High Output-Current Capability
– Source...20 mA Typ
– Sink...20 mA Typ
description
In signal-conditioning applications utilizing a
single power source, a reference voltage equal to
one-half the supply voltage is required for
termination of all analog signal grounds. Texas
Instruments presents a precision virtual ground
whose output voltage is always equal to one-half
the input voltage, the TLE2426 “rail splitter.”
TLE2426, TLE2426Y
THE “RAIL SPLITTER”
PRECISION VIRTUAL GROUND
SLOS098D – AUGUST 1991 – REVISED MA Y 1998
D
Excellent Output Regulation
– –45 µV Typ at I
– +15 µV Typ at I
D
Low-Impedance Output...0.0075 Ω Typ
D
Noise Reduction Pin (D, JG, and P
Packages Only)
INPUT/OUTPUT TRANSFER CHARACTERISTICS
10
V
I
8
6
V
Voltage – V
4
O
= 0 to –10 mA
O
= 0 to +10 mA
O
V
I
V
O
VO+
V
I
2
The unique combination of a high-performance,
micropower operational amplifier and a precision-
2
trimmed divider on a single silicon chip results in
a precise V
sourcing current. The TLE2426 provides a lowimpedance output with 20 mA of sink and source
capability while drawing less than 280 µA
ratio of 0.5 while sinking and
O/VI
0
00.250.50.751
t – Time – s
of supply current over the full input range of 4 V to 40 V. A designer need not pay the price in terms of board
space for a conventional signal ground consisting of resistors, capacitors, operational amplifiers, and voltage
references. The performance and precision of the TLE2426 is available in an easy-to-use, space saving,
3-terminal LP package. For increased performance, the optional 8-pin packages provide a noise-reduction pin.
With the addition of an external capacitor (C
), peak-to-peak noise is reduced while line ripple rejection is
NR
improved.
Initial output tolerance for a single 5-V or 12-V system is better than 1% with 3.6% over the full 40-V input range.
Ripple rejection exceeds 12 bits of accuracy . Whether the application is for a data acquisition front end, analog
signal termination, or simply a precision voltage reference, the TLE2426 eliminates a major source of system
error.
AVAILABLE OPTIONS
PACKAGED DEVICES
SMALL
T
A
0°C to 70°CTLE2426CD—TLE2426CLPTLE2426CP
–40°C to 85°CTLE2426ID—TLE2426ILPTLE2426IPTLE2426Y
–55°C to 125°CTLE2426MDTLE2426MJGTLE2426MLPTLE2426MP
The D and LP packages are available taped and reeled in the commercial temperature range only. Add R suffix
to the device type (e. g., TLC2426CDR). Chips are tested at 25°C.
OUTLINE
(D)
CERAMIC
DIP
(JG)
PLASTIC
(LP)
PLASTIC
DIP
(P)
CHIP
FORM
(Y)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1998, Texas Instruments Incorporated
1
TLE2426, TLE2426Y
THE “RAIL SPLITTER”
PRECISION VIRTUAL GROUND
SLOS098D – AUGUST 1991 – REVISED MA Y 1998
description (continued)
The C-suffix devices are characterized for operation from 0°C to 70°C. The I suffix devices are characterized
for operation from –40°C to 85°C. The M suffix devices are characterized over the full military temperature range
of –55°C to 125°C.
D, JG, OR P PACKAGE
(TOP VIEW)
LP PACKAGE
(TOP VIEW)
OUT
COMMON
NC – No internal connection
IN
NC
1
2
3
4
NOISE REDUCTION
8
NC
7
NC
6
NC
5
IN
COMMON
OUT
TLE2426Y chip information
This chip, properly assembled, displays characteristics similar to the TLE2426C. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(2) (2)
(1)
(1)
NOISE
REDUCTION
IN
(8)
(2)
COMMON
(3)
+1
(1)
CHIP THICKNESS:
15 MILS TYPICAL
BONDING PADS:
4 × 4 MILS MINIMUM
OUT
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN
MILS.
60
(3)
(3)
(8)
88
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
NOTE A: Both bonding pads numbered 1, both numbered 2,
and both numbered 3, must be bonded out to the
corresponding functions pin.
TLE2426, TLE2426Y
PACKAGE
UNIT
THE “RAIL SPLITTER”
PRECISION VIRTUAL GROUND
SLOS098D – AUGUST 1991 – REVISED MA Y 1998
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or P package 260°C. . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG or LP package 300°C. . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The output may be shorted to either supply. T emperature and/or supply voltages must be limited to ensure that the maximum dissipation
rating is not exceeded.
DISSIPATION RATING TABLE
TA ≤ 25°CDERATING FACTORTA = 70°CTA = 85°CTA = 125°C
POWER RATINGABOVE TA = 25°CPOWER RATING POWER RATINGPOWER RATING