with the OSC_DIS
pin. The OSC_DIS pin must follow the CLKINSEL pin operation. For more details on these two configuration
pins, see the Device Configuration at Device Reset section of this data sheet.
Table 4−1. TMS320C6413 PLL Multiply Factor Options, Clock Frequency Ranges,
and Typical Lock Time for −500 Devices
GTS and ZTS PACKAGES − 23 x 23 mm BGA
CLKMODE[3:0]
0000Bypass (x1)12−10012−10012−3012−30N/A
0001x528−100140−50028−30140−150
0010x623−83140−50023−30140−180
0011x720−71140−50020−30140−210
0100x817−63140−50017−30140−240
0101x915−56140−50015−30140−270
0110x1014−50140−50014−30140−300
0111x1112−45140−50012−30140−330
1000x1212−42144−50012−30144−360
1001x1612−31192−50012−30192−480
1010x1812−28216−50012−28216−500
1011x1912−26228−50012−26228−500
1100x2012−25240−50012−25240−500
1101x2112−24252−50012−24252−500
1110x2212−23264−50012−23264−500
1111x2412−21288−50012−21288−500
†
Use external pullup resistors on the CLKMODE pins (CLKMODE1 and CLKMODE0) to set the C6413/C6410 device to one of the valid PLL
multiply clock modes (x5, x6, x7, x8, x9, x10, x11, x12, x16, x18, x19, x20, x21, x22, or x24). With internal pulldown resistors on the CLKMODE
pins (CLKMODE3, CLKMODE2, CLKMODE1, CLKMODE0), the default clock mode is x1 (bypass).
‡
Under some operating conditions, the maximum PLL lock time may vary by as much as 150% from the specified typical value. For example, if
the typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
(PLL MULTIPLY FACTORS)
CLKMODE
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE
(MHz)
†
OSCIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE
(MHz)
TYPICAL
LOCK TIME
‡
(µs)
75
April 2004 − Revised May 2005SPRS247E
73
Clock PLL and Oscillator
75
Table 4−2. TMS320C6410 PLL Multiply Factor Options, Clock Frequency Ranges,
and Typical Lock Time for −400 Devices
GTS and ZTS PACKAGES − 23 x 23 mm BGA
CLKMODE[3:0]
0000Bypass (x1)12−10012−10012−3012−30N/A
0001x528−80140−40028−30140−150
0010x623−67140−40023−30140−180
0011x720−57140−40020−30140−210
0100x817−50140−40017−30140−240
0101x915−44140−40015−30140−270
0110x1014−40140−40014−30140−300
0111x1112−36140−40012−30140−330
1000x1212−33144−40012−30144−360
1001x1612−25192−40012−25192−400
1010x1812−22216−40012−22216−400
1011x1912−21228−40012−21228−400
1100x2012−20240−40012−20240−400
1101x2112−19252−40012−19252−400
1110x2212−18264−40012−18264−400
1111x2412−17288−40012−17288−400
†
Use external pullup resistors on the CLKMODE pins (CLKMODE1 and CLKMODE0) to set the C6413/C6410 device to one of the valid PLL
multiply clock modes (x5, x6, x7, x8, x9, x10, x11, x12, x16, x18, x19, x20, x21, x22, or x24). With internal pulldown resistors on the CLKMODE
pins (CLKMODE3, CLKMODE2, CLKMODE1, CLKMODE0), the default clock mode is x1 (bypass).
‡
Under some operating conditions, the maximum PLL lock time may vary by as much as 150% from the specified typical value. For example, if
the typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
(PLL MULTIPLY FACTORS)
CLKMODE
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE
(MHz)
†
OSCIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE
(MHz)
TYPICAL
LOCK TIME
‡
(µs)
75
For the lowest jitter on the oscillator circuit, it is recommended that a pair of 470-pF capacitors be connected
between isolated (not directly connected to the board supply) OSCV
and OSCVSS pins. This helps to cancel
DD
out switching noise from other circuits on the DSP device.
Table 4−3 shows a recommended crystal and tank circuit values for the C6413/C6410 PLL circuitry.
Table 4−3. Crystal and Tank Circuit Recommendations
ComponentsRECOMMENDED PART NUMBERS or VALUESMANUFACTURER
1AS245766AHA (SMD-49)
1AF245766AAA (AT-49)
1AS225796AG (SMD-49)
1AF225796A (AT-49)
1 MΩ—
0 Ω—
8 pF—
KDS™ Diashinku Corp.
Crystal
R
B
R
S
C7
C8
24.576 MHz
22.5792 MHz
74
April 2004 − Revised May 2005SPRS247E
4.2Host-Port Interface (HPI) Peripheral
The TMS320C6413/C6410 device includes a user-configurable 16-bit or 32-bit Host-port interface
(HPI16/HPI32). On the C6413/C6410 device the HPI peripheral pins are muxed with the McASP1 and GP0
peripheral pins. By default, the HPI peripheral pin functions are enabled. For more detailed information on the
C6413/C6410 device pin muxing, see the Device Configurations section of this data sheet.
The HPI peripheral can be disabled or enabled at reset through the HPI enable function of the TOUT0/HPI_EN
pin. The HPI is enabled when the TOUT0/HPI_EN pin is sampled low at reset and it is disabled if the pin is
sample high at reset. The TOUT0/HPI_EN
However, the HPI can be disabled via an external pullup resistor or by having an external device such as an
FPGA/CPLD drive that pin high at reset. In the latter case, the external device should ensure it has stopped
driving this pin to avoid contention. The HPI enable function can only be set a reset and cannot be changed
via software.
The HD5 pin controls the HPI_WIDTH, allowing the user to configure the HPI as a 16-bit or 32-bit peripheral.
For more details on HPI peripheral configuration and the associated pins, see the Device Configurations
section of this data sheet.
Host-Port Interface (HPI) Peripheral
pin has an internal pulldown that enables the HPI by default.
