TEXAS INSTRUMENTS TLK1221 Technical data

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FEATURES

11 121314

15 16

18 19

40 39 38 37 36

RHA Package

(TopView)

35 34 33 32 31

ENABLE

TD0

TD1

TD2

TD3

VDD

TD4

TD5

TD6

TD7

SYNC

RD0

RD1

RD2

VDD

RD3

RD4

RD5

RD6

RD7

GNDA

TXN

TXP

VDDA

VDDPLL

GNDA

RXP

RXN

SYNCEN

PRBSEN

GND

TD8

TD9

RBCMODE

REFCLK

LOOPEN

VDD

RBC0

RD9

RD8

RBC1

DESCRIPTION

TLK1221

SLLS713 – FEBRUARY 2007

ETHERNET TRANSCEIVER

• 0.6- to 1.3-Gigabits Per Second (Gbps)

Serializer/Deserializer

• Low Power Consumption 250 mW (typ) at 1.25

Gbps

• LVPECL-Compatible Differential I/O on

High-Speed Interface

• Single Monolithic PLL Design

• Support For 10-Bit Interface

• Receiver Differential-Input Thresholds,

200-mV Minimum

• Industrial Temperature Range From –40 ° C to 85 ° C

• IEEE 802.3 Gigabit Ethernet Compliant

• Designed in 0.25 µ m CMOS Technology

• No External Filter Capacitors Required

• Comprehensive Suite of Built-In Testability

• 2.5-V Supply Voltage for Lowest-Power

Operation

• 3.3-V Tolerant on LVTTL Inputs

• Hot Plug Protection

• 40-Pin 6-mm × 6-mm QFN PowerPAD™

Package

The TLK1221 gigabit Ethernet transceiver provides for high-speed full-duplex point-to-point data transmissions. These devices are based on the timing requirements of the 10-bit interface specification by the IEEE 802.3 Gigabit Ethernet specification. The TLK1221 supports data rates from 0.6 Gbps through 1.3 Gbps.

The primary application of these devices is to provide building blocks for point-to-point baseband data transmission over controlled-impedance media of 50 Ω . The transmission media can be printed-circuit board traces, copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

The TLK1221 performs the data serialization, deserialization, and clock extraction functions for a physical layer interface device. The transceiver operates at 1.25 Gbps (typical), providing up to 1 Gbps of data bandwidth over a copper or optical media interface.

This device supports the defined 10-bit interface (TBI). In the TBI mode, the serializer/deserializer (SERDES) accepts 10-bit wide 8b/10b parallel encoded data bytes. The parallel data bytes are serialized and transmitted differentially at PECL-compatible voltage levels. The SERDES extracts clock information from the input serial stream and deserializes the data, outputting a parallel 10-bit data byte.

A comprehensive series of built-in tests is provided for self-test purposes, including loopback and pseudorandom binary sequence (PRBS) generation and verification.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

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Differences Between TLK2201B, TLK2201BI, TLK1221, and TNETE2201

2:1

MUX

PRBS

Generator

10Bit

Registers

TD(0–9)

PRBSEN

LOOPEN

Parallelto

Serial

PhaseGenerator

Clock

REFCLK

Control

Logic

ENABLE

Interpolator

and

ClockExtraction

PRBS

Verification

SerialtoParallel

and

CommaDetect

Clock

RBC1

RBC0

SYNC/PASS

RD(0–9)

SYNCEN

2:1

MUX

2:1

MUX

Clock

Data

TXP

TXN

RXP

RXN

RBCMODE

TLK1221

SLLS713 – FEBRUARY 2007

The TLK1221 is housed in a high-performance, thermally enhanced, 40-pin QFN package. Use of this package does not require any special considerations except to note that the pad, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is required that the TLK1221 pad be soldered to the thermal land on the board as it serves as the main ground connection for the device.

