8-Bit Output For Use in
Microprocessor-Based Systems
D
Power-Saving CMOS Technology
D
3-State Output Buffers
D
400-mV Assured DC Noise Immunity With
Standard TTL Loads
D
Latchup Immunity of 250 mA on All Input
and Output Pins
D
No Pullup Resistors Required
D
Low Power Dissipation (VCC = 5.5 V)
– Active...275 mW Worst Case
– Standby...0.55 mW Worst Cas E
(CMOS-Input Levels)
D
Temperature Range Options
description
The TMS27C040 devices are 524288 by 8-bit
(4194304-bit), ultraviolet (UV) light erasable,
electrically programmable read-only memories
(EPROMs).
The TMS27PC040 devices are 524 288 by 8-bit
(4194304-bit), one-time programmable (OTP)
electrically programmable read-only memories
(PROMs).
These devices are fabricated using CMOS
technology for high speed and simple interface
with MOS and bipolar circuits. All inputs (including
program data inputs) can be driven by the Series
74 TTL circuits. Each output can drive one Series
74 TTL circuit without external resistors.
TMS27C040
J PACKAGE
(TOP VIEW)
V
1
PP
A16
2
A15
3
A12
4
A7
5
A6
6
A5
7
A4
8
A3
9
A2
10
A1
11
A0
12
DQ0
13
DQ1
14
DQ2
15
GND
5
A7
6
A6
7
A5
8
A4
A3
9
A2
10
A1
11
A0
12
DQ0
13
A0–A18Address Inputs
DQ0–DQ7Inputs (programming)/Outputs
E
G
GNDGround
V
CC
V
PP
†
Only in program mode.
16
TMS27PC040
FM PACKAGE
(TOP VIEW)
A12
A15
A16
3213231
430
14
15 16 17 18 19
DQ1
DQ2
GND
PIN NOMENCLATURE
Chip Enable
Output Enable
5-V Supply
13-V Power Supply
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
PP
V
DQ3
CC
V
DQ4
V
CC
A18
A17
A14
A13
A8
A9
A1 1
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
A18
20
DQ5
A17
29
28
27
26
25
24
23
22
21
DQ6
†
A14
A13
A8
A9
A1 1
G
A10
E
DQ7
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
Copyright 1997, Texas Instruments Incorporated
1
TMS27C040 524288 BY 8-BIT UV ERASABLE
MODE
Signature Mode
VILVILVCCV
V
‡
TMS27PC040 524288 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORY
SMLS040F – NOVEMBER 1990 – REVISED SEPTEMBER 1997
description (continued)
The data outputs are 3-state for connecting multiple devices to a common bus
The TMS27C040 is offered in a 600-mil ceramic dual-in-line package (J suffix). The TMS27C040 is offered with
two choices of temperature ranges of 0°C to 70°C (JL suffix) and – 40°C to 85°C (JE suffix). (See Table 1.)
The TMS27PC040 is offered in a 32-lead plastic leaded chip carrier package (FM suffix). The TMS27PC040
is offered with two choices of temperature ranges of 0°C to 70°C (JL suffix) and –40°C to 85° C (JE suffix).
Table 1. Temperature Range Suffixes
SUFFIX FOR OPERATING
FUNCTION
TMS27C040-XXXJLJE
TMS27PC040-XXXFMLFME
These EPROMs and PROMS operate from a single 5-V supply (in the read mode), and they are ideal for use
in microprocessor-based systems. One other (13 V) supply is needed for programming. All programming
signals are TTL level. For programming outside the system, existing EPROM programmers can be used.
FREE-AIR TEMPERATURE
RANGES
0°C to 70°C– 40°C to 85°C
operation
The seven modes of operation are listed in T able 2. The read mode requires a single 5-V supply . All inputs are
TTL level except for V
ReadV
Output DisableV
StandbyV
ProgrammingV
Program InhibitV
VerifyV
†
X can be VIL or V
‡
VH = 12 V ± 0.5 V
IH
read/output disable
When the outputs of two or more TMS27C040s or TMS27PC040s are connected in parallel on the same bus,
the output of any particular device in the circuit can be read with no interference from competing outputs of the
other devices. To read the output of a single device, a low level signal is applied to the E
devices in the circuit should have their outputs disabled by applying a high level signal to one of these pins.
during programming (13 V), and VH (12 V) on A9 for the signature mode.