April 2004 − Revised May 2005SPRS247E
75
Multichannel Audio Serial Port (McASP) Peripheral
4.3Multichannel Audio Serial Port (McASP) Peripheral
The TMS320C6413/C6410 device includes two multichannel audio serial port (McASP) interface peripheral
(McASP0 and McASP1). On the C6413/C6410 device the McASP1 peripheral pins are muxed with the HPI
peripheral pins. By default, the HPI peripheral pin functions are enabled. For the C6413/C6410 device
McASP1 is a standalone peripheral, not muxed. For more detailed information on the C6413/C6410 device
pin muxing, see the Device Configurations section of this data sheet.
The McASP is a serial port optimized for the needs of multichannel audio applications.
The McASP consists of a transmit and receive section. These sections can operate completely independently
with different data formats, separate master clocks, bit clocks, and frame syncs or alternatively, the transmit
and receive sections may be synchronized. The McASP module also includes a pool of 16 shift registers that
may be configured to operate as either transmit data, receive data, or general-purpose I/O (GPIO).
The transmit section of the McASP can transmit data in either a time-division-multiplexed (TDM) synchronous
serial format or in a digital audio interface (DIT) format where the bit stream is encoded for S/PDIF, AES-3,
IEC-60958, CP-430 transmission. The receive section of the McASP supports the TDM synchronous serial
format.
The McASP can support one transmit data format (either a TDM format or DIT format) and one receive format
at a time. All transmit shift registers use the same format and all receive shift registers use the same format.
However, the transmit and receive formats need not be the same.
Both the transmit and receive sections of the McASP also support burst mode which is useful for non-audio
data (for example, passing control information between two DSPs).
The McASP peripheral has additional capability for flexible clock generation, and error detection/handling, as
well as error management.
For more detailed information on and the functionality of the McASP peripheral, see the TMS320C6000 DSPMultichannel Audio Serial Port (McASP) Reference Guide (literature number SPRU041).
4.3.1McASP Block Diagram
Figure 4−2 illustrates the major blocks along with external signals of the TMS320C6413/C6410 McASP
peripheral; and shows the 6 serial data [AXRx] pins. The McASP also includes full general-purpose I/O (GPIO)
control, so any pins not needed for serial transfers can be used for general-purpose I/O.
76
April 2004 − Revised May 2005SPRS247E
McASPx
Multichannel Audio Serial Port (McASP) Peripheral
DMA Transmit
DIT
RAM
Transmit
Clock Check
(High-
Frequency)
Error
Detect
Receive
Clock Check
(High-
Frequency)
Transmit
Data
Serializer 0
Serializer 1
Serializer 2
Serializer 3
Serializer 4
Serializer 5
Serializer 6
Transmit
Frame Sync
Generator
Transmit
Clock
Generator
Receive
Clock
Generator
Receive
Frame Sync
GeneratorFormatter
AFSXx
AHCLKXx
ACLKXx
AMUTEx
AMUTEINx
AHCLKRx
ACLKRx
†
AFSRx
AXRx[0]
AXRx[1]
AXRx[2]
AXRx[3]
AXRx[4]
AXRx[5]
†
Serializer 7
INDIVIDUALLY PROGRAMMABLE TX/RX/GPIO
Receive
Data
Formatter
GPIO
Control
DMA Receive
†
On the C6413/C6410 device, the McASP1 peripheral has some additional pins muxed with AFSR1 and with ACLKR1 pins (i.e.,
AFSR1[1], AFSR1[2], AFSR1[3] and ACLKR1[1]. ACLKR1[2], ACLKR1[3], respectively).
‡
On the C6413/C6410 device, the McASP0 peripheral is standalone, not muxed and the McASP1 peripheral is muxed with the HPI
peripheral. For more detailed information on multiplexed pins, see the Device Configurations section of this data sheet.
Figure 4−2. McASP0 and McASP1‡ Configuration
April 2004 − Revised May 2005SPRS247E
77
I2C
4.4I2C
The TMS320C6413/C6410 device includes two I2C peripheral modules (I2C0 and I2C1). NOTE: when using
the I2C modules (any mode), ensure there are external pullup resistors on the SDAx and SCLx pins.
One of the I2C modules on the TMS320C6413/C6410 may be used by the DSP to control local peripherals
ICs (DACs, ADCs, etc.) while the other module may be used to communicate with other controllers in a system
or to implement a user interface.
The I2Cx port supports:
•Compatible with Philips I2C Specification Revision 2.1 (January 2000)
•Fast Mode up to 400 Kbps (no fail-safe I/O buffers)
•Noise Filter to remove noise 50 ns or less
•7- and 10-Bit Device Addressing Modes
•Multi-Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality
•Events: DMA, Interrupt, or Polling
•Slew-Rate Limited Open-Drain Output Buffers
•General-purpose input and output (GPIO) functionality for I2C pins
For more detailed information on C6413/6410 I2C additional features, such as GPIO capability, etc., see the
TMS320C6000 DSP Inter−Integrated Circuit (I2C) Module Reference Guide (literature number SPRU175)
and the TMS320C6410/C6413/C6418 DSP Inter−Integrated Circuit (I2C) Module Reference Guide (literature
number SPRZ221) addendum.
78
April 2004 − Revised May 2005SPRS247E
Figure 4−3 is a block diagram of the I2C0 and I2C1 modules.
General-Purpose Input/Output (GPIO)
I2C Clock
I2C Data
SCL
SDA
I2Cx Module
GPIO Control
I2CPFUNCx
I2CPDIRx
I2CPDINx
I2CPDOUTx
I2CPDSETx
I2CPDCLRx
Noise
Filter
Pin
Function
Pin
Direction
Pin Data
In
Pin Data
Out
Pin Data
Set
Pin Data
Clear
Noise
Filter
Clock
Prescale
I2CPSCx
Bit Clock
Generator
I2CCLKHx
I2CCLKLx
Transmit
I2CXSRx
I2CDXRx
Receive
I2CDRRx
I2CRSRx
Transmit
Shift
Transmit
Buffer
Receive
Buffer
Receive
Shift
Peripheral Clock
(CPU/4)
Control
I2COARx
I2CSARx
I2CMDRx
I2CCNTx
I2CEMDRx
Interrupt/DMA
I2CIERx
I2CSTRx
I2CISRCx
Own
Address
Slave
Address
Mode
Data
Count
Extended
Mode
Interrupt
Enable
Interrupt
Status
Interrupt
Source
NOTE A: Shading denotes control/status registers.