The TLK1221 is characterized for operation from –40 ° C to 85 ° C. This device uses a 2.5-V supply. The I/O section is 3.3-V compatible. With the 2.5-V supply, the chipset is very

power-efficient, dissipating less than 200 mW typical power when operating at 1.25 Gbps. The TLK1221 is designed to be hot-plug capable. A power-on reset causes RBC0, RBC1, the parallel output

signal terminals, TXP, and TXN to be held in the high-impedance state.

The TLK1221 is the functional equivalent of the TNETE2201. There are several differences between the devices as noted below. Refer to Figure 12 in the application information section for an example of a typical application circuit.

• V

is 2.5 V for the TLK2201B, TLK2201BI, TLK1221, and TLK1201A vs 3.3 V for TNETE2201.

• The PLL filter capacitors on pins 16, 17, 48, and 49 of the TNETE2201 are no longer required. The TLK2201B, TLK2201BI, TLK1221, and TLK1201A use these pins to provide added test capabilities. The capacitors, if present, do not affect the operation of the device.

• No pulldown resistors are required on the TXP/TXN outputs.

• The TLK1221 is a QFN version of the TLK2201B optimized for GBE-only TBI-mode operation with no JTAG

functionality.

Functional Block Diagram

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Detailed Description

Transmission Latency

10-BitCode

TXP,TXN

REFCLK

d(Tx latency)

10-BitCode

TD(0–9)

Data Reception

Receiver Clock Select Mode

TLK1221

SLLS713 – FEBRUARY 2007

In the TBI mode, the transmitter portion registers incoming 10-bit-wide data words (8b/10b encoded data, TD0–TD9) on the rising edge of REFCLK. REFCLK is also used by the serializer, which multiplies the clock by a factor of 10, providing a signal that is fed to the shift register. The 8b/10b encoded data is transmitted sequentially, bits 0 through 9, over the differential high-speed I/O channel.

Data transmission latency is defined as the delay from the initial 10-bit word load to the serial transmission of bit 9. The minimum latency in TBI mode is 19 bit times. The maximum latency in TBI mode is 20 bit times.

Figure 1. Transmitter Latency, Full-Rate Mode

The receiver section deserializes the differential serial data. The serial data is retimed based on an interpolated clock generated from the reference clock. The serial data is then aligned to the 10-bit word boundaries and presented to the protocol controller along with the receive byte clocks (RBC0, RBC1).

The TLK1221 only supports TBI-mode operation with half-rate and full-rate clocks on RBC0 and RBC1. In TBI mode, there are two user-selectable clock modes that are controlled by the RBCMODE terminal: 1) full-rate clock on RBC0 and 2) half-rate clocks on RBC0 and RBC1.

Table 1. Mode Selection

RECEIVE BYTE CLOCK

RBCMODE MODE

TLK1221

0 TBI half-rate 30–65 MHz 1 TBI full-rate 60–130 MHz

In the half-rate mode, two receive byte clocks (RBC0 and RBC1) are 180 degrees out of phase and operate at one-half the data rate. The clocks are generated by dividing down the recovered clock. The received data is output with respect to the two receive byte clocks (RBC0, RBC1), allowing a protocol device to clock the parallel bytes using the RBC0 and RBC1 rising edges. For the outputs to the protocol device, byte 0 of the received data is valid on the rising edge of RBC1. Refer to the timing diagram shown in Figure 2 .

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d(S)

d(H)

K28.5

DXX.X

DXX.X DXX.X

K28.5

DXX.X

RBC0

RBC1

SYNC

RD(0–9)

d(H)

d(S)

K28.5

DXX.X DXX.X DXX.X

K28.5

DXX.X

RBC0

SYNC

RD(0–9)

Receiver Word Alignment

TLK1221

SLLS713 – FEBRUARY 2007

Figure 2. Synchronous Timing Characteristic Waveforms (TBI Half-Rate Mode)

The receiver clock interpolator can lock to the incoming data without the need for a lock-to-reference preset. The received serial data rate (RXP and RXN) is at the same baud rate as the transmitted data stream, ± 0.02% (200 PPM) for proper operation.

