Texas Instruments TLV2393IPWR, TLV2393IPWLE, TLV2393IP, TLV2393IDR, TLV2393ID Datasheet

TLV1393, TLV1393Y, TLV2393, TLV2393Y

DUAL DIFFERENTIAL COMPARATORS

SLCS121A – AUGUST 1993 – REVISED APRIL 1994

1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D

Low-Voltage and Single-Supply Operation

V

CC

= 2 V to 7 V

D

Common-Mode Voltage Range Includes
Ground

D

Fast Response Time

450 ns Typ (TLV2393)

D

Low Supply Current

0.16 mA Typ (TLV1393)

D

Fully Specified at 3-V and 5-V Supply
Voltages

description

The TLV1393 and the TLV2393 are dual differential comparators built using a new Texas Instruments
low-voltage, high-speed bipolar process. These devices have been specifically developed for low-voltage,
single-supply applications. Their enhanced performance makes them excellent replacements for the LM393 in
today’s improved 3-V and 5-V system designs.

The TLV1393, with its typical supply current of only 0.16 mA, is ideal for low-power systems. Response time
has also been improved to 0.7 µs. For higher-speed applications, the TLV2393 features excellent ac
performance with a response time of just 0.45 µs, three times that of the LM393.

Package availability for these devices includes the TSSOP (thin-shrink small-outline package). With a
maximum thickness of 1.1 mm and a package area that is 25% smaller than the standard surface-mount
package, the TSSOP is ideal for high-density circuits, particularly in hand-held and portable equipment.

AVAILABLE OPTIONS

PACKAGED DEVICES

T

A

SUPPLY CURRENT

(TYP)

RESPONSE TIME

(TYP)

SMALL OUTLINE

(D)

PLASTIC DIP

(P)

TSSOP

(PW)

†

CHIP FORM

(Y)

°

°

0.16 mA 0.7 µs TLV1393ID TLV1393IP TLV1393IPWLE TLV1393Y

–

40°C to 105°C

1.1 mA

µ

0.45 µs TLV2393ID TLV2393IP TLV2393IPWLE TLV2393Y

†

The PW packages are only available left-ended taped and reeled (e.g., TLV1393IPWLE).

symbol (each comparator)

OUT

IN+

IN–

Copyright  1994, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

1
2
3
4

8
7
6
5

1OUT

1IN–

1IN+

GND

V

CC

2OUT
2IN–
2IN+

D, P, OR PW PACKAGE

(TOP VIEW)

TLV1393, TLV1393Y, TLV2393, TLV2393Y
DUAL DIFFERENTIAL COMPARATORS

SLCS121A – AUGUST 1993 – REVISED APRIL 1994

2

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TLV1393, TLV1393Y equivalent schematic (each comparator)

V

CC

GND OUT

IN +

IN –

COMPONENT COUNT

Transistors 44
Resistors 1
Diodes

7

Epi-FET 2

TLV1393, TLV1393Y, TLV2393, TLV2393Y

DUAL DIFFERENTIAL COMPARATORS

SLCS121A – AUGUST 1993 – REVISED APRIL 1994

3

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TLV2393, TLV2393Y equivalent schematic (each comparator)

V

CC

GND OUT

IN +

IN –

COMPONENT COUNT

Transistors 44
Resistors 1
Diodes

7

Epi-FET 2

TLV1393, TLV1393Y, TLV2393, TLV2393Y
DUAL DIFFERENTIAL COMPARATORS

SLCS121A – AUGUST 1993 – REVISED APRIL 1994

4

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TLV1393Y chip information

This chip, when properly assembled, displays characteristics similar to the TL V1393. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 13 TYPICAL
BONDING PADS: 3.54 × 3.54 MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

1OUT

1IN+

1IN–

V

CC

(8)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN+

2IN–

2OUT

(4)

GND

32

38

(1)

(2)

(3)

(4)

(5)

(6)(7)

(8)

TLV1393, TLV1393Y, TLV2393, TLV2393Y

DUAL DIFFERENTIAL COMPARATORS

SLCS121A – AUGUST 1993 – REVISED APRIL 1994

5

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TLV2393Y chip information

This chip, when properly assembled, displays characteristics similar to the TL V2393. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 3.6 × 3.6 MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

1OUT

1IN+

1IN–

V

CC

(8)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN+

2IN–

2OUT

(4)

GND

32

38

(1)

(2)

(3)

(4)

(5)

(6)(7)

(8)