Figure 4−3. I2Cx Module Block Diagram
4.5General-Purpose Input/Output (GPIO)
On the C6413/C6410 device the GPIO peripheral pins GP0[15:9] are muxed with the HPI peripheral pins
HD[15:9], respectively. By default, the HPI peripheral pin functions are enabled [TOUT0/HPI_EN
pulled low]. For more detailed information on device/peripheral configuration and the C6413/C6410 device
pin muxing, see the Device Configurations section of this data sheet.
To use the GP0[15:0] software-configurable GPIO pins, the GPxEN bits in the GP Enable (GPEN) Register
and the GPxDIR bits in the GP Direction (GPDIR) Register must be properly configured.
GPxEN = 1GP[x] pin is enabled
GPxDIR =0GP[x] pin is an input
GPxDIR =1GP[x] pin is an output
where “x” represents one of the 15 through 0 GPIO pins
Figure 4−4 shows the GPIO enable bits in the GPEN register for the C6413/C6410 device. To use any of the
GPx pins as general-purpose input/output functions, the corresponding GPxEN bit must be set to “1”
(enabled). Default values are device-specific, so refer to Figure 4−4 for the C6413/C6410 default
configuration.
Figure 4−5 shows the GPIO direction bits in the GPDIR register. This register determines if a given GPIO pin
is an input or an output providing the corresponding GPxEN bit is enabled (set to “1”) in the GPEN register.
By default, all the GPIO pins are configured as input pins.
Legend: R/W = Readable/Writeable; -n = value after reset, -x = undefined value after reset
DIR
GP14
DIR
GP13
DIR
GP12
DIR
GP11
DIR
10
GP10
DIR
98
GP9
DIR
GP8
DIR
GP7
DIR
6
7
GP6
DIR
5
GP5
DIR
43
GP4
DIR
GP3
DIR
2
GP2
DIR
10
GP1
DIR
GP0
DIR
Figure 4−5. GPIO Direction Register (GPDIR) [Hex Address: 01B0 0004]
For more detailed information on general-purpose inputs/outputs (GPIOs), see the TMS320C6000 DSP
General-Purpose Input/Output (GPIO) Reference Guide (literature number SPRU584).
April 2004 − Revised May 2005SPRS247E
81
Power-Down Modes Logic
4.6Power-Down Modes Logic
Figure 4−6 shows the power-down mode logic on the C6413/C6410.
CLKOUT4
Internal Clock Tree
Clock
Distribution
and Dividers
PD1
PD2
CPU
IFR
IER
CSR
Internal
Peripherals
TMS320C6413/C6410
PD3
Power-
Down
Logic
PWRD
Clock
PLL
CLKINRESET
†
External input clocks, with the exception of CLKIN, are not gated by the power-down mode logic.
CLKOUT6
Figure 4−6. Power-Down Mode Logic
Note: to further save power, the PERCFG register can be used to disable unused peripherals. For more
detailed information on disabling peripherals using the PERCFG register, see the Device Configurations
section of this data sheet.
4.6.1Triggering, Wake-up, and Effects
The power-down modes and their wake-up methods are programmed by setting the PWRD field (bits 15−10)
of the control status register (CSR). The PWRD field of the CSR is shown in Figure 4−7 and described in
Table 4−4. When writing to the CSR, all bits of the PWRD field should be set at the same time. Logic 0 should
be used when writing to the reserved bit (bit 15) of the PWRD field. The CSR is discussed in detail in the
TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189).
†
82
April 2004 − Revised May 2005SPRS247E
Power-Down Modes Logic
3116
15141312111098
Enable or
Reserved
R/W-0R/W-0R/W-0R/W-0R/W-0R/W-0
70
Legend: R/W−x = Read/write reset value
NOTE: The shadowed bits are not part of the power-down logic discussion and therefore are not covered here. For information on these other
bit fields in the CSR register, see the TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189).
Non-Enabled
Interrupt Wake
Enabled
Interrupt Wake
PD3PD2PD1
Figure 4−7. PWRD Field of the CSR Register
A delay of up to nine clock cycles may occur after the instruction that sets the PWRD bits in the CSR before the
PD mode takes effect. As best practice, NOPs should be padded after the PWRD bits are set in the CSR to
account for this delay.
If PD1 mode is terminated by a non-enabled interrupt, the program execution returns to the instruction where
PD1 took effect. If PD1 mode is terminated by an enabled interrupt, the interrupt service routine will be executed
first, then the program execution returns to the instruction where PD1 took effect. In the case with an enabled
interrupt, the GIE bit in the CSR and the NMIE bit in the interrupt enable register (IER) must also be set in order
for the interrupt service routine to execute; otherwise, execution returns to the instruction where PD1 took effect
upon PD1 mode termination by an enabled interrupt.
PD2 and PD3 modes can only be aborted by device reset. Table 4−4 summarizes all the power-down modes.
April 2004 − Revised May 2005SPRS247E
83
Power-Supply Sequencing
Power down mode blocks the internal clock inputs at the
Table 4−4. Characteristics of the Power-Down Modes
PRWD FIELD
(BITS 15−10)
000000No power-down——
001001PD1Wake by an enabled interrupt
010001PD1
011010PD2
011100PD3
All othersReserved——
†
When entering PD2 and PD3, all functional I/O remains in the previous state. However, for peripherals which are asynchronous in nature or
peripherals with an external clock source, output signals may transition in response to stimulus on the inputs. Under these conditions,
peripherals will not operate according to specifications.