Figure 3. Synchronous Timing Characteristic Waveforms (TBI Full-Rate Mode)

These devices use the IEEE 802.3 Gigabit Ethernet defined 10-bit K28.5 character, which contains the 7-bit comma-pattern word alignment scheme. The following sections explain how this scheme works and how it realigns to the proper byte boundary of the data.

Comma Character on Expected Boundary

These devices provide 10-bit K28.5 character recognition and word alignment. The 10-bit word alignment is enabled by forcing the SYNCEN terminal high. This enables the function that examines and compares serial input data to the 7-bit synchronization pattern. The K28.5 character is defined by the 8b/10b coding scheme as a pattern consisting of 0011 1110 10 (a negative number beginning with disparity), with the 7 MSBs (0011 111) referred to as the comma character. The K28.5 character was implemented specifically for aligning data words. As long as the K28.5 character falls within the expected 10-bit boundary, the received 10-bit data is properly aligned and data realignment is not required. Figure 2 shows the timing characteristics of RBC0, RBC1, SYNC and RD0–RD9 while synchronized. (Note: the K28.5 character is valid on the rising edge of RBC1).

Comma Character Not on Expected Boundary

If synchronization is enabled and a K28.5 character straddles the expected 10-bit word boundary, then word realignment is necessary. Realignment or shifting the 10-bit word boundary truncates the character following the misaligned K28.5, but the following K28.5 and all subsequent data is aligned properly as shown in Figure 4 . The RBC0 and RBC1 pulse widths are stretched or stalled in their current state during realignment. With this design, the maximum stretch that occurs is 20 bit times. This occurs during a worst-case scenario when the K28.5 is aligned to the falling edge of RBC1 instead of the rising edge. Figure 4 shows the timing characteristics of the data realignment.

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DXX.X

K28.5

DXX.X DXX.X

K28.5K28.5

DXX.X DXX.XDXX.X DXX.X

DXX.X

K28.5

DXX.X DXX.X

K28.5K28.5

DXX.X DXX.X

31Bit

Times

MaxReceive

PathLatency

WorstCase

MisalignedK28.5

MisalignmentCorrected

INPUTDATA

RBC0

RBC1

RD(0–9)

SYNC

CorruptData

30Bit

Times(Max)

Data Reception Latency

10-BitCode

RXP,RXN

RD(0–9)

RBC0

10-BitCode

d(Rx latency)

RBC1

Testability

TLK1221

SLLS713 – FEBRUARY 2007

Figure 4. Word Realignment Timing Characteristic Waveforms

Systems that do not require framed data may disable byte alignment by tying SYNCEN low. When a SYNC character is detected, the SYNC signal is brought high and is aligned with the K28.5 character.

The duration of the SYNC pulse is equal to the duration of the data.

The serial-to-parallel data latency is the time from when the first bit arrives at the receiver until it is output in the aligned parallel word with RD0 received as the first bit. The minimum latency in TBI mode is 21 bit times and the maximum latency is 31 bit times.

Figure 5. Receiver Latency, TBI Half-Rate Mode Shown

The loopback function provides for at-speed testing of the transmit/receive section of the circuitry. The enable function allows for all circuitry to be disabled so that an Iddq test can be performed. The PRBS function also allows for built-in self-test (BIST).

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Loopback Testing

ENABLE Function

PRBS Function

TLK1221

SLLS713 – FEBRUARY 2007

The transceiver can provide a self-test function by enabling (LOOPEN to high level) the internal loopback path. Enabling this function causes serial transmitted data to be routed internally to the receiver. The parallel data output can be compared to the parallel input data for functional verification. (The external differential output is held in a high-impedance state during the loopback testing.)

When held low, ENABLE disables all quiescent power in both analog and digital circuitry. This allows an ultralow-power idle state when the link is not active.