PP
Table 2. Operation Modes
†
A9A0DQ0–DQ7
XXData Out
XXHi-Z
XXHi-Z
XXData In
XXHi-Z
XXData Out
V
H
IL
V
IH
EGV
IL
IL
IH
IL
IH
IH
V
IL
V
IH
XV
V
IH
V
IH
V
IL
PP
XV
V
CC
CC
V
PP
V
PP
V
PP
FUNCTION
V
CC
CC
V
CC
V
CC
V
CC
V
CC
V
CC
CC
MFG Code 97
Device Code 50
and G pins. All other
latchup immunity
2
Latchup immunity on the TMS27C040 and TMS27PC040 is a minimum of 250 mA on all inputs and outputs.
This feature provides latchup immunity beyond any potential transients at the P .C. board level when the EPROM
is interfaced to industry standard TTL or MOS logic devices. The input/output layout approach controls latchup
without compromising performance or packing density.
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
IDENTIFIER
†
TMS27C040 524288 BY 8-BIT UV ERASABLE
TMS27PC040 524288 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORY
SMLS040F – NOVEMBER 1990 – REVISED SEPTEMBER 1997
power down
Active I
100 µA by applying a high CMOS input on E
erasure (TMS27C040)
Before programming, the TMS27C040 EPROM is erased by exposing the chip through the transparent lid to
a high intensity UV-light (wavelength 2537 Å). The recommended minimum exposure dose (UV intensity ×
exposure time) is 15-W⋅s/cm
lamp must be located about 2.5 cm above the chip during erasure. After erasure, all bits are in the high state.
Normal ambient light contains the correct wavelength for erasure; therefore, when using the TMS27C040, the
window must be covered with an opaque label. After erasure (all bits in logic high state), logic lows are
programmed into the desired locations. A programmed low can be erased only by UV light.
initializing (TMS27PC040)
The OTP TMS27PC040 PROM is provided with all bits in logic high state, then logic lows are programmed into
the desired locations. Logic lows programmed into an OTP PROM cannot be erased.
SNAP! Pulse programming
The TMS27C040 and TMS27PC040 are programmed by using the SNAP! Pulse programming algorithm. The
programming sequence is shown in the SNAP! Pulse programming flow chart shown in Figure 1.
supply current can be reduced from 50 mA to 1 mA by applying a high TTL input on E and to
CC
. In this mode all outputs are in the high-impedance state.
2
. A typical 12-mW/cm2, filterless UV lamp erases the device in 21 minutes. The
The initial setup is V
= 13 V , VCC = 6.5 V , E = VIH, and G = VIH. Once the initial location is selected, the data
PP
is presented in parallel (eight bits) on pins DQ0 through DQ7. Once addresses and data are stable, the
programming mode is achieved when E
is pulsed low (VIL) with a pulse duration of t
w(PGM)
. Every location is
programmed only once before going to interactive mode.
In the interactive mode, the word is verified at V
is not read, the programming is performed by pulling E
= 13 V , VCC = 6.5 V , E = VIH, and G = VIL. If the correct data
PP
low with a pulse duration of t
w(PGM)
. This sequence of
verification and programming is performed up to a maximum of 10 times. When the device is fully programmed,
all bytes are verified with V
= VPP = 5 V ± 10%.
CC
program inhibit
Programming can be inhibited by maintaining high level inputs on the E
and G pins.
program verify
Programmed bits can be verified with V
= 13 V when G = VIL, and E = VIH.
PP
signature mode
The signature mode provides access to a binary code identifying the manufacturer and type. This mode is
activated when A9 (pin 26) is forced to 12 V. Two identifier bytes are accessed by toggling A0. All other
addresses must be held low. The signature code for the TMS27C040 is 9750. A0 low selects the manufacturer’s
code 97 (Hex), and A0 high selects the device code 50 (Hex), as shown in Table 3.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Supply voltage range, V
Input voltage range (see Note 1), All inputs except A9 –0.6 V to V
Output voltage range, with respect to V
Operating free-air temperature range (’27C040-_ _JL and ’27PC040-_ _FML) 0°C to 70°C. . . . . . . . . . . . . .
Operating free-air temperature range (’27C040-_ _JE and ’27PC040 _ _ FME) – 40°C to 85°C. . . . . . . . . . .
Storage temperature range, T
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to GND.
NOTE 2: VCC must be applied before or at the same time as VPP and removed after or at the same time as VPP. The device must not be inserted
into or removed from the board when VPP or VCC is applied.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature
PARAMETERTEST CONDITIONSMINMAXUNIT
p
p
I
I
I
O
I
PP1
I
PP2
CC1
I
CC2
†
Minimum cycle time = maximum access time.