POWER-DOWN
MODE
†
†
WAKE-UP METHODEFFECT ON CHIP’S OPERATION
CPU halted (except for the interrupt logic)
Power-down mode blocks the internal clock inputs at the
Wake by an enabled or
non-enabled interrupt
Wake by a device reset
Wake by a device reset
boundary of the CPU, preventing most of the CPU’s logic from
switching. During PD1, EDMA transactions can proceed between
peripherals and internal memory.
Output clock from PLL is halted, stopping the internal clock
structure from switching and resulting in the entire chip being
halted. All register and internal RAM contents are preserved. All
functional I/O “freeze” in the last state when the PLL clock is
turned off.
Input clock to the PLL stops generating clocks. All register and
internal RAM contents are preserved. All functional I/O “freeze” in
the last state when the PLL clock is turned off. Following reset, the
PLL needs time to re-lock, just as it does following power-up.
Wake-up from PD3 takes longer than wake-up from PD2 because
the PLL needs to be re-locked, just as it does following power-up.
4.6.2C64x Power-Down Mode with an Emulator
If user power-down modes are programmed, and an emulator is attached, the modes will be masked to allow
the emulator access to the system. This condition prevails until the emulator is reset or the cable is removed
from the header. If power measurements are to be performed when in a power-down mode, the emulator cable
should be removed.
When the DSP is in power-down mode PD2 or PD3, emulation logic will force any emulation execution
command (such as Step or Run) to spin in IDLE. For this reason, PC writes (such as loading code) will fail.
A DSP reset will be required to get the DSP out of PD2/PD3.
4.7Power-Supply Sequencing
TI DSPs do not require specific power sequencing between the core supply and the I/O supply. However,
systems should be designed to ensure that neither supply is powered up for extended periods of time
(>1 second) if the other supply is below the proper operating voltage.
4.7.1Power-Supply Design Considerations
A dual-power supply with simultaneous sequencing can be used to eliminate the delay between core and I/O
power up. A Schottky diode can also be used to tie the core rail to the I/O rail (see Figure 4−8).
84
April 2004 − Revised May 2005SPRS247E
Power-Supply Sequencing
I/O Supply
DV
DD
Schottky
Diode
Core Supply
CV
V
GND
C6000
DSP
DD
SS
Figure 4−8. Schottky Diode Diagram
Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize
inductance and resistance in the power delivery path. Additionally, when designing for high-performance
applications utilizing the C6000™ platform of DSPs, the PC board should include separate power planes for
core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors.
TI DSPs do not require specific power sequencing between the core supply and the I/O supply. However,
systems should be designed to ensure that neither supply is powered up for extended periods of time if the
other supply is below the proper operating voltage.
4.8Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to the DSP. Assuming 0603 caps, the user should be able to fit a total of 60 caps, 30 for the
core supply and 30 for the I/O supply. These caps need to be close to the DSP power pins, no more than
1.25 cm maximum distance to be effective. Physically smaller caps, such as 0402, are better because of their
lower parasitic inductance. Proper capacitance values are also important. Small bypass caps (near 560 pF)
should be closest to the power pins. Medium bypass caps (220 nF or as large as can be obtained in a small
package) should be next closest. TI recommends no less than 8 small and 8 medium caps per supply (32 total)
be placed immediately next to the BGA vias, using the “interior” BGA space and at least the corners of the
“exterior”.
Eight larger caps (4 for each supply) can be placed further away for bulk decoupling. Large bulk caps (on the
order of 100 µF) should be furthest away (but still as close as possible). No less than 4 large caps per supply
(8 total) should be placed outside of the BGA.
Any cap selection needs to be evaluated from a yield/manufacturing point-of-view. As with the selection of any
component, verification of capacitor availability over the product’s production lifetime should be considered.
April 2004 − Revised May 2005SPRS247E
85
Peripheral Power-Down Operation
4.9Peripheral Power-Down Operation
The C6413/C6410 device can be powered down in two ways:
•Power-down due to software configuration − relates to the default state of the peripheral configuration bits
in the PERCFG register.
•Power-down during run-time via software configuration
On the C6413/C6410 device, the HPI, McASP1, and GP0 peripherals pin muxing is controlled (selected) at
the pin level during chip reset (e.g., HPI_EN
MCASP1EN bit in the peripheral configuration register (PERCFG.8) must be configured properly to enable
the McASP1 peripheral.
The McASP1, McASP0, I2C1, and I2C0 peripheral functions are selected via the peripheral configuration
(PERCFG) register bits.
For more detailed information on the peripheral configuration pins and the PERCFG register bits, see the
Device Configurations section of this document.
and HD5 pins). If McASP1 pin muxing is selected, then the
86
April 2004 − Revised May 2005SPRS247E
4.10IEEE 1149.1 JTAG Compatibility Statement
The TMS320C6413/C6410 DSP requires that both TRST and RESET be asserted upon power up to be
properly initialized. While RESET
resets are required for proper operation.
initializes the DSP core, TRST initializes the DSP’s emulation logic. Both
IEEE 1149.1 JTAG Compatibility Statement
Note: TRST
after TRST
While both TRST
DSP to boot properly. TRST
and DSP’s emulation logic in the reset state. TRST
JTAG controller to debug the DSP or exercise the DSP’s boundary scan functionality. RESET
is synchronous and must be clocked by TCLK; otherwise, BSCAN may not respond as expected
is asserted.
and RESET need to be asserted upon power up, only RESET needs to be released for the
may be asserted indefinitely for normal operation, keeping the JTAG port interface
only needs to be released when it is necessary to use a
must be
released in order for boundary-scan JTAG to read the variant field of IDCODE correctly. Other boundary-scan
instructions work correctly independent of current state of RESET
For maximum reliability, the TMS320C6413/C6410 DSP includes an internal pulldown (IPD) on the TRST
to ensure that TRST
will always be asserted upon power up and the DSP’s internal emulation logic will always
be properly initialized. JTAG controllers from Texas Instruments actively drive TRST
third-party JTAG controllers may not drive TRST
using this type of JTAG controller, assert TRST
high but expect the use of a pullup resistor on TRST. When
to intialize the DSP after powerup and externally drive TRST
.
pin
high. However, some
high before attempting any emulation or boundary scan operations.
