400-mV Minimum DC Noise Immunity With
Standard TTL Loads
D
Latchup Immunity of 250 mA on All Input
and Output Lines
D
Low Power Dissipation (VCC = 5.5 V)
– Active...165 mW Worst Case
– Standby...1.4 mW Worst Case
(CMOS Input Levels)
D
Temperature Range Options
D
256K EPROM Available With MIL-STD-883C
Class B High Reliability Processing
(SMJ27C256)
description
The TMS27C256 series are 32768 by 8-bit
(262144-bit), ultraviolet (UV) light erasable,
electrically programmable read-only memories
(EPROMs).
The TMS27PC256 series are 32768 by 8-bit
(262144-bit), one-time programmmable (OTP)
electrically programmable read-only memories
(PROMs).
TMS27C256 32768 BY 8-BIT UV ERASABLE
TMS27PC256 32768 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORIES
SMLS256H– SEPTEMBER 1984 – REVISED NOVEMBER 1997
J PACKAGE
(TOP VIEW)
V
1
PP
A12
2
A7
3
A6
4
A5
5
A4
6
A3
7
A2
8
A1
9
A0
10
DQ0
11
DQ1
12
DQ2
13
GND
5
A6
6
A5
7
A4
8
A3
A2
9
A1
10
A0
11
NC
12
DQ0
13
A0–A14Address Inputs
DQ0–DQ7Inputs (programming)/Outputs
E
G
GNDGround
NCNo Internal Connection
NUMake No External Connection
V
CC
V
PP
†
Only in program mode
14
FM PACKAGE
(TOP VIEW)
PP
A7
A12VNUVA14
3213231
430
14
15 16 17 18 19
DQ1
DQ2NUDQ3
GND
PIN NOMENCLATURE
Chip Enable/Powerdown
Output Enable
5-V Power Supply
13-V Power Supply
28
27
26
25
24
23
22
21
20
19
18
17
16
15
CC
V
CC
A14
A13
A8
A9
A1 1
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
20
DQ4
†
A13
29
28
27
26
25
24
23
22
21
DQ5
A8
A9
A1 1
NC
G
A10
E
DQ7
DQ6
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
Copyright 1997, Texas Instruments Incorporated
1
TMS27C256 32768 BY 8-BIT UV ERASABLE
TMS27PC256 32768 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORIES
SMLS256H– SEPTEMBER 1984 – REVISED NOVEMBER 1997
description (continued)
These devices are fabricated using power-saving CMOS technology for high speed and simple interface with
MOS and bipolar circuits. All inputs (including program data inputs) can be driven by Series 74 TTL circuits
without the use of external pull-up resistors. Each output can drive one Series 74 TTL circuit without external
resistors.
The data outputs are 3-state for connecting multiple devices to a common bus. The TMS27C256 and the
TMS27PC256 are pin compatible with 28-pin 256K MOS ROMs, PROMs, and EPROMs.
The TMS27C256 EPROM is offered in a dual-in-line ceramic package (J suffix) designed for insertion in
mounting-hole rows on 15,2-mm (600-mil) centers. The TMS27PC256 OTP PROM is supplied in a 32-lead
plastic leaded chip-carrier package using 1,25-mm (50-mil) lead spacing (FM suffix).
The TMS27C256 and TMS27PC256 are offered with two choices of temperature ranges of 0°C to 70°C (JL and
FML suffixes) and – 40°C to 85°C (JE and FME suffixes). See Table 1.
All package styles conform to JEDEC standards.
Table 1. Temperature Range Suffixes
EPROM
AND
OTP PROM
TMS27C512-xxxJLJE
TMS27PC512-xxxFMLFME
SUFFIX FOR OPERATING
FREE-AIR TEMPERATURE RANGES
0°C TO 70°C–40°C TO 85°C
These EPROMs and OTP PROMs operate from a single 5-V supply (in the read mode), thus are ideal for use
in microprocessor-based systems. One other 13-V supply is needed for programming . All programming signals
are TTL level. These devices are programmable by the SNAP! Pulse programming algorithm. The SNAP! Pulse
programming algorithm uses a V
of 13 V and a VCC of 6.5 V for a nominal programming time of four seconds.