These devices have a built-in 27– 1 PRBS function. When the PRBSEN control bit is set high, the PRBS test is enabled. A PRBS is generated and fed into the 10-bit parallel transmitter input bus. Data from the normal parallel input source is ignored during PRBS test mode. The PRBS pattern is then fed through the transmit circuitry as if it were normal data and sent out to the transmitter. The output can be sent to a bit error rate tester (BERT) or to the receiver of another TLK1221. Because the PRBS is not really random and is really a predetermined sequence of ones and zeros, the data can be captured and checked for errors by a BERT. These devices also have a built-in BERT function on the receiver side that is enabled by PRBSEN. It can receive a PRBS pattern and check for errors, and then report the errors by forcing the SYNC/PASS terminal low. The PRBS testing supports two modes (normal and latched), which are controlled by the SYNCEN input. When SYNCEN is low, the result of the PRBS bit-error-rate test is passed to the SYNC/PASS terminal. When SYNCEN is high, the result of the PRBS verification is latched on the SYNC/PASS output (i.e., a single failure forces SYNC/PASS to remain low).

Table 2. TERMINAL FUNCTIONS

TERMINAL

I/O DESCRIPTION

NAME NO. SIGNAL

Differential output transmit. TXP and TXN are differential serial outputs that interface to a

TXP 38 PECL

copper or an optical I/F module. TXP and TXN are put in a high-impedance state when

TXN 39 O

LOOPEN is high and are active when LOOPEN is low.

RXP 34 PECL Differential input receive. RXP and RXN together are the differential serial input interface RXN 33 I from a copper or an optical I/F module.

Reference clock. REFCLK is an external input clock that synchronizes the receiver and transmitter interface (60 MHz to 130 MHz). The transmitter uses this clock to register the

REFCLK 14 I

input data (TD0–TD9) for serialization. In the TBI mode that data is registered on the rising edge of REFCLK.

Transmit data. These inputs carry 10-bit parallel data output from a protocol device to the transceiver for serialization and transmission. This 10-bit parallel data is clocked into the

TD0–TD9 2–5, 7–12 I

transceiver on the rising edge of REFCLK and transmitted as a serial stream with TD0 sent as the first bit.

Receive data. These outputs carry 10-bit parallel data output from the transceiver to the

RD0–RD9 29–27, 25–19 O protocol layer. The data is referenced to terminals RBC0 and RBC1. RD0 is the first bit

received. Receive byte clock. RBC0 and RBC1 are recovered clocks used for synchronizing the 10-bit

output data on RD0–RD9. In the half-rate mode, the 10-bit output data words are valid on the rising edges of RBC0

RBC0 17 and RBC1. These clocks are adjusted to half-word boundaries in conjunction with

RBC1 18 synchronous detect. The clocks are always expanded during data realignment and never

slivered or truncated. RBC0 registers bytes 1 and 3 of received data. RBC1 registers bytes 0 and 2 of received data. In normal-rate mode, only RBC0 is valid and operates at 1/10th the serial data rate. Data is aligned to the rising edge.

Receive clock mode select. When RBCMODE is low, half-rate clocks are output on RBC0

RBCMODE 13 and RBC1. When RBCMODE is high, a full baud-rate clock is output on RBC0, and RBC1 is

P/D

(1)

held low.

(1) P/D = Internal pulldown resistor

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ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

TLK1221

SLLS713 – FEBRUARY 2007

Table 2. TERMINAL FUNCTIONS (continued)

TERMINAL

I/O DESCRIPTION

NAME NO.

Synchronous function enable. When SYNCEN is high, the internal synchronization function

I is activated. When this function is activated, the transceiver detects the comma pattern

SYNCEN 32

P/U

(2)

(0011 111 negative beginning disparity) in the serial data stream and realigns data on byte boundaries if required. When SYNCEN is low, serial input data is unframed in RD0–RD9.

Synchronous detect. The SYNC output is asserted high upon detection of the comma pattern in the serial data path. SYNC pulses are output only when SYNCEN is activated

SYNC/PASS 30 O

(asserted high). In PRBS test mode (PRBSEN = high), SYNC/PASS outputs the status of the PRBS test results (high = pass).