Following the release of RESET, the low-to-high transition of TRST must occur to latch the state of EMU1 and
EMU0. The EMU[1:0] pins configure the device for either Boundary Scan mode or Normal/Emulation mode.
For more detailed information, see the terminal functions section of this data sheet.
Note: The DESIGN_WARNING section of the TMS320C6413/C6410 BSDL file contains information and
constraints regarding proper device operation while in Boundary Scan Mode.
For more detailed information on the C6413/C6410 JTAG emulation, see the TMS320C6000 DSP Designingfor JTAG Emulation Reference Guide (literature number SPRU641).
4.11EMIF Device Speed
The rated EMIF speed of these devices only applies to the SDRAM interface when in a system that meets the
following requirements:
•1 chip-enable (CE) space (maximum of 2 chips) of SDRAM connected to EMIF
•up to 1 CE space of buffers connected to EMIF
•EMIF trace lengths between 1 and 3 inches
•143-MHz SDRAM for 100-MHz operation
Other configurations may be possible, but timing analysis must be done to verify all AC timings are met.
Verification of AC timings is mandatory when using configurations other than those specified above. TI
recommends utilizing I/O buffer information specification (IBIS) to analyze all AC timings.
To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS Modelsfor Timing Analysis application report (literature number SPRA839).
To maintain signal integrity, serial termination resistors should be inserted into all EMIF output signal lines (see
the Terminal Functions table for the EMIF output signals).
For more detailed information on the C6413/C6410 EMIF peripheral, see the TMS320C6000 DSP External
Memory Interface (EMIF) Reference Guide (literature number SPRU266).
April 2004 − Revised May 2005SPRS247E
87
Bootmode
4.12Bootmode
The C6413/C6410 device resets using the active-low signal RESET. While RESET is low, the device is held
in reset and is initialized to the prescribed reset state. Refer to reset timing for reset timing characteristics and
states of device pins during reset. The release of RESET
device configuration and boot mode.
The C6413/C6410 has three types of boot modes:
•Host boot
starts the processor running with the prescribed
If host boot is selected, upon release of RESET
, the CPU is internally “stalled” while the remainder of the
device is released. During this period, an external host can initialize the CPU’s memory space as
necessary through the host interface, including internal configuration registers, such as those that control
the EMIF or other peripherals. For the C6413/C6410 device, the HPI peripheral is used for host boot
providing the TOUT0/HPI_EN
pin is low, enabling the HPI peripheral [default]. Once the host is finished
with all necessary initialization, it must set the DSPINT bit in the HPIC register to complete the boot
process. This transition causes the boot configuration logic to bring the CPU out of the “stalled” state. The
CPU then begins execution from address 0. The DSPINT condition is not latched by the CPU, because it
occurs while the CPU is still internally “stalled”. Also, DSPINT brings the CPU out of the “stalled” state only
if the host boot process is selected. All memory may be written to and read by the host. This allows for the
host to verify what it sends to the DSP if required. After the CPU is out of the “stalled” state, the CPU needs
to clear the DSPINT, otherwise, no more DSPINTs can be received.
•EMIF boot (using default ROM timings)
Upon the release of RESET
, the 1K-Byte ROM code located in the beginning of CE1 is copied to address 0
by the EDMA using the default ROM timings, while the CPU is internally “stalled”. The data should be
stored in the endian format that the system is using. In this case, the EMIF automatically assembles
consecutive 8-bit bytes to form the 32-bit instruction words to be copied. The transfer is automatically done
by the EDMA as a single-frame block transfer from the ROM to address 0. After completion of the block
transfer, the CPU is released from the “stalled” state and starts running from address 0.
•No boot
With no boot, the CPU begins direct execution from the memory located at address 0. Note: operation is
undefined if invalid code is located at address 0.
4.13Reset
A hardware reset (RESET) is required to place the DSP into a known good state out of power-up. The RESET
signal can be asserted (pulled low) prior to ramping the core and I/O voltages or after the core and I/O voltages
have reached their proper operating conditions. As a best practice, reset should be held low during power-up.
Prior to deasserting RESET
operating conditions and CLKIN should also be running at the correct frequency.
88
(low-to-high transition), the core and I/O voltages should be at their proper
April 2004 − Revised May 2005SPRS247E
5Device Electrical Specifications
Device Electrical Specifications
5.1Absolute Maximum Ratings Over Operating Case Temperature Range (Unless Otherwise
Noted)
†
Supply voltage ranges:CVDD (see Note 1)− 0.3 V to 1.8 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to V
SS
.
5.2Recommended Operating Conditions
MINNOMMAXUNIT
CV
DV
V
V
V
V
T
C
‡
Future variants of the C64x DSPs may operate at voltages ranging from 0.9 V to 1.4 V to provide a range of system power/performance options.
TI highly recommends that users design-in a supply that can handle multiple voltages within this range (i.e., 1.2 V, 1.25 V, 1.3 V, 1.35 V, 1.4 V
with ± 3% tolerances) by implementing simple board changes such as reference resistor values or input pin configuration modifications. Examples
of such supplies include the PT4660, PT5500, PT5520, PT6440, and PT6930 series from Power Trends, a subsidiary of Texas Instruments. Not
incorporating a flexible supply may limit the system’s ability to easily adapt to future versions of C64x devices.
§
The absolute maximum ratings should not be exceeded for more than 30% of the cycle period.