PP
For programming outside the system, existing EPROM programmers can be used. Locations can be
programmed singly, in blocks, or at random.
2
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS27C256 32768 BY 8-BIT UV ERASABLE
TMS27PC256 32768 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORIES
SMLS256H– SEPTEMBER 1984 – REVISED NOVEMBER 1997
operation
The seven modes of operation are listed in Table 2. The read mode requires a single 5-V supply. All inputs are
TTL level except for V
FUNCTION
EV
GV
V
PP
V
CC
A9XXXXXXVH‡VH‡
A0XXXXXXV
DQ0–DQ7Data OutHi-ZHi-ZData InData OutHi-Z
†
X can be VIL or VIH.
‡
VH = 12 V ± 0.5 V.
READ
IL
IL
V
CC
V
CC
during programming (13 V for SNAP! Pulse), and 12 V on A9 for the signature mode.
PP
Table 2. Operation Modes
†
MODE
OUTPUT
DISABLE
V
IL
V
IH
V
CC
V
CC
STANDBYPROGRAMMINGVERIFY
V
IH
XV
V
CC
V
CC
V
IL
IH
V
PP
V
CC
V
IH
V
IL
V
PP
V
CC
PROGRAM
INHIBIT
V
IH
XV
V
PP
V
CC
SIGNATURE
MODE
V
V
IL
CODE
MFGDEVICE
9704
V
IL
IL
CC
CC
V
IH
read/output disable
When the outputs of two or more TMS27C256s or TMS27PC256s are connected in parallel on the same bus,
the output of any particular device in the circuit can be read with no interference from the competing outputs
of the other devices. To read the output of a single device, a low-level signal is applied to the E
and G pins. All
other devices in the circuit should have their outputs disabled by applying a high-level signal to one of these
pins. Output data is accessed at pins DQ0 through DQ7.
latchup immunity
Latchup immunity on the TMS27C256 and TMS27PC256 is a minimum of 250 mA on all inputs and outputs.
This feature provides latchup immunity beyond any potential transients at the P .C. board level when the devices
are interfaced to industry-standard TTL or MOS logic devices. Input-output layout approach controls latchup
without compromising performance or packing density.
power down
Active I
inputs) by applying a high TTL or CMOS signal to the E
supply current can be reduced from 30 mA to 500 µA (TTL-level inputs) or 250 µA (CMOS-level
CC
pin. In this mode all outputs are in the high-impedance
state.
erasure (TMS27C256)
Before programming, the TMS27C256 EPROM is erased by exposing the chip through the transparent lid
to a high intensity ultraviolet light (wavelength 2537 Å). EPROM erasure before programming is necessary to
assure that all bits are in the logic high state. Logic lows are programmed into the desired locations. A
programmed logic low can be erased only by ultraviolet light. The recommended minimum exposure dose (UV
intensity × exposure time) is 15-W•s/cm
2
. A typical 12-mW/ cm2, filterless UV lamp erases the device in 21
minutes. The lamp should be located about 2.5 cm above the chip during erasure. It should be noted that normal
ambient light contains the correct wavelength for erasure. Therefore, when using the TMS27C256, the window
should be covered with an opaque label.
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
3
TMS27C256 32768 BY 8-BIT UV ERASABLE
IDENTIFIER
†
TMS27PC256 32768 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORIES
SMLS256H– SEPTEMBER 1984 – REVISED NOVEMBER 1997
initializing (TMS27PC256)
The one-time programmable TMS27PC256 PROM is provided with all bits in the logic high state, then logic lows
are programmed into the desired locations. Logic lows programmed into an OTP PROM cannot be erased.
SNAP! Pulse programming
The 256K EPROM and OTP PROM are programmed using the TI SNAP! Pulse programming algorithm
illustrated by the flowchart in Figure 1, which programs in a nominal time of four seconds. Actual programming
time varies as a function of the programmer used.
Data is presented in parallel (eight bits) on pins DQ0 to DQ7. Once addresses and data are stable, E
The SNAP! Pulse programming algorithm uses initial pulses of 100 microseconds (µs) followed by a byte
verification to determine when the addressed byte has been successfully programmed. Up to 10 (ten) 100-µs
pulses per byte are provided before a failure is recognized.
