•Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
2Applications
•AV Receiver
•Audio Dock: Portable
•Blu-ray Player and Home Theater
•MP3 Player/Recorder
•Personal Digital Assistant (PDA)
•Power: Telecom/Server AC/DC Supply: Single
Controller: Analog and Digital
•Solid State Drive (SSD): Client and Enterprise
•TV: LCD/Digital and High-Definition (HDTV)
•Tablet: Enterprise
•Video Analytics: Server
•Wireless Headset, Keyboard, and Mouse
This single Schmitt-trigger buffer is designed for
1.65-V to 5.5-V VCCoperation.
The SN74LVC1G17 device contains one buffer and
performs the Boolean function Y = A.
The CMOS device has high output drive while
maintaining low static power dissipation over a broad
Vcc operating range.
The SN74LVC1G17 is available in a variety of
packages, including the ultra-small DPW package
with a body size of 0.8 mm × 0.8mm.
Device Information
DEVICE NAMEPACKAGEBODY SIZE
SN74LVC1G17X2SON (4)0.8mm × 0.8mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
SN74LVC1G17
SCES351V –JULY 2001–REVISED APRIL 2014
(1)
SOT-23 (5)2.9mm × 1.6mm
SC70 (5)2.0mm × 1.25mm
SON (6)1.45mm × 1.0mm
SON (6)1.0mm × 1.0mm
4Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
•Changed MAX operating free-air temperature from 85°C to 125°C....................................................................................... 5
•Added –40°C to 125°C to Electrical Characteristics table...................................................................................................... 6
•Added Switching Characteristics table for –40°C to 125°C temperature range..................................................................... 7
Changes from Revision S (June 2011) to Revision TPage
to Handling Ratings table..................................................................................................................................... 4
stg
•Removed Ordering Information table. .................................................................................................................................... 3
over operating free-air temperature range (unless otherwise noted)
MINMAXUNIT
V
V
V
V
I
IK
I
OK
I
O
Supply voltage range–0.56.5V
CC
Input voltage range
I
Voltage range applied to any output in the high-impedance or power-off state
O
Voltage range applied to any output in the high or low state
O
(2)
(2)
(2)(3)
–0.56.5V
–0.56.5V
–0.5VCC+ 0.5V
Input clamp currentVI< 0–50mA
Output clamp currentVO< 0–50mA
Continuous output current±50mA
Continuous current through VCCor GND±100mA
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions tables is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCCis provided in the Recommended Operating Conditions table.
7.2 Handling Ratings
MINMAXUNIT
T
stg
(1)
V
ESD
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process.
Storage temperature range–65150°C
Human-Body Model (HBM)
Charged-Device Model (CDM)
B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol.
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10MHz,Z =50 .
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
E. t andtarethesameast .
F. t andtarethesameast .
G. tandtarethesameast .
H. Allparametersandwaveformsarenotapplicabletoalldevices.
B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol.
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10MHz,Z =50 .
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
E. t andtarethesameast .
F. t andtarethesameast .
G. tandtarethesameast .
H. Allparametersandwaveformsarenotapplicabletoalldevices.
The SN74LVC1G17 device contains one Schmitt trigger buffer and performs the Boolean function Y = A. The
device functions as an independent buffer, but because of Schmitt action, it will have different input threshold
levels for a positive-going (VT+) and negative-going signals.
The DPW package technology is a major breakthrough in IC packaging. Its tiny 0.64 mm square footprint saves
significant board space over other package options while still retaining the traditional manufacturing friendly lead
pitch of 0.5 mm.
This device is fully specified for partial-power-down applications using I
preventing damaging current backflow through the device when it is powered down.
9.2 Functional Block Diagram
9.3 Feature Description
•Wide operating voltage range.
– Operates From 1.65 V to 5.5 V.
•Allows Down voltage translation.
•Inputs accept voltages to 5.5 V.
•I
feature allows voltages on the inputs and outputs, when VCCis 0 V.
The SN74LVC1G14 is a high drive CMOS device that can be used for a multitude of buffer type functions where
the input is slow or noisy. It can produce 24 mA of drive current at 3.3 V making it Ideal for driving multiple
outputs and good for high speed applications up to 100 MHz. The inputs are 5.5 V tolerant allowing it to translate
down to VCC.
10.2 Typical Application
10.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus
contention because it can drive currents that would exceed maximum limits. The high drive will also create fast
edges into light loads so routing and load conditions should be considered to prevent ringing.
10.2.2 Detailed Design Procedure
1. Recommended Input Conditions
– Rise time and fall time specs. See (Δt/ΔV) in the Recommended Operating Conditions table.
– Specified high and low levels. See (VIHand VIL) in the Recommended Operating Conditions table.
– Inputs are overvoltage tolerant allowing them to go as high as (VImax) in the Recommended Operating
Conditions table at any valid VCC.
2. Recommend Output Conditions
– Load currents should not exceed (IOmax) per output and should not exceed (continuous current through
VCCor GND) total current for the part. These limits are located in the Absolute Max Ratings table.
The power supply can be any voltage between the min and max supply voltage rating located in the
Recommended Operating Conditions table.
Each Vcc pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply a 0.1-μF capacitor is recommended and if there are multiple Vcc pins then a 0.01-μF or 0.022-μF
capacitor is recommended for each power pin. It is ok to parallel multiple bypass caps to reject different
frequencies of noise. 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be
installed as close to the power pin as possible for best results.
12Layout
12.1 Layout Guidelines
When using multiple bit logic devices inputs should not ever float. In many cases, functions or parts of functions
of digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only
3 of the 4 buffer gates are used. Such input terminals should not be left unconnected because the undefined
voltages at the outside connections result in undefined operational states. Specified below are the rules that must
be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or
low bias to prevent them from floating. The logic level that should be applied to any particular unused input
depends on the function of the device. Generally they will be tied to Gnd or Vcc whichever make more sense or
is more convenient.