Supply voltage, Core (-400, -500 device)
DD
Supply voltage, I/O3.143.33.46V
DD
Supply ground000V
SS
High-level input voltage2V
IH
Low-level input voltage0.8V
IL
Maximum voltage during overshoot/undershoot−1.0
OS
Operating case temperature
‡
Commercial temperature devices
(GTS and ZTS)
Extended temperature devices
(GTSA and ZTSA)
1.141.21.26V
§
090_C
−40105_C
4.3
§
V
April 2004 − Revised May 2005SPRS247E
89
Device Electrical Specifications
IOLLowlevel output current
5.3Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating
Case Temperature (Unless Otherwise Noted)
PARAMETERTEST CONDITIONS
V
V
High-level output voltageDVDD = MIN,I
OH
Low-level output voltageDVDD = MIN,I
OL
VI = VSS to DVDD no opposing internal
resistor
= VSS to DVDD opposing internal
V
I
I
I
OH
Input current
High-level output current
I
pullup resistor
VI = VSS to DVDD opposing internal
pulldown resistor
‡
‡
EMIF, CLKOUT4, CLKOUT6, EMUx−16mA
Timer, TDO, GPIO, McBSP, HPI
EMIF, CLKOUT4, CLKOUT6, EMUx16mA
I
OL
Low-level output current
Timer, TDO, GPIO, McBSP, HPI
SCL1, SDA1, SCL0, and SDA03mA
I
OZ
I
CDD
I
DDD
C
C
†
For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
‡
Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
§
Measured with average activity (50% high/50% low power) at 25°C case temperature and 100-MHz EMIF for -500 and -400 speeds. This model
Off-state output currentVO = DV
Core supply current
I/O supply current
Input capacitance10pF
i
Output capacitance10pF
o
§
§
CVDD = 1.2 V, CPU clock = 500 MHz568mA
CVDD = 1.2 V, CPU clock = 400 MHz465mA
DVDD = 3.3 V, CPU clock = 500 MHz140mA
DVDD = 3.3 V, CPU clock = 400 MHz132mA
or 0 V±10uA
DD
represents a device performing high-DSP-activity operations 50% of the time, and the remainder performing low-DSP-activity operations. The
high/low-DSP-activity models are defined as follows:
High-DSP-Activity Model:
CPU: 8 instructions/cycle with 2 LDDW instructions [L1 Data Memory: 128 bits/cycle via LDDW instructions;
L1 Program Memory: 256 bits/cycle; L2/EMIF EDMA: 50% writes, 50% reads to/from SDRAM (50% bit-switching)]
McBSP: 2 channels at E1 rate
Timers: 2 timers at maximum rate
Low-DSP-Activity Model:
CPU: 2 instructions/cycle with 1 LDH instruction [L1 Data Memory: 16 bits/cycle; L1 Program Memory: 256 bits per 4 cycles;
L2/EMIF EDMA: None]
McBSP: 2 channels at E1 rate
Timers: 2 timers at maximum rate
The actual current draw is highly application-dependent. For more details on core and I/O activity, refer to the TMS320C6410/13 PowerConsumption Summary application report (literature number SPRAA59).
†
= MAX2.4V
OH
= MAX0.4V
OL
MINTYPMAXUNIT
±10uA
50100150uA
−150−100−50uA
−8mA
8mA
5.4Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
90
April 2004 − Revised May 2005SPRS247E
6Parameter Information
Device Electrical Specifications
Tester Pin Electronics
42 Ω3.5 nH
4.0 pF1.85 pF
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects
must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect.
The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from
the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
Transmission Line
Z0 = 50 Ω
(see note)
Data Sheet Timing Reference Point
Output
Under
Test
Device Pin
(see note)
Figure 6−1. Test Load Circuit for AC Timing Measurements
The load capacitance value stated is only for characterization and measurement of AC timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
6.1Signal Transition Levels
All input and output timing parameters are referenced to 1.5 V for both “0” and “1” logic levels.
Figure 6−2. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to V
and V
MIN for output clocks.
OH
Figure 6−3. Rise and Fall Transition Time Voltage Reference Levels
6.2Signal Transition Rates
All timings are tested with an input edge rate of 4 Volts per nanosecond (4 V/ns).
V
= 1.5 V
ref
MAX and VIH MIN for input clocks, V
IL
V
= VIH MIN (or VOH MIN)
ref
V
= VIL MAX (or VOL MAX)
ref
OL
MAX
April 2004 − Revised May 2005SPRS247E
91
Device Electrical Specifications
6.3Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data sheet do not include delays by board routings. As a good
board design practice, such delays must always be taken into account. Timing values may be adjusted by
increasing/decreasing such delays. TI recommends utilizing the available I/O buffer information specification
(IBIS) models to analyze the timing characteristics correctly. To properly use IBIS models to attain accurate
timing analysis for a given system, see the Using IBIS Models for Timing Analysis application report (literature
number SPRA839). If needed, external logic hardware such as buffers may be used to compensate any timing
differences.
For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external device
and from the external device to the DSP. This round-trip delay tends to negatively impact the input setup time
margin, but also tends to improve the input hold time margins (see Table 6−1 and Figure 6−4).
Figure 6−4 represents a general transfer between the DSP and an external device. The figure also represents
board route delays and how they are perceived by the DSP and the external device.
Table 6−1. Board-Level Timing Example (see Figure 6−4)
NO.DESCRIPTION
1Clock route delay
2Minimum DSP hold time
3Minimum DSP setup time
4External device hold time requirement
5External device setup time requirement
6Control signal route delay
7External device hold time
8External device access time
9DSP hold time requirement
10DSP setup time requirement
11Data route delay
92
ECLKOUTx
(Output from DSP)
(Input to External Device)
(Input to External Device)
(Output from External Device)
† Control signals include data for Writes.
‡Data signals are generated during Reads from an external device.
ECLKOUTx
Control Signals
(Output from DSP)
Control Signals
Data Signals
Data Signals
(Input to DSP)
†
‡
‡
3
6
8
Figure 6−4. Board-Level Input/Output Timings
1
2
4
5
7
9
11
10
April 2004 − Revised May 2005SPRS247E
Peripheral Electrical Specifications
NO
UNIT
7Peripheral Electrical Specifications
7.1Input and Output Clocks
Table 7−1. Timing Requirements for External Crystal Oscillator Input (OSCIN and OSCOUT)
−400
.
NO.
