Texas Instruments TIBPAL16R8-12MWB, TIBPAL16R8-12MJB, TIBPAL16R8-12MJ, TIBPAL16R6-12MWB, TIBPAL16R6-12MJB Datasheet

...
TIBPAL16L8-10C, TIBPAL16R4-10C, TIBPAL16R6-10C, TIBPAL16R8-10C
TIBPAL16L8-12M, TIBPAL16R4-12M, TIBPAL16R6-12M, TIBPAL16R8-12M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS017 – D3023, MA Y 1987 – REVISED MARCH 1992
CIRCUITS
High-Performance Operation:
f
(w/o feedback)
max
TIBPAL16R’-10C Series . . . 62.5 MHz Min TIBPAL16R’-12M Series . . . 56 MHz Min
f
(with feedback)
max
TIBPAL16R’-10C Series . . . 55.5 MHz Min TIBPAL16R’-12M Series . . . 48 MHz Min
Propagation Delay
TIBPAL16L’-10C Series . . . 10 ns Max TIBPAL16L’-12M Series . . . 12 ns Max
Functionally Equivalent, but Faster than,
Existing 20-Pin PLDs
Preload Capability on Output Registers
Simplifies Testing
Power-Up Clear on Registered Devices (All
Register Outputs are Set Low, but Voltage Levels at the Output Pins Go High)
Package Options Include Both Plastic and
Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
Security Fuse Prevents Duplication
Dependable Texas Instruments Quality and
Reliability
DEVICE
PAL16L8 10 2 0 6 PAL16R4 8 0 4 (3-state buffers) 4 PAL16R6 8 0 6 (3-state buffers) 2 PAL16R8 8 0 8 (3-state buffers) 0
I
INPUTS
description
3-STATE
O OUTPUTS
REGISTERED
Q OUTPUTS
I/O
PORT
S
TIBPAL16L8’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
(TOP VIEW)
I
I
I
I
4
I
I
I
I
I
GND
C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE
I I I I I
10
TIBPAL16L8’
(TOP VIEW)
I
I
3 2 1 20 19
910111213
I
V
20
CC
O
19
I/O
18
I/O
17
I/O
16 15
I/O
14
I/O
13
I/O
12
O
11
I
CC
I
O
V
I/O
18
I/O
17
I/O
16
I/O
15
I/O
14
I
O
I/O
GND
Pin assignments in operating mode
These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-X circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.
All of the register outputs are set to a low level during power up. Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.
The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.
These devices are covered by U.S. Patent 4,410,987. IMPACT-X is a trademark of Texas Instruments Incorporated. PAL is a registered trademark of Advanced Micro Devices Inc.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1992, Texas Instruments Incorporated
TIBPAL16R4-10C, TIBPAL16R6-10C, TIBPAL16R8-10C TIBPAL16R4-12M, TIBPAL16R6-12M, TIBPAL16R8-12M HIGH-PERFORMANCE IMPACT-X PAL
SRPS017 – D3023, MA Y 1987 – REVISED MARCH 1992
CIRCUITS
TIBPAL16R4’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
(TOP VIEW)
CLK
I
I
I
4
I
I
I
I
I
GND
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
GND
CLK
I I I I I I I I
10
TIBPAL16R6’
(TOP VIEW)
20 19 18 17 16 15 14 13 12 11
20 19 18 17 16 15 14 13 12 11
V I/O I/O Q Q Q Q I/O I/O OE
V I/O Q Q Q Q Q Q I/O OE
CC
CC
TIBPAL16R4’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
CC
I
CLK
I/O
V
18 17 16 15 14
3 2 1 20 19
I
I
I
I
I
910111213
I
I
I/O
I/O
OE
GND
TIBPAL16R6’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
GND
CLK
OE
CC
V
I/O
I/O
18 17 16 15 14
Q
3 2 1 20 19
I
I
I
I
I
910111213
I
I
I/O Q Q Q Q
Q Q Q Q Q
TIBPAL16R8’
C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
(TOP VIEW)
CLK
I
I
I
4
I
I
I
I
I
GND
Pin assignments in operating mode
10
V
20
CC
Q
19
Q
18
Q
17