The programming mode is achieved when V
= 13 V , VCC = 6.5 V , G = VIH, and E = VIL. More than one device
PP
can be programmed when the devices are connected in parallel. Locations can be programmed in any order.
When the SNAP! Pulse programming routine is complete, all bits are verified with V
= VPP = 5 V.
CC
program inhibit
Programming can be inhibited by maintaining a high level input on the E
pin.
program verify
Programmed bits can be verified with V
= 13 V when G = VIL and E = VIH.
PP
signature mode
The signature mode provides access to a binary code identifying the manufacturer and type. This mode is
activated when A9 is forced to 12 V . T wo identifier bytes are accessed by toggling A0. All other addresses must
be held low. The signature code for these devices is 9704. A0 selects the manufacturer’s code 97 (Hex), and
A0 high selects the device code 04, as shown in Table 3.
Table 3. Signature Mode
PINS
A0DQ7DQ6DQ5DQ4DQ3DQ2DQ1DQ0HEX
MANUFACTURER CODEV
DEVICE CODEV
†
E = G = VIL, A9 = VH, A1–A8 = VIL, A10–A15 = VIL, VPP = VCC, PGM = VIH or VIL.
1001011197
IL
0000010004
IH
is pulsed.
4
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMS27C256 32768 BY 8-BIT UV ERASABLE
TMS27PC256 32768 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORIES
SMLS256H– SEPTEMBER 1984 – REVISED NOVEMBER 1997
Start
Address = First Location
Increment
Address
VCC = 6.5 V, VPP = 13 V
Program One Pulse = tw = 100 µs
Last
Address?
Yes
Address = First Location
X = 0
Verify
One Byte
Pass
No
Fail
Increment Address
Program One Pulse = tw = 100 µs
No
X = 10?X = X + 1
Program
Mode
Interactive
Mode
No
VCC = VPP = 5 V ±10%
Last
Address?
YesYes
Compare
All Bytes
To Original
Data
Pass
Device Passed
Fail
Device Failed
Figure 1. SNAP! Pulse Programming Flowchart
Final
Verification
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
5
TMS27C256 32768 BY 8-BIT UV ERASABLE
TMS27PC256 32768 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORIES
SMLS256H– SEPTEMBER 1984 – REVISED NOVEMBER 1997
logic symbol
10
A0
9
A1
8
A2
7
A3
6
A4
5
A5
4
A6
3
A7
25
A8
24
A9
21
A10
23
A11
2
A12
26
A13
27
A14
20
E
22
G
†
These symbols are in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for J package.
†
0
14
[PWR DWN]
&
EPROM
32 768 × 8
0
A
32 767
EN
&
OTP PROM
32 768 × 8
0
A
32 767
EN
A
A
A
A
A
A
A
A
11
12
13
15
16
17
18
19
10
A0
9
A1
8
A2
7
A3
6
11
A
A
A
A
A
A
A
A
12
13
15
16
17
18
19
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
5
4
3
25
24
21
23
2
26
27
20
E
22
G
0
14
[PWR DWN]
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Supply voltage range, V
Input voltage range (see Note 1): All inputs except A9 :–0.6 V to V
Output voltage range (see Note 1) :–0.6 V to V
Operating free-air temperature range (’27C256-_ _JL, ’27PC256-_ _FML) T
Operating free-air temperature range (’27C5256-_ _JE, ’27PC256-_ _FME) T
Storage temperature range, T
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to GND.
TMS27PC256 32768 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORIES
SMLS256H– SEPTEMBER 1984 – REVISED NOVEMBER 1997
switching characteristics over recommended range of operating conditions
t
a(A)
t
a(E)
t
en(G)
t
dis
t
v(A)
PARAMETER
Access time from address100120150ns
Access time from chip enable100120150ns
Output enable time from G
Output disable time from G or E, whichever
occurs first
Output data valid time after change of
address, E
†
, or G, whichever occurs first
†
TEST CONDITIONS
CL = 100 pF,
Input tr ≤ 20 ns,
Input t
≤ 20 ns
’27C256-10
’27PC256-10
MINMAXMINMAX MINMAX
,
045045060ns
000ns
’27C256-12
’27PC256-12
555575ns
’27C256-15
’27PC256-15
UNIT
PARAMETER
t
t
t
t
t
†
NOTES: 3. For all switching characteristics the input pulse levels are 0.4 V to 2.4 V. Timing measurements are made at 2 V for logic high and
Access time from address170200250ns
a(A)
Access time from chip enable170200250ns
a(E)
Output enable time from G
en(G)
Output disable time from G or E, whichever
dis
occurs first
Output data valid time after change of
v(A)
address, E
Value calculated from 0.5 V delta to measured level. This parameter is only sampled and not 100% tested.