1f
OSC
†
The PLL multiplier factors (x5, x6, x7, x8, x9, x10, x11, x12, x16, x18, x19, x20, x21, x24) further limit the MIN and MAX values for CLKIN and
Input oscillator frequency1230MHz
OSCIN. For more details on these limitations, see Table 4−1 and Table 4−2 of the Clock PLL and Oscillator section of this data sheet.
Table 7−2. Timing Requirements for CLKIN
†‡§
(see Figure 7−1)
−400
−500
NO.
PLL MULT MODEx1 (BYPASS)
MINMAXMINMAX
1t
c(CLKIN)
2t
w(CLKINH)
3t
w(CLKINL)
4t
t(CLKIN)
5t
J(CLKIN)
†
The PLL multiplier factors (x5, x6, x7, x8, x9, x10, x11, x12, x16, x18, x19, x20, x21, x24) further limit the MIN and MAX values for CLKIN and
OSCIN. For more details on these limitations, see Table 4−1 and Table 4−2 of the Clock PLL and Oscillator section of this data sheet.
‡
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
§
C = CLKIN cycle time in ns. For example, when CLKIN frequency is 50 MHz, use C = 20 ns.
Cycle time, CLKIN10
Pulse duration, CLKIN high0.45C0.45Cns
Pulse duration, CLKIN low0.45C0.45Cns
Transition time, CLKIN51ns
Period jitter, CLKIN0.02C0.02Cns
5
1
2
†
83.310
4
−500
MINMAX
†
83.3ns
UNIT
UNIT
CLKIN
3
4
Figure 7−1. CLKIN Timing
April 2004 − Revised May 2005SPRS247E
93
Input and Output Clocks
NO
PARAMETER
UNIT
NO
PARAMETER
UNIT
Table 7−3. Switching Characteristics Over Recommended Operating Conditions for CLKOUT4
(see Figure 7−2)
−400
NO.PARAMETER
.
−500
MINMAX
1t
c(CKO4)
2t
w(CKO4H)
3t
w(CKO4L)
4t
†
The reference points for the rise and fall transitions are measured at VOL MAX and V
‡
PH is the high period of CLKIN in ns and PL is the low period of CLKIN in ns.
§
P = 1/CPU clock frequency in nanoseconds (ns)
t(CKO4)
Cycle time, CLKOUT44P − 0.74P + 0.7ns
Pulse duration, CLKOUT4 high2P − 0.72P + 0.7ns
Pulse duration, CLKOUT4 low2P − 0.72P + 0.7ns
Transition time, CLKOUT41ns
MIN.
OH
21
4
CLKOUT4
3
4
Figure 7−2. CLKOUT4 Timing
Table 7−4. Switching Characteristics Over Recommended Operating Conditions for CLKOUT6
(see Figure 7−3)
†‡§
UNIT
†‡§
NO.PARAMETER
.
1t
c(CKO6)
2t
w(CKO6H)
3t
w(CKO6L)
4t
†
The reference points for the rise and fall transitions are measured at VOL MAX and V
‡
PH is the high period of CLKIN in ns and PL is the low period of CLKIN in ns.
§
P = 1/CPU clock frequency in nanoseconds (ns)
t(CKO6)
Cycle time, CLKOUT66P − 0.76P + 0.7ns
Pulse duration, CLKOUT6 high3P − 0.73P + 0.7ns
Pulse duration, CLKOUT6 low3P − 0.73P + 0.7ns
Transition time, CLKOUT61ns
21
CLKOUT6
Figure 7−3. CLKOUT6 Timing
−400
−500
UNIT
MINMAX
MIN.
OH
4
3
4
94
April 2004 − Revised May 2005SPRS247E
Input and Output Clocks
NO
UNIT
NO
PARAMETER
UNIT
Table 7−5. Timing Requirements for AECLKIN for EMIFA
†‡§
(see Figure 7−4)
−400
NO.
.
−500
UNIT
MINMAX
1t
c(EKI)
2t
w(EKIH)
3t
w(EKIL)
4t
t(EKI)
5t
J(EKI)
†
P = 1/CPU clock frequency in ns. For example, when running parts at 500 MHz, use P = 2 ns.
‡
The reference points for the rise and fall transitions are measured at VIL MAX and V
§
E = the EMIF input clock (AECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA.
¶
Minimum AECLKIN cycle times must be met, even when AECLKIN is generated by an internal clock source. Minimum AECLKIN times are based
Cycle time, AECLKIN6¶16Pns
Pulse duration, AECLKIN high2.7ns
Pulse duration, AECLKIN low2.7ns
Transition time, AECLKIN3ns
Period jitter, AECLKIN0.02Ens
MIN.
IH
on internal logic speed; the maximum useable speed of the EMIF may be lower due to AC timing requirements. 100-MHz operation is achievable
if the requirements of the EMIF Device Speed section are met.
5
1
2
4
AECLKIN
3
4
Figure 7−4. AECLKIN Timing for EMIFA
Table 7−6. Switching Characteristics Over Recommended Operating Conditions for AECLKOUT1 for the
EMIFA Module
NO.PARAMETER
.
1t
c(EKO1)
2t
w(EKO1H)
3t
w(EKO1L)
4t
t(EKO1)
5t
d(EKIH-EKO1H)
6t
d(EKIL-EKO1L)
§
E = the EMIF input clock (AECLKIN, CPU/4 clock, or CPU/6 clock) period in ns.
#
The reference points for the rise and fall transitions are measured at VOL MAX and V
||
EH is the high period of E (EMIF input clock period) in ns and EL is the low period of E (EMIF input clock period) in ns for EMIFA.
AECLKIN
AECLKOUT1
Cycle time, AECLKOUT1E − 0.7E + 0.7ns
Pulse duration, AECLKOUT1 highEH − 0.7EH + 0.7ns
Pulse duration, AECLKOUT1 lowEL − 0.7EL + 0.7ns
Transition time, AECLKOUT11ns
Delay time, AECLKIN high to AECLKOUT1 high18ns
Delay time, AECLKIN low to AECLKOUT1 low18ns
1
5
§#||
(see Figure 7−5)
6
OH
MIN.