Q
16 15
Q
14
Q
13
Q
12
Q
11
OE
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TIBPAL16R8’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
GND
CLK
OE
CC
V
Q
Q
18 17 16 15 14
Q
3 2 1 20 19
I
I
I
I
I
910111213
I
I
Q Q Q Q Q
functional block diagrams (positive logic)
TIBPAL16L8-10C, TIBPAL16R4-10C
TIBPAL16L8-12M, TIBPAL16R4-12M
HIGH-PERFORMANCE IMPACT-X PAL
SRPS017 – D3023, MA Y 1987 – REVISED MARCH 1992
TIBPAL16L8
CIRCUITS
OE
CLK
10 16
I
16 x
&
32 X 64
166
TIBPAL16R4
EN
1
O
O
I/O
I/O
I/O
I/O
I/O
I/O
EN 2
C1
denotes fused inputs
816
I
16 x
164
&
32 X 64
1D
I = 0
Q
Q
Q
Q
I/O
I/O
I/O
I/O
1
1
EN
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TIBPAL16R6-10C, TIBPAL16R8-10C TIBPAL16R6-12M, TIBPAL16R8-12M HIGH-PERFORMANCE IMPACT-X PAL
SRPS017 – D3023, MA Y 1987 – REVISED MARCH 1992
functional block diagrams (positive logic)
CIRCUITS
TIBPAL16R6
OE
CLK
816
I
16 x
162
&
32 X 64
EN 2
C1
1D
I = 0
Q
Q
Q
Q
Q
Q
I/O
I/O
1
1
EN
OE
CLK
denotes fused inputs
816
I
16 x
168
TIBPAL16R8
&
32 X 64
EN 2
C1
1D
I = 0
Q
Q
Q
Q
Q
Q
Q
Q
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
logic diagram (positive logic)
I
First Fuse Numbers
I
I
I
I
I
I
I
I
0 4 8 12 16 20 24 28 31
0 32 64 96
128 160 192 224
256 288 320 352 384 416 448 480
512 544 576 608 640 672 704 736
768 800 832 864 896 928 960 992
1024 1056 1088 1120 1152 1184 1216 1248
1280 1312 1344 1376 1408 1440 1472 1504
1536 1568 1600 1632 1664 1696 1728 1760
1792 1824 1856 1888 1920 1952 1984 2016
HIGH-PERFORMANCE IMPACT-XPAL
SRPS017 – D3023, MA Y 1987 – REVISED MARCH 1992
Increment
TIBPAL16L8-10C
TIBPAL16L8-12M
CIRCUITS
19
O
18
I/O
17
I/O
16
I/O
15
I/O
14
I/O
13
I/O
12
O
11
I
Fuse number = First fuse number + Increment
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TIBPAL16R4-10C TIBPAL16R4-12M HIGH-PERFORMANCE IMPACT-XPAL
SRPS017 – D3023, MA Y 1987 – REVISED MARCH 1992
logic diagram (positive logic)
CLK
First Fuse Numbers
I
I
I
I
I
I
I
I
0 4812 16 20 24 28 31
0 32 64 96
128 160 192 224
256 288 320 352 384 416 448 480
512 544 576 608 640 672 704 736
768 800 832 864 896 928 960 992
1024 1056 1088 1120 1152 1184 1216 1248
1280 1312 1344 1376 1408 1440 1472 1504
1536 1568 1600 1632 1664 1696 1728 1760
1792 1824 1856 1888 1920 1952 1984 2016
Fuse number = First fuse number + Increment
Increment
CIRCUITS
I = 0
1D
I = 0
1D
I = 0
1D
I = 0
1D
C1
C1
C1
C1
19
18
17
16
15
14
13
12
11
I/O
I/O
Q
Q
Q
Q
I/O
I/O
OE
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
logic diagram (positive logic)
CLK
First Fuse Numbers
I
I
I
I
I
I
I
I
Fuse number = First fuse number + Increment
0 4 8 12 16 20 24 28 31
0 32 64 96
128 160 192 224
256 288 320 352 384 416 448 480
512 544 576 608 640 672 704 736
768 800 832 864 896 928 960 992
1024 1056 1088 1120 1152 1184 1216 1248
1280 1312 1344 1376 1408 1440 1472 1504
1536 1568 1600 1632 1664 1696 1728 1760
1792 1824 1856 1888 1920 1952 1984 2016
HIGH-PERFORMANCE IMPACT-XPAL
SRPS017 – D3023, MA Y 1987 – REVISED MARCH 1992
Increment
TIBPAL16R6-10C
TIBPAL16R6-12M
CIRCUITS
19
I/O
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
I = 0
1D
C1
18
17
16
15
14
13
12
11
Q
Q
Q
Q
Q
Q
I/O
OE
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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