4. Common test conditions apply for the t
†
, or G, whichever occurs first
0.8 V for logic low) (see Figure 2).
†
TEST CONDITIONS
CL = 100 pF,
Input tr ≤ 20 ns,
Input t
≤ 20 ns
except during programming.
dis
’27C256-17
’27PC256-17
MINMAXMINMAXMINMAX
,
060060060ns
000ns
’27C256-20
’27PC256-20
7575100ns
’27C256-25
’27PC256-25
UNIT
switching characteristics for programming: VCC = 6.50 V and VPP = 13 V (SNAP! Pulse), TA = 25°C
(see Note 3)
PARAMETERMINMAXUNIT
t
dis(G)
t
en(G)
NOTE 3: For all switching characteristics, the input pulse levels are 0.4 V to 2.4 V. Timing measurements are made at 2 V for logic high and
Output disable time from G0130ns
Output enable time from G150ns
0.8 V for logic low).
timing requirements for programming
MINNOMMAXUNIT
t
h(A)
t
h(D)
t
w(IPGM)
t
su(A)
t
su(G)
t
su(E)
t
su(D)
t
su(VPP)
t
su(VCC)
Hold time, address0µs
Hold time, data2µs
Pulse duration, initial program95100105µs
Setup time, address2µs
Setup time, G2µs
Setup time, E2µs
Setup time, data2µs
Setup time, V
Setup time, V
PP
CC
2µs
2µs
8
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
PARAMETER MEASUREMENT INFORMATION
Output
Under Test
NOTE A: CL includes probe and fixture capacitance.
ac testing input/output wave forms
TMS27C256 32768 BY 8-BIT UV ERASABLE
TMS27PC256 32768 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORIES
SMLS256H– SEPTEMBER 1984 – REVISED NOVEMBER 1997
2.08 V
RL = 800 Ω
CL = 100 pF
(see Note A)
2.4 V
0.4 V
2 V2 V
0.8 V0.8 V
AC testing inputs are driven at 2.4 V for logic high and 0.4 V for logic low. Timing measurements are made at
2 V for logic high and 0.8 V for logic low for both inputs and outputs.
Figure 2. AC Testing Output Load Circuit
V
A0–A14
DQ0–DQ7
Addresses Valid
E
t
a(E)
G
t
dis
Hi-Z
Hi-Z
t
a(A)
t
en(G)
t
v(A)
Output Valid
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
OH
V
OL
Figure 3. Read-Cycle Timing
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
9
TMS27C256 32768 BY 8-BIT UV ERASABLE
TMS27PC256 32768 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORIES
SMLS256H– SEPTEMBER 1984 – REVISED NOVEMBER 1997
PARAMETER MEASUREMENT INFORMATION
Program
A0–A14
t
su(A)
DQ0–DQ7
V
PP
V
CC
E
t
w(IPGM)
G
†
t
and t
dis(G)
‡
13-V VPP and 6.5-V VCC for SNAP! Pulse programming
are characteristics of the device but must be accommodated by the programmer
NOTES: A. All linear dimensions are in inches (millimeters).
PINS**
MAX
A
MIN
MAX
B
MIN
MAX
C
MIN
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification only on press ceramic glass frit seal only.
NARR
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
1.265(32,13) 1.265(32,13)
1.235(31,37) 1.235(31,37)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
24
WIDE
NARR
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
1.465(37,21) 1.465(37,21)
1.435(36,45) 1.435(36,45)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
28
WIDEWIDE
NARR
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
1.668(42,37) 1.668(42,37)
1.632(41,45) 1.632(41,45)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
32
WIDE
NARR
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
2.068(52,53) 2.068(52,53)
2.032(51,61) 2.032(51,61)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
4040084/B 04/95
40
12
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.