−400
−500
UNIT
MINMAX
2
3
4
4
Figure 7−5. AECLKOUT1 Timing for the EMIFA Module
April 2004 − Revised May 2005SPRS247E
95
Input and Output Clocks
NO
PARAMETER
UNIT
Table 7−7. Switching Characteristics Over Recommended Operating Conditions for AECLKOUT2 for the
EMIFA Module
NO.PARAMETER
.
1t
c(EKO2)
2t
w(EKO2H)
3t
w(EKO2L)
4t
t(EKO2)
5t
d(EKIH-EKO2H)
6t
d(EKIH-EKO2L)
†
The reference points for the rise and fall transitions are measured at VOL MAX and V
‡
E = the EMIF input clock (AECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA.
N = the EMIF input clock divider; N = 1, 2, or 4.
Table 7−8. Timing Requirements for Asynchronous Memory Cycles for EMIFA Module
(see Figure 7−7 and Figure 7−8)
NO.
.
MIN MAX
3t
su(EDV-AREH)
4t
h(AREH-EDV)
6t
su(ARDY-EKO1H)
7t
†
h(EKO1H-ARDY)
To ensure data setup time, simply program the strobe width wide enough. ARDY is internally synchronized. The ARDY signal is recognized in
the cycle for which the setup and hold time is met. The ARDY signal is only recognized two cycles before the end of the programmed strobe time
and while ARDY is low, the strobe time is extended cycle-by-cycle. When ARDY is recognized low, the end of the strobe time is two cycles after
ARDY is recognized high To use ARDY as an asynchronous input, the pulse width of the ARDY signal should be wide enough (e.g., pulse width
= 2E) to ensure setup and hold time is met.
‡
RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters are
programmed via the EMIF CE space control registers.
Setup time, AEDx valid before AARE high6.5ns
Hold time, AEDx valid after AARE high1ns
Setup time, AARDY valid before AECLKOUTx high3ns
Hold time, AARDY valid after AECLKOUTx high3ns
Table 7−9. Switching Characteristics Over Recommended Operating Conditions for Asynchronous
Memory Cycles for EMIFA Module
NO.PARAMETER
.
1t
osu(SELV-AREL)
2t
oh(AREH-SELIV)
5t
d(EKO1H-AREV)
8t
osu(SELV-AWEL)
9t
oh(AWEH-SELIV)
10t
‡
§
¶
d(EKO1H-AWEV)
RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters are
programmed via the EMIF CE space control registers.
E = ECLKOUT1 period in ns for EMIFA
Select signals for EMIFA include: ACEx, ABE[3.:0], AEA[22:3], AAOE; and for EMIFA writes, include AED[31:0].
Output setup time, select signals valid to AARE lowRS * E − 1.5ns
Output hold time, AARE high to select signals invalidRH * E − 1.9ns
Delay time, AECLKOUTx high to AARE valid17ns
Output setup time, select signals valid to AAWE lowWS * E − 1.7ns
Output hold time, AAWE high to select signals invalidWH * E − 1.8ns
Delay time, AECLKOUTx high to AAWE valid1.37.1ns
द
(see Figure 7−7 and Figure 7−8)
−400
−500
MINMAX
UNIT
April 2004 − Revised May 2005SPRS247E
97
Asynchronous Memory Timing
AECLKOUTx
ACEx
Setup = 2Strobe = 3Not ReadyHold = 2
1
2
2
2
ABE[3:0]
AEA[22:3]
1
BE
1
Address
3
4
AED[31:0]
2
/ASDRAS/ASOE
AAOE
AARE/ASDCAS/ASADS/ASRE
AAWE/ASDWE/ASWE
1
†
5
†
†
7
Read Data
5
7
66
AARDY
†
AOE/SDRAS/SOE, ARE/SDCAS/SADS/SRE, and AWE/SDWE/SWE operate as AOE (identified under select signals), ARE, and AWE,
respectively, during asynchronous memory accesses.
Figure 7−7. Asynchronous Memory Read Timing for EMIFA
98
April 2004 − Revised May 2005SPRS247E
Asynchronous Memory Timing
Setup = 2
Strobe = 3 Not Ready
Hold = 2
AECLKOUTx
8
9
ACEx
9
9
9
10
ABE[3:0]
AEA[22:3]
AED[31:0]
AAOE/ASDRAS/ASOE
AARE/ASDCAS/ASADS/ASRE
AAWE/ASDWE/ASWE
8
BE
8
Address
8
Write Data
†
†
10
†
77
6
6
AARDY
†
AOE/SDRAS/SOE, ARE/SDCAS/SADS/SRE, and AWE/SDWE/SWE operate as AOE (identified under select signals), ARE, and AWE,
respectively, during asynchronous memory accesses.
Figure 7−8. Asynchronous Memory Write Timing for EMIFA
April 2004 − Revised May 2005SPRS247E
99
Programmable Synchronous Interface Timing
NO
UNIT
NO
PARAMETER
UNIT
7.3Programmable Synchronous Interface Timing
Table 7−10. Timing Requirements for Programmable Synchronous Interface Cycles for EMIFA Module
(see Figure 7−9)
−400
NO.
6t
7t
.
su(EDV-EKOxH)
h(EKOxH-EDV)
Setup time, read AEDx valid before AECLKOUTx high3.1ns
Hold time, read AEDx valid after AECLKOUTx high1.5ns
−500
MINMAX
UNIT
Table 7−11. Switching Characteristics Over Recommended Operating Conditions for Programmable
Synchronous Interface Cycles for EMIFA Module
NO.PARAMETER
.
1t
d(EKOxH-CEV)
2t
d(EKOxH-BEV)
3t
d(EKOxH-BEIV)
4t
d(EKOxH-EAV)
5t
d(EKOxH-EAIV)
8t
d(EKOxH-ADSV)
9t
d(EKOxH-OEV)
10t
d(EKOxH-EDV)
11t
d(EKOxH-EDIV)
12t
†
The following parameters are programmable via the EMIF CE Space Secondary Control register (CExSEC):