Input current (leakage)VI = 0 V to 5.5 V±1µA
Output current (leakage)VO = 0 V to V
VPP supply currentVPP = VCC = 5.5 V10µA
VPP supply current (during program pulse)VPP = 12.75 V50mA
switching characteristics over recommended ranges of operating conditions (see Notes 3
and 4)
’27C040-10
PARAMETERTEST CONDITIONS
t
t
t
t
t
†
NOTES: 3. For all switching characteristics the input pulse levels are 0.4 V to 2.4 V. Timing measurements are made at 2 V for logic high and
Access time from address100120150ns
a(A)
Access time from chip enable
a(E)
Output enable time from G
en(G)
Output disable time from G or E, whichever
dis
occurs first
Output data valid time after change of
v(A)
address, E
Value calculated from 0.5-V delta to measured output level.
4. Common test conditions apply for t
, or G, whichever occurs first
0.8 V for logic low. (See Figure 2)
†
except during programming.
dis
=
p
=
1 Series 74
TTL load,
Input tr ≤ 20 ns,
p
,
≤ 20
’27PC040-10
MINMAXMINMAXMINMAX
050050050ns
000ns
switching characteristics for programming: VCC = 6.5 V and VPP = 13 V (SNAP! Pulse), TA = 25°C
(see Note 3)
PARAMETERMINMAXUNIT
t
dis(G)
t
en(G)
NOTE 3: For all switching characteristics the input pulse levels are 0.4 V to 2.4 V. Timing measurements are made at 2 V for logic high and
Output disable time from G0100ns
Output enable time from G150ns
0.8 V for logic low. (See Figure 2)
’27C040-12
’27PC040-12
100120150ns
505050ns
’27C040-15
’27PC040-15
UNIT
timing requirements for programming
t
w(PGM)
t
su(A)
t
su(E)
t
su(G)
t
su(D)
t
su(VPP)
t
su(VCC)
t
h(A)
t
h(D)
Pulse duration, programSNAP! Pulse programming algorithm95100105µs
Setup time, address2µs
Setup time, E2µs
Setup time, G2µs
Setup time, data2µs
Setup time, V
Setup time, V
Hold time, address0µs
Hold time, data2µs
PP
CC
MINNOMMAXUNIT
2µs
2µs
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
7
TMS27C040 524288 BY 8-BIT UV ERASABLE
TMS27PC040 524288 BY 8-BIT
PROGRAMMABLE READ-ONLY MEMORY
SMLS040F – NOVEMBER 1990 – REVISED SEPTEMBER 1997
PARAMETER MEASUREMENT INFORMATION
Output
Under Test
2.08 V
RL = 800 Ω
CL = 100 pF
(see Note A)
2.4 V
0.4 V
NOTES: A. CL includes probe and fixture capacitance.
B. AC testing inputs are driven at 2.4 V for logic high and 0.4 V for logic low . Timing measurements are made at 2 V for logic high and
0.8 V for logic low for both inputs and outputs.
2 V
0.8 V
Figure 2. AC Testing Output Load Circuit and Waveform
A0–A18
DQ0–DQ7
E
G
Hi-Z
Addresses Valid
t
a(A)
t
a(E)
t
en(G)
2 V
0.8 V
t
v(A)
Output Valid
t
dis
Hi-Z
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
Figure 3. Read-Cycle Timing
8
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
PARAMETER MEASUREMENT INFORMATION
Program
A0–A18
t
su(A)
DQ0–DQ7
V
PP
V
CC
E
G
†
13-V VPP and 6.5-V VCC for SNAP! Pulse programming
NOTES: A. All linear dimensions are in inches (millimeters).
PINS**
MAX
A
MIN
MAX
B
MIN
MAX
C
MIN
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification only on press ceramic glass frit seal only.
NARR
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
1.265(32,13) 1.265(32,13)
1.235(31,37) 1.235(31,37)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
24
WIDE
NARR
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
1.465(37,21) 1.465(37,21)
1.435(36,45) 1.435(36,45)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
28
WIDEWIDE
NARR
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
1.668(42,37) 1.668(42,37)
1.632(41,45) 1.632(41,45)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
32
WIDE
NARR
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
2.068(52,53) 2.068(52,53)
2.032(51,61) 2.032(51,61)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
4040084/B 04/95
40
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
11
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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