TEST

Loop enable. When LOOPEN is high (active), the internal loopback path is activated. The transmitted serial data is directly routed to the inputs of the receiver. This provides a self-test

LOOPEN 15 capability in conjunction with the protocol device. The TXP and TXN outputs are held in a

P/D

(3)

high-impedance state during the loopback test. LOOPEN is held low during standard operational state with external serial outputs and inputs active.

PRBS enable. When PRBSEN is high, the PRBS generation circuitry is enabled. The PRBS

I verification circuit in the receive side is also enabled. A PRBS signal can be fed to the

PRBSEN 31

P/D

(3)

receive inputs and checked for errors, which are reported by the SYNC/PASS terminal indicating low.

When this terminal is low, the device is disabled for Iddq testing. RD0–RD9, RBCn, TXP and

ENABLE 1 TXN are high-impedance. The pullup and pulldown resistors on any input are disabled.

P/D

(2)

When ENABLE is high, the device operates normally.

POWER

VDD 6, 16, 26 Supply Digital logic power. Provides power for all digital circuitry and digital I/O buffers

Analog power. VDDA provides power for the high-speed analog circuits, receiver, and

VDDA 37 Supply

transmitter.

VDDPLL 36 Supply PLL power. Provides power for the PLL circuitry. This terminal requires additional filtering.

GROUND

GNDA 35, 40 Ground Analog ground. GNDA provides a ground for the high-speed analog circuits, RX and TX. GNDQFN PAD Ground Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers

(2) P/U = Internal pullup resistor (3) P/D = Internal pulldown resistor

over operating free-air temperature range (unless otherwise noted)

VALUE

(1)

UNIT

Supply voltage

(2)

–0.3 to 3 V

Input voltage range at TTL terminals –0.5 to 4 V

Input voltage range at other terminals –0.3 to V

+ 0.3 V ESD Electrostatic discharge CDM: 1, HBM: 2 kV T

stg

Storage temperature –65 to 150 ° C

Characterized free-air temperature range –40 to 85 ° C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

TA≤ 25 ° C DERATING FACTOR TA= 70 ° C TA= 85 ° C

PACKAGE

POWER RATING ABOVE TA= 25 ° C POWER RATING POWER RATING

RHA

(1) (2)

2.85 W 28 mW/ ° C 1.57 W 1.4 W

(1) The thermal resistance junction to ambient of the RHA package is 35 ° C/W measured on a high-K board. (2) The thermal resistance junction-to-case (exposed pad) of the RHA package is 5 ° C/W.

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RECOMMENDED OPERATING CONDITIONS

REFERENCE CLOCK (REFCLK) TIMING REQUIREMENTS

TTL ELECTRICAL CHARACTERISTICS

TLK1221

SLLS713 – FEBRUARY 2007

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

VDD, V

DDA

, Supply voltage 2.3 2.5 2.7 V

DDPLL

IDD, I

DDA

, Frequency = 1.25 Gbps, PRBS pattern; ENABLE

Total supply current 113 mA

DDPLL

= 1, V

, V

DDPLL

and V

DDA

= 2.7 V

Total power dissipation Frequency = 1.25 Gbps, PRBS pattern 235 305 mW Total shutdown current (IDD+I

DDA

DDQ

Enable = 0; V

, V

DDPLL

and V

DDA

= 2.7 V 1000 µ A

DDPLL

)

PLL Startup lock time VDD, V

DDA

= 2.5 V 500 µ s

Operating free-air temperature –40 85 ° C

over recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Minimum data rate TYP – 0.01% 60 TYP + 0.01%

f Frequency MHz

Maximum data rate TYP – 0.01% 130 TYP + 0.01%

Accuracy –100 100 ppm

DC Duty cycle 40% 50% 60%

Jitter Random plus deterministic 40 ps

over recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

High-level output voltage IOH= –400 µ A V

– 0.2 2.3 V

Low-level output voltage IOL= 1 mA GND 0.25 0.5 V

High-level input voltage 1.7 3.6 V

Low-level input voltage 0.8 V

High-level input current V

= 2.3 V, VIN= 2 V 40 µ A

Low-level input current V

= 2.3 V, VIN= 0.4 V –40 µ A

Input capacitance 4 pF

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TRANSMITTER/RECEIVER CHARACTERISTICS

80% 50% 20%

80%

20%

0V

1V

–1V

TX+

TX–

VOD

RXP,RXN

RD(0–9)

RBC0

10-BitCode

d(Rx latency)

10-BitCode

b1 b2

b8 b9

TLK1221

SLLS713 – FEBRUARY 2007

over recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOD = |TxD – TxN| Rt = 50 Ω 600 850 1100 mV Transmit common mode voltage

(CM)

Rt = 50 Ω 1000 1250 1400 mV

range Receiver input voltage requirement,

200 1600 mV

VID = |RxP – RxN| Receiver common mode voltage

1000 1250 2250 mV

range, (RxP + RxN)/2

Receiver input capacitance 2 pF

Differential output jitter, random +

(TJ)

Serial data total jitter (peak-to-peak) deterministic, PRBS pattern, 0.24 UI

Rω= 125 MHz

Serial data deterministic jitter Differential output jitter, PRBS

(DJ)

0.12 UI

(peak-to-peak) pattern, Rω= 125 MHz Differential signal rise, fall time (20% RL= 50 Ω , CL= 5 pF, see Figure 6

tr, t

100 250 ps

to 80%) and Figure 8 Serial data jitter tolerance minimum

Differential input jitter, random +

required eye opening, (per 0.25 UI

deterministic, Rω= 125 MHz

IEEE-802.3 specification) Receiver data acquisition lock time

500 µ s

from power up Data relock time from loss of

1024 Bit times

synchronization

d(Tx latency)

Tx latency See Figure 1 20 22 UI

d(Rx latency)

Rx latency See Figure 5 and Figure 7 18 24 UI

Figure 6. Differential and Common-Mode Output Voltage Definitions

Figure 7. Receiver Latency, TBI Normal Mode Shown

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5pF

50 W

CLOCK

80% 50% 20%

2V

0.8V

DATA

1.4V

LVTTL OUTPUT SWITCHING CHARACTERISTICS

TRANSMITTER TIMING REQUIREMENTS

TLK1221

SLLS713 – FEBRUARY 2007

Figure 8. Transmitter Test Setup

Figure 9. TTL Data I/O Valid Levels for AC Measurement

over recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

r(RBC)

Clock rise time 0.3 1.5 ns

f(RBC)

Clock fall time 0.3 1.5 ns

80% to 20% output voltage, C = 5 pF (see

Figure 9 )

Data rise time 0.3 1.5 ns

Data fall time 0.3 1.5 ns

TBI normal mode (see Figure 3 ), Rω= 125 MHz,

2.5 ns

data valid prior to RBC0 rising

Data setup time

su(d1)

(RD0–RD9)

TBI normal mode (see Figure 3 ), Rω= 61.44

5 ns

MHz, data valid prior to RBC0 rising TBI normal mode (see Figure 3 ), Rω= 125 MHz,

2 ns

data valid after RBC0 rising

h(d1)

Data hold time (RD0–RD9)

TBI normal mode (see Figure 3 ), Rω= 61.44

4 ns

MHz, data valid after RBC0 rising

Data setup time TBI half-rate mode, Rω= 125 MHz (see

su(d3)

2.5 ns

(RD0–RD9) Figure 2 )

TBI half-rate mode, Rω= 125 MHz (see

h(d3)

Data hold time (RD0–RD9) 1.5 ns

Figure 2 )

over recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

su(d4)

Data setup time (TD0–TD9) 1.6 ns

h(d4)

Data hold time (TD0–TD9) 0.8 ns

tr, t

TD[0,9] data rise and fall time See Figure 9 2 ns

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TLK1221

SLLS713 – FEBRUARY 2007

Table 3. AVAILABLE OPTIONS

PACKAGE

QFN PLASTIC QUAD FLAT PACK (RHA)

–40 ° C to 85 ° C TLK1221RHA

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APPLICATION INFORMATION

8b/10b Transmission Code

TLK1221

SLLS713 – FEBRUARY 2007

The PCS maps GMII signals into ten-bit code groups and vice versa, using an 8b/10b block coding scheme. The PCS uses the transmission code to improve the transmission characteristics of information to be transferred across the link. The encoding defined by the transmission code ensures that sufficient transitions are present in the PHY bit stream to make clock recovery possible in the receiver. Such encoding also greatly increases the likelihood of detecting any single- or multiple-bit errors that may occur during transmission and reception of information. The 8b/10b transmission code specified for use has a high transition density, is run length limited, and is dc-balanced. The transition density of the 8b/10b symbols ranges from 3 to 8 transitions per symbol. The definition of the 8b/10b transmission code is specified in IEEE 802.3 Gigabit Ethernet and ANSI X3.230-1994 (FC-PH), clause 11.

8b/10b transmission code uses letter notation describing the bits of an unencoded information octet. The bit notation of A, B, C, D, E, F, G, H for an unencoded information octet is used in the description of the 8b/10b transmission code-groups, where A is the LSB. Each valid code group has been given a name using the following convention: /Dx.y/ for the 256 valid data code-groups and /Kx.y/ for the special control code-groups, where y is the decimal value of bits EDCBA and x is the decimal value of bits HGF (noted as K<HGF.EDCBA>). Thus, an octet value of FE representing a code-group value of K30.7 would be represented in bit notation as 111 11110.

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VDD

GND

5kW

7.5kW

RXP

RXN

GND

7.5kW

VDD

TXP

TXN

Transmitter Media Receiver

VDD

GND

5kW

7.5kW

RXP

RXN

GND

7.5kW

VDD

TXP

TXN

Transmitter Media Receiver

TLK1221

SLLS713 – FEBRUARY 2007

APPLICATION INFORMATION (continued)

Figure 10. High-Speed I/O Directly Coupled Mode

Figure 11. High-Speed I/O AC-Coupled Mode

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GNDQFN

GNDA

TD0–TD9

REFCLK

PRBSEN

SYNCEN

SYNC/PASS

RD0–RD9

RBC0–RBC1

ENABLE

LOOPEN

RCBMODE

Host

Protocol

Device

VDD VDDA

2.5V

VDDPLL

GNDA

5 at100MHzW

2.5V

Controlled-Impedance

TransmissionLine

TXP

Controlled-Impedance

TransmissionLine

TXN

Controlled-Impedance

TransmissionLine

RXP

Controlled-Impedance

TransmissionLine

RXN

TLK1221

0.01µF

TLK1221

SLLS713 – FEBRUARY 2007

APPLICATION INFORMATION (continued)

Figure 12. Typical Application Circuit (AC Mode)

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PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

TLK1221RHAR ACTIVE QFN RHA 40 2500 Green (RoHS &

no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

TLK1221RHARG4 ACTIVE QFN RHA 40 2500 Green (RoHS &

no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

TLK1221RHAT ACTIVE QFN RHA 40 250 Green (RoHS &

no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

TLK1221RHATG4 ACTIVE QFN RHA 40 250 Green (RoHS &

no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com

16-Mar-2007

Addendum-Page 1

IMPORTANT NOTICE

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

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PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

TLK1221RHAR ACTIVE QFN RHA 40 2500 Green (RoHS &

no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

TLK1221RHARG4 ACTIVE QFN RHA 40 2500 Green (RoHS &

no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

TLK1221RHAT ACTIVE QFN RHA 40 250 Green (RoHS &

no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

TLK1221RHATG4 ACTIVE QFN RHA 40 250 Green (RoHS &

no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

(1)

The marketing status values are defined as follows:

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com

16-Mar-2007

Addendum-Page 1

TEXAS INSTRUMENTS TLK